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Hsio Technologies Llc patents

Recent patent applications related to Hsio Technologies Llc. Hsio Technologies Llc is listed as an Agent/Assignee. Note: Hsio Technologies Llc may have other listings under different names/spellings. We're not affiliated with Hsio Technologies Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Hsio Technologies Llc-related inventors

High density, high performance electrical interconnect circuit structure

A method of making a fusion bonded circuit structure. Each major surface of an lcp substrate is provided with a seed layers of a conductive material. ... Hsio Technologies Llc

Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrate

An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. ... Hsio Technologies Llc

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Hsio Technologies Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Hsio Technologies Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by