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Flexenable Limited patents


Recent patent applications related to Flexenable Limited. Flexenable Limited is listed as an Agent/Assignee. Note: Flexenable Limited may have other listings under different names/spellings. We're not affiliated with Flexenable Limited, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "F" | Flexenable Limited-related inventors


A control component for a current-driven optical media

The present invention relates to a control component for a current-driven optical media, for example a control component including thin film transistors (tft) for driving pixels of an active matrix optoelectronic device. An additional electrode is provided in a separate conducting layer within the control component in order to add a separate capacitance (c2) that is coupled to the gate electrode of the control component to supplement the capacitance (c1) already coupled between the gate and source electrodes.. ... Flexenable Limited

Patterning layer stacks for electronic devices

There is provided a method of patterning a stack of layers defining one or more electronic device elements, comprising: creating a first thickness profile in an uppermost portion of the stack of layers by laser ablation; and etching the stack of layers to translate the first thickness profile into a second thickness profile at a lower level; wherein the etching reduces the thickness of said uppermost portion of the stack and one or more lower layers of the stack under said uppermost portion.. . ... Flexenable Limited

Source/drain conductors for transistor devices

A transistor device comprising: source and drain conductors connected by a semiconductor channel provided by a layer of semiconductor material formed over the source and drain conductors; and a gate conductor capacitively coupled to the semiconductor channel via a gate dielectric; wherein at least one of the source and drain conductors comprises a multilayer structure in at least one region thereof, the multilayer structure comprising a lower layer and an upper layer, the material of the lower layer being better than the material of the upper layer at injecting charge into the semiconductor material; and the material of the upper layer exhibiting better electrical conductivity than the material of the lower layer.. . ... Flexenable Limited

Protecting transistor elements against degrading species

A technique comprising: providing a stack of layers defining at least (a) source and drain electrodes, (b) gate electrode, and (c) semiconductor channel of at least one transistor; depositing one or more organic insulating layers over the stack; removing at least part of the stack in one or more selected regions by an ablation technique; depositing conductor material over the stack in at least the one or more ablated regions and one or more border regions immediately surrounding a respective ablated region; and depositing inorganic insulating material over the stack at least in the ablated regions and the border regions to cover the ablated regions and make direct contact with said conductor material in said one or more border regions all around the respective ablated region.. . ... Flexenable Limited

Production of transistor arrays

A method of producing a transistor array, comprising an array of addressing conductors each providing the source electrodes of a respective set of transistors and at least part of a conductive connection between a respective driver terminal and said source electrodes; wherein the method comprises: forming a conductor layer on a support; and displacing a plurality of portions of said conductor layer relative to other portions of said conductor layer to create from said conductor layer at least (i) said array of addressing conductors and an array of drain conductors at said first level, (ii) conductor element islands in transistor channel regions at a second level, and (iii) one or more further conductor elements at a third level.. . ... Flexenable Limited

Method of bonding flexible printed circuits

A method for forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors, the method comprising: providing a first cushion (32) on a mount (26); disposing a first substrate (10) on the mount wherein a first side of the first substrate is in contact with the first cushion and a second side of the first substrate comprises the first plurality of electrical conductors (12); depositing an anisotropic conductive (ac) bonding material (18) on the first plurality of electrical conductors; aligning a second substrate 14 with the first substrate, wherein a first side of the second substrate comprises the second plurality of conductors (16), and wherein the second plurality of conductors are aligned with the first plurality of conductors such that the ac bonding material is sandwiched between the first side of the first substrate and the first side of the second substrate; providing a second cushion (28) on the second substrate; applying heat and pressure to the second cushion to form the ac bond between the first and second plurality of conductors; wherein the first and second cushions are formed of a thermally resistive and elastic material to enable substantially uniform pressure and heat to be applied across the first and second plurality of electrical conductors when forming the ac bond.. . ... Flexenable Limited








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