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Applied Materials Israel Ltd patents


Recent patent applications related to Applied Materials Israel Ltd. Applied Materials Israel Ltd is listed as an Agent/Assignee. Note: Applied Materials Israel Ltd may have other listings under different names/spellings. We're not affiliated with Applied Materials Israel Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Applied Materials Israel Ltd-related inventors


Asymmetrical magnification inspection system and illumination module

An illumination module that includes a pair of anamorphic prisms that comprises a first anamorphic prism and a second anamorphic prism; wherein the pair of anamorphic prisms is configured to (a) receive a first radiation beam that propagates along a first optical axis, and (b) asymmetrically magnify the first radiation beam to provide a second radiation beam that propagates along a second optical axis that is parallel to the first optical axis; and a rectangular prism that is configured to receive the second radiation beam and perform a lateral shift of the second radiation beam to provide a third radiation beam; and a rotating mechanism that is configured to change an asymmetrical magnification of the pair of anamorphic prisms by rotating at least one of the first anamorphic prism and the second anamorphic prism.. . ... Applied Materials Israel Ltd

Scanning system and method for scanning an object

A scanning system that includes an illumination module that is configured to scan, at a first direction, an elongated radiation spot over an object; and a collection module that is configured to (a) collect a collected radiation beam from the object, and (b) optically manipulate the collected radiation beam to provide a counter-scan beam is directed towards a set of detection units and has a focal point that is positioned at a same location regardless of the propagation of the elongated radiation spot along the first direction.. . ... Applied Materials Israel Ltd

Multi mode system with a dispersion x-ray detector

A method for evaluating a specimen, the method can include positioning an energy dispersive x-ray (edx) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an edx detector tip; detecting, by the edx detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the edx detector at a second position in which a distance between the edx detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the edx detector on the plane of the flat surface virtually falls on the flat surface when the edx detector is positioned at the first position and when the edx detector is positioned at the second position.. . ... Applied Materials Israel Ltd

Method of deep learning-based examination of a semiconductor specimen and system thereof

There are provided system and method of classifying defects in a semiconductor specimen. The method comprises: upon obtaining by a computer a deep neural network (dnn) trained to provide classification-related attributes enabling minimal defect classification error, processing a fabrication process (fp) sample using the obtained trained dnn; and, resulting from the processing, obtaining by the computer classification-related attributes characterizing the at least one defect to be classified, thereby enabling automated classification, in accordance with the obtained classification-related attributes, of the at least one defect presented in the fp image. ... Applied Materials Israel Ltd

Method of deep learining-based examination of a semiconductor specimen and system thereof

There are provided system and method of segmentation a fabrication process (fp) image obtained in a fabrication of a semiconductor specimen. The method comprises: upon obtaining a deep neural network (dnn) trained to provide segmentation-related data, processing a fabrication process (fp) sample using the obtained trained dnn and, resulting from the processing, obtaining by the computer segments-related data characterizing the fp image to be segmented, the obtained segments-related data usable for automated examination of the semiconductor specimen. ... Applied Materials Israel Ltd

Chuck for supporting a wafer

According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. ... Applied Materials Israel Ltd

Detection module, inspection system and a method for obtaining multipe sensing results

A detection module that includes a readout circuit and detector having a group of sensing elements. The group is configured to detect multiple beams. ... Applied Materials Israel Ltd

High voltage electron beam system and method

A high voltage inspection system that includes a vacuum chamber; electron optics that is configured to direct an electron beam towards an upper surface of a substrate; a substrate support module that comprises a chuck and a housing; wherein the chuck is configured to support a substrate; wherein the housing is configured to surround the substrate without masking the electron beam, when the substrate is positioned on the chuck during a first operational mode of the high voltage inspection system; and wherein the substrate, the chuck and the housing are configured to (a) receive a high voltage bias signal of a high voltage level that exceeds ten thousand volts, and (b) to maintain at substantially the high voltage level during the first operational mode of the high voltage inspection system.. . ... Applied Materials Israel Ltd

Method and system for scanning an object

A method for scanning an object with a charged particle beam, the method may include repeating, for each pair of scan lines out of multiple pairs of scan lines, the stages of: (i) deflecting the charged particle beam along a first direction, thereby scanning the object along a first scan line of the pair of scan lines; (ii) collecting electrons emitted from the object during the scanning of the object along a majority of the first scan line; (iii) deflecting the charged particle beam along a second direction that is normal to the first direction; (iv) deflecting the charged particle beam along a third direction that is opposite to the first direction, thereby scanning the object along a second scan line of the pair of scan lines; (v) collecting electrons emitted from the object during the scanning of the object along a majority of the second scan line; and (vi) deflecting the charged particle beam along the second direction that is normal to the third direction.. . ... Applied Materials Israel Ltd

Inspection system and method for inspecting a sample by using a plurality of spaced apart beams

An inspection system that may include an illumination module that may be configured to scan a sample during multiple scan iterations; wherein during each scan iteration the illumination module scans each beam of a plurality of spaced apart beams along a scan line; a mechanical stage that may be configured to move the sample during the multiple scan iterations; a detection module; and a processor; wherein when the inspection system operates in an interlaced mode, the mechanical stage may be configured to move at a first speed thereby preventing a substantial overlap between scan lines obtained during the multiple scan iterations; wherein when the inspection system operates in a non-interlaced mode: the mechanical stage may be configured to move at a second speed that differs from the first speed thereby introducing an overlap between scan lines of different beams that may be obtained during different scan iterations; the detection module may be configured to generate detection signals in response to a detection of radiation emitted from the sample as a result of each scan line; and wherein the processor may be configured to independently process detection signals relating to different scan lines.. . ... Applied Materials Israel Ltd

Particle-optical systems and arrangements and particle-optical components for such systems and arrangements

A particle-optical arrangement comprises a charged-particle source for generating a beam of charged particles; a multi-aperture plate arranged in a beam path of the beam of charged particles, wherein the multi-aperture plate has a plurality of apertures formed therein in a predetermined first array pattern, wherein a plurality of charged-particle beamlets is formed from the beam of charged particles downstream of the multi-aperture plate, and wherein a plurality of beam spots is formed in an image plane of the apparatus by the plurality of beamlets, the plurality of beam spots being arranged in a second array pattern; and a particle-optical element for manipulating the beam of charged particles and/or the plurality of beamlets; wherein the first array pattern has a first pattern regularity in a first direction, and the second array pattern has a second pattern regularity in a second direction electron-optically corresponding to the first direction, and wherein the second regularity is higher than the first regularity.. . ... Applied Materials Israel Ltd

System and method for design based inspection

A system for design based inspection of a lithographic mask of a first layer of an article, the system may include a decision module and a memory module; wherein the memory module is configured to store (a) first layer information about an outcome of an illumination of the lithographic mask during a lithographic process, (b) design information related to an irrelevant area to be removed from the first layer of the article after a manufacturing of the first layer of the article; and wherein the decision module is configured to process the first layer information to detect lithographic mask defects and to reduce a significance of a lithographic mask defect that is positioned within the irrelevant area.. . ... Applied Materials Israel Ltd

System and method for multi-location zapping

A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in a first location of a backside insulating layer of a wafer, and (b) second zapping pulses for causing a breakdown in a second location of the backside insulating layer of the wafer; a first conductive interface that is configured to convey the first zapping pulses to the first location, while contacting the first location; a second conductive interface that is configured to convey the second zapping pulses to the second location, while contacting the second location; and wherein the first location differs from the second location.. . ... Applied Materials Israel Ltd

Optical module and a detection method

An optical module that includes (a) an optical interface that includes an input surface and an output surface, and (b) a scintillator that has a flat surface. The scintillator is configured emit emitted light through the flat surface in response to an impingement of a charged particle on the scintillator. ... Applied Materials Israel Ltd

09/07/17 / #20170254847

Arc detector and a method for detecting arcs

A system comprising: a first high voltage unit that is coupled via a high voltage supply cable to a second high voltage unit; a transformer that is configured to magnetically couple the high voltage supply cable to windings of a transformer; and a detection unit that is configured to monitor a windings signal developed in the windings of the transformer to detect a first high voltage unit arc formed within the first high voltage unit and to detect a second high voltage unit arc formed within the second high voltage unit.. . ... Applied Materials Israel Ltd

08/31/17 / #20170250052

System for discharging an area that is scanned by an electron beam

A method and a system for imaging an object, the system may include electron optics that may be configured to scan a first area of the object with at least one electron beam; wherein the electron optics may include a first electrode; and light optics that may be configured to illuminate at least one target of (a) the first electrode and (b) the object, thereby causing an emission of electrons between the first electrode and the object.. . ... Applied Materials Israel Ltd

08/24/17 / #20170243343

Technique for measuring overlay between layers of a multilayer structure

A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.. ... Applied Materials Israel Ltd

07/27/17 / #20170213697

Multi mode system with a dispersion x-ray detector

A method for evaluating a specimen, the method can include positioning an energy dispersive x-ray (edx) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an edx detector tip; detecting, by the edx detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the edx detector at a second position in which a distance between the edx detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the edx detector on the plane of the flat surface virtually falls on the flat surface when the edx detector is positioned at the first position and when the edx detector is positioned at the second position.. . ... Applied Materials Israel Ltd

07/27/17 / #20170213696

Multi mode systems with retractable detectors

A method for evaluating a specimen includes positioning a detector in an inserted position in which a first distance between a tip of the detector and a plane extending along a surface of the specimen is less than a distance between the plane and a tip of charged particle beam optics. While maintaining the detector at the inserted position, the surface of the specimen is scanned by a primary beam that exits from the tip of the charged particle beam optics. ... Applied Materials Israel Ltd

07/06/17 / #20170194125

Cd-sem technique for wafers fabrication control

A critical dimensions scanning electron microscope (cd-sem) is described that comprises a unit for performing cd-sem measurements of a semiconductor wafer, a bse imaging unit for obtaining a grey level image (gl) of the wafer, and a unit for gl analysis and for processing the gl analysis results with reference to results of the cd-measurements.. . ... Applied Materials Israel Ltd

06/22/17 / #20170177997

Method of deep learining-based examination of a semiconductor specimen and system thereof

There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a deep neural network (dnn) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (fp) images using the obtained trained dnn, wherein the dnn is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more fp images. ... Applied Materials Israel Ltd

06/15/17 / #20170169554

System and method for patch based inspection

An inspection system that may include a processor and a memory module; wherein the memory module is configured to store a first image of an area of an object and a second image of the area of the object; wherein the processor is configured to generate a synthetic image of the area of the object, and to compare the synthetic image to the second image to provide defect detection results.. . ... Applied Materials Israel Ltd

05/11/17 / #20170134735

Technique for visualizing elements in images by color coding

A technique for visualizing elements in images by applying a color coding procedure to data which comprises an initial image and segmentation results based on n labels. The segmentation results comprise information on segmentation uncertainty. ... Applied Materials Israel Ltd

03/23/17 / #20170084425

Scanning an object using multiple mechanical stages

A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage exceeds a weight of the second mechanical stage.. . ... Applied Materials Israel Ltd

01/19/17 / #20170018403

Method and system for optimizing configurable parameters of inspection tools

A method, computer product and system for optimization of configurable parameters of inspection tools are provided. The method includes applying a heuristic that utilizes a prioritized sequence of selections of configurable parameters. ... Applied Materials Israel Ltd

01/19/17 / #20170018398

Review of suspected defects using one or more reference dies

A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. ... Applied Materials Israel Ltd

01/19/17 / #20170018066

Technique for measuring overlay between layers of a multilayer structure

A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.. ... Applied Materials Israel Ltd

01/12/17 / #20170011881

Imaging low electron yield regions with a charged beam imager

A system that may include a processor, wherein the processor comprise an image waveform finder, a synthetic image generator and an output image generator; wherein the processor is configured to (i) receive or generate multiple images of a region of the object; wherein the region has an electron yield that is below an electron yield threshold; wherein each image is generated by scanning the region with an electron beam; (ii) process the multiple images to generate multiple synthetic images, and (iii) generate an output image of the region in response to the multiple synthetic images; wherein the image waveform finder is configured to process each image of the multiple images to find at least one image waveform that has a peak intensity that exceeds an intensity threshold; wherein the synthetic image generator is configured to replace one or more of the at least one image waveforms by one or more corresponding synthetic waveforms to provide a synthetic image; and wherein the output image generator is configured to generate an output image of the region in response to the multiple synthetic images. . ... Applied Materials Israel Ltd

01/12/17 / #20170010219

Method for inspecting an object with an array of beams

According to an embodiment of the invention there may be provided a system for inspecting an object, the system may include a traveling lens acousto-optic device that is configured to generate a sequence of traveling lenses that propagate through an active region of the traveling lens acousto-optic device; an illumination unit that that is configured to illuminate the sequence of traveling lenses to provide a sequence of input beams; a first beam splitter that is configured to split the sequence of input beams to an intermediate array of intermediate beams, the intermediate array comprises multiple sequences of intermediate beams, the sequences of intermediate beams are spaced apart from each other; a masking unit that is configured to mask first beams of the intermediate array and unmask output beams of the intermediate array in an alternating manner; multiple detectors; and an objective lens that is configured to receive the output beams, direct the output beams towards multiple areas of the object, receive collected beams from the multiple areas of the object, and direct the collected beams towards the multiple detectors; and wherein each detector is associated with an area of the multiple areas.. . ... Applied Materials Israel Ltd

01/05/17 / #20170004951

System and method for controlling specimen outgassing

According to an embodiment of the invention there may be provided a system that may include a specimen chamber, an exchange chamber, a pressure monitor; and a controller. The exchange chamber may be configured to (i) receive a specimen when an exchange chamber pressure maintained within the exchange chamber is at a first pressure level, (ii) reduce the exchange chamber pressure to be lower than a specimen vapor pressure. ... Applied Materials Israel Ltd








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