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Besi Switzerland Ag patents

Recent patent applications related to Besi Switzerland Ag. Besi Switzerland Ag is listed as an Agent/Assignee. Note: Besi Switzerland Ag may have other listings under different names/spellings. We're not affiliated with Besi Switzerland Ag, we're just tracking patents.

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Apparatus for mounting components on a substrate

An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. ... Besi Switzerland Ag

Method for mounting semiconductors provided with bumps on substrate locations of a substrate

The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. ... Besi Switzerland Ag

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Besi Switzerland Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Besi Switzerland Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by