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Asm Technology Singapore Pte Ltd patents


Recent patent applications related to Asm Technology Singapore Pte Ltd. Asm Technology Singapore Pte Ltd is listed as an Agent/Assignee. Note: Asm Technology Singapore Pte Ltd may have other listings under different names/spellings. We're not affiliated with Asm Technology Singapore Pte Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Asm Technology Singapore Pte Ltd-related inventors


Method and system for automatic bond arm alignment

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.. ... Asm Technology Singapore Pte Ltd

Vertical chromatic confocal scanning method and system

A method of scanning a surface of an object using a confocal imaging system comprises the steps of obtaining first, second and third confocal images of the surface of the object when the object is illuminated respectively by light rays having first, second and third spectral waveforms, and using a camera to capture responsive signals from the object illuminated by the first, second and third spectral waveforms. The first, second and third spectral waveforms are distinguishable from one another and each spectral waveform has overlapping portions relative to another spectral waveform. ... Asm Technology Singapore Pte Ltd

Dual-feed test handling system

A test handler for testing electronic components comprises a rotary turret for conveying electronic components, a first input station and a second input station, the first and second input stations each being operative to separately feed electronic components to the rotary turret for conveying the electronic components. The electronic components fed only from the first input station are tested at a first set of test stations comprising a plurality of first test platforms, and the electronic components fed only from the second input station are tested at a second set of second test stations comprising a plurality of second test platforms. ... Asm Technology Singapore Pte Ltd

Method for manufacturing wafer-level semiconductor packages

During the manufacture of a semiconductor package, a semiconductor wafer including a plurality of bond pads on a surface of the wafer is provided and the surface of the wafer is covered with a dielectric material to form a dielectric layer over the bond pads. Portions of the dielectric layer corresponding to positions of the bond pads are removed to form a plurality of wells, wherein each well is configured to form a through-hole between top and bottom surfaces of the dielectric layer for exposing each bond pad. ... Asm Technology Singapore Pte Ltd

Confocal imaging of an object utilising a pinhole array

A confocal imaging apparatus for inspecting an object comprises a light source operative to project light to illuminate the object, and an imaging device for receiving light reflected from the object along a lighting path located between the object and the imaging device. A pinhole array comprising a plurality of pinholes is positioned along the lighting path such that light reflected from the object is passed through the pinhole array. ... Asm Technology Singapore Pte Ltd

System for adjusting relative positions between components of a bonding apparatus

A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. ... Asm Technology Singapore Pte Ltd

Molding apparatus including a compressible structure

The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. ... Asm Technology Singapore Pte Ltd

Apparatus and method for transferring electronic devices

The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. ... Asm Technology Singapore Pte Ltd

Wireless signal transmission in a pick-and-place apparatus

A pick-and-place apparatus has a rotary turret and a plurality of pick arms arranged on the rotary turret for picking up and placing electronic devices during pick and place operations. A transmission stator and a transmission rotor are mounted on the rotary turret with an air gap between the transmission stator and the transmission rotor such that the transmission rotor is rotatable relative to the transmission stator. ... Asm Technology Singapore Pte Ltd

Molding system for applying a uniform clamping pressure onto a substrate

A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position. ... Asm Technology Singapore Pte Ltd

Magnet assembly for an electromagnetic motor

A magnet assembly for a linear motor, the magnet assembly including one or more permanent magnets, a mounting plate having a mounting portion that is configured for arranging and mounting the one or more permanent magnets along a direction of elongation of the mounting plate, and at least one elongate member that extends at least partially through the mounting plate between a first end and second end thereof, the at least one elongate member extending at least partially through the or each magnet for fixing the or each magnet with respect to the mounting plate.. . ... Asm Technology Singapore Pte Ltd

Plated lead frame including doped silver layer

A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of led devices utilizing the lead frame.. ... Asm Technology Singapore Pte Ltd

Method and apparatus for aligning probe pins with respect to positions of electronic devices

A method for aligning probe pins with respect to positions of electronic devices comprises conducting contact stamping on a first electronic device with the probe pins to form first probe marks on lead pads of the first electronic device, capturing an image of the first electronic device, determining positions of the first probe marks on the first electronic device using the captured image, calculating an offset using the positions of the first probe marks, adjusting relative positions between a subsequent plurality of electronic devices and the probe pins using the offset, and contacting lead pads of the subsequent plurality of electronic devices with the probe pins for testing said electronic devices. The first probe marks are configured to have greater visibility as compared with second probe marks formed when contacting the lead pads of the subsequent plurality of electronic devices with the probe pins, so as to improve the accuracy of the offset calculated.. ... Asm Technology Singapore Pte Ltd

Electronic device separator for a feeding apparatus

A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. ... Asm Technology Singapore Pte Ltd

09/07/17 / #20170252954

Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump

A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open. The base vacuum pump and the reservoir vacuum pump are each operative to reduce a pressure of the cavity pressure zone to the molding process pressure when they are in fluid communication with the cavity pressure zone.. ... Asm Technology Singapore Pte Ltd

08/24/17 / #20170243796

Apparatus and method for cutting a wafer that is substantially covered by an opaque material

A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a centre of the camera's field of view follows a path along the exposed peripheral area of the wafer. ... Asm Technology Singapore Pte Ltd

08/17/17 / #20170238449

Pick arm comprising a winged part for a bonding apparatus

. . A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. ... Asm Technology Singapore Pte Ltd

08/17/17 / #20170236734

Pick and place device comprising pick arm correction module

A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. ... Asm Technology Singapore Pte Ltd

07/13/17 / #20170201744

Active lens alignment system

For aligning an image sensor relative to a lens module prior to fixing the image sensor to the lens module, an exposure of the image sensor is turned on and the image sensor is moved to different distances relative to the lens module. At certain predetermined distances between the image sensor and the lens module, a calibration pattern is illuminated and two or more pictures of the calibration pattern which is focused through the lens module are captured with the image sensor to produce at least two pictures of the calibration pattern captured at different distances, the at least two pictures being superimposed onto a calibration image. ... Asm Technology Singapore Pte Ltd

03/02/17 / #20170062256

Apparatus and method for adjustment of a handling device for handling electronic components

Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components. The apparatus comprises a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark.. ... Asm Technology Singapore Pte Ltd

03/02/17 / #20170062247

Optical station for exchanging optical elements

An optical station for a laser processing device including a plurality of holders for holding respective optical elements; a rotatable magazine having a plurality of accommodation spaces for accommodating the plurality of holders; a positioning device having a holder clamp for clamping and positioning a selected one of the optical elements. A magazine actuator for rotating the magazine; linear shifting means for shifting the magazine in a direction parallel to the optical axis, wherein the magazine is shifted towards the positioning device such that the positioning device lifts the holder from its accommodation space.. ... Asm Technology Singapore Pte Ltd








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