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Chipbond Technology Corporation patents

Recent patent applications related to Chipbond Technology Corporation. Chipbond Technology Corporation is listed as an Agent/Assignee. Note: Chipbond Technology Corporation may have other listings under different names/spellings. We're not affiliated with Chipbond Technology Corporation, we're just tracking patents.

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Wafer cassette

A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.. ... Chipbond Technology Corporation

Wafer dicing method

A wafer dicing method comprises providing a wafer and performing a cutting procedure and a contacting procedure. The wafer includes a plurality of dies and a metal layer, wherein the metal layer is formed on a scribe line which is formed between adjacent dies. ... Chipbond Technology Corporation

Flexible substrate

A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. ... Chipbond Technology Corporation

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Chipbond Technology Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Chipbond Technology Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by