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Freescale Semiconductor Inc patents (2014 archive)


Recent patent applications related to Freescale Semiconductor Inc. Freescale Semiconductor Inc is listed as an Agent/Assignee. Note: Freescale Semiconductor Inc may have other listings under different names/spellings. We're not affiliated with Freescale Semiconductor Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "F" | Freescale Semiconductor Inc-related inventors


12/25/14 / #20140380258

Method and apparatus for performing integrated circuit layout verification

A method of performing layout verification for an integrated circuit (ic) layout is described. The method comprises receiving layout information for the ic layout, identifying at least one ic component within the ic layout, extracting localised layout information for the at least one ic component from the received layout information, defining the localised layout information for the at least one ic component within at least one component instance parameter therefor, and performing at least one layout verification check for the at least one component based at least partly on the at least one component instance parameter.. ... Freescale Semiconductor Inc

12/25/14 / #20140380017

Memory management and method for allocation using free-list

A method of managing a memory of an apparatus includes maintaining a plurality of lists of identifiers that each has an associated size value, wherein each identifier identifies a corresponding region of the memory that had been allocated for a process but that is currently not required by any of the one or more processes. When a process requests allocation of a region of the memory: one of the lists is identified that has an associated size value suitable for the allocation request; and if that list is not empty, a region of the memory is identified to the process by one of the identifiers that identifier is removed from that list, and, otherwise, a region of the memory is allocated with a size of the identified associated size value and the allocated region of the memory is identified the process.. ... Freescale Semiconductor Inc

12/25/14 / #20140376586

Multi-chip device with temperature control element for temperature calibration

A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. ... Freescale Semiconductor Inc

12/25/14 / #20140376317

Reducing the power consumption of memory devices

Systems and methods for reducing the power consumption of memory devices. A method of operating a memory device may include monitoring a plurality of sense amplifiers, each sense amplifier configured to evaluate a logic value stored in a memory cell, determining whether each of the plurality of sense amplifiers has completed its evaluation, and stopping a reference current from being provided to the sense amplifiers in response to all of the sense amplifiers having completed their evaluations. ... Freescale Semiconductor Inc

12/25/14 / #20140375341

Die fracture detection and humidity protection with double guard ring arrangement

An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically coupled to one another to define a conduction path between the first and second contact pads. ... Freescale Semiconductor Inc

12/25/14 / #20140374851

Mems device and method for fabricating mems devices

A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82). ... Freescale Semiconductor Inc

12/25/14 / #20140374849

Angular rate sensor with quadrature error compensation

An angular rate sensor includes a substrate, a drive mass flexibly coupled to the substrate, and a sense mass suspended above the substrate and flexibly coupled to the drive mass via flexible support elements. An electrode structure is mechanically coupled to, but electrically isolated from, the drive mass and is spaced apart from the substrate so that it is not in contact with the substrate. ... Freescale Semiconductor Inc

12/18/14 / #20140369015

Warp compensated electronic assemblies

An electronic panel assembly (epa) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (wcs). ... Freescale Semiconductor Inc

12/18/14 / #20140367859

Tin-based wirebond structures

Tin-based wirebond structures and wirebonds formed thereon. In some embodiments, an electronic package includes a semiconductor die located over a substrate and a wire configured to couple a terminal of the semiconductor die to a bond pad on the substrate. ... Freescale Semiconductor Inc

12/18/14 / #20140367830

Esd protection device

An electrostatic discharge protection clamp includes a substrate and a first electrostatic discharge protection device over the substrate. The first electrostatic discharge protection device includes a buried layer over the substrate. ... Freescale Semiconductor Inc

12/18/14 / #20140367239

Capacitive keypad position sensor with low cross-interference

A capacitive keypad position sensor includes a keypad touch panel having a first defined key area disposed in a plane having first and second orthogonal axes. First and second electrodes respectively occupy first and second areas below the first defined key area. ... Freescale Semiconductor Inc








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