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Jcu Corporation patents

Recent patent applications related to Jcu Corporation. Jcu Corporation is listed as an Agent/Assignee. Note: Jcu Corporation may have other listings under different names/spellings. We're not affiliated with Jcu Corporation, we're just tracking patents.

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Packing for substrate plating jig and substrate plating jig using the same

. . A packing for a plating jig attached to a plating jig for sealing conductive members for supplying power to a substrate and portions of the substrate surface in contact with the conductive members from a plating solution, including a packing main body formed from a long elastic member having ends and a connecting member which connects and fix connection ends of both end portions of the packing main body to each other for allowing the packing main body to be an endless shape. The connecting member includes a shaft portion and plural hooks provided to protrude at a prescribed angle from the shaft portion, and when both connection ends of the packing main body are linked, the connecting member is internally provided to extend inside the packing main body in both directions from a connecting point within a prescribed range over the connecting point where the connection ends are linked.. ... Jcu Corporation

High-speed filling method for copper

To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating at a high speed, containing: immersing the substrate having the holes or grooves in an acidic copper plating solution containing a copper ion, a sulfate ion, and a halide ion, at from 30 to 70° c.; and plating the substrate at a current density of 3 a/dm2 or more by using an insoluble electrode as an anode.. ... Jcu Corporation

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Jcu Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Jcu Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by