Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Ebara Corporation patents


Recent patent applications related to Ebara Corporation. Ebara Corporation is listed as an Agent/Assignee. Note: Ebara Corporation may have other listings under different names/spellings. We're not affiliated with Ebara Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Ebara Corporation-related inventors


Plating apparatus and substrate holder used together with plating apparatus

The present invention provides a plating apparatus capable of individually controlling a plating process on a front surface and a back surface of a substrate and a substrate holder usable for such a plating apparatus. A substrate holder for holding a substrate which is a plating target during a plating process is provided and such a substrate holder includes a body part for holding the substrate, provided with a first opening and a second opening, the body part is configured such that when the body part holds the substrate, a plated region on the front surface of the substrate is exposed through the first opening and a plated region on the back surface of the substrate is exposed through the second opening and a sealing part that protrudes from a peripheral portion is included in at least part of the peripheral portion of the body part.. ... Ebara Corporation

Method and apparatus for polishing a substrate

A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. ... Ebara Corporation

Paddle, plating apparatus equipped with the paddle, and plating method

A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. ... Ebara Corporation

Motor attachment bracket, motor attachment structure, and substrate processing apparatus

Various examples, relating to motor attachment, a motor attachment structure, substrate processing apparatus are disclosed. The present disclosure exemplifies a motor attachment bracket including a plate-shaped motor mounting portion which an output shaft insertion hole through which an output shaft of a motor is inserted penetrates, and to which the motor the output shaft of which is inserted through the output shaft insertion hole is fixed. ... Ebara Corporation

Shaft seal device and vertical pump with this shaft seal device

A shaft seal device is fixed to a container that separates a high-pressure fluid and a low-pressure fluid from each other, and seals a shaft-penetrated portion of the container through which a rotational shaft extends. This shaft seal device includes: a seal casing having a through-hole through which the rotational shaft extends, the seal casing having a seal chamber which communicates with the through-hole and into which the high-pressure fluid flows; and a disk-shaped seal body which is housed in the seal chamber, the seal body being rotatable together with the rotational shaft and having an annular surface perpendicular to an axis of the rotational shaft. ... Ebara Corporation

Substrate processing apparatus, substrate processing system and substrate processing method

The invention performs optimum processing even when process requirements vary in the middle of a substrate processing process. A method is provided whereby a substrate is processed by causing the substrate and a catalyst to contact each other in the presence of a processing liquid. ... Ebara Corporation

Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method

A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. ... Ebara Corporation

Vacuum pump with abatement function

A vacuum pump with abatement function is used for evacuating a chamber of a manufacturing apparatus. The vacuum pump with abatement function includes a vacuum pump having a discharge port to which one or more abatement parts for treating an exhaust gas discharged from the vacuum pump to make the exhaust gas harmless are attached. ... Ebara Corporation

Scheduler, substrate processing apparatus, and substrate conveyance method

A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. ... Ebara Corporation

Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device

A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.. . ... Ebara Corporation

Method and apparatus for processing a substrate

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.. ... Ebara Corporation

Plating apparatus, plating method and computer readable recording medium

There is provided a plating apparatus for performing plating treatment on a substrate having a resist pattern. The plating apparatus includes: a pretreatment unit for causing a surface of the substrate to be brought into contact with a pretreatment solution; and a plating bath in which the plating treatment is performed on the substrate having a surface to be treated which is brought into contact with the pretreatment solution. ... Ebara Corporation

Polishing method and polishing apparatus

A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. ... Ebara Corporation

Polishing apparatus and polishing method

A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.. ... Ebara Corporation

06/21/18 / #20180169820

Polishing apparatus and pressing pad for pressing polishing tool

A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate w and to rotate the substrate w and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate w held by the substrate holder 3. ... Ebara Corporation

06/14/18 / #20180166286

Electrolytic plating apparatus

An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The electrolytic plating apparatus includes: a plating tank configured to hold a plating solution therein; an anode disposed in the plating tank; a substrate holder having an electric contact arranged to be able to contact a substrate; a power supply coupled to the anode; a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact.. ... Ebara Corporation

06/07/18 / #20180155847

Substrate holder, plating apparatus, and method for manufacturing substrate holder

Provided is a substrate holder where an effect of a pressure of a plating solution can be suppressed. A substrate holder includes first and second holding members for sandwiching a substrate. ... Ebara Corporation

05/31/18 / #20180147687

Polishing apparatus and polishing method

A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. ... Ebara Corporation

05/17/18 / #20180135198

Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus

. . There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.. ... Ebara Corporation

05/10/18 / #20180130667

Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus

The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (m1, m2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (m1, m2). ... Ebara Corporation

05/10/18 / #20180129189

Control device for substrate treatment apparatus, substrate treatment apparatus, and display control device

The present invention efficiently executes a plurality of functions of a substrate treatment apparatus. A control device 5 includes: a plurality of software applications (interface-related apsw 510 and control-related apsw 520) configured to execute each function of treatments concerning a cmp apparatus; and a shared memory 540 which stores information that is used in the plurality of software applications therein. ... Ebara Corporation

05/10/18 / #20180128281

Impeller assembly for centrifugal pumps

The present invention relates to an impeller assembly for centrifugal pumps, comprising a first disk-like element, operatively arranged towards a coaxial inlet, facing a second disk-like element with a smaller diameter, operatively arranged towards the outlet; this second disk-like element is rigidly connected to the first disk-like element through a set of angularly spaced blades, and is centrally provided with fastening means for fastening to a drive shaft. The distinctive feature of the present invention is that the blades comprise appendices, in flat sheet form, adjacent to the second disk-like element, which are essentially located in correspondence with areas subject to lesser axial thrust.. ... Ebara Corporation

05/10/18 / #20180126422

Cleaning member and substrate cleaning apparatus

A cleaning member 10, for use in cleaning a substrate w, comprises: a tip surface 13 configured to be in contact with the substrate w when cleaning the substrate w, and the tip surface 13 being not covered with a skin layer 11; and a circumferential part having a covered part 16, which is disposed on the base end side and a circumferential surface of which is covered with the skin layer 11, and an exposed part 17, which is disposed on the tip end side and a circumferential surface of which is not covered with the skin layer 11.. . ... Ebara Corporation

05/03/18 / #20180117730

Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane

A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. ... Ebara Corporation

04/19/18 / #20180105946

Copper oxide powder for use in plating of a substrate, method of plating a substrate using the copper oxide powder, and method of managing plating solution using the copper oxide powder

Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. ... Ebara Corporation

04/12/18 / #20180102700

Rotary electrical machine having permanent magnet rotor

A rotary electrical machine capable of preventing an increase in a magnetic flux density at both ends of a rotor that can occur due to a leakage flux to thereby prevent a local overheat of the rotor is disclosed. The rotary electrical machine includes: a rotor having a rotor core and permanent magnets disposed on an outer surface of the rotor core; a stator having windings arranged around the rotor; and a shaft which is rotatable together with the rotor. ... Ebara Corporation

04/05/18 / #20180093363

Substrate polishing apparatus

According to an aspect of the present disclosure, a substrate polishing apparatus including a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions is provided.. . ... Ebara Corporation

04/05/18 / #20180093360

Polishing apparatus and polishing method

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30a for holding the polishing pad 10 and a top ring 31a for holding the semiconductor wafer 16. ... Ebara Corporation

03/29/18 / #20180090347

Substrate cleaning apparatus and substrate processing apparatus x

A substrate cleaning apparatus for bringing an elongated roll cleaning member into sliding contact with a flat plate type substrate to perform cleaning processing on the substrate includes a roll holder for supporting the roil cleaning member so that the roll cleaning member is rotatable, an elevating mechanism that has a linking member for supporting the roll holder, and moves the roll holder up and down so that the roll cleaning member applies a predetermined roll load to the substrate, a sensor member that is provided to the linking member and measures frictional force between the roll cleaning member and the substrate, and a controller for performing feedback control on the frictional force between the roll cleaning member and the substrate based on a measured value of the sensor member.. . ... Ebara Corporation

03/29/18 / #20180087176

Plating apparatus

A plating apparatus enabling a user to conduct maintenance of a substrate holder while an operation of the plating apparatus is being performed is disclosed. The plating apparatus includes: a processing section for plating a substrate; a storage container configured to store the substrate holder for holding the substrate; a transport machine configured to transport the substrate holder between the processing section and the storage container; a maintenance area adjacent to the storage container; and a substrate-holder carrier supported by the storage container. ... Ebara Corporation

03/15/18 / #20180076043

Substrate processing method and substrate processing apparatus

. . A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.. ... Ebara Corporation

03/15/18 / #20180071885

Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body

A coupling mechanism which enables a rotating body to follow an undulation of a polishing surface without generating flutter or vibration of the rotating body, and can finely control a load on the rotating body on a polishing surface in a load range which is smaller than the gravity of rotating body is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and the rotating body. ... Ebara Corporation

03/08/18 / #20180068877

Substrate cleaning apparatus and substrate cleaning method

According to one embodiment, a substrate cleaning apparatus that cleans a substrate while rotating the substrate, the substrate cleaning apparatus includes: a first cleaning liquid supplier that sprays cleaning liquid in a spray shape at a first spraying angle toward a center of the substrate; and a second cleaning liquid supplier that sprays cleaning liquid in a spray shape at a second spraying angle greater than the first spraying angle toward an area between the center of the substrate and an edge of the substrate.. . ... Ebara Corporation

03/08/18 / #20180065228

Polishing apparatus

A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. ... Ebara Corporation

03/01/18 / #20180056470

Substrate processing apparatus and substrate processing method

A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.. . ... Ebara Corporation

02/22/18 / #20180051878

Exhaust gas treatment apparatus

A hybrid stepping motor has a connector housing formed integrally with an insulator having an upper insulator and a lower insulator. The hybrid stepping motor includes a stator core and output terminals concentrically disposed outside the stator core. ... Ebara Corporation

02/22/18 / #20180051718

Volute pump

A volute pump for delivering a liquid containing fibrous substances. The volute pump includes an impeller (1) rotatable together with a rotational shaft (11), and an impeller casing (5) having a suction port (3) and a volute chamber (7). ... Ebara Corporation

02/22/18 / #20180051708

Volute pump

The present invention relates to a volute pump for delivering a liquid containing fibrous substances. The volute pump includes an impeller (1) having a vane (2), and an impeller casing (5) which houses the impeller (1) therein. ... Ebara Corporation

02/15/18 / #20180047572

Dressing device, polishing apparatus, holder, housing and dressing method

A dressing device including: a disk that has an opening on an inside, the disk dressing a polishing surface for polishing a substrate; a rotatable holder, the disk being coupled to a lower surface side of the holder, the holder being provided with a first flow passage that passes from a lower surface to an upper surface, the lower surface being inside an outer edge of the opening of the disk; and a housing that is provided with a distance from the upper surface of the holder, the housing being provided with a second flow passage in an interior, the housing being fixed such that an opening of the second flow passage faces the upper surface of the holder, the second flow passage being connected with a supply source and a suction source of process liquid.. . ... Ebara Corporation

02/15/18 / #20180045213

Impeller for centrifugal pumps

An impeller for centrifugal pumps has a first disk element, functionally arranged toward the inlet, which is coaxial to and faces a second disk element, which is functionally arranged toward the delivery and is connected rigidly to the first disk element by virtue of a series of angularly spaced vanes and is provided centrally with a means for fixing to a transmission shaft. The particularity of the present invention resides in that the impeller includes a series of openings formed in the substantially peripheral region of the second disk element, between pairs of adjacent vanes, substantially at the areas subjected to the greatest axial thrust.. ... Ebara Corporation

02/08/18 / #20180040452

Inspection device

An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. ... Ebara Corporation

02/08/18 / #20180038008

Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method

A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. ... Ebara Corporation

01/25/18 / #20180021920

Method of monitoring a dressing process and polishing apparatus

A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.. ... Ebara Corporation

01/25/18 / #20180021917

Polishing method and polishing apparatus

A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. ... Ebara Corporation

01/18/18 / #20180016698

Substrate holder and plating apparatus using the same

A substrate holder has a first holding member having a first surface configured to contact with a substrate, and a second holding member for sandwiching and holding the substrate together with the first holding member. The first holding member has a positioning member for positioning the substrate in contact with the first surface at a prescribed position of the first surface. ... Ebara Corporation

01/18/18 / #20180016676

Film thickness measuring device, polishing apparatus, film thickness measuring method and polishing method

Eddy current formable in a polishing target is detected as an impedance by an eddy current sensor. A resistance component and a reactance component of the impedance are associated with respective axes of a coordinate system having orthogonal axes, respectively. ... Ebara Corporation

01/18/18 / #20180015590

Cmp apparatus having polishing pad surface property measuring device

The present invention relates to a cmp apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The cmp apparatus includes a polishing pad surface property measuring device (30) configured to apply a laser beam to a surface of a polishing pad (2) and to receive reflected light from the polishing pad to obtain reflection intensity in each reflection angle, a processor (40) configured to perform a fourier transform on a reflection intensity distribution obtained by the measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad and to obtain surface properties of the polishing pad by numerical analysis, a dressing control unit (23) configured to determine dressing conditions of the polishing pad (2) by a closed loop control based on the surface properties of the polishing pad obtained by the processor, and a dressing apparatus (20) configured to dress the polishing pad based on the dressing conditions determined by the dressing control unit.. ... Ebara Corporation

01/18/18 / #20180015508

Apparatus and method for polishing a surface of a substrate

An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. ... Ebara Corporation

01/11/18 / #20180012780

Substrate processing apparatus

Disclosed is a substrate processing apparatus that includes: a polishing table; an atomizer configured to spray a fluid to a polishing surface; a polishing liquid supply nozzle configured to drop a slurry at a position that corresponds to a slurry dropping position set on the polishing table and is lower than the top surface of the atomizer; a nozzle moving mechanism configured to move the polishing liquid supply nozzle above the atomizer between the retreat position set outside the polishing table and the slurry dropping position; and a nozzle tip retreating mechanism configured to bring the tip end of the polishing liquid supply nozzle into a retreated position above the top surface of the atomizer when the polishing liquid supply nozzle moves between the slurry dropping position and the retreat position.. . ... Ebara Corporation

01/11/18 / #20180009081

Turntable cloth peeling jig

Disclosed is a turntable cloth peeling jig including: a cylindrical winding cylinder including a slit formed on an outer periphery of the cylindrical winding cylinder and extending in an axial direction thereof; a cloth clamping member disposed inside the winding cylinder and configured to clamp an outer peripheral edge of a cloth inserted into the slit; an extension bar attached to one end portion of the winding cylinder so as to extend coaxially therewith; an engaging portion provided at a tip end portion of the extension bar and engaged with a rotation jig configured to rotate the winding cylinder; and a handle provided in the engaging portion and configured to support the winding cylinder when rotating the rotating jig.. . ... Ebara Corporation

01/04/18 / #20180001440

Substrate processing apparatus

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. ... Ebara Corporation

01/04/18 / #20180001438

Head height adjustment device and substrate processing apparatus provided with head height adjustment device

According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.. ... Ebara Corporation

01/04/18 / #20180001437

Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method

A receiving unit receives sensor data output from an eddy current sensor for detecting the film thickness of a polishing object to generate film thickness data. A correcting unit corrects the film thickness data in an inside of the edge of the polishing object based on the film thickness data generated by the receiving unit. ... Ebara Corporation

12/28/17 / #20170372893

Cleaning apparatus and substrate processing apparatus

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.. ... Ebara Corporation

12/28/17 / #20170370016

Cleaning apparatus, plating apparatus using the same, and cleaning method

A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. ... Ebara Corporation

12/28/17 / #20170368661

Polishing apparatus, polishing method and polishing control program

A polishing unit polishes a semiconductor wafer. An eddy current sensor measures an eddy current variable according to variation of the film thickness of the semiconductor wafer at plural measurement times. ... Ebara Corporation

12/21/17 / #20170361420

Polishing method and polishing apparatus

A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. ... Ebara Corporation

12/14/17 / #20170358472

Substrate processing apparatus and substrate tranfser method

A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. ... Ebara Corporation

12/14/17 / #20170356098

Feeder capable of feeding anode and plating apparatus

There is provided a feeder capable of reducing deterioration of the contact state between the feeder and an anode more than the prior art as dissolution of the anode progresses. The feeder can supply power to the anode 5 for use in plating a substrate in a plating tank. ... Ebara Corporation

12/07/17 / #20170352573

Substrate processing apparatus

It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.. ... Ebara Corporation

12/07/17 / #20170350033

Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method

Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.. . ... Ebara Corporation

11/09/17 / #20170323809

Substrate washing device

A substrate washing device includes a substrate holding mechanism 70 that holds a substrate w, a substrate rotating mechanism 72 that rotates the substrate w held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate w. The two-fluid nozzle 46 is formed of a conductive material. ... Ebara Corporation

11/09/17 / #20170321343

Substrate holder and plating apparatus using the same

To provide a substrate holder having a new positioning structure, which does not use a plate spring, and a plating apparatus using this substrate holder. A substrate holder is provided. ... Ebara Corporation

10/12/17 / #20170291274

Substrate processing apparatus

The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.. . ... Ebara Corporation

10/12/17 / #20170291273

Polishing apparatus and polishing method

A polishing apparatus which can maintain a polishing load within an appropriate range is disclosed. The polishing apparatus includes: a pressing member for pressing a polishing tool against the substrate; an actuator configured to control a pressing force of the pressing member; a positioning member which is movable together with the pressing member; a stopper arranged to restrict movement of the pressing member and the positioning member; a stopper moving mechanism configured to move the stopper in a predetermined direction; a polishing-load detector configured to obtain a load feedback value which varies according to a polishing load applied to the pressing member; and a stopper-speed determining device configured to determine a movement speed of the stopper which can allow the load feedback value to fall within a set range.. ... Ebara Corporation

10/05/17 / #20170287762

Plating apparatus and plating method

A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. ... Ebara Corporation

10/05/17 / #20170287761

Plating apparatus and plating method

A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. ... Ebara Corporation

10/05/17 / #20170287755

Substrate processing apparatus and substrate presence or absence checking method and program

A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer w is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position information acquiring part 81 for acquiring position information of the substrate w in the transport passage, a detection result acquiring part 83 for acquiring a detection result from the sensor 40, and a determination processor 84 for determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensor 40 is inconsistent with the position information, the sensor controller 82 makes the sensor 40 retry to detect whether the substrate w is held.. ... Ebara Corporation

10/05/17 / #20170285609

Teaching device and teaching method

A teaching apparatus is provided with an arm-side position sensor attached to arms, a dummy wafer placed on a stage, a dummy-wafer-side position sensor attached to the dummy wafer, and a signal receiver configured to receive a position signal from the arm-side position sensor to determine a position coordinate of the arm-side position sensor, and receive a position signal from the dummy-wafer-side position sensor to determine a position coordinate of the dummy-wafer-side position sensor. A control part, based on the position coordinate of the dummy-wafer-side position sensor, calculates a position coordinate of the arm-side position sensor when the arms hold the wafer, and moves the arms such that the arm-side position sensor moves to the calculated position coordinate.. ... Ebara Corporation

10/05/17 / #20170284727

Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method

A substrate transport apparatus includes a substrate holding unit configured to hold a substrate; a casing; and a drive mechanism at least partially provided within the casing and configured to drive the substrate holding unit using air. The drive mechanism is capable of supplying air into the casing.. ... Ebara Corporation

10/05/17 / #20170284579

Substrate processing apparatus

Provided is a substrate processing apparatus that includes: a rotary joint including a rotary unit that rotates together with the rotation of the head unit, a fixing unit that is provided around the rotary unit, and a sealing unit that seals a gap between the rotary unit and the fixing unit; and an outlet pipe through which the quenching water is discharged. A first flow passage through which a gas passes and a second flow passage through which the quenching water passes are formed in the rotary joint, and the second flow passage is isolated from the first flow passage by the sealing unit. ... Ebara Corporation

10/05/17 / #20170282325

End point detection method, polishing apparatus, and polishing method

An end point detection method is provided for detecting an end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (s102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (s103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (s105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.. ... Ebara Corporation

10/05/17 / #20170282132

Gas-dissolved water production device and production method

An ozone water production device (1) includes: flow rate controllers (4, 5) that each control a flow rate of gas which is a raw material; a flow rate meter (12) that measures a flow rate of water which is a raw material; a booster pump (13) that controls pressure of the water; an ozone water generating unit (8) that generates ozone water by mixing ozone gas and the water; and a pressure sensor (17) that measures pressure of the ozone water which is to be supplied to a use point (19). The booster pump (13) controls the pressure of the water such that the pressure of the ozone water measured by the pressure sensor (17) is constant. ... Ebara Corporation

09/28/17 / #20170278813

Plating method

A plating method which can achieve a desired dome height is disclosed. The method includes: preparing correlation data showing a relationship between proportion of dome height to bump height and concentration of chloride ions; producing a plating solution containing chloride ions at a concentration which has been selected based on a desired proportion of dome height to bump height and on the correlation data, the selected concentration being in a range of 100 mg/dm3 to 300 mg/dm3; immersing a substrate in the plating solution; and passing an electric current between an anode and the substrate, both immersed in the plating solution, thereby plating the substrate to form bumps.. ... Ebara Corporation

09/28/17 / #20170276176

Bearing apparatus and pump

A bearing apparatus is capable of stably supplying an appropriate amount of lubricating oil to a bearing with a simple arrangement, even if a peripheral speed of a rotational shaft increases. The bearing apparatus includes a bearing unit for receiving a load of a rotational shaft, a lubricating oil reservoir disposed below the bearing unit, and an oil disk rotatable together with the rotational shaft to scoop up lubricating oil stored in the lubricating oil reservoir. ... Ebara Corporation

09/21/17 / #20170271178

Substrate cleaning apparatus and substrate cleaning method

A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. ... Ebara Corporation

09/21/17 / #20170266779

Substrate polishing method, top ring, and substrate polishing apparatus

According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.. . ... Ebara Corporation

09/21/17 / #20170266778

Polishing apparatus and polishing method

A polishing apparatus capable of enabling a user to know a frequency and a trend of a retry operation of retrying a substrate release operation is disclosed. The polishing apparatus includes: a substrate holder configured to press a substrate against a polishing pad; a fluid ejection system configured to eject a fluid into a gap between the substrate and a flexible membrane for releasing the substrate from a substrate holding surface; an operation controller configured to instruct the fluid ejection system to perform a retry operation of ejecting the fluid again in a case where the release of the wafer has failed; and a monitoring device configured to store a historical information of the retry operation.. ... Ebara Corporation

09/14/17 / #20170263471

Substrate cleaning apparatus

A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. ... Ebara Corporation

09/14/17 / #20170260992

Impeller assembly for centrifugal pumps

An impeller assembly for centrifugal pumps has two disk members that have different diameters, are arranged coaxially to a rotation axis and face each other so as to form an interspace; blades are radially arranged in the interspace; the two disk members are also centrally provided with a fastening means for fastening to a transmission shaft, which rotates about the rotation axis. The particularity of the present invention resides in having contoured vanes that protrude radially from the peripheral region of the disk member that has the smallest diameter and are arranged substantially at the blades.. ... Ebara Corporation

09/14/17 / #20170259395

Polishing machine and a polishing method for a substrate

One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. ... Ebara Corporation

09/14/17 / #20170259394

Polishing apparatus

An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. ... Ebara Corporation

09/07/17 / #20170253987

Plating apparatus and plating method

The present invention improves the hydrophilicity of a substrate surface, and suppresses variation in the degree of hydrophilicity with each substrate. A plating apparatus is provided that performs a plating process on a substrate having a resist pattern. ... Ebara Corporation

09/07/17 / #20170252895

Substrate processing apparatus

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.. ... Ebara Corporation

09/07/17 / #20170252894

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. ... Ebara Corporation

09/07/17 / #20170252889

Polishing apparatus

A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.. ... Ebara Corporation

09/07/17 / #20170252700

Seawater desalination system and energy recovery apparatus

The present invention relates to a seawater desalination system for desalinating seawater by removing salinity from the seawater and an energy recovery apparatus which is preferably used in the seawater desalination system. The energy recovery apparatus includes a cylindrical chamber (ch) being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port (p1) for supplying and discharging the concentrated seawater, a seawater port (p2) for supplying and discharging the seawater, a flow resistor (23) provided at a concentrated seawater port (p1) side in the chamber (ch), and a flow resistor (23) provided at a seawater port (p2) side in the chamber (ch). ... Ebara Corporation

08/24/17 / #20170239784

Polishing apparatus and polishing method

A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.. ... Ebara Corporation

08/24/17 / #20170239778

Apparatus and method for regulating surface temperature of polishing pad

There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.. ... Ebara Corporation

08/17/17 / #20170236730

Substrate cleaning apparatus and substrate processing apparatus

A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate w and cleans the substrate w; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate w; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.. . ... Ebara Corporation

08/17/17 / #20170236727

Substrate holding module, substrate processing apparatus, and substrate processing method

According to the present disclosure, there is provided a substrate holding module that is capable of accommodating a substrate transferred by a transfer robot. The substrate holding module includes a pedestal including a holding mechanism configured to hold the substrate, a cover configured to cover the pedestal, and a moving mechanism configured to move the cover away from the pedestal.. ... Ebara Corporation

08/10/17 / #20170229323

Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and non-transitory computer readable medium recording water discharge control program

A water discharge system for a substrate processing apparatus comprising a substrate processor that processes a substrate using liquid, includes: at least two water discharge lines capable of discharging the liquid used in the substrate processor; a switching device configured to switch a water discharge line to which the liquid used in the substrate processor is to be discharged among the at least two water discharge lines; a measurement device configured to generate water discharge information by measuring the liquid used in the substrate processor; and a control mechanism configured to control the switching device in accordance with the water discharge information.. . ... Ebara Corporation

08/10/17 / #20170226656

Apparatus and method for supplying plating solution to plating tank, plating system, powder container, and plating method

An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.. ... Ebara Corporation

08/03/17 / #20170216989

Polishing apparatus

. . A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. ... Ebara Corporation

07/27/17 / #20170209902

Cleaning device, method of manufacturing the same and substrate cleaning apparatus

A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.. . ... Ebara Corporation

07/20/17 / #20170207106

Cleaning apparatus and substrate processing apparatus

A cleaning apparatus includes: a cleaning chamber configured to clean a substrate; a transfer chamber positioned adjacent to the cleaning chamber and configured to transfer the substrate; a partition wall partitioning the cleaning chamber and the transfer chamber; a gutter fixed to the partition wall; and a discharge pipe connected to a bottom portion of the gutter. A first pass hole and a second pass hole positioned below the first pass hole are formed in the partition wall. ... Ebara Corporation

07/13/17 / #20170200623

Cleaning apparatus

A cleaning apparatus 1 is provided with a heating unit 5 that heats a cleaning surface of a substrate w, a cleaning unit 6 that supplies ozone water to the cleaning surface of the substrate w and cleans the cleaning surface and a control unit 7 that controls the heating of the cleaning surface and the supply of the cleaning liquid so as to clean the cleaning surface after heating the cleaning surface of the substrate w.. . ... Ebara Corporation

07/13/17 / #20170200622

Vacuum evacuation system

The present invention relates to a vacuum evacuation system used to evacuate a processing gas from one or more process chambers for use in, for example, a semiconductor-device manufacturing apparatus. The vacuum evacuation system is a vacuum apparatus for evacuating a gas from a plurality of process chambers (1). ... Ebara Corporation

07/06/17 / #20170190020

Polishing method and polishing apparatus

The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate. The polishing method includes preparing a plurality of spectrum groups each containing a plurality of reference spectra corresponding to different film thicknesses; directing light to a substrate and receiving reflected light from the substrate; producing, from the reflected light, a sampling spectrum for selecting a spectrum group; selecting a spectrum group containing a reference spectrum which is closest in shape to the sampling spectrum; producing a measurement spectrum for obtaining a film thickness while polishing the substrate; selecting, from the selected spectrum group, a reference spectrum which is closest in shape to the measurement spectrum that has been produced when the substrate is being polished; and obtaining a film thickness corresponding to the selected reference spectrum.. ... Ebara Corporation

06/22/17 / #20170179783

Canned motor and vacuum pump

Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. ... Ebara Corporation

06/22/17 / #20170178940

Substrate transfer apparatus and substrate transfer method

Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. ... Ebara Corporation

06/22/17 / #20170175285

Plating apparatus

A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.. ... Ebara Corporation

06/22/17 / #20170173756

Polishing apparatus, control method and recording medium

A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.. ... Ebara Corporation

06/15/17 / #20170170034

Cleaning device and roll cleaning member

. . The present invention prevents or alleviates cleaning unevenness in cleaning of a substrate with the use of a roll cleaning member having protruding members. The roll cleaning device includes: a substrate support member that supports and rotates a substrate w; and an upper roll cleaning member (52) for scrub cleaning a surface of the substrate w which is rotated by the substrate support member, while rotating. ... Ebara Corporation

06/08/17 / #20170159203

Plating method and plating apparatus

. . A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.. . ... Ebara Corporation

06/08/17 / #20170157734

Polishing method and apparatus

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. ... Ebara Corporation

06/01/17 / #20170151649

Polishing table replacement apparatus, polishing table replacement method, and apparatus for replacing a component of semiconductor-device manufacturing machine

. . An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). ... Ebara Corporation

05/04/17 / #20170120194

Energy recovery system

An energy recovery system in a seawater desalination plant uses a reverse-osmosis membrane method for removing salinity from seawater. The system is configured to supply high-pressure water produced by pressurizing raw water with a high-pressure pump to a reverse-osmosis membrane cartridge, and to supply concentrated water discharged from the cartridge to an isobaric energy recovery device to recover pressure energy of the concentrated water whereby part of the raw water supplied to the isobaric energy recovery device is pressurized, and then to allow the pressurized raw water to merge into the high-pressure water pressurized by the high-pressure pump. ... Ebara Corporation

04/27/17 / #20170117165

Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. Pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. ... Ebara Corporation

04/20/17 / #20170106497

Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device

Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. ... Ebara Corporation

04/20/17 / #20170106493

Polishing apparatus and polishing method

A polishing apparatus 100 includes a first electric motor 14 that rotationally drives a polishing table 12, and a second electric motor 22 that rotationally drives a top ring 20 that holds a semiconductor wafer 18. The polishing apparatus 100 includes: a current detection portion 24; an accumulation portion 110 that accumulates, for a prescribed interval, current values of three phases that are detected by the current detection portion 24; a difference portion 112 that determines a difference between a detected current value in an interval that is different to the prescribed interval and the accumulated current value; and an endpoint detection portion 29 that detects a polishing endpoint that indicates the end of polishing of the surface of the semiconductor wafer 18, based on a change in the difference that the difference portion 112 outputs.. ... Ebara Corporation

04/20/17 / #20170106492

Polishing apparatus

Disclosed is a polishing apparatus that polishes a substrate by causing the substrate to be in slide contact with a polishing pad. The polishing apparatus includes a pad temperature control mechanism configured to control a surface temperature of the polishing pad, which includes a pad contact member that comes in contact with the surface of the polishing pad and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact member. ... Ebara Corporation

04/13/17 / #20170103928

Polishing method and polishing apparatus

A polishing method capable of obtaining an accurate thickness of a silicon layer during polishing of a substrate and determining an accurate polishing end point of the substrate based on the thickness of the silicon layer obtained. The method includes: calculating relative reflectance by dividing the measured intensity of the infrared ray by predetermined reference intensity; producing spectral waveform representing relationship between the relative reflectance and wavelength of the infrared ray; performing a fourier transform process on the spectral waveform to determine a thickness of the silicon layer and a corresponding strength of frequency component; and determining a polishing end point of the substrate based on a point of time when the determined thickness of the silicon layer has reached a predetermined target value.. ... Ebara Corporation

04/13/17 / #20170100813

Polishing apparatus and polishing method

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. ... Ebara Corporation

04/06/17 / #20170095901

Polishing apparatus

The polishing apparatus has: a polishing pad that has a polishing surface to polish a semiconductor wafer; a polishing table to which a back surface of the polishing pad on an opposite side of the polishing surface can be attached; a top ring that is opposed to the polishing surface, and can hold the semiconductor wafer; and an eddy current sensor that is arranged in the polishing table, and detects an end point of polishing. The polishing table has on an attachment surface a projection member projecting from the attachment surface to which the polishing pad is attached. ... Ebara Corporation

03/16/17 / #20170072531

Reversing machine and substrate polishing apparatus

. . Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.. ... Ebara Corporation

03/16/17 / #20170072528

Polishing apparatus and polishing method

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. ... Ebara Corporation

03/09/17 / #20170070171

Driving apparatus for electric motor

A driving apparatus for driving an electric motor, such as a synchronous motor or an induction motor, and more particularly to a driving apparatus which performs a vector control based on an output current of an inverter. The driving apparatus of the present invention includes an inverter, a current detector configured to detect an output current of the inverter, and a vector controller configured to transform the output current, detected by the current detector, into a torque current and a magnetization current and to control the torque current and the magnetization current. ... Ebara Corporation

03/09/17 / #20170066101

Substrate processing system and substrate processing method

The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus (1) configured to process a substrate w; and a flushing device for cleaning a distribution line (93) and a processing-liquid supply line (92). ... Ebara Corporation

03/02/17 / #20170058423

Plating apparatus, plating method, and substrate holder

In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. ... Ebara Corporation

03/02/17 / #20170057051

Eddy current sensor

An eddy current sensor 1-50 arranged in the vicinity of a substrate includes a core part 1-60 and a coil part 1-61. The core part 1-60 includes a common part 1-65, and four cantilever parts 1-66 to 69 connected to the common part 1-65. ... Ebara Corporation

03/02/17 / #20170057049

Polishing apparatus and polishing method

A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. ... Ebara Corporation

02/23/17 / #20170050289

Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.. . ... Ebara Corporation

02/16/17 / #20170043449

Dresser disk cleaning brush, cleaning apparatus, and cleaning method

. . The present invention provides a cleaning brush and a cleaning apparatus that can effectively discharge dust, removed from a dresser disk of a cmp apparatus upon cleaning the dresser disk, to the outside of the cleaning system in order to prevent the dust from being again deposited on the dresser disk. A cleaning brush includes a large number of brushes formed to protrude on its top surface, vertical through-holes and into which a nozzle for ejecting a cleaning fluid is inserted, and a recessed groove formed on a lower surface that lower ends of the through-holes and face. ... Ebara Corporation

01/12/17 / #20170008144

Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. ... Ebara Corporation

01/12/17 / #20170007961

Fan scrubber and vacuum pump apparatus

The fan scrubber is provided with a casing having a gas draw-in port and a gas ejection port, a fan disposed in the casing, a nozzle from which a liquid is jetted into the casing, and a canned motor connected to the fan. The canned motor has a main shaft connected to the fan, a rotor which rotates integrally with the main shaft, a stator disposed on the periphery of the rotor, a motor casing in which the rotor and the stator are housed, and a can which partitions the interior of the motor casing into a rotor chamber in which the rotor is disposed and a stator chamber in which the stator is disposed.. ... Ebara Corporation








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Ebara Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Ebara Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###