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Bridgelux Inc patents


Recent patent applications related to Bridgelux Inc. Bridgelux Inc is listed as an Agent/Assignee. Note: Bridgelux Inc may have other listings under different names/spellings. We're not affiliated with Bridgelux Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "B" | Bridgelux Inc-related inventors


Linear led module

Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. ... Bridgelux Inc

Optics for chip-on-board lighting having a protrusion

A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. ... Bridgelux Inc

Die emitting white light

Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. ... Bridgelux Inc

Apparatus providing beamforming and environmental protection for led light sources

Apparatus providing beamforming and environmental protection for led light sources. A lens apparatus is provided to protect an led mounted on a substrate. ... Bridgelux Inc

Optics for chip-on-board road and area lighting

A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.. ... Bridgelux Inc

Light emitting diode package having series connected leds

Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (led) that are electrically coupled in series, wherein the first and the second leds each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. ... Bridgelux Inc

Packaging a substrate with an led into an interconnect structure only through top side landing pads on the substrate

Standardized photon building blocks are packaged in molded interconnect structures to form a variety of led array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which led dies are mounted. ... Bridgelux Inc

Side light led troffer tube

Side light led troffer tube. In an aspect, a side light led tube is provided that includes a tube having at least one light receiving portion configured to receive light and gradient optics formed on the tube. ... Bridgelux Inc

Substrate free led package

A method of fabricating a substrate free light emitting diode (led), includes arranging led dies on a tape to form an led wafer assembly, molding an encapsulation structure over at least one of the led dies on a first side of the led wafer assembly, removing the tape, forming a dielectric layer on a second side of the led wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual led wafer assembly, and singulating the virtual led wafer assembly into predetermined regions including at least one led. The tape can be a carrier tape or a saw tape. ... Bridgelux Inc

Flip chip light emitting diode having transparent material with surface features

Flip chip leds include a transparent substrate or carrier having an active material attached thereto and having a number of electrodes disposed along a common surface of the active material. The substrate may include a number of surface features disposed along a first surface adjacent the active material for improving light extraction from the active material, and includes a number of surface features along a second surface opposite the first surface for minimizing internal reflection of light through the substrate, thereby improving light extraction from the transparent substrate. ... Bridgelux Inc

Packaging a substrate with an led into an interconnect structure only through top side landing pads on the substrate

Standardized photon building blocks are packaged in molded interconnect structures to form a variety of led array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which led dies are mounted. ... Bridgelux Inc

Led-based replacement for fluorescent light source

A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of leds mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to dc power that powers the leds. ... Bridgelux Inc

Light sources utilizing segmented leds to compensate for manufacturing variations in the light output of individual segmented leds

A light source and method for making the same are disclosed. The light source includes a plurality of segmented leds connected in parallel to a power bus and a controller. ... Bridgelux Inc

Die emitting white light

Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. ... Bridgelux Inc

01/19/17 / #20170018687

Led-based light source utilizing asymmetric conductors

A light source includes led dies that are flip-chip mounted on a flexible plastic substrate. The led dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the led dies and traces on the substrate. ... Bridgelux Inc

01/19/17 / #20170018539

Jetting a highly reflective layer onto an led assembly

A layer of highly reflective (hr) material is deposited by jetting microdots of the hr material in liquid form onto a substrate and then allowing the hr material to harden. In one example, the hr layer is the hr layer of a white led assembly. ... Bridgelux Inc








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