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Disco Corporation patents


Recent patent applications related to Disco Corporation. Disco Corporation is listed as an Agent/Assignee. Note: Disco Corporation may have other listings under different names/spellings. We're not affiliated with Disco Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Disco Corporation-related inventors


Processing method of wafer

A processing method of a wafer includes a cut groove forming step of carrying out cutting with a cutting blade along streets from the back surface of the wafer to form cut grooves, a wafer dividing step of irradiating the wafer with a laser beam along the cut grooves and dividing the wafer into individual chips after the cut groove forming step is carried out, and a die bonding layer disposing step of applying a liquid die bonding agent on the back surface of the wafer and curing it to form the chips on which die bonding layers are formed on the back surface. According to the processing method of the present invention, the occurrence of clogging in the cutting blade and generation of a burr or the like in the die bonding layers can be prevented.. ... Disco Corporation

Modulators of myocyte lipid accumulation and insulin resistance and methods of use thereof

Formulations and methods for reducing blood glucose and/or increasing insulin signaling in a subject have been developed. The formulations include sbi-477 and compounds based on sbi-477 i.e., sbi-477 analogs (collectively, sbi-477 compounds) and/or mondo family inhibitors, in an effective amount to inhibit intracellular lipid accumulation and/or increase cellular glucose uptake when compared to levels in a control subject not administered the composition. ... Disco Corporation

Processing method of workpiece

A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark.. ... Disco Corporation

Processing apparatus

A processing apparatus includes a cassette rest unit from which a wafer is fed by an unloading unit and a feed unit to a plurality of processing units, in which the layout of the units can be changed. The processing unit also has a control unit including a display panel for displaying an input screen for entering operating conditions for the units and a memory unit configured to store at least the operating conditions for the units. ... Disco Corporation

Sic wafer producing method

A method for producing a wafer from an ingot of single crystal sic includes an end surface planarizing step of planarizing an end surface of the ingot, a separation layer forming step of setting a focal point of a laser beam having a transmission wavelength to single crystal sic inside the ingot at a predetermined depth from the end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the laser beam to the ingot to thereby form a separation layer for separating the wafer from the ingot, a hard plate providing step of providing a hard plate through an adhesive on the end surface of the ingot in which the separation layer has been formed, and a separating step of separating the wafer with the hard plate from the ingot along the separation layer.. . ... Disco Corporation

Determining method, measuring apparatus, and adhesive tape attaching apparatus

A determining method for determining whether or not the tension of an adhesive tape constituting a frame unit is proper, in which a plate-shaped workpiece and an annular frame are attached to the adhesive tape to form the frame unit, is provided. The adhesive tape is composed of a base layer and an adhesive layer formed on the base layer. ... Disco Corporation

Method of using laminated dressing board

A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. ... Disco Corporation

Laser processing apparatus

A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an x-axis moving unit that moves the chuck table in an x-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. ... Disco Corporation

Laser processing apparatus

Disclosed herein is a laser processing apparatus for forming a separation layer inside an ingot by applying a laser beam to an end surface of the ingot in the condition where the focal point of the laser beam is set inside the ingot, the laser beam having a transmission wavelength to the ingot. The laser processing apparatus includes a holding unit for holding the ingot, a moving unit for moving the holding unit in a direction parallel to the end surface of the ingot held by the holding unit, a laser beam applying unit for applying the laser beam to the ingot held by the holding unit, an imaging unit for detecting the position of the ingot in the direction parallel to the end surface of the ingot, and a height detecting unit for detecting the height of the end surface of the ingot held by the holding unit.. ... Disco Corporation

Optical device wafer processing method

An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device chips includes applying a laser beam to a wafer substrate along each division line to thereby form a laser processed groove along each division line, and next forming a v groove along each laser processed groove on the optical device wafer by using a cutting blade having a v-shaped tip in the condition where each laser processed groove is removed by the cutting blade. A crack is formed so as to extend from the bottom of each laser processed groove due to a load applied from the cutting blade, thereby dividing the optical device wafer into the individual device chips. ... Disco Corporation

Method of manufacturing semiconductor package

Disclosed herein is a method of manufacturing a semiconductor package including a semiconductor chip sealed by a sealing synthetic resin. The method includes preparing a wiring board in which upstanding encircling walls with side-surface shield layers embedded therein surround mounts on which semiconductor chips are to be mounted, mounting the semiconductor chips on the mounts surrounded by the upstanding encircling walls on the wiring board, supplying a sealing synthetic resin to spaces surrounded by the upstanding encircling walls thereby to produce an sealed board, dividing the sealed board along projected dicing lines into individual semiconductor packages, and forming an upper-surface shield layer for blocking electromagnetic waves on the semiconductor packages.. ... Disco Corporation

Method of processing a wafer and wafer processing system

A method of processing a wafer having a plurality of devices partitioned by division lines, including attaching the wafer to an adhesive tape supported by a first annular frame, dividing the wafer along the division lines into a plurality of dies, and placing the wafer (and the adhesive tape) on a support surface of a support member before or after dividing the wafer, wherein an outer diameter of the support member in the plane of the support surface is smaller than an inner diameter of the first annular frame. The method also includes moving the first annular frame and at least a peripheral part of the support member relative to each other to radially expand the adhesive tape, thereby moving the dies away from each other, and attaching a second annular frame to a portion of the expanded adhesive tape arranged at the peripheral part of the support member.. ... Disco Corporation

Laser processing apparatus

A laser processing apparatus includes: a chuck table that holds a packaged wafer; a laser beam applying unit that applies a pulsed laser beam to the packaged wafer; x-axis moving unit for moving the chuck table in an x-axis direction; an imaging unit that images the packaged wafer; and a control unit. The chuck table has a transparent or semi-transparent holding member and a light emitting body. ... Disco Corporation

Cutting apparatus

A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. ... Disco Corporation

07/26/18 / #20180211324

Dynamic adjustment of an annuity based on wellness monitoring of a participant

A computer-implemented method, system and computer program product for dynamic adjustment of an annuity based on wellness monitoring of a participant is described. Investment data is accessed including capital amount data relating to a capital amount to be invested for the person, investment selection data relating to an investment selection of how the capital amount is to be invested, and periodic payment amount relating to the selected periodic payment amount to be paid to the person. ... Disco Corporation

07/26/18 / #20180209783

Spot shape detection apparatus

A spot shape detection apparatus for detecting the spot shape of a laser beam oscillated from a laser oscillator includes: a focusing leans for focusing the laser beam oscillated by the oscillator; a rotary body (mirror holder) in which a plurality of mirrors for reflecting the laser beam having passed through the focusing lens are disposed on concentric circles; a drive source (motor) for rotating the rotary body at a predetermined period; a beam splitter for branching return beams of the laser beam reflected by the plurality of mirrors of the rotary body; an imaging unit which is disposed in a direction in which the return beams are branched by the beam splitter and which images spot shapes of the return beams; and a display unit for displaying images obtained by imaging by the imaging unit, in relation with the plurality of mirrors.. . ... Disco Corporation

07/26/18 / #20180208605

Substituted aza compounds as irak-4 inhibitors

The present invention provides substituted aza compounds of formula (i) or (ii) and pharmaceutically acceptable salts thereof, and their use to inhibit irak-4 and/or for the treatment of diseases or disorders induced by irak-4.. . ... Disco Corporation

07/26/18 / #20180208391

Container for icecream

A container for ice cream according to an exemplary embodiment of the present disclosure is an ice cream container having an inner space, in which ice cream is stored, formed by coupling between a container part and a cap part, and the container for ice cream includes: a container part which is formed of a material obtained by mixing polyethylene terephthalate (pet) and silicone resin in order to endow the same with elasticity and has a first coupling flange formed on the periphery thereof and a first grip portion formed on one side thereof; and a cap part which has a second coupling flange corresponding to the first coupling flange and has a second grip portion corresponding to the first grip portion and thus corresponds to the container part.. . ... Disco Corporation

07/19/18 / #20180204818

Manufacturing method for package device

A manufacturing method for a package device includes a chip preparation step of preparing a device chip that includes an adhesive layer, a mounting substrate preparation step of preparing a mounting substrate that has a chip adhesion region to which the device chip is to be adhered, an electrode portion to be connected to the device chip, and a stepped portion formed between the chip adhesion region and the electrode portion, a mounting step of adhering the device chip to the chip adhesion region of the mounting substrate, a hardening step of hardening the adhesive layer, a connection step of electrically connecting the device chip and the electrode portion by a wire, and a molding step of covering the device chip and the wire with mold resin.. . ... Disco Corporation

07/19/18 / #20180204771

Method of processing a substrate

A method of processing a substrate, having a first surface with at least one division line formed thereon and a second surface opposite the first surface, includes applying a pulsed laser beam to the substrate from the side of the first surface, at least in a plurality of positions along the at least one division line, so as to form a plurality of modified regions in the substrate, each modified region extending at least from the first surface towards the second surface. Each modified region is formed by melting substrate material by means of the pulsed laser beam and allowing the molten substrate material to resolidify. ... Disco Corporation

07/19/18 / #20180204752

Frame unit transfer system

Disclosed herein is a frame unit transfer system for transferring a frame unit formed by supporting a workpiece through an adhesive tape to an annular frame, the frame unit being stored in a tray during transfer. The tray includes a bottom portion having a mounting surface for mounting the frame unit thereon during transfer, a side wall standing from the outer edge of the bottom portion, an inlet/outlet opening formed through the side wall so as to allow the pass of the frame unit, an abutting member provided on the bottom portion at the inlet/outlet opening for preventing the frame unit mounted on the mounting surface of the bottom portion from undesirably projecting from the inlet/outlet opening during transfer, and a plurality of openings formed at predetermined target positions in the bottom portion in relation to the frame unit.. ... Disco Corporation

07/19/18 / #20180204746

Grinding apparatus

Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. ... Disco Corporation

07/19/18 / #20180201984

Magnetic base for collection and release of paramagnetic particles

Provided herein are devices, systems, and methods for magnetic purification of sample components. In particular, provided herein are device bases, systems, and methods for manipulating magnetic particles.. ... Disco Corporation

07/19/18 / #20180201609

Indazole and azaindazole compounds as irak-4 inhibitors

The present invention provides indazole and aza indazole compounds of formula (i) or (ii) and pharmaceutically acceptable salts thereof, and their use to inhibit irak-4 and/or for the treatment of diseases or disorders induced by irak-4.. . ... Disco Corporation

07/19/18 / #20180200866

Dressing board, cutting blade dressing method, and cutting apparatus

Disclosed herein is a dressing board for dressing a cutting blade. The dressing board is held on a chuck table in dressing the cutting blade. ... Disco Corporation

07/19/18 / #20180200865

Method of detecting clogging of chuck table and processing apparatus

A method of detecting clogging of a chuck table includes an imaging step of capturing an image of a holding surface of the chuck table while air and water are being ejected to the holding surface of the chuck table, an image processing step of binarizing the captured image into a binary image, and a decision step of deciding a clogged ratio of the chuck table on the basis of the binary image.. . ... Disco Corporation

07/19/18 / #20180200830

Method of processing workpiece

Disclosed herein is a method of processing a workpiece having a plurality of streets provided on a face side thereof, the method including: a laser beam applying step of applying a laser beam having a wavelength that is transmittable through the workpiece along the streets while focusing the laser beam at a point within the workpiece, thereby forming modified layers in the workpiece along the streets and cracks extending from the modified layers to the face side; and a cutting step of, thereafter, cutting the workpiece from a reverse side thereof along the streets while supplying the workpiece with a cutting fluid, thereby removing the modified layers from the workpiece.. . ... Disco Corporation

07/19/18 / #20180200247

Substituted tetrahydroquinolinone compounds as ror gamma modulators

The present invention provides substituted tetrahydroquinolinone and related compounds of formula (i), which are therapeutically useful as modulators of retinoic acid receptor-related orphan receptors (rors), more particularly as rorγ modulators. These compounds are useful in the treatment and prevention of diseases and/or disorder, in particular their use in diseases and/or disorder mediated by rorγ receptor. ... Disco Corporation

07/12/18 / #20180197823

Semiconductor device chip and method of manufacturing semiconductor device chip

A semiconductor device chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a semiconductor device disposed on the first surface of the semiconductor substrate, an interconnect pattern having an end connected to the semiconductor device and another end exposed on a surface of a function layer disposed on the first surface of the semiconductor substrate, plurality of external connection electrodes mounted on the surface of the function layer and electrically connected to the other end of the interconnect pattern, an electromagnetic wave shield film for shielding electromagnetic waves, which is disposed on the second surface of the semiconductor substrate and side surfaces of the function layer, and a ground interconnect electrically connected to the electromagnetic shield film and disposed on the function layer.. . ... Disco Corporation

07/12/18 / #20180197776

Resin package substrate processing method

Disclosed herein is a resin package substrate processing method for processing a resin package substrate including a mold resin in which a filler is mixed. The resin package substrate processing method includes a fixing step of fixing the resin package substrate through an adhesive tape to an annular frame, a dividing step of applying a laser beam having an absorption wavelength to the mold resin of the resin package substrate, to the mold resin to thereby form a plurality of division grooves dividing the resin package substrate into a plurality of package device chips, an interchip distance increasing step of expanding the adhesive tape to thereby increase the distance between any adjacent ones of the plural package device chips of the resin package substrate, and a cleaning step of supplying a cleaning liquid to the resin package substrate to thereby remove the filler caught between the adjacent package device chips.. ... Disco Corporation

07/12/18 / #20180197765

Wafer processing method and adhesive tape

Disclosed is a wafer processing method for dividing a wafer into individual chips by applying to the wafer a laser beam having such a wavelength as to be absorbed in the wafer. The wafer processing method includes: an adhesive tape attaching step of attaching to the wafer an adhesive tape that emits plasma light different from plasma light emitted by the wafer upon application of a laser light thereto; a holding step of holding the adhesive tape side on the chuck table so as to expose the wafer; a dividing step of dividing the wafer while relatively moving the chuck table and the laser beam; and a plasma light detection step of detecting the plasma light generated at the time of the dividing step.. ... Disco Corporation

07/05/18 / #20180186890

Anti-cd276 antibodies (b7h3)

Polypeptides and proteins that specifically bind to and immunologically recognize cd276 are disclosed. Chimeric n antigen receptors (cars), anti-cd276 binding moieties, nucleic acids, recombinant expression vectors, host cells, populations of cells, pharmaceutical compositions, and conjugates relating to the polypeptides and proteins are also disclosed. ... Disco Corporation

07/05/18 / #20180186796

Compounds and uses thereof

The present invention refers to 4-amino-substituted pyrazolo[3,4-d]pyrimidine and pyrrolo[2,3-d]pyrimidine derivatives of formula i and iv able to target the src family kinases (sfks) such as src, fyn and hck tyrosine kinases as well as abl tyrosine kinase and uses and method of preparation thereof. In particular, the compounds of the invention are for use in the treatment and/or prevention of cancer, such as neuroblastoma (nb) or glioblastoma multiforme (gbm) or for use in the treatment and/or prevention of neurodegenerative diseases such as taupathies.. ... Disco Corporation

06/28/18 / #20180182715

Semiconductor package manufacturing method

A plurality of semiconductor packages are manufactured by a method that includes the steps of bonding a plurality of semiconductor chips on the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to form a resin layer from the sealing component on the front side of the wiring substrate, thereby forming a sealed substrate including the wiring substrate and the resin layer covering the semiconductor chips, next cutting the sealed substrate from the resin layer side by using a v blade to thereby form a v groove along each division line, next dividing the wiring substrate along each v groove to obtain a plurality of individual bare packages, and finally forming an electromagnetic shield layer on the upper surface and an inclined side surface of each bare package, thereby obtaining the plural semiconductor packages.. . ... Disco Corporation

06/21/18 / #20180176601

Method for encoding and decoding image using adaptive deblocking filtering, and apparatus therefor

Disclosed is an encoding/decoding method and apparatus related to adaptive deblocking filtering. There is provided an image decoding method performing adaptive filtering in inter-prediction, the method including: reconstructing, from a bitstream, an image signal including a reference block on which block matching is performed in inter-prediction of a current block to be encoded; obtaining, from the bitstream, a flag indicating whether the reference block exists within a current picture where the current block is positioned; reconstructing the current block by using the reference block; adaptively applying an in-loop filter for the reconstructed current block based on the obtained flag; and storing the current block to which the in-loop filter is or is not applied in a decoded picture buffer (dpb).. ... Disco Corporation

06/21/18 / #20180176596

Image encoding and decoding method and image decoding device

Disclosed are an image encoding and decoding method and an image decoding device for selecting a prediction candidate from reference blocks of a reference picture, which includes a current picture, and using the selected prediction candidate so as to derive motion information on a current block during image encoding and decoding. The image encoding and decoding method includes the steps of: configuring a spatial motion vector candidate; determining whether the reference picture of the current block is present within the current picture; and adding a spatial motion vector candidate in other block of the current picture encoded before the current block, when the reference picture of the current block is present within the current picture.. ... Disco Corporation

06/21/18 / #20180174684

Artificial intelligence expert system

Systems and methods are disclosed that access over a network a set of codes and respective code descriptions from a first data store. Course data for courses is accessed over a network from a second data store. ... Disco Corporation

06/21/18 / #20180168210

Natural stilbenes as sweeteners or sweetener enhancer

Suggested are compositions comprising natural stilbenes as a sweetener or sweetener enhancer in preparations and compositions, especially oral edible compositions comprising them.. . ... Disco Corporation

06/14/18 / #20180166355

Interposer manufacturing method

A plurality of interposers are made from a material substrate. The material substrate includes a glass substrate partitioned by a plurality of crossing division lines to define a plurality of separate regions. ... Disco Corporation

06/14/18 / #20180166282

Wafer processing method

Disclosed herein is a wafer processing method including a protective film forming step of forming a protective film with which the whole of a surface of a wafer is coated, a laser beam irradiation step of irradiating the wafer with a laser beam along streets to remove a functional layer and expose a substrate, a protective film detecting step of detecting the coating state of the protective film in plural device regions over the wafer after the laser beam irradiation, a protective film re-forming step of forming the protective film again in such a manner that the protective film covers each device region if a part that is not coated with the protective film exists in the device regions, a plasma irradiation step of carrying out plasma irradiation for the wafer, and a dividing step of dividing the wafer by cutting along the streets.. . ... Disco Corporation

06/14/18 / #20180162878

Anti-pulmonary tuberculosis nitroimidazole derivative

Disclosed is a substituted nitroimidazole derivative, which is mainly used for treating related diseases caused by mycobacterial infections, such as mycobacterium tuberculosis, especially being suitable for diseases caused by resistant mycobacterium tuberculosis.. . ... Disco Corporation

06/14/18 / #20180161927

Laser processing apparatus

Disclosed herein is a laser processing apparatus that includes a cassette table for placing thereon a cassette in which a plurality of workpieces are accommodated, a carrying-out unit for carrying out the workpiece from the cassette placed on the cassette table, an x-axis direction moving unit for processing feed of a chuck table in the x-axis direction, a y-axis direction moving unit for indexing feed of the chuck table in a y-axis direction orthogonal to the x-axis direction, and a laser beam applying unit having a focusing unit for applying a laser beam to the workpiece held on the chuck table.. . ... Disco Corporation

06/14/18 / #20180161921

Substrate processing method

A substrate has a first surface with at least one division line formed thereon and a second surface opposite the first surface. The substrate is processed by applying a pulsed laser beam from the side of the first surface. ... Disco Corporation

06/14/18 / #20180161920

Laser processing apparatus

Disclosed herein is a laser processing apparatus for processing a plate-shaped workpiece by applying a laser beam to the workpiece. The laser processing apparatus includes a cassette table for placing thereon a cassette in which a plurality of workpieces are accommodated, a carrying-out unit for carrying out the workpiece from the cassette placed on the cassette table, and a laser beam applying unit including a focusing unit for applying the laser beam to the workpiece held on the chuck table. ... Disco Corporation

06/14/18 / #20180161919

Dividing method of workpiece and laser processing apparatus

Disclosed herein is a dividing method of a workpiece including a dicing tape sticking step of sticking a dicing tape to the workpiece, a first laser processing step of irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves, a first expanding step of expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves, a second laser processing step of irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step of expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.. . ... Disco Corporation

06/07/18 / #20180160113

Method and device for encoding and decoding intra-frame prediction

A method and a device for encoding and decoding intra prediction are disclosed. An image decoding method for performing intra prediction comprises the steps of: receiving a bitstream including data on prediction modes of a current block and a block adjacent to the current block; extracting the data from the received bitstream so as to confirm the prediction mode of the adjacent block; determining whether a boundary pixel within the adjacent block can be used as a reference pixel for the current block in consideration of the prediction mode of the adjacent block; obtaining the reference pixel of the current block according to the determined result; generating a prediction block predicted in the frame on the basis of the obtained reference pixel; and decoding the current block by using the generated prediction block.. ... Disco Corporation

06/07/18 / #20180159172

Solid electrolyte compositions for electrochemical cells

A solid-state electrolyte including an ion-conducting inorganic material represented by the formula li1+yzr2−xmex(po4)3 where 2>x>0, 0.2>y>−0.2, and me is at least one element from group 14, group 6, group 5, or combinations thereof.. . ... Disco Corporation

06/07/18 / #20180158675

Cleaning method

A method of cleaning an object that includes a plurality of chips divided individually, starting from modified layers, and integral with a holding member, includes the steps of placing the object in a cleaning tank filled with a cleaning liquid which contains a surface active agent, and cleaning away modified layer debris on side faces of the chips with ultrasonic waves generated by ultrasonic oscillating means.. . ... Disco Corporation

06/07/18 / #20180155706

Method and device for disaggregation via heterogeneous particles

A method and a device are provided for facilitating the disaggregation of a plurality of solid phase substrate as the plurality of solid phase substrate are transferred from a first location to a second location. A plurality of solid phase substrate are deposited at the first location and a plurality of particles are added to the plurality of solid phase substrate. ... Disco Corporation

06/07/18 / #20180155293

Substituted heterocyclyl derivatives as cdk inhibitors

The present invention provides substituted heterocyclyl derivatives of formula (i), which are therapeutically useful, particularly as selective transcriptional cdk inhibitors including cdk7, cdk9, cdk12, cdk13 and cdk18, more particularly transcriptional cdk7 inhibitors. These compounds are useful in the treatment and prevention of diseases and/or disorders associated with selective transcriptional cdks in a mammal. ... Disco Corporation

06/07/18 / #20180154543

Sic wafer producing method

A sic wafer producing method produces an sic wafer from a single crystal sic ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal sic inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where sic has been decomposed into si and c, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.. ... Disco Corporation

06/07/18 / #20180154542

Sic wafer producting method

An sic wafer producing method includes setting a focal point of a pulsed laser beam to a single crystal sic inside an ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. The pulsed laser beam is applied to the ingot, thereby forming a small circular modified portion on a c-plane present in the ingot at the predetermined depth, in which the modified portion is a region where sic has been decomposed into si and c. ... Disco Corporation

06/07/18 / #20180153893

Therapeutic compositions containing dipyridamole, treatment packs and kits including such compositions and methods for producing same

A method comprising: (a) identifying a subject in need of treatment for cataract and/or nevus and/or tumor lesion; and (b) topically administering to the eye an amount of dipyridamole which is physiologically effective in treatment of cataract and/or nevus and/or melanoma.. . ... Disco Corporation

05/31/18 / #20180151773

Led assembling method

Led module chips are assembled by preparing red, green and blue led substrates in regions partitioned at predetermined intervals. A module substrate has on its upper face a plurality of module chips each having an accommodation region for accommodating the red, green and blue leds therein. ... Disco Corporation

05/31/18 / #20180151508

Wafer processing method

A wafer processing method for processing a wafer has a front side and a back side, the front side of the wafer being formed with a plurality of crossing streets for defining a plurality of separate regions where a plurality of devices are individually formed. The wafer processing method includes the steps of first attaching a protective tape to the front side of the wafer, next heating the protective tape and the wafer, next applying a laser beam having a transmission wavelength to the wafer to the back side of the wafer along the streets, thereby forming a modified layer inside the wafer along each street, and next grinding the back side of the wafer, thereby reducing a thickness of the wafer to a predetermined thickness and also dividing the wafer into individual chips along each street where the modified layer is formed as a division start point.. ... Disco Corporation

05/31/18 / #20180151370

Wafer processing method

A processing method for a wafer having a plurality of streets inclined at 45° relative to a cleavage direction including a laser processing step of positioning a focusing point of a laser beam with a wavelength as to be transmitted through the wafer in the inside of the wafer, and applying the laser beam along the streets to form a plurality of modified layers, overlapping with one another in the wafer thickness direction, inside the wafer along each of the streets. In the laser processing step, m modified layers (m is a natural number not less than n·√2) are formed overlapping with one another in the wafer thickness direction, where n (n is a natural number) is the number of modified layers needing to be formed overlapping with one another in a wafer thickness direction when dividing a wafer having a plurality of streets parallel to a cleavage direction.. ... Disco Corporation

05/31/18 / #20180148452

Toll-like receptor-7 agonist

Disclosed are a novel pyrrolopyrimidine ring compound as a tlr7 agonist or a pharmaceutically acceptable salt thereof, used for preventing or treating allergic rhinitis and asthma. In particular, disclosed is a compound represented by formula (i) or a pharmaceutically acceptable salt thereof.. ... Disco Corporation

05/24/18 / #20180145325

High energy cathodes for lithium ion batteries

. . An electrode formed from a material represented by li1−xmxco1−ym′yo2−d where 0<x≤0.2, 0≤y<1, and 0<d≤0.2. M and m′ each independently comprises a metal selected from the group consisting of transition metals, group i elements, and group ii elements.. ... Disco Corporation

05/24/18 / #20180144983

Device wafer processing method

Disclosed herein is a device wafer processing method including a protective film forming step of applying a water-soluble protective film material to the front side of a device wafer having devices separated by division lines and next exposing the division lines to form a protective film for protecting each device, an application time recording step of recording the time at which the water-soluble protective film material is applied to the device wafer, a determining step of determining whether or not a predetermined duration has elapsed from the time recorded in the application time recording step, an etching step of dry-etching the device wafer along the division lines after performing the determining step, and a protective film removing step of supplying a cleaning water to the protective film to thereby remove the protective film after performing the etching step. Only when it is determined in the determining step that the predetermined duration has not elapsed, the etching step is performed.. ... Disco Corporation

05/24/18 / #20180144981

Device chip package manufacturing method

Disclosed herein is a device chip package manufacturing method including a cutting step of forming cut grooves having a depth reaching a finished thickness of device chips by cutting a device wafer from a top surface of the device wafer along streets by a cutting blade, a cut groove inclination state detecting step of detecting an inclination state of the cut grooves, a sealing resin layer forming step of forming a sealing resin layer coating the top surface and the cut grooves of the device wafer by supplying a sealing resin to the top surface of the device wafer, and a laser processing step of dividing the device wafer into individual chips and forming device chip packages by applying a laser beam having a wavelength absorbable by the sealing resin layer along the cut grooves of the device wafer held by a chuck table.. . ... Disco Corporation

05/24/18 / #20180143544

Decompression processing apparatus

Disclosed herein is a decompression processing apparatus for processing a wafer in a decompressed state including a chamber having a decompressing unit configured to decompress the inside of the chamber, an opening and closing door configured to open and close a carrying-in-and-out opening for carrying the wafer into and out of the chamber, and an inert gas supply source configured to supply an inert gas to the inside of the chamber. The inside of the chamber is maintained in a dry state by continuing to supply the inert gas in a state in which the opening and closing door is opened.. ... Disco Corporation

05/24/18 / #20180143416

Upright and inverted microscope

A dual-configuration microscope is provided that may be converted into an upright or inverted microscope. The microscope includes a body having a plurality of planar surfaces, each planar surface configured to support the body on a working surface as the body is tilted between the upright and inverted configurations. ... Disco Corporation

05/24/18 / #20180142285

Method to detect activity of a polymerase

The present invention relates to methods for detection of nucleotide polymerase activity and methods of detecting compounds that modulate nucleotide polymerase activity, by detecting product formation of the nucleotide polymerase to be tested based on determination of close proximity of two labeled nucleotide probes able to bind the product of the nucleotide polymerase. It is preferred that proximity dependent energy transfer, such as forster resonance energy transfer, between said labeled nucleotide probes is determined. ... Disco Corporation

05/17/18 / #20180135875

Floating-type humidifier

A floating-type humidifier according to an exemplary embodiment of the present invention includes: a floating body which floats in a reservoir that accommodates water; an ultrasonic wave generation unit which is installed by being inserted into the floating body, and atomizes the water, which is introduced into a lower side of the floating body, into a water particles state by means of ultrasonic vibration; a guide tube which is detachably coupled to the floating body, is installed above the ultrasonic wave generation unit, guides the water particles, and has a fan installation hole horizontally and penetratively formed in a lateral portion of the guide tube; a blower fan which is coupled in the fan installation hole, and injects air into the guide tube so as to discharge the water particles to an upper side of the guide tube; and a discharge groove which is formed in an upper surface of the floating body so as to communicate with the fan installation hole in which the blower fan is mounted.. . ... Disco Corporation

05/17/18 / #20180134905

Protective film forming resin agent and laser processing method

Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. ... Disco Corporation

05/17/18 / #20180133930

Package substrate cutting jig table

A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. ... Disco Corporation

05/10/18 / #20180131413

Wireless power transmission apparatus and method therefor

The present invention relates to a wireless power transmission apparatus and a method therefor. The present invention provides a wireless power transmission apparatus including: a power transmission module; a first communication module; a second communication module; and a controller for searching out a first wireless power reception device performing wireless power transmission/reception, transmitting a second magnetic field signal of a second frequency band through the power transmission module, sensing a second response signal to the second magnetic field signal through the second communication module, and searching out a second wireless power reception device performing wireless power transmission/reception by means of the second frequency band according to whether the second response signal is received.. ... Disco Corporation

05/10/18 / #20180130709

Method of processing wafer

A wafer processing method includes a protective member laying step of placing a protective member on a face side of a wafer, a reverse side grinding step of grinding a reverse side of the wafer to thin the wafer, a cut groove forming step of positioning a cutting blade in alignment with projected dicing lines one at a time on the reverse side of the wafer, cutting the wafer with the cutting blade to form cut grooves in the wafer which terminate short of the face side thereof, and a cutting step of applying a laser beam to the wafer from the reverse side thereof along the cut grooves to completely sever the wafer along the projected dicing lines into individual device chips.. . ... Disco Corporation

05/10/18 / #20180130688

Transfer apparatus, processing apparatus, and transfer method

A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. ... Disco Corporation

05/10/18 / #20180130005

Personnel management system

A personnel management system has an account storage unit configured to store a balance of a department account and a balance of a personal account of an employee belonging to and linked to the department. A controller is configured to manage the balance of each account, and a terminal for entering information. ... Disco Corporation

05/10/18 / #20180128814

Predicting human developmental toxicity of pharmaceuticals using human stem-like cells and metabolomic ratios

This present invention provides rapid, reproducible, biomarker-based screening methods for the developmental toxicity testing of compounds. The methods are designed to identify the exposure level at which a test compound perturbs metabolism in a manner predictive of developmental toxicity. ... Disco Corporation

05/03/18 / #20180122700

Wafer processing method

. . A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.. ... Disco Corporation

05/03/18 / #20180118745

Novel inhibitors of protein kinases

Protein kinases are regulators of cellular signaling and their functional dysregulation is common in carcinogenesis and many other disease states or disorders. The present invention relates to novel chemical entities that have biological activity to modulate mammalian protein kinase enzymes. ... Disco Corporation

05/03/18 / #20180118697

Triazole benzamide derivatives and the compositions and methods of treatment regarding the same

The present disclosure is directed to triazole benzamide compounds of formula (i) and formula (ii), pharmaceutical compositions thereof and methods for modulating or activating a parkin ligase the present disclosure is also directed to methods of treating and/or reducing the incidence of diseases or conditions related to the activation of parkin ligase. R1, r2, r3, m1, m2, m3, l1, l2, and l3 are as defined herein.. ... Disco Corporation

04/19/18 / #20180108583

Device chip, accommodating tray, and method of accommodating device chips

A device chip is shaped as an inverted frustum with a device formed on an upper surface thereof. An accommodating tray for accommodating a plurality of device chips each shaped as an inverted frustum with a device formed on an upper surface thereof, has a plurality of open recesses defined in an upper surface thereof, for accommodating device chips therein, each of the recesses having a bottom surface and a side surface which form an obtuse angle therebetween. ... Disco Corporation

04/19/18 / #20180108565

Method of laser-processing device wafer

There is provided a method of laser-processing a device wafer with a laser beam applied thereto. The device wafer has a face side having thereon a plurality of crossing projected dicing lines and devices formed in respective areas demarcated by the projected dicing lines. ... Disco Corporation

04/19/18 / #20180104228

Methods and compositions for treating non-erk mapk pathway inhibitor-resistant cancers

The present invention provides, inter alia, methods, pharmaceutical compositions, and kits for treating or ameliorating the effects of a cancer in a subject, which cancer is refractory or resistant to non-erk mapk pathway inhibitor therapy. Also provided are methods for identifying a subject having cancer who would benefit from therapy with an erk inhibitor and methods for inhibiting phosphorylation of rsk in a cancer cell that is refractory or resistant to a non-erk mapk pathway inhibitor.. ... Disco Corporation

04/19/18 / #20180104220

Imidazole compound

Disclosed is an imidazole compound, in particular, the compound as shown in formula (i) and a pharmaceutically acceptable salt or tautomer thereof are disclosed.. . ... Disco Corporation

04/12/18 / #20180103547

Manufacturing method for wiring board

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a cmp process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.. . ... Disco Corporation

04/12/18 / #20180102288

Wafer processing method

A wafer processing method is provided. The wafer processing method includes a first laser processing step of forming a first modified layer inside the wafer by applying a laser beam at a wavelength which transmits the wafer along first projected division lines, a second laser processing step of forming a second modified layer inside the wafer excluding non-processed regions in intersecting regions where the first and second projected division lines intersect each other by applying a laser beam at a wavelength which transmits the wafer along the second projected division lines, and a grinding step of grinding a reverse side of the wafer to thin the wafer to a predetermined thickness and at the same time dividing the wafer into a plurality of chips starting from the first and second modified layers. ... Disco Corporation

04/12/18 / #20180102268

Processing apparatus

Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures characteristics of the carried wafer by a measuring section, and a determining section of a control unit compares actual measurements of the wafer characteristics measured by the measuring section with setpoints of wafer characteristics corresponding to the processing condition, to thereby determine conformability of the carried wafer. ... Disco Corporation

04/12/18 / #20180099972

Compounds useful for inhibiting metastasis from cancer and methods using same

The present invention includes compositions that are useful in preventing or treating metastasis in a subject diagnosed with cancer. The present invention also includes methods of preventing or treating metastasis in a subject diagnosed with cancer, wherein the method comprises administering to the subject in need thereof an effective amount of a pharmaceutical formulation comprising at least one pharmaceutically acceptable carrier and at least one cx3cr1 or fractalkine antagonist.. ... Disco Corporation

04/12/18 / #20180099961

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099960

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099959

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099377

Processing apparatus and processing method for workpiece

A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.. ... Disco Corporation

04/12/18 / #20180099375

Frame fixing jig

A frame fixing jig for mounting on a chuck table has a chuck portion for holding a workpiece in an annular frame, and a body portion for supporting the chuck portion. A frame support member (fsm) supports the annular frame, and a ring presses the frame against the fsm. ... Disco Corporation

04/12/18 / #20180099373

Grinding apparatus and wafer processing method

A grinding apparatus includes a chuck table for holding a wafer having a modified layer near the front side or a groove on the front side, the groove having a depth not less than a finished thickness of the wafer, a grinding unit for grinding the back side of the wafer to divide the wafer into a plurality of chips, a die strength measuring unit for measuring the die strength of any one of the chips, and a control unit for controlling each component according to a measured value of die strength. The control unit determines that grinding is not to be performed on the remaining wafers stored in the cassette when the measured value is less than a threshold value, and determines that grinding is to be performed on the remaining wafers when the measured value is greater than or equal to the threshold value.. ... Disco Corporation

04/05/18 / #20180097564

Processing apparatus

. . A processing apparatus for processing a workpiece includes: a chuck table that holds the workpiece; a processing unit that processes the workpiece held by the chuck table; a controller that controls the chuck table and the processing unit; an input section that inputs a processing condition to the controller; a storage section that stores the processing condition inputted to the input section; and an infrared transmission/reception unit that transfers apparatus information between the processing apparatus and another processing apparatus by infrared radiation.. . ... Disco Corporation

04/05/18 / #20180096948

Method of manufacturing semiconductor package

A method of manufacturing a semiconductor package includes: bonding a plurality of semiconductor chips to a plurality of mounting regions on a wiring board partitioned by crossing streets; supplying a liquid resin to a front surface side of the wiring board onto which the plurality of semiconductor chips have been bonded, to seal the plurality of semiconductor chips in a collective manner, thereby forming a sealed board; cutting the sealed board along the regions corresponding to the streets, to individualize the sealed chips in such a manner that the sealed chips each have an upper surface and a lower surface larger than the upper surface, with a side surface inclined from the upper surface toward the lower surface; and forming a conductive shield layer on the upper surfaces and the side surfaces of the plurality of sealed chips.. . ... Disco Corporation

04/05/18 / #20180096892

Device wafer processing method

A device wafer processing method includes forming a mask patterned so as to cover plural devices formed on a front side of the wafer and expose streets between the devices, applying plasma through the mask to thereby form a groove along each street, the groove having a depth corresponding to a finished thickness of the devices and having a reverse tapering shape such that the distance between opposed side walls of the groove is increased with an increase in depth of the groove, removing the mask, attaching a protective member to the front side of the wafer, and then grinding a back side of the wafer until the bottom of the groove is exposed, thereby reducing the thickness of the wafer to the finished thickness to divide the wafer into a plurality of device chips.. . ... Disco Corporation

04/05/18 / #20180096112

Method for determining three-dimensional structures of dynamic molecules

The present invention relates to a method for determining three-dimensional structures of molecules, particularly, but not exclusively, dynamic organic molecules of biological interest such as peptides, carbohydrates, proteins and drug molecules. A first aspect of the present invention provides a method for generating data representing an ensemble of three-dimensional structures of a molecule, the molecule comprising first and second atoms linked by at least one bond, said bond having an associated angle, and the angle varying to generate a plurality of three-dimensional structures of said molecule, the method comprising: receiving data representing said molecule, said data comprising data indicating variability of said angle; and generating an ensemble of structures such that the angle has an associated value selected based upon said variability. ... Disco Corporation

04/05/18 / #20180094972

Method of detecting spot shape of pulsed laser beam

A method of detecting a spot shape of a pulsed laser beam, includes applying a pulsed laser beam having a wavelength absorbable by an inspection wafer held on a chuck table continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer. An image of the laser spots is captured, and profiles of shapes of the laser spots are extracted from the captured image of the laser spots. ... Disco Corporation

04/05/18 / #20180093976

Pyridazinone compounds and methods for the treatment of cystic fibrosis

The invention relates to a compound of having the following formulae and methods of treating cystic fibrosis:. . ... Disco Corporation

04/05/18 / #20180093968

Quinoline derivatives as tam rtk inhibitors

The present invention relates to novel compounds which are inhibitors of tam (axl, mer and tyro 3) and/or met family receptor tyrosine kinases (rtks). These compounds are suitable for the treatment of disorders associated with, accompanied by, caused by or induced by a receptor of the tam family, in particular a hyperfunction thereof. ... Disco Corporation

04/05/18 / #20180093361

Processing apparatus

Disclosed herein is a carrying mechanism that carries a plate-shaped workpiece in which a substrate larger than a wafer in area is stacked on a lower surface of the wafer. The carrying mechanism includes a carrying pad for covering an upper surface of the wafer, holding sections for holding the substrate on outside of the outer periphery of the wafer, and a water supply source for supplying water to the wafer. ... Disco Corporation

04/05/18 / #20180092942

Hypochlorous acid-based hand sanitizer

A sanitizing formulation is disclosed for use as a hand sanitizer. The formulation may include hypochlorous acid, a silicone polymer or blend thereof, sodium phosphate, hydrochloric acid, and sodium magnesium silicate. ... Disco Corporation

03/29/18 / #20180085851

Sic wafer producing method

. . A sic wafer is produced from a single crystal sic ingot. A modified layer is formed by setting a focal point of a pulsed laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. ... Disco Corporation

03/22/18 / #20180084248

Method for encoding/decoding an intra-picture prediction mode using two intra- prediction mode candidate, and apparatus using such a method

The method for decoding an intra-picture prediction mode includes the steps of: determining whether the intra-picture prediction mode of a current prediction unit is identical to a first intra-picture prediction mode candidate or a second intra-picture prediction mode candidate based on bit information; and when the intra-picture prediction mode of the current prediction unit is identical to the first intra-picture prediction mode candidate and/or to the second intra-picture prediction mode candidate, determining whether the first intra-picture prediction mode candidate or the second intra-picture prediction mode candidate is identical to the intra-picture prediction mode of the current prediction unit on the basis of additional bit information, and decoding the intra-picture prediction mode of the current prediction unit.. . ... Disco Corporation

03/22/18 / #20180082897

Processing method for wafer

A wafer has a front face that is partitioned by a plurality of streets crossing with each other into a plurality of regions in each of which a device is formed. A surface protective tape is adhered to the front face of the wafer. ... Disco Corporation

03/22/18 / #20180079731

Axially chiral isomers, and preparation methods therefor and pharmaceutical uses thereof

Disclosed are two axially chiral isomers and pharmaceutically available salts thereof, preparation method therefor, and pharmaceutical use of the two axially chiral isomers or pharmaceutical compositions thereof.. . ... Disco Corporation

03/22/18 / #20180079046

Grinding wheel and grinding apparatus

A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.. . ... Disco Corporation

03/22/18 / #20180078501

Methods of eye treatment using therapeutic compositions containing dipyridamole

A method comprising administering an effective amount of a topical dipyridamole to a subject in need thereof due to conjunctivitis.. . ... Disco Corporation

03/15/18 / #20180076784

Method of manufacturing surface acoustic wave device chips

. . A method of manufacturing surface acoustic wave device chips includes grinding a reverse side of a wafer with a surface acoustic wave device formed in each area demarcated by a plurality of crossing projected dicing lines on a face side of the wafer; before or after grinding, applying a laser beam to the reverse side of the wafer such that the laser beam is focused at a position within the wafer, the position being closer to the face side of the wafer than a position corresponding to a reverse side of each of the surface acoustic wave device chips to be produced from the wafer, thereby forming a modified layer for diffusing an acoustic wave; and after grinding and applying the laser beam, dividing the wafer along the projected dicing lines into a plurality of the surface acoustic wave device chips.. . ... Disco Corporation

03/15/18 / #20180076088

Method of processing wafer

A method of processing a wafer includes forming a mask on portions of a face side of the wafer which correspond to devices; performing plasma etching on the face side of the wafer through the mask to etch areas of streets other than areas thereof corresponding to metal components, thereby forming grooves in the areas of the streets to a depth corresponding to a finished thickness of device chips; bonding a protective member for protecting the face side of the wafer, holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, to fragmentize the wafer into the device chips; and picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member.. . ... Disco Corporation

03/15/18 / #20180076016

Wafer and method of processing wafer

A method of processing a wafer having on a face side thereof a device area with a plurality of devices formed therein and an outer circumferential excess area surrounding the device area includes a grinding step for grinding a reverse side of the wafer corresponding to the device area with a grinding wheel that is smaller in diameter than the wafer, thereby forming a first portion corresponding to the device area and an annular second portion surrounding the first portion, the annular second portion being thicker and more protrusive toward a reverse side thereof than the first portion. In the grinding step, the grinding wheel and the wafer are moved relatively to each other so that the angle formed between the reverse side of the first portion and an inner side surface of the annular second portion is larger than 45° and smaller than 75°.. ... Disco Corporation

03/15/18 / #20180072707

Substituted 2-hydrogen-pyrazole derivative serving as anticancer drug

Disclosed is a substituted 2h-pyrazole derivative serving as a selective cdk4/6 inhibitor. Specifically, disclosed is a compound of formula (i) or a pharmaceutically acceptable salt thereof which serves as a selective cdk4/6 inhibitor.. ... Disco Corporation

03/08/18 / #20180070208

Interaction tracking and organizing system

A server that cross-references a first user's device location with registered members in a spatial proximity of the first user's device and returns the results by disclosing personal user attributes including pictures and names of all members in the spatial proximity of the first user's device. The first user who initiated the inquiry may select from the results returned any discovered user he/she wishes to connect with and send a form of invitation to connect using network available tools such as email, sms, text or any customized invitation form. ... Disco Corporation

03/08/18 / #20180070079

Intra prediction mode mapping method and device using the method

The present invention relates to an intra prediction mode mapping method and a device using the method. The intra prediction mode includes: decoding flag information providing information regarding whether an intra prediction mode of a plurality of candidate intra prediction modes for the current block is the same as the intra prediction mode for the current block, and decoding a syntax component including information regarding the intra prediction mode for the current block in order to induce the intra prediction mode for the current block if the intra prediction mode from among the plurality of candidate intra prediction modes for the current block is not the same as the intra prediction mode for the current block. ... Disco Corporation

03/08/18 / #20180069265

Electrolyte formulations for electrochemical cells containing a silicon electrode

Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives.. ... Disco Corporation

03/08/18 / #20180068895

Method of processing a wafer

A method of processing a wafer having a metal film formed on a reverse side thereof includes removing a metal film on the reverse side of the wafer along an outer circumferential edge of the wafer, thereby exposing a substrate of the wafer along the outer circumferential edge thereof, detecting a projected dicing line on a face side of the wafer with an infrared camera through the substrate exposed along the outer circumferential edge of the wafer and performing alignment of the wafer based on the detected projected dicing line, removing the metal film on the reverse side of the wafer along the detected projected dicing line, and thereafter, forming dividing grooves in the substrate along the projected dicing lines by plasma etching, thereby dividing the wafer into individual device chips.. . ... Disco Corporation

03/08/18 / #20180065187

Chuck table and method of manufacturing suction plate of porous ceramics

A chuck table for holding a plate-shaped workpiece under suction includes a suction plate made of porous ceramics and having a plurality of open pores, and a frame covering a side surface and a reverse side, except an attractive suction surface, of the suction plate and having a plurality of suction grooves defined in an upper surface thereof and a fluid communication passage defined therein that holds the suction grooves in fluid communication with a suction source, the frame supporting the suction plate thereon. The suction plate has a porosity in the range from 60% to 70% by volume, and the open pores have diameters in the range from 10 μm to 25 μm.. ... Disco Corporation

03/01/18 / #20180062202

Electrolyte formulations for electrochemical cells containing a silicon electrode

. . . . Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives. ... Disco Corporation

03/01/18 / #20180062201

Electrolyte formulations for electrochemical cells containing a silicon electrode

Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives. ... Disco Corporation

03/01/18 / #20180061711

Processing method of package wafer

A processing method of a package wafer includes a mold resin removal step of exposing grooves filled with a mold resin of the package wafer in a peripheral surplus region, a holding step of holding the package wafer in such a manner that the grooves are exposed, an orientation adjustment step of causing the grooves to be parallel to a processing-feed direction in which processing feeding of a chuck table is carried out when dividing grooves are formed, a coordinate registration step of imaging both ends of the plural grooves exposed at a peripheral edge and registering coordinate information of both ends or a single side of the grooves from taken images, and a dividing groove forming step of calculating the positions of the dividing grooves to be formed along the grooves based on the registered coordinate information of the grooves and forming the dividing grooves along the grooves.. . ... Disco Corporation

03/01/18 / #20180056525

Plate-shaped workpiece transfer apparatus and processing apparatus

Apparatus transfers a plate-shaped workpiece to/from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. ... Disco Corporation

03/01/18 / #20180056440

Method of producing sic wafer

An sic wafer is generated from an sic ingot by a peel-off plane generating step for generating a peel-off plane by forming a separation layer made up of a modified layer, and cracks extending from the modified layer along a c-plane, a plurality of times by indexing-feeding a focused point of a pulsed laser beam and the sic ingot relative to each other in a direction in which an off-angle is formed, thereby forming a plurality of separation layers to generate the peel-off plane. The peel-off plane generating step includes relatively moving the focused point from an end to an opposite end of the sic ingot in a forward stroke and relatively moving the focused point from the opposite end to the end of the sic ingot in a backward stroke to trace back the separation layer that has already been formed in the forward stroke.. ... Disco Corporation

02/22/18 / #20180053680

Peeling method and peeling apparatus

Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the wafer through the resin in a state in which a protruding portion is formed. The method includes: a step of holding the other side of the wafer, with the protective member on the lower side; an outer circumferential edge adhered resin peeling step of grasping the protruding portion of the protective member, and pulling the protruding portion to an outer side than an outer circumferential edge of the wafer, to peel the resin adhered to the outer circumferential edge of the wafer from the outer circumferential edge of the wafer; and a step of peeling, after the outer circumferential edge adhered resin peeling step, the whole body of the protective member from the wafer.. ... Disco Corporation

02/22/18 / #20180050436

Polishing apparatus

A polishing apparatus includes a slurry circulating unit for storing a slurry below a chuck table having a holding surface for holding a wafer, and circulating the slurry to a polishing surface of a polishing pad for polishing the wafer. The slurry circulating unit includes an annular cup-shaped receptacle that surrounds the chuck table and the polishing pad overhanging from the holding surface of the chuck table in a polishing position where the polishing surface is in contact with the wafer, an air blow opening formed through a bottom plate of the receptacle for blowing air to thereby spray the slurry stored in the receptacle toward the polishing pad, a pipe for connecting the air blow opening to an air source, an opening formed through a side wall of the pipe, and a valve for controlling the supply and stop of air from the air source to the pipe.. ... Disco Corporation

02/15/18 / #20180048977

Audio signal processing method

Disclosed is an audio signal processing method. The audio signal processing method according to the present invention comprises the steps of: receiving a bit-stream including at least one of a channel signal and an object signal; receiving a user's environment information; decoding at least one of the channel signal and the object signal on the basis of the received bit-stream; generating the user's reproducing channel information on the basis of the user's received environment information; and generating a reproducing signal through a flexible renderer on the basis of at least one of the channel signal and the object signal and the user's reproducing channel information.. ... Disco Corporation

02/15/18 / #20180045851

Determining apparatus for determining object stored in cassette

Apparatus determines whether a stored object is a wafer alone or a frame unit formed by uniting the wafer and a ring frame. The apparatus includes first and second detecting units, the second detecting unit being stored more shallowly than the first detecting unit. ... Disco Corporation

02/15/18 / #20180044330

Phthalazinone compounds and methods for the treatment of cystic fibrosis

The invention relates to a compound of formula i and methods of treating cftr (cystic fibrosis transmembrane conductance regulator) mediated diseases, in particular cystic fibrosis, comprising the step of administering a therapeutically effective amount of a compound of formula i to a patient in need thereof:. . ... Disco Corporation

02/15/18 / #20180044329

3-substituted-1,2,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 3-substituted-1,2,4-oxadiazole and thiadiazole compounds of formula (i) or formula (ii) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180044305

3-substituted 1,3,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 3-substituted 1,3,4-oxadiazole and thiadiazole compounds of formula (i) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180044304

1,3,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 1,3,4-oxadiazole and thiadiazole compounds of formula (i) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180043468

Sic wafer producing method

An sic wafer is produced from a single crystal sic ingot by a method that includes forming a plurality of breakable layers constituting a separation surface in the sic ingot, each breakable layer including a modified layer and cracks extending from the modified layer along a c-plane, and separating part of the sic ingot along the separation surface as an interface to thereby produce the sic wafer. In forming the separation surface, the energy density of a pulsed laser beam is set to an energy density not causing the formation of an upper damage layer above the breakable layer previously formed due to the reflection of the pulsed laser beam from the breakable layer and not causing the formation of a lower damage layer below the breakable layer previously formed due to the transmission of the pulsed laser beam through the breakable layer.. ... Disco Corporation

02/08/18 / #20180040513

Processing method for wafer

A wafer processing method of dividing along a plurality of projected dicing lines set on the wafer includes a placing step of placing the wafer on a heating table with a tape interposed therebetween, the wafer having modified layers, from which to start to divide the wafer, formed therein at positions aligned with the projected dicing lines, the tape being applied to one surface of the wafer, and a dividing step of dividing the wafer on the heating table by heating with the heating table and thereafter cooling an exposed opposite surface in its entirety of the wafer with a cooing unit whereby the wafer starts being ruptured from the modified layers along the projected dicing lines due to a thermal shock caused by a temperature difference developed between the heated and cooled surfaces of the wafer.. . ... Disco Corporation

02/01/18 / #20180029187

Grinding apparatus

A grinding apparatus includes a holding table for holding a wafer, a support table for supporting the holding table, a motor for rotating the support table, a frame member supporting the support table for rotation, and at least three support poles for supporting the frame member from the base. Each of the support poles has formed in the inside thereof a through-hole, a supply port which communicates the through-hole and an air supply source with each other, and an exhaust port which exhausts air having flowed through the through-hole toward the support table. ... Disco Corporation

01/25/18 / #20180025953

Inspecting method for inspecting influence of installation environment upon processing apparatus

. . . . A method for inspecting the influence of an installation environment upon a processing apparatus includes setting a mark for specifying a relative positional relation between a chuck table and a processing unit, imaging the mark plural times by using an imaging unit when a moving unit is at rest, and detecting the position of the mark from an image and then determining whether or not the influence of the installation environment upon the processing apparatus is present based on whether the change in position of the mark is less than or more than a threshold.. . ... Disco Corporation

01/25/18 / #20180025928

Hold checking method and unhold checking method for wafer

Disclosed herein is a hold checking method for checking whether or not a wafer is held by an electrostatic chuck in loading the wafer to the electrostatic chuck by operating a transfer unit holding the wafer. The hold checking method includes a connecting step of bringing the wafer held by a transfer pad into contact with the electrostatic chuck to thereby connect the transfer pad through the wafer to the electrostatic chuck, and a hold determining step of supplying electric power from a dc power source through first wiring to the electrostatic chuck after performing the connecting step, and next determining that the wafer is held by the electrostatic chuck when the voltage across a resistor inserted in the first wiring has reached a predetermined voltage value.. ... Disco Corporation

01/25/18 / #20180024223

Method and system for determining precise robotic position and orientation using near-simultaneous radio frequency measurements

A method and system for determining position and/or pose of an object. A robotic device moves throughout an environment and includes a master transceiver tag and, optionally, additional tags. ... Disco Corporation

01/25/18 / #20180021911

Grinding apparatus

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. ... Disco Corporation

01/18/18 / #20180019168

Electrostatic chuck table

An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.. ... Disco Corporation

01/18/18 / #20180015638

Cutting apparatus

A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.. . ... Disco Corporation

01/11/18 / #20180012804

Semiconductor device chip manufacturing method

Disclosed herein is a semiconductor device chip manufacturing method including a chipping prevention layer forming step of forming a chipping prevention layer at each intersection of a plurality of crossing division lines formed on the front side of a wafer, a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer to the back side thereof along each division line in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a modified layer inside the wafer along each division line, and a dividing step of grinding the back side of the wafer after performing the modified layer forming step, thereby reducing the thickness of the wafer and also dividing the wafer into individual semiconductor device chips along each division line where the modified layer is formed as a break start point.. . ... Disco Corporation

01/11/18 / #20180012169

Management system for supervising operator

A management system for supervising an operator within an operation area with a processing apparatus installed therein has an imaging camera for capturing an image of the operator, and a control unit. The control unit stores an area map that includes information about the processing apparatus and the positions of the processing apparatus, acquires identifying information regarding the operator on the basis of the image captured by the imaging camera, and extracts traffic lines of the operator. ... Disco Corporation

01/11/18 / #20180009112

Method and system for determining precise robotic position and orientation using near-simultaneous radio frequency measurements

A method and system for determining position and/or pose of an object. A robotic device moves throughout an environment and includes a master transceiver tag and, optionally, additional tags. ... Disco Corporation

01/04/18 / #20180006330

Electrolyte additives and electrode materials for high temperature and high voltage operation

A battery including an anode, a cathode, a separator, and a liquid electrolyte including a lithium salt, a non-aqueous solvent, and an additive compound including a functionalized matrix having a polymer or copolymer or silica. The cathode material can be an nmc or lco material. ... Disco Corporation

01/04/18 / #20180006328

Solid electrolyte compositions

A solid-state electrolyte including a polymer, which can be ion-conducting or non-conducting; an ion-conducting inorganic material; a lithium salt; an additive salt and optionally a coupling agent.. . ... Disco Corporation

01/04/18 / #20180006326

Electrode compositions for solid-state batteries

An electrode formulation including a polymer, which can be ion-conducting or non-conducting; an ion-conducting inorganic material; a lithium salt; and optionally an additive salt.. . ... Disco Corporation

12/28/17 / #20170372908

Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object

There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. ... Disco Corporation

12/28/17 / #20170370927

Method of measuring the affinity of biomolecules

The invention provides a method of measuring the affinity of first and second biomolecules in which a first biomolecule is tethered by a first tether portion having a first tether portion length and a second biomolecule is tethered by a second tether portion having a second tether portion length, the method comprising determining binding of adjacent first and second biomolecules to each other, varying at least one of the first and second tether lengths and determining binding of the first and second biomolecules. The invention also provides apparatus suitable for use in the method of the invention.. ... Disco Corporation

12/28/17 / #20170370856

Internal crack detecting method and internal crack detecting apparatus

A method for detecting an internal crack in a wafer includes a first image recording step of applying near infrared light having a transmission wavelength to a reference wafer having the same configuration as a target wafer to be subjected to the detection of the internal crack, thereby obtaining a first image of the reference wafer having no internal crack and then recording the first image, a processing step of processing the target wafer, a second image recording step of applying the near infrared light to the target wafer, thereby obtaining a second image of the processed target wafer and then recording the second image, and an internal crack detecting step of removing the same image information between the first image and the second image from the second image to obtain a residual image, thereby detecting the residual image as the internal crack in the target wafer.. . ... Disco Corporation

12/28/17 / #20170370845

Fluorescence detecting apparatus

A fluorescence detecting apparatus includes an excitation light applying section that applies excitation light to a protective film containing an absorbing agent. A photomultiplier tube detects fluorescence emitted from the absorbing agent due to absorption of the excitation light. ... Disco Corporation

12/28/17 / #20170369585

Anti-cd276 polypeptides, proteins, and chimeric antigen receptors

Polypeptides and proteins that specifically bind to and immunologically recognize cd276 are disclosed. Chimeric antigen receptors (cars), anti-cd276 binding moieties, nucleic acids, recombinant expression vectors, host cells, populations of cells, and pharmaceutical compositions relating to the polypeptides and proteins are also disclosed. ... Disco Corporation

12/28/17 / #20170368659

Processing apparatus

A processing apparatus includes a chuck table having a holding surface for holding a workpiece thereon, and a processing unit. The processing unit includes a spindle, a wheel mount coupled to an end of the spindle and facing the holding surface, a first tool detachably mounted on a mount surface of the wheel mount, the first tool having a first diameter, a second tool mount nonrotatably and axially movably mounted on the spindle over a rear surface of the wheel mount which is opposite the mount surface, the second tool mount having a storage region for the wheel mount and the first tool, a second tool mount member surrounding the storage region and having an inside diameter larger than the first diameter, and a second tool detachably mounted on the second tool mount and having an inside diameter larger than the first diameter.. ... Disco Corporation

12/28/17 / #20170368636

Protective film applying apparatus and protective film applying method

A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. ... Disco Corporation

12/21/17 / #20170365519

Method of processing a wafer and wafer processing system

A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. ... Disco Corporation

12/14/17 / #20170358468

Peeling apparatus

A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. ... Disco Corporation

12/14/17 / #20170358465

Wafer processing system

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.. ... Disco Corporation








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