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Evatec Ag patents


Recent patent applications related to Evatec Ag. Evatec Ag is listed as an Agent/Assignee. Note: Evatec Ag may have other listings under different names/spellings. We're not affiliated with Evatec Ag, we're just tracking patents.

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Chamber for degassing substrates

A heater or cooler chamber for a batch of more than one workpiece includes a heat storage block. In the block a multitude of pockets are provided, whereby each of the pockets may be closed or opened by a controllably operated door. ... Evatec Ag

Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. ... Evatec Ag

Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates

A method of manufacturing substrates using a transport and handing-over arrangement for disc shaped substrates, including a carrier and a take-over arrangement. A substrate carrier of magnetisable material has a peripheral protruding rim. ... Evatec Ag

Film stress uniformity control by rf coupling and wafer mount with adapted rf coupling

A fixture or clamp for a wafer in a vacuum treatment system has a non-conductive body with a first plane surface for arranging a substrate (wafer) thereon and a second surface opposite to first surface. A body includes a plurality of electrode-pairs; each electrode pair comprising a first electrode with a first electrode surface and a second electrode with a second electrode surface, electrode surfaces interconnected via a conductive member and arranged essentially in parallel to the first and second surfaces, the first electrode located closer to the first surface than the second electrode and the second electrode located closer to the second surface than the first electrode. ... Evatec Ag

Method of sputtering and sputter system

So as to control the operation of a sputter target during the lifetime of the target and under hipims operation, part of a magnet arrangement associated to the target is retracted from the target whereas a second part ii of the magnet arrangement is, if at all, retracted less from the addressed backside during the lifetime of the target. Thereby, part i is closer to the periphery of target than part ii, as both are eccentrically rotated about a rotational axis.. ... Evatec Ag

Apparatus and method for processing a substrate

A method of processing a substrate that displays out-gassing when placed in a vacuum includes placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature t1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature t2 at which the diffusion rate of the substrate's contamination is lower than at t1. ... Evatec Ag

Sputtering source arrangement, sputtering system and method of manufacturing metal-coated plate-shaped substrates

For coating substrates (s) having along their surfaces to be coated high aspect ratio vias, a sputtering system has a sputtering source arrangement, which includes a first dc pulse operated magnetron sub-source (1203) and a second frame-shaped magnetron sub-source (1213) which latter is arranged, in the system, between the substrate (s) and the first magnetron sub-source (1203). The second magnetron sub-source (1213) may be operated in dc, pulsed dc, thereby also hipims mode. ... Evatec Ag

Electro-static chuck with radiofrequency shunt

An electrostatic chuck (esc) exhibits a ceramic body with planar electrodes applied as bottom and top electrodes connected by vias through the ceramic body and a conducting layer on top of said ceramic body. A conducting current path is being arranged around the edge of the esc acting as an rf shunt connecting the rf chuck body with the back side of a substrate when arranged on said conducting top layer. ... Evatec Ag

Apparatus for depositing a layer on a substrate in a processing gas

Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing the substrate to the first surface of the chuck, an evacuatable enclosure enclosing the chuck and the clamp and control apparatus. The evacuatable enclosure includes an inlet, through which the processing gas is insertable into the enclosure. ... Evatec Ag








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