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Chengdu Haicun Ip Technology Llc patents


Recent patent applications related to Chengdu Haicun Ip Technology Llc. Chengdu Haicun Ip Technology Llc is listed as an Agent/Assignee. Note: Chengdu Haicun Ip Technology Llc may have other listings under different names/spellings. We're not affiliated with Chengdu Haicun Ip Technology Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Chengdu Haicun Ip Technology Llc-related inventors


Three-dimensional vertical one-time-programmable memory comprising schottky diodes

The present invention discloses a three-dimensional vertical read-only memory (3d-otpv) comprising schottky diodes. It comprises a plurality of vertical otp strings formed side-by-side on a substrate circuit. ... Chengdu Haicun Ip Technology Llc

Configurable computing array based on three-dimensional printed memory

The present invention discloses a configurable computing array based on three-dimensional printed memory (3d-p). It comprises an array of configurable computing elements, an array of configurable logic elements and a plurality of configurable interconnects. ... Chengdu Haicun Ip Technology Llc

Configurable gate array comprising three-dimensional printed memory

The present invention discloses a configurable gate array comprising three-dimensional printed memory (3d-p). It comprises an array of configurable computing elements, an array of configurable logic elements and a plurality of configurable interconnects. ... Chengdu Haicun Ip Technology Llc

Three-dimensional vertical multiple-time-programmable memory comprising no separate diode layer

The present invention discloses a three-dimensional vertical multiple-time-programmable memory (3d-mtpv) comprising no separate diode layer. It comprises a plurality of vertically stacked horizontal address lines, at least a memory hole through the horizontal address lines, a memory layer and a vertical address line disposed in the memory hole. ... Chengdu Haicun Ip Technology Llc

Storage with in-situ string-searching capabilities

The present invention discloses a three-dimensional memory (3d-m) with in-situ string-searching capabilities (3d-mss). It comprises a plurality of storage-processing units (spu). ... Chengdu Haicun Ip Technology Llc

Storage with in-situ anti-malware capabilities

The present invention discloses a three-dimensional memory (3d-m) with in-situ anti-malware capabilities (3d-mam). It comprises a plurality of storage-processing units (spu). ... Chengdu Haicun Ip Technology Llc

Three-dimensional vertical one-time-programmable memory comprising no separate diode layer

The present invention discloses a three-dimensional vertical read-only memory (3d-otpv) comprising no separate diode layer. It comprises a plurality of vertical address line, a plurality of memory holes through said vertical address line, a plurality of antifuse layers and vertical address lines in said memory holes. ... Chengdu Haicun Ip Technology Llc

Configurable computing-array package

The present invention discloses a configurable computing-array package. It comprises a configurable computing die including an array of configurable computing elements and a configurable logic die including an array of configurable logic elements. ... Chengdu Haicun Ip Technology Llc

Configurable computing array using two-sided integration

The present invention discloses a configurable computing array using two-sided integration. It is a monolithic integrated circuit comprising at least a configurable computing element located on one side of the substrate and at least a configurable logic element on the other side of the substrate. ... Chengdu Haicun Ip Technology Llc

Configurable computing array based on three-dimensional vertical writable memory

The present invention discloses a configurable computing array. It is a monolithic integrated circuit comprising at least a configurable computing element and a configurable logic element. ... Chengdu Haicun Ip Technology Llc

Configurable computing array

The present invention discloses a configurable computing array. It comprises an array of configurable computing elements and an array of configurable logic elements. ... Chengdu Haicun Ip Technology Llc

Configurable computing array comprising three-dimensional writable memory

The present invention discloses a configurable computing array comprising three-dimensional writable memory (3d-w). It is a monolithic integrated circuit comprising an array of configurable computing elements, an array of configurable logic elements and an array of configurable interconnects. ... Chengdu Haicun Ip Technology Llc

Processor for enhancing network security

The present invention discloses a processor for enhancing network security, i.e. A three-dimensional (3-d) security processor. ... Chengdu Haicun Ip Technology Llc

Processor for enhancing computer security

The present invention discloses a processor for enhancing computer security, i.e. A three-dimensional (3-d) security processor. ... Chengdu Haicun Ip Technology Llc

11/16/17 / #20170329548

Processor for realizing at least two categories of functions

The present invention discloses a first preferred processor comprising a fixed look-up table circuit (ltc) and a writable ltc. The fixed ltc realizes at least a common function while the writable ltc realizes at least a non-common function. ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170323042

Simulation processor with backside look-up table

The present invention discloses a simulation processor for simulating a system comprising a system component. The simulation processor comprises a look-up table circuit (lut) and an arithmetic logic circuit (alc). ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170323041

Simulation processor with in-package look-up table

The present invention discloses a simulation processor for simulating a system comprising a system component. The simulation processor comprises a memory die and a logic die. ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170322906

Processor with in-package look-up table

The present invention discloses a processor for computing a mathematical function. The processor comprises a memory die and a logic die. ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170322774

Configurable processor with backside look-up table

The present invention discloses a configurable processor with a backside look-up table. The configurable processor comprises a look-up table circuit (lut) on the backside of the processor substrate and an arithmetic logic circuit (alc) on the front side of the processor substrate. ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170322771

Configurable processor with in-package look-up table

The present invention discloses a configurable processor with an in-package look-up table. The configurable processor comprises a programmable memory die and a logic die located in a same package. ... Chengdu Haicun Ip Technology Llc

11/09/17 / #20170322770

Processor with backside look-up table

The present invention discloses a processor for computing a mathematical function. The processor comprises a look-up table circuit (lut) and an arithmetic logic circuit (alc). ... Chengdu Haicun Ip Technology Llc

10/05/17 / #20170289351

Night detection of side-by-side parked vehicles

To detect side-by-side parked vehicles at night, the present invention discloses a night-detection device and method. The night-detection device comprises a moving-vehicle sensor and a parked-vehicle sensor. ... Chengdu Haicun Ip Technology Llc

09/07/17 / #20170255921

Mobile vending machine

The present invention discloses a mobile vending machine and the associated card-rental method for long-distance travels. The mobile vending machine contains a large number of content cards (e.g. ... Chengdu Haicun Ip Technology Llc

09/07/17 / #20170255516

Field-repair system and method of mask-programmed read-only memory

The present invention discloses field-repair system and method for a mask-programmed memory (mask-rom). The mask-rom data are encoded with an error-checking-and-correction (ecc) scheme. ... Chengdu Haicun Ip Technology Llc

08/03/17 / #20170221528

Compact three-dimensional memory with semi-conductive address line portion

In a compact three-dimensional memory (3d-mc), a memory array and an above-substrate decoding stage thereof are formed on a same memory level. For the memory devices in the memory array, the overlap portion and the non-overlap portions of the x-line are both highly-conductive; for the decoding device in the above-substrate decoding stage, while the non-overlap portions are still highly-conductive, the overlap portion is semi-conductive.. ... Chengdu Haicun Ip Technology Llc

07/06/17 / #20170194379

Manufacturing methods of mosfet-type compact three-dimensional memory

Manufacturing methods of mosfet-type compact three-dimensional memory (3d-mc) are disclosed. In a memory level stacked above the substrate, an x-line extends from a memory array to an above-substrate decoding stage. ... Chengdu Haicun Ip Technology Llc

04/20/17 / #20170110463

Imprinted memory

Although photolithography is the preferred pattern-transfer method for even the 10 nm electrically-programmable memory (epm, which comprises only periodic patterns), imprint-lithography is the preferred method to form the sub-25 nm printed memory (which comprises at least one non-periodic data-pattern). Accordingly, the present invention discloses an imprinted memory.. ... Chengdu Haicun Ip Technology Llc

04/06/17 / #20170098651

Offset-printing method for three-dimensional package

The present invention discloses an offset-printing method for a three-dimensional 3d-op (three-dimensional offset-printed memory)-based package. The mask-patterns for different 3d-op dice are merged onto a same data-mask. ... Chengdu Haicun Ip Technology Llc

04/06/17 / #20170098632

Three-dimensional 3d-op-based package

The present invention discloses a three-dimensional 3d-op (three-dimensional offset-printed memory)-based package (3d2-op). The mask-patterns for different dice in a same 3d2-op package are merged onto a same data-mask. ... Chengdu Haicun Ip Technology Llc

01/26/17 / #20170025389

Three-dimensional mask-programmed read-only memory with reserved space

The present invention discloses a 3d-mprom with reserved level (3d-mpromrl). Versions of the 3d-mpromrl, including an original 3d-mpromrl and at least an updated 3d-mpromrl, collectively form a 3d-mpromrl family. ... Chengdu Haicun Ip Technology Llc

01/26/17 / #20170024330

Secure printed memory

The present invention discloses a secure printed memory. It comprises a laser-programmable read-only memory (lp-rom) which stores at least a key. ... Chengdu Haicun Ip Technology Llc








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