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Amkor Technology Inc patents


Recent patent applications related to Amkor Technology Inc. Amkor Technology Inc is listed as an Agent/Assignee. Note: Amkor Technology Inc may have other listings under different names/spellings. We're not affiliated with Amkor Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Amkor Technology Inc-related inventors


Semiconductor package with multiple compartments

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. ... Amkor Technology Inc

Semiconductor package and manufacturing method thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.. ... Amkor Technology Inc

Semiconductor package and fabricating method thereof

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.. ... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.. ... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.. ... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. ... Amkor Technology Inc

Semiconductor package structure for improving die warpage and manufacturing method thereof

A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film.. . ... Amkor Technology Inc

System and method for laser assisted bonding of semiconductor die

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.. ... Amkor Technology Inc

Semiconductor package with emi shield and fabricating method thereof

A semiconductor device with emi shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes emi shield on all six surfaces of the semiconductor device without the use of a discrete emi lid.. ... Amkor Technology Inc

Packaged electronic device having integrated antenna and locking structure

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. ... Amkor Technology Inc

Method of manufacturing an electronic device and electronic device manufactured thereby

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.. ... Amkor Technology Inc

Semiconductor device and method of manufacturing thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a semiconductor die coupled to a substrate and surrounded by a perforated metal plane and a method of manufacturing thereof.. ... Amkor Technology Inc

Electronic package structure

A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. ... Amkor Technology Inc

Method of forming a molded substrate electronic package and structure

An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. ... Amkor Technology Inc

05/24/18 / #20180145019

Method for fabricating semiconductor package and semiconductor package using the same

Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process. In one embodiment, the method for fabricating a semiconductor package includes forming a frame on a carrier, forming a first pattern layer on the frame, first encapsulating the frame and the first pattern layer using a first encapsulant, forming conductive vias electrically connected to the first pattern layer while passing through the first encapsulant, forming a second pattern layer electrically connected to the conductive vias on the first encapsulant, forming a first solder mask formed on the first encapsulant and exposing a portion of the second pattern layer to the outside, removing the frame by an etching process and etching a portion of the first pattern layer, and attaching a semiconductor die to the first pattern layer.. ... Amkor Technology Inc

05/17/18 / #20180138155

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof. ... Amkor Technology Inc

05/17/18 / #20180138138

Semiconductor device and method of manufacturing thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.. ... Amkor Technology Inc

05/17/18 / #20180138117

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. ... Amkor Technology Inc

05/17/18 / #20180134546

Semiconductor device and manufacturing method thereof

Disclosed is a semiconductor device including a conductive shield layer formed within a cavity of a molding part and a manufacturing method thereof. Various aspects of the present invention, for example and without limitation, includes a semiconductor device including a conductive shield layer formed along the wall of a cavity to of a molding part to improve emi shielding performance, and a manufacturing method thereof.. ... Amkor Technology Inc

04/12/18 / #20180102342

Manufacturing method of semiconductor device and semiconductor device thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.. ... Amkor Technology Inc

04/05/18 / #20180096928

Semiconductor package and fabricating method thereof

A semiconductor device structure, for example a 3d structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.. ... Amkor Technology Inc

03/29/18 / #20180090409

Packaging for fingerprint sensors and methods of manufacture

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. ... Amkor Technology Inc

03/22/18 / #20180083061

Electronic device package and fabricating method thereof

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (pcb), and a method for manufacturing thereof.. ... Amkor Technology Inc

03/22/18 / #20180082932

Land structure for semiconductor package and method therefor

A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. ... Amkor Technology Inc

03/22/18 / #20180082896

Encapsulated semiconductor package and method of manufacturing thereof

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.. ... Amkor Technology Inc

03/15/18 / #20180076172

Semiconductor device and manufacturing method thereof

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various electronic devices, and methods of making thereof, that comprise a permanently coupled carrier that enhances reliability of the electronic devices.. ... Amkor Technology Inc

03/08/18 / #20180069163

Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.. ... Amkor Technology Inc

03/08/18 / #20180068966

Semiconductor device with thin redistribution layers

A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. ... Amkor Technology Inc

03/01/18 / #20180061674

Method of manufacturing an electronic device and electronic device manufactured thereby

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.. ... Amkor Technology Inc

03/01/18 / #20180057353

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.. ... Amkor Technology Inc

02/15/18 / #20180047692

Method and system for packing optimization of semiconductor devices

Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.. ... Amkor Technology Inc

02/01/18 / #20180033708

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.. ... Amkor Technology Inc

01/11/18 / #20180012829

Semiconductor package with clip alignment notch

An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. ... Amkor Technology Inc

01/04/18 / #20180005987

Semiconductor package and fabricating method thereof

A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.. ... Amkor Technology Inc

12/28/17 / #20170373051

Method of manufacturing a package-on-package type semiconductor package

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.. ... Amkor Technology Inc

12/14/17 / #20170358560

Semiconductor package using a coreless signal distribution structure

A semiconductor package using a coreless signal distribution structure (csds) is disclosed and may include a csds comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the csds via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the csds via the second bond pad. ... Amkor Technology Inc

12/07/17 / #20170352613

Semiconductor device and manufacturing method thereof

An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.. ... Amkor Technology Inc

11/23/17 / #20170338163

Fingerprint sensor and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.. ... Amkor Technology Inc

11/09/17 / #20170323868

Semiconductor device and manufacturing method thereof

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.. ... Amkor Technology Inc

11/09/17 / #20170323863

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one surface of the dielectric layer, and a protection layer covering the at least one conductive trace and conductive bump pad, the at least one conductive bump pad having one end exposed through the protection layer, and a semiconductor die electrically connected to the conductive bump pad of the substrate.. ... Amkor Technology Inc

11/09/17 / #20170323862

Wafer level fan out semiconductor device and manufacturing method thereof

A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. ... Amkor Technology Inc

11/09/17 / #20170320723

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.. ... Amkor Technology Inc

10/26/17 / #20170309554

Method of forming a semiconductor package with conductive interconnect frame and structure

A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. ... Amkor Technology Inc

10/12/17 / #20170294412

Semiconductor package and manufacturing method thereof

Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.. . ... Amkor Technology Inc

10/12/17 / #20170294405

Method of forming a plurality of electronic component packages

A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. ... Amkor Technology Inc

09/28/17 / #20170278810

Embedded die in panel method and structure

Methods for an embedded die panel are disclosed and may include fabricating a first layered structure by: forming first redistribution layers on a first carrier, forming a first dielectric layer on the first redistribution layers and carrier, forming a mask pattern on the first dielectric layer exposing a portion of the first dielectric layer, forming a second dielectric layer on the exposed portion of the first dielectric layer, forming vias in the first and second dielectric layers, and forming second redistribution layers on the second dielectric layer. The mask pattern may be removed forming a die cavity defined by the second dielectric layer. ... Amkor Technology Inc

09/21/17 / #20170271315

Semiconductor device using emc wafer support system and fabricating method thereof

Provided are a semiconductor device using, for example, an epoxy molding compound (emc) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (tsv) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the tsv and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the tsv of the first semiconductor die.. ... Amkor Technology Inc

09/21/17 / #20170271307

Semiconductor package and fabricating method thereof

A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.. ... Amkor Technology Inc

09/14/17 / #20170263568

Semiconductor device having conductive wire with increased attachment angle and method

A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. ... Amkor Technology Inc

09/14/17 / #20170263544

Semiconductor package and manufacturing method thereof

A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. ... Amkor Technology Inc

09/14/17 / #20170263543

Semiconductor device and manufacturing method thereof

A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.. ... Amkor Technology Inc

08/24/17 / #20170243798

Fingerprint sensor and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.. ... Amkor Technology Inc

08/03/17 / #20170221844

Semiconductor device with thin redistribution layers

A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. ... Amkor Technology Inc

07/27/17 / #20170213755

Semiconductor device and manufacturing method thereof

Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.. ... Amkor Technology Inc

07/20/17 / #20170207162

Method for fabricating semiconductor package and semiconductor package using the same

Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process. In one embodiment, the method for fabricating a semiconductor package includes forming a frame on a carrier, forming a first pattern layer on the frame, first encapsulating the frame and the first pattern layer using a first encapsulant, forming conductive vias electrically connected to the first pattern layer while passing through the first encapsulant, forming a second pattern layer electrically connected to the conductive vias on the first encapsulant, forming a first solder mask formed on the first encapsulant and exposing a portion of the second pattern layer to the outside, removing the frame by an etching process and etching a portion of the first pattern layer, and attaching a semiconductor die to the first pattern layer.. ... Amkor Technology Inc

07/13/17 / #20170200782

Capacitor of semiconductor integrated circuit and method for manufacturing the same

Provided are a capacitor of a semiconductor integrated circuit and a method for manufacturing the same, for example a metal-insulator-metal (mim) type capacitor of a semiconductor integrated circuit, which is capable of improving adhesive force between an electrode layer and a dielectric layer of a capacitor, and a method for manufacturing the same. For example, the present disclosure provides a capacitor for a semiconductor integrated circuit having a new structure, which is capable of preventing a delamination phenomenon on an interface between a lower electrode layer and a dielectric layer by further forming a buffer layer, which is capable of decreasing or compensating for a difference in a coefficient of thermal expansion, between a metal electrode layer and a dielectric layer, particularly, between the lower electrode layer and the dielectric layer, and a method for manufacturing the same.. ... Amkor Technology Inc

07/13/17 / #20170200686

Semiconductor device and manufacturing method thereof

Disclosed are a semiconductor device and a manufacturing method thereof, which can easily increase the number of input/output pads by increasing regions for forming the input/output pads such that a redistribution layer is formed to extend up to an encapsulant. In one embodiment, the manufacturing method includes preparing a wafer by sequentially forming an oxide layer, a semiconductor layer and a back end of line (beol) layer on a wafer substrate, dicing the wafer to divide the wafer into individual semiconductor chips, mounting the semiconductor chip on one surface of a carrier by flipping the semiconductor chips and removing the wafer substrate from the semiconductor chips, encapsulating the one surface of the carrier and the semiconductor chips using an encapsulant and then removing the carrier, forming a redistribution layer to be electrically connected to the beol layer exposed to the outside while removing the carrier, and forming conductive bumps to be electrically connected to be electrically connected to the redistribution layer.. ... Amkor Technology Inc

07/06/17 / #20170194274

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.. ... Amkor Technology Inc

07/06/17 / #20170194239

A semiconductor package having an etched groove for an embedded device formed on bottom surface of a support substrate and a method for fabricating the same

A semiconductor device with etched grooves for embedded devices is disclosed and may, for example, include a substrate comprising a top surface and a bottom surface, a groove extending into the substrate from the bottom surface, and a redistribution structure in the substrate between the top surface and the bottom surface of the substrate. A semiconductor die may, for example, be coupled to the top surface of the substrate. ... Amkor Technology Inc

06/29/17 / #20170186679

Semiconductor device package and manufacturing method thereof

Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. ... Amkor Technology Inc

06/15/17 / #20170170107

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a signal redistribution structure that comprises an anti-oxidation layer.. ... Amkor Technology Inc

06/08/17 / #20170162535

Transient interface gradient bonding for metal bonds

A method and apparatus for performing metal-to-metal bonding for an electrical device and an electrical device produced thereby. For example and without limitation, various aspects of this disclosure provide a process that comprises depositing a thin metal layer on a copper pillar and then mating the copper pillar with another copper element. ... Amkor Technology Inc

06/08/17 / #20170162519

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor package, and a semiconductor package resulting therefrom, that comprises attaching at least one semiconductor die to a metal plate, encapsulating the at least one semiconductor die on the metal plate using an encapsulant, and dicing the metal plate and the encapsulant.. ... Amkor Technology Inc

06/08/17 / #20170162510

Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects

A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. ... Amkor Technology Inc

06/01/17 / #20170154861

Semiconductor device and manufacturing method thereof

A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. ... Amkor Technology Inc

05/18/17 / #20170141081

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.. ... Amkor Technology Inc

05/18/17 / #20170141046

Semiconductor device with an electromagnetic interference (emi) shield

A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive tape, and forming an electromagnetic interference (emi) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die. The adhesive tape may be peeled away from the encapsulated substrate and semiconductor die, thereby leaving portions of the emi shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the emi shield layer remaining on portions of the adhesive tape. ... Amkor Technology Inc

05/18/17 / #20170140988

Encapsulated semiconductor package and method of manufacturing thereof

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.. ... Amkor Technology Inc

05/11/17 / #20170133334

Semiconductor device and manufacturing method thereof

A semiconductor device and a manufacturing method thereof, which can reduce a number of manufacturing processes and/or can reduce a thickness of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for the elimination process steps and/or a reduction in package size based on dielectric layer characteristics.. ... Amkor Technology Inc

05/11/17 / #20170133310

Semiconductor package and fabricating method thereof

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.. ... Amkor Technology Inc

05/04/17 / #20170125881

Packaged electronic device having integrated antenna and locking structure

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. ... Amkor Technology Inc

05/04/17 / #20170125264

Semiconductor device and manufacturing method thereof

Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer.. ... Amkor Technology Inc

04/27/17 / #20170117249

Manufacturing method of semiconductor device and semiconductor device thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.. ... Amkor Technology Inc

04/27/17 / #20170117214

Semiconductor device with through-mold via

In accordance with the present invention, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. ... Amkor Technology Inc

04/27/17 / #20170117200

Semiconductor device and manufacturing method thereof

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.. ... Amkor Technology Inc

03/09/17 / #20170069558

Semiconductor package having routable encapsulated conductive substrate and method

A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. ... Amkor Technology Inc

03/02/17 / #20170062372

Semiconductor device and manufacturing method thereof

A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.. ... Amkor Technology Inc

03/02/17 / #20170062364

Semiconductor package and manufacturing method thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.. ... Amkor Technology Inc

01/19/17 / #20170018493

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.. ... Amkor Technology Inc

01/05/17 / #20170005070

Method of manufacturing a semiconductor package

Methods for a semiconductor device package formed in a chip-on-wafer last process using thin film adhesives are disclosed and may include bonding a first carrier to a first surface of an interposer in wafer form, forming conductive bumps on a second surface of the interposer, bonding a second carrier to the conductive bumps utilizing a film adhesive, removing the first carrier from the interposer, bonding a semiconductor die to the first surface of the interposer, and encapsulating the die and the first surface of the interposer in an encapsulant material. The second carrier and the film adhesive may be removed from the conductive bumps utilizing a slide-off process. ... Amkor Technology Inc

01/05/17 / #20170005029

Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure

In one embodiment, a semiconductor package includes a multi-layer encapsulated conductive substrate having a fine pitch. The multi-layer encapsulated conductive substrate includes a conductive leads spaced apart from each other, a first encapsulant disposed between the leads, a first conductive layer electrically connected to the plurality of leads, conductive pillars disposed on the first conductive layer, a second encapsulant encapsulating the first conductive layer and the conductive pillars, and a second conductive layer electrically connected to the conductive pillars and exposed in the second encapsulant. ... Amkor Technology Inc








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