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Glo Ab patents


Recent patent applications related to Glo Ab. Glo Ab is listed as an Agent/Assignee. Note: Glo Ab may have other listings under different names/spellings. We're not affiliated with Glo Ab, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "G" | Glo Ab-related inventors


Light emitting diodes with integrated reflector for a direct view display and method of making thereof

An led subpixel can be provided with a reflector layer that controls viewing angles. After formation of an array of nanowires including first conductivity type cores and active layers, a second conductivity type semiconductor material layer, a transparent conductive oxide layer, and a dielectric material layer are sequentially formed. ... Glo Ab

Semiconductor light emitting device including reflective element and method of making same

A light emitting device and method of forming the same, the method including etching grooves into semiconductor layers disposed on a substrate to form mesas, forming an insulating layer on the mesas, etching the insulating layer to expose upper surfaces of the mesas, and forming a reflective contact layer on the mesas. The contact layer may include protrusions disposed in the grooves on the etched insulating layer, and facing sidewalls of the mesas.. ... Glo Ab

Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer

A laser liftoff process is provided. A device layer can be provided on a transfer substrate. ... Glo Ab

Micro-lensed light emitting device

A micro-lensed, light emitting device including, a backplane, light emitting diodes (leds) disposed on the backplane, an encapsulation layer encapsulating the leds, and micro-lenses disposed on the encapsulation layer and configured to reduce an emission angle of light emitted from the leds.. . ... Glo Ab

Semiconductor light emitting device including cap structure and method of making same

A light emitting device and method of forming the same, the light emitting device including: a substrate, a buffer layer disposed on the substrate, a semiconductor mesa disposed on the buffer layer and including a first semiconductor layer, a light emitting active layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the first semiconductor layer, a contact layer disposed on an upper surface of the mesa, a passivation layer covering sidewalls of the mesa and the contact layer, and a cap structure including a reflective layer covering an upper surface of the contact layer, and a solder layer including a recess in which the reflective layer is disposed.. . ... Glo Ab

Iii-nitride nanowire led with strain modified surface active region and method of making thereof

A core-shell nanowire device includes an eave region having a structural discontinuity from the p-plane in the upper tip portion of the shell to the m-plane in the lower portion of the shell. The eave region has at least 5 atomic percent higher indium content than the p-plane and m-plane portions of the shell.. ... Glo Ab

Method of forming an array of a multi-device unit cell

Backplane-side bonding structures including a common metal are formed on a backplane. Multiple source coupons are provided such that each source coupon includes a transfer substrate and an array of devices to be transferred. ... Glo Ab

Monolithic image chip for near-to-eye display

A set of light emitting devices can be formed on a substrate a growth mask having a first aperture in a first area and a second aperture in a second area is formed on a substrate. A first nanowire and a second nanowire are formed in the first and second apertures, respectively. ... Glo Ab

Molded led package with laminated leadframe and method of making thereof

A method of packaging light emitting diodes (leds) includes molding a lead frame containing a plurality of lead frame fingers that are parallel to each other such that the lead frame fingers are separated from each other by a molded insulating structure to form a molded lead frame, mounting light emitting diodes to at least a portion of the molded lead frame, and dicing the molded lead frame to form a plurality of lead-containing mounting structures. Each of the lead-containing mounting structure includes a respective plurality of leads that are remaining portions of the lead frame, and each of the plurality of leads contains at least one castellation.. ... Glo Ab

Light emitting diode array on a backplane and method of making thereof

A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. ... Glo Ab

Selective die repair on a light emitting device assembly

A method of repairing a light emitting device assembly includes providing a light emitting device assembly including a backplane and light emitting devices, where a predominant subset of pixels in the light emitting device assembly includes an empty site for accommodating a repair light emitting device, generating a test map that identifies non-functional light emitting devices in the light emitting device assembly, providing an assembly of a repair head and repair light emitting devices, wherein the repair light emitting devices are located only on locations that are mirror images of empty sites within defective pixels that include non-functional light emitting devices, and transferring the repair light emitting devices from the repair head to the backplane in the empty site in the defective pixels.. . ... Glo Ab

Iii-nitride nanowire led with strain modified surface active region and method of making thereof

A light emitting diode (led) device includes a semiconductor nanowire core, and an in(al)gan active region quantum well shell located radially around the semiconductor nanowire core. The active quantum well shell contains indium rich regions having at least 5 atomic percent higher indium content than indium poor regions in the same shell. ... Glo Ab

Narrow angle light engine

A light engine includes a housing containing a rectangular aperture, a polarizer disposed in the housing facing the aperture, a light emitting diode (led) array disposed in the housing, and a light guide configured to guide light emitted from the led array toward the aperture, such that light is emitted through the aperture.. . ... Glo Ab

Monolithic multicolor direct view display containing different color leds and method of making thereof

A direct view multicolor light emitting device includes blue, green and red light emitting diodes (leds) in each pixel. The different light emitting diodes can be formed by depositing different types of active region layers in a stack such that deposition area of each subsequent active region is less than the deposition area of any preceding active region, and by patterning the active region layers into different types of stacks. ... Glo Ab

10/26/17 / #20170309223

Small pitch direct view display and method of making thereof

A direct view display device includes a printed circuit board, an array of pixels located on a first side of the printed circuit board, each pixel including a plurality of light emitting diodes, and an isolation grid comprising a light absorbing material located between the pixels in the array of pixels.. . ... Glo Ab

10/05/17 / #20170288102

Through backplane laser irradiation for die transfer

Light emitting devices can be disposed on the front side of a transparent backplane. A laser beam can be irradiated through the transparent backplane and onto a component located on the front side of the transparent backplane. ... Glo Ab

09/28/17 / #20170279017

Nanostructured led

The device according to the invention comprises a nanostructured led with a first group of nanowires protruding from a first area of a substrate and a contacting means in a second area of the substrate. Each nanowire of the first group of nanowires comprises a p-i-n-junction and a top portion of each nanowire or at least one selection of nanowires is covered with a light-reflecting contact layer. ... Glo Ab

08/17/17 / #20170236975

Iii-nitride nanowire led with strain modified surface active region and method of making thereof

A core-shell nanowire device includes an eave region having a structural discontinuity from the p-plane in the upper tip portion of the shell to the m-plane in the lower portion of the shell. The eave region has at least 5 atomic percent higher indium content than the p-plane and m-plane portions of the shell.. ... Glo Ab

08/17/17 / #20170236811

Method of selectively transferring led die to a backplane using height controlled bonding structures

Selective transfer of dies including semiconductor devices to a target substrate can be performed employing local laser irradiation. Coining of at least one set of solder material portions can be employed to provide a planar surface-to-surface contact and to facilitate bonding of adjoining pairs of bond structures. ... Glo Ab

08/17/17 / #20170235039

Integrated back light unit including non-uniform light guide unit

An integrated back light unit can include a light guide plate having a non-uniform distribution of extraction features. The non-uniform distribution of the extraction features can be provided by an extraction-feature-free region in proximity to a light emitting device, and/or by a variable density of the extraction features that changes with distance from the light emitting device. ... Glo Ab

08/10/17 / #20170227816

Led backlight unit with separately and independently dimmable zones for a liquid crystal display

A liquid crystal display module includes a plurality of liquid crystal pixels and a backlight unit containing white-light-emitting leds located in individually dimmable zones. Selectively brightening or dimming one or more individually dimmable zones to directly illuminate one or more pixels with brighter or dimmer white light.. ... Glo Ab

08/03/17 / #20170221963

Pixilated display device based upon nanowire leds and method for making the same

A pixelated display device and a method for making the same are disclosed. The device may include an array of nanowire leds located above a substrate. ... Glo Ab

06/15/17 / #20170170372

Monolithic image chip for near-to-eye display

A set of light emitting devices can be formed on a substrate. A growth mask having a first aperture in a first area and a second aperture in a second area is formed on a substrate. ... Glo Ab

06/15/17 / #20170170261

Coalesced nanowire structures with interstitial voids and method for manufacturing the same

A semiconductor device, such as an led, includes a plurality of first conductivity type semiconductor nanowire cores located over a support, a continuous second conductivity type semiconductor layer extending over and around the cores, a plurality of interstitial voids located in the second conductivity type semiconductor layer and extending between the cores, and first electrode layer that contacts the second conductivity type semiconductor layer.. . ... Glo Ab

06/08/17 / #20170162552

Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer

A laser liftoff process is provided. A device layer can be provided on a transfer substrate. ... Glo Ab

05/18/17 / #20170139105

Integrated back light unit with remote phosphor

An integrated back light unit includes a light emitting device assembly including a plurality of light emitting devices located in a reflective mixing chamber containing reflective walls, a phosphor material which is located remotely from the leds and converts the light from the light emitting devices into phosphor converted light, and a light guide unit optically coupled to the light emitting device assembly to receive light from the light emitting devices and the phosphor material. The combination of the light from the plurality of light emitting devices that passes through the phosphor material and the phosphor converted light can provide white light that can be scattered by the light guide unit to provide white backlight.. ... Glo Ab

03/09/17 / #20170068038

Integrated back light unit

An integrated back light unit includes a light emitting device assembly which contains an optically transparent encapsulant portion which encapsulates at least one light emitting device, and a light guide unit optically coupled to the at least one light emitting device to receive light from the at least one light emitting device. An adhesive material portion can be provided to bond the light emitting device assembly and the light guide unit. ... Glo Ab

02/23/17 / #20170052313

Light bar for back light unit containing resistance modulated led strings

A light bar includes a plurality of first color light emitting leds including a first subset of first color light emitting leds and a second subset of first color light emitting leds, a plurality of second color light emitting leds, where the second color is different from the first color, and a plurality of third color light emitting leds, where the third color is different from the first and the second colors. The second subset of first color light emitting leds are electrically connected in series with a larger electrical load than the first subset of first color light emitting leds. ... Glo Ab








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