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Bridge Semiconductor Corporation patents


Recent patent applications related to Bridge Semiconductor Corporation. Bridge Semiconductor Corporation is listed as an Agent/Assignee. Note: Bridge Semiconductor Corporation may have other listings under different names/spellings. We're not affiliated with Bridge Semiconductor Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "B" | Bridge Semiconductor Corporation-related inventors


Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same

A wiring board includes an electronic component laterally surrounded by a stiffener, and a third routing circuitry disposed beyond the space laterally surrounded by the stiffener and extends over the stiffener. The electronic component includes a first routing circuitry, an encapsulant, an array of vertical connecting elements and a second routing circuitry integrated together. ... Bridge Semiconductor Corporation

3-d stacking semiconductor assembly having heat dissipation characteristics

A semiconductor assembly having heat dissipation characteristics includes stacked semiconductor chips thermally conductible to a thermal pad of an interconnect substrate and electrically connected to the interconnect substrate through bonding wire. The bonding wires extending from a primary routing circuitry in between the stacked chips can accommodate the height difference between the stacked chips and the interconnect substrate. ... Bridge Semiconductor Corporation

Method of making wiring board with interposer and electronic component incorporated with base board

A wiring board includes an interposer and an electronic component laterally surrounded by a base board and a dielectric layer and connected to a routing circuitry. The interposer and the electronic component are inserted into a first through opening and a second through opening of the base board, respectively. ... Bridge Semiconductor Corporation

Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly

The wiring substrate includes a cavity and a plurality of metal leads disposed around the cavity. The metal leads are bonded with a resin compound and provide horizontal and vertical routing for a semiconductor device to be disposed in the cavity. ... Bridge Semiconductor Corporation

Methods of making stackable wiring board having electronic component in dielectric recess

A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. A plurality of plated through holes are formed to provide vertical electrical connections between dual buildup circuitries, thereby providing the wiring board with stacking capability.. ... Bridge Semiconductor Corporation

Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same

The leadframe substrate includes a routing circuitry disposed on a compound layer and electrically connects an electronic component encapsulated in the compound layer to metal leads. The compound layer fills in spaces between the metal leads and provides a dielectric platform for the routing circuitry deposited thereon. ... Bridge Semiconductor Corporation

Interconnect substrate having cavity for stackable semiconducotr assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same

An interconnect substrate includes vertical connection channels around a cavity. The vertical connection channels are made of a combination of metal posts and metallized vias. ... Bridge Semiconductor Corporation

Method of making interconnect substrate having routing circuitry connected to posts and terminals

A method of making an interconnect substrate includes steps of: providing a base and a plurality of posts projecting from the base, providing a dielectric compound on the base, forming a top routing circuitry on the dielectric compound and electrically coupled to the posts; and selectively removing portions of the base to form a plurality of terminals. The terminals are below the posts and extend laterally from the posts to provide electrical contacts underneath the dielectric compound. ... Bridge Semiconductor Corporation

Wiring board with electrical isolator and base board incorporated therein and semiconductor assembly and manufacturing method thereof

A wiring board includes an electrical isolator laterally surrounded by a base board and a molding compound. The electrical isolator is inserted into a through opening of the base board and has a thickness greater than that of the base board. ... Bridge Semiconductor Corporation

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

A thermally enhanced semiconductor assembly with three dimensional integration includes a semiconductor chip electrically coupled to a wiring board by bonding wires. A heat spreader that provides an enhanced thermal characteristic for the semiconductor chip is disposed in a through opening of a wiring structure. ... Bridge Semiconductor Corporation

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

A thermally enhanced semiconductor assembly with three dimensional integration includes a stacked semiconductor sub-assembly electrically coupled to a wiring board by bonding wires. A heat spreader that provides an enhanced thermal characteristic for the stacked semiconductor sub-assembly is disposed in a through opening of a wiring structure. ... Bridge Semiconductor Corporation

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

A thermally enhanced semiconductor assembly with three dimensional integration includes a first component and a second component face-to-face mounted together. A heat spreader that provides an enhanced thermal characteristic for the semiconductor assembly is disposed in a through opening of a routing circuitry. ... Bridge Semiconductor Corporation

Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener

A semiconductor assembly includes an anti-warping controller, a semiconductor device, a balance layer and a first routing circuitry positioned within a through opening of a stiffener and a second routing circuitry positioned outside of the through opening of the stiffener and electrically connected to the first routing circuitry and a vertical connecting element of the stiffener. The mechanical robustness of the stiffener and the anti-warping controller can prevent the assembly from warping, whereas the vertical connecting element of the stiffener provides electrical connection between two opposite sides of the stiffener. ... Bridge Semiconductor Corporation

Semiconductor assembly with three dimensional integration and method of making the same

A semiconductor assembly includes a face-to-face semiconductor sub-assembly electrically coupled to a circuit board by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a routing circuitry, and is disposed in a through opening of the circuit board. ... Bridge Semiconductor Corporation

05/11/17 / #20170133352

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

A semiconductor assembly with three dimensional integration includes a face-to-face semiconductor sub-assembly electrically coupled to a heat spreader by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a first routing circuitry, and the heat spreader includes a metal plate and a second routing circuitry on the metal plate. ... Bridge Semiconductor Corporation

03/23/17 / #20170084530

Wiring board having isolator and bridging element and method of making wiring board

A wiring board includes a low cte (coefficient of thermal expansion) and high thermal conductivity isolator incorporated in a resin laminate by an adhesive and a bridging element disposed over the isolator and the resin laminate and electrically coupled to a first routing circuitry on the isolator and a second routing circuitry on the resin laminate. The isolator provides cte-compensated contact interface for a semiconductor chip to be assembled thereon, and also provides primary heat conduction for the chip. ... Bridge Semiconductor Corporation

03/09/17 / #20170069602

Interconnect substrate having cavity for stackable semiconducotr assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same

An interconnect substrate having vertical connection channels around a cavity is characterized in that contact pads are exposed from the cavity and the vertical connection channels are made of a combination of metal posts and metallized vias. The cavity includes a recess in a core layer and an aperture in a stiffener. ... Bridge Semiconductor Corporation

03/02/17 / #20170062394

Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same

A semiconductor assembly includes an encapsulated device and a thermally enhanced device face-to-face mounted together through first and second routing circuitries and a heat spreader that provides thermal dissipation and electromagnetic shielding. The encapsulated device has a first semiconductor chip sealed in an encapsulant, whereas the thermally enhanced device has a second semiconductor chip thermally conductible to a shielding lid of the heat spreader and laterally surrounded by posts of the heat spreader. ... Bridge Semiconductor Corporation

02/02/17 / #20170034923

Methods of making stackable wiring board having electronic component in dielectric recess

A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. An array of metal posts that provide vertical electrical connections are formed by using the same metal carrier that forms the recess, so that the predetermined distance and relative location between metal posts and pads/bumps of the electronic component can be maintained.. ... Bridge Semiconductor Corporation

02/02/17 / #20170033083

Package-on-package semiconductor assembly having bottom device confined by dielectric recess

A package-on-package semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between two both opposite sides of the core base can be reduced by the amount equal to the depth of the recess. ... Bridge Semiconductor Corporation

02/02/17 / #20170033082

Face-to-face semiconductor assembly having semiconductor device in dielectric recess

A face-to-face semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between both opposite sides of the core base can be reduced by the amount equal to the depth of the recess. ... Bridge Semiconductor Corporation

01/26/17 / #20170025393

Thermally enhanced face-to-face semiconductor assembly with heat spreader and method of making the same

A face-to-face semiconductor assembly is characterized in that an encapsulated device having a first semiconductor chip surrounded by an array of vertical connecting elements in an encapsulant is stacked on and electrically coupled to a thermally enhanced device having a second semiconductor chip accommodated in a cavity of a thermal board. The first and second semiconductor chips are face-to-face mounted on two opposite sides of a first routing circuitry and is further electrically connected to the vertical connecting elements through the first routing circuitry. ... Bridge Semiconductor Corporation

01/19/17 / #20170018505

Wiring board with embedded component and integrated stiffener and method of making the same

A wiring board with embedded component and integrated stiffener is characterized in that an embedded semiconductor device, a first routing circuitry, an encapsulant and an array of vertical connecting elements are integrated as an electronic component disposed within a through opening of a stiffener, and a second routing circuitry is disposed beyond the through opening of the stiffener and extends over the stiffener. The mechanical robustness of the stiffener can prevent the wiring board from warping. ... Bridge Semiconductor Corporation








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