Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Deca Technologies Inc patents


Recent patent applications related to Deca Technologies Inc. Deca Technologies Inc is listed as an Agent/Assignee. Note: Deca Technologies Inc may have other listings under different names/spellings. We're not affiliated with Deca Technologies Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Deca Technologies Inc-related inventors


Semiconductor device and method of packaging

A semiconductor device may comprise a semiconductor die comprising an active surface and contact pads disposed. Conductive interconnects comprising first ends may be coupled to the contact pads and second ends may be disposed opposite the first ends. ... Deca Technologies Inc

Fully molded miniaturized semiconductor module

A semiconductor module can comprise a fully molded base portion comprising a planar surface that further comprises a semiconductor die comprising contact pads, conductive pillars coupled to the contact pads and extending to the planar surface, and an encapsulant material disposed over the active surface, four side surfaces, and around the conductive pillars, wherein ends of the conductive pillars are exposed from the encapsulant material at the planar surface of the fully molded base portion. A build-up interconnect structure comprising a routing layer can be disposed over the fully molded base portion. ... Deca Technologies Inc

Semiconductor device and method of unit specific progressive alignment

A semiconductor device and method can comprise measuring a true position of each of a plurality of semiconductor die within an embedded die panel and determining a total radial shift of each of the plurality of semiconductor die. The total radial shift of each of the plurality of semiconductor die can be distributed to two or more layers for each of the plurality of semiconductor die by assigning a portion of the total radial shift to each of the layers according to a priority list to form a distributed radial shift for each of the layers. ... Deca Technologies Inc

Thermally enhanced fully molded fan-out module

A method of making a semiconductor device can include providing a temporary carrier with adhesive. A first semiconductor die and a second semiconductor die can be mounted face up to the temporary carrier such that back surfaces of the first semiconductor die and the second semiconductor die are depressed within the adhesive. ... Deca Technologies Inc

Semiconductor device and method comprising redistribution layers

A method of making a semiconductor package can include placing a single layer dielectric film on a temporary carrier substrate. A plurality of semiconductor die can be placed directly on the first surface of the single layer dielectric film. ... Deca Technologies Inc

Automated optical inspection of unit specific patterning

An automated optical inspection (aoi) system can comprise aligning a wafer comprising a plurality of unit specific patterns. A plurality of unique reference standards can be created as a plurality of electrical nets by generating with a computer an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point. ... Deca Technologies Inc

Fully molded peripheral package on package device

A method of making a semiconductor device can include providing a temporary carrier with a semiconductor die mounting site, and forming conductive interconnects over the temporary carrier in a periphery of the semiconductor die mounting site. A semiconductor die can be mounted at the semiconductor die mounting site. ... Deca Technologies Inc

Semiconductor device processing method for material removal

A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. ... Deca Technologies Inc

Method of marking a semiconductor package

A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. A photosensitive layer can be formed over the wafer and on a backside of each of the plurality of semiconductor die within the wafer with a coating machine. ... Deca Technologies Inc

Multi-die package comprising unit specific alignment and unit specific routing

A method of making a semiconductor device can include forming an embedded die panel by encapsulating a first semiconductor die and a second semiconductor die with conductive interconnects in a single step. An actual position of the first semiconductor die and second semiconductor die can be measured within the embedded die panel. ... Deca Technologies Inc

Thermally enhanced fully molded fan-out module

A method of making a semiconductor device can include providing a temporary carrier with adhesive. A first semiconductor die and a second semiconductor die can be mounted face up to the temporary carrier such that back surfaces of the first semiconductor die and the second semiconductor die are depressed within the adhesive. ... Deca Technologies Inc

Fully molded miniaturized semiconductor module

A semiconductor module can comprise a fully molded base portion comprising a planar surface that further comprises a semiconductor die comprising contact pads, conductive pillars coupled to the contact pads and extending to the planar surface, and an encapsulant material disposed over the active surface, four side surfaces, and around the conductive pillars, wherein ends of the conductive pillars are exposed from the encapsulant material at the planar surface of the fully molded base portion. A build-up interconnect structure comprising a routing layer can be disposed over the fully molded base portion. ... Deca Technologies Inc

Semiconductor device and method comprising redistribution layers

A method of making a semiconductor package can include placing a single layer dielectric film on a temporary carrier substrate. A plurality of semiconductor die can be placed directly on the first surface of the single layer dielectric film. ... Deca Technologies Inc

Semiconductor device processing method for material removal

A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. ... Deca Technologies Inc








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Deca Technologies Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Deca Technologies Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###