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Ev Group Gmbh patents


Recent patent applications related to Ev Group Gmbh. Ev Group Gmbh is listed as an Agent/Assignee. Note: Ev Group Gmbh may have other listings under different names/spellings. We're not affiliated with Ev Group Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Ev Group Gmbh-related inventors


Method and device for bonding substrates

A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.. ... Ev Group Gmbh

Method for the bonding and debonding of substrates

A method for bonding a product substrate to a carrier substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. A method for debonding a product substrate from a carrier substrate bonded to the product substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is dissolved through an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. ... Ev Group Gmbh

Method for producing a microlens

A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.. . ... Ev Group Gmbh

Embossing compound for embossing lithography

An embossing material that can be hardened and used for embossing lithography, comprised of a mixture of at least one polymerizable main component, and at least one secondary component. The invention also relates to a use of the embossing material for the primary forming of an embossing form.. ... Ev Group Gmbh

Method and device for the surface treatment of substrates

A method for the surface treatment of a substrate surface of a substrate includes arranging the substrate surface in a process chamber, bombarding the substrate surface with an ion beam, generated by an ion beam source and aimed at the substrate surface, to remove impurities from the substrate surface, whereby the ion beam has a first component, and introducing a second component into the process chamber to bind the removed impurities. A device for the surface treatment of a substrate surface of a substrate includes a process chamber for receiving the substrate, an ion beam source for generating an ion beam that has a first component and is aimed at the substrate surface to remove impurities from the substrate surface, and means to introduce a second component into the process chamber to bind the removed impurities.. ... Ev Group Gmbh

Receptacle device, device and method for handling substrate stacks

The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.. ... Ev Group Gmbh

Method and device for coating substrates

A method and device for coating a substrate with a film layer. The device comprises application means for applying a thermoplastic film layer material and distribution means for distributing the film layer material on the substrate for the formation of the film layer.. ... Ev Group Gmbh

Method for producing of structures on a substrate surface

A method and mould for producing millimetre and/or micrometre and/or nanometre-size structures on a substrate surface of a substrate.. . ... Ev Group Gmbh

Method for applying a bonding layer

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.. ... Ev Group Gmbh

Method for aligning substrates before bonding

A method and corresponding device for the alignment of a first substrate comprising at least two first alignment marks with a second substrate comprising at least two second alignment marks. By means of a first assignment, the first alignment marks are assigned to at least two first characteristic alignment features of the first substrate in an x-direction and in a y-direction. ... Ev Group Gmbh

Apparatus and method for bonding substrates

A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. ... Ev Group Gmbh

Method for application of an overgrowth layer on a germ layer

A method for applying a masked overgrowth layer onto a seed layer for producing semiconductor components, characterized in that a mask for masking the overgrowth layer is imprinted onto the seed layer.. . ... Ev Group Gmbh

Substrate attachment for attaching a substrate thereto

A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.. . ... Ev Group Gmbh

Method for bonding of substrates

A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force fh1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force fh2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature th; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature th is reduced at the second sample holder surface during the bonding.. . ... Ev Group Gmbh

02/08/18 / #20180040495

Substrate holder and method for bonding two substrates

A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.. . ... Ev Group Gmbh

02/08/18 / #20180040489

Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack

A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. ... Ev Group Gmbh

01/25/18 / #20180022079

Method and device for detaching a substrate from a substrate stack

A method and device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate and a product substrate, as well as a bonding layer bonding the carrier substrate and the product substrate. The bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, and the adhesive strength is at least partially reduced by a beam of electromagnetic radiation directed at least predominantly on the bonding layer.. ... Ev Group Gmbh

11/30/17 / #20170345690

Method and device for prefixing of substrates

A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.. . ... Ev Group Gmbh

10/26/17 / #20170305086

Die tool, device and method for producing a lens wafer

This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.. . ... Ev Group Gmbh

09/07/17 / #20170256663

Method for producing a conductive multiple substrate stack

A method for producing a multiple-substrate stack from an, in particular wavelength-sensitive, semiconductor substrate and at least one further, in particular wavelength-sensitive, semiconductor substrate with the following steps: applying a dielectric layer, which is electrically conductive at least in certain sections, onto at least one substrate surface of at least one of the semiconductor substrates, and contacting the semiconductor substrate with the further semiconductor substrate and forming an electrically conductive connection between the semiconductor substrates.. . ... Ev Group Gmbh

08/10/17 / #20170229336

Receptacle device, device and method for handling substrate stacks

. . The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.. ... Ev Group Gmbh

06/08/17 / #20170162538

Method for applying a bonding layer

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.. ... Ev Group Gmbh

04/27/17 / #20170117247

Method for bonding substrates

A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.. . ... Ev Group Gmbh

04/20/17 / #20170110377

Method and device for leveling a substrate stack

A method for equalizing the thickness variation of a substrate stack comprised of a product substrate and a carrier substrate and which is connected in particular by means of an interconnect layer, by local application of local thickness peaks by means of an application apparatus which has at least one application unit. Furthermore this invention relates to a corresponding device.. ... Ev Group Gmbh

04/13/17 / #20170100780

Chuck adapted for automated coupling

A chuck for clamping workpieces or tools in a clamping space with a clamping force (f). The chuck includes at least two chuck jaws movable in translation along one clamping plane (e) in the direction of one center z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. ... Ev Group Gmbh

04/06/17 / #20170098572

Method and device for surface treatment of substrates

A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.. ... Ev Group Gmbh

03/09/17 / #20170069483

Method and device for the surface treatment of substrates

A method for the surface treatment of a substrate surface of a substrate with the following steps: arrangement of the substrate surface in a process chamber, bombardment of the substrate surface with an ion beam, generated by an ion beam source and aimed at the substrate surface, to remove impurities from the substrate surface, whereby the ion beam has a first component, introduction of a second component into the process chamber to bind the removed impurities. A device for the surface treatment of a substrate surface of a substrate with: a process chamber for receiving the substrate, an ion beam source for generating an ion beam that has a first component and is aimed at the substrate surface to remove impurities from the substrate surface, means to introduce a second component into the process chamber to bind the removed impurities.. ... Ev Group Gmbh

02/23/17 / #20170053892

Device and method for permanent bonding

A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the boding.. . ... Ev Group Gmbh

02/16/17 / #20170047203

Method and device for plasma treatment of substrates

. . A device for bombarding at least one substrate with a plasma with a first electrode fiend a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.. ... Ev Group Gmbh

02/02/17 / #20170031242

Method and device for embossing structures

A method for embossing at least one microstructure or nanostructure with an embossing die that has at least one embossing structure with the following steps, in particular the following sequence: aligning the embossing structure of the embossing die relative to a metering device, metering an embossing material in the embossing structure by means of the metering device, at least partial hardening of the embossing material and embossing of the embossing material, characterized in that the embossing structures point in a gravitational direction (g) at least in the case of the metering. In addition, the invention relates to a corresponding device.. ... Ev Group Gmbh

01/05/17 / #20170001431

Method and device for embossing of a nanostructure

A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.. ... Ev Group Gmbh








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