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Kemet Electronics Corporation patents


Recent patent applications related to Kemet Electronics Corporation. Kemet Electronics Corporation is listed as an Agent/Assignee. Note: Kemet Electronics Corporation may have other listings under different names/spellings. We're not affiliated with Kemet Electronics Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kemet Electronics Corporation-related inventors


Leadless multi-layered ceramic capacitor stack

A stacked mlcc capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. ... Kemet Electronics Corporation

Face down mlcc

An multilayered ceramic capacitor is provided with mitigated microphonic noise propagation. The multilayered ceramic capacitor comprising a body comprising at least one face wherein the face has a body length. ... Kemet Electronics Corporation

Mlcc with id marker for orientation

An mlcc with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. This allows an mlcc with substantially similar width and thickness to be oriented with the electrodes in a preferred direction (either vertical or horizontal with respect to the board) that results in the minimum noise and vibration compared to other orientations. ... Kemet Electronics Corporation

Multilayer ceramic structure

An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. ... Kemet Electronics Corporation

Component stability structure

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. ... Kemet Electronics Corporation

Leadless stack comprising multiple components

An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements. . ... Kemet Electronics Corporation

Process to improve coverage and electrical performance of solid electrolytic capacitors

A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying a monoamine, a weak acid and a conductive polymer.. ... Kemet Electronics Corporation

Polyanion copolymers for use with conducting polymers in solid electrolytic capacitors

A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups a, b and c represented by formula axbycz as described herein.. ... Kemet Electronics Corporation

Hybrid capacitor and method of manufacturing a capacitor

An improved capacitor is described herein. The capacitor comprises a working element wherein the working element comprises an anode comprising a dielectric thereon and an anode conductive polymer layer on the dielectric. ... Kemet Electronics Corporation

Polymerization method for preparing conductive polymer

An improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. ... Kemet Electronics Corporation

Anode lead wires for improved solid electrolytic capacitors

An improved solid electrolytic capacitor, and method of making the solid electrolytic capacitor, is described. The solid electrolytic capacitor comprises a pressed powder anode and a braided lead wire extending from the anode. ... Kemet Electronics Corporation

Solid electrolytic capacitor with enhanced humidity resistance and method for producing the same

An improved capacitor is provided. The capacitor comprises an anode and a functional dielectric on said anode and a conductive layer on the functional dielectric. ... Kemet Electronics Corporation

Capacitor and method of manufacture utilizing membrane for encapsulant thickness control

An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. ... Kemet Electronics Corporation

Capacitor array and method of manufacturing

An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. ... Kemet Electronics Corporation

06/15/17 / #20170169956

Bulk mlcc capacitor module

Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.. ... Kemet Electronics Corporation

06/15/17 / #20170169955

Multiple mlcc modules

An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. ... Kemet Electronics Corporation

04/06/17 / #20170098512

Conductive polymer dispersion with enhanced coverage

An improved process for forming an electrolytic capacitor is provided. The process comprises: providing an anode with an anode wire extending from the anode body; forming a dielectric on the anode to form an anodized anode; applying a first slurry wherein the first slurry comprises conducting polymer and polyanion, wherein the polyanion and conducting polymer are in a first weight ratio thereby forming a first slurry layer; and applying a second slurry on the first slurry layer wherein the second slurry comprises the conducting polymer and said polyanion and wherein the polyanion and the conducting polymer are in a second weight ratio wherein the second weight ratio is lower than the first weight ratio.. ... Kemet Electronics Corporation

03/23/17 / #20170084397

Methods to reduce case height for capacitors

A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. ... Kemet Electronics Corporation

03/09/17 / #20170069429

Low energy milling to produce flake powders

A method for increasing surface area of a valve metal particle is provided as is an improved valve metal particle provided thereby. The method includes charging a mill apparatus with a valve metal powder and a media wherein the media has an average diameter of at least 0.01 cm to no more than 0.3175 cm. ... Kemet Electronics Corporation

01/26/17 / #20170025223

Electronic component structures with reduced microphonic noise

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. ... Kemet Electronics Corporation








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Kemet Electronics Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kemet Electronics Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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