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Mitsui Chemicals Tohcello Inc patents


Recent patent applications related to Mitsui Chemicals Tohcello Inc. Mitsui Chemicals Tohcello Inc is listed as an Agent/Assignee. Note: Mitsui Chemicals Tohcello Inc may have other listings under different names/spellings. We're not affiliated with Mitsui Chemicals Tohcello Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "M" | Mitsui Chemicals Tohcello Inc-related inventors


Semiconductor wafer surface protection film and method for manufacturing semiconductor device

This semiconductor wafer surface protection film has a substrate layer a, an adhesive absorption layer b, and adhesive surface layer c, in the stated order. The adhesive absorption layer b comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer b having a minimum value g′bmin of the storage elastic modulus g′b in the range of 25° c. ... Mitsui Chemicals Tohcello Inc

Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package

Provided are an electronic-device-protecting film used when semiconductor parts obtained by segmentation are to be sealed in the form of an array using a sealant after the semiconductor parts are rearranged, wherein the curing temperature of the sealant does not need to be adjusted downward; an electronic-device-protecting member; a method for manufacturing an electronic device; and a method for manufacturing a package. The electronic-device-protecting film includes a base layer and an adhesive layer, and the method includes: bonding the adhesive layer to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening; subsequently bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other; subsequently covering the semiconductor parts and the surface of the adhesive layer with a sealant; and heat-curing the sealant.. ... Mitsui Chemicals Tohcello Inc

Film for manufacturing semiconductor parts

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio re (=e′(160)/e′(−40)) of the elastic modulus of the base layer at 160° c. ... Mitsui Chemicals Tohcello Inc

Gas barrier laminate

A gas barrier laminate which includes a base material layer, and a gas barrier polymer layer having a thickness of from 0.01 μm to 0.45 μm provided over at least one surface of the base material layer and formed by heating a mixture including a polycarboxylic acid and a polyamine compound.. . ... Mitsui Chemicals Tohcello Inc

Gas barrier polymer, gas barrier film, and gas barrier laminate

A gas barrier polymer of the present invention is formed by heating a mixture including a polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum of the gas barrier polymer, when a total peak area in a range of an absorption band of equal to or more than 1493 cm−3 and equal to or less than 1780 cm−1 is a, and a total peak area in a range of an absorption band of equal to or more than 1598 cm−1 and equal to or less than 1690 cm−1 is b, an area ratio of an amide bond indicated by b/a is 0.370 or more.. . ... Mitsui Chemicals Tohcello Inc

Coating material for gas barrier, gas barrier film, and laminated body

A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —coo— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.. . ... Mitsui Chemicals Tohcello Inc

Resin composition for solar-cell encapsulating material, solar-cell encapsulating material, and solar cell module

According to the present invention, a resin composition for a solar-cell encapsulating material includes an ethylene•α-olefin copolymer of which an mfr measured based on astm d1238 under conditions of 190° c. And a load of 2.16 kg is equal to or less than 10 g/10 minutes, a silane coupling agent, and a hindered amine-based photostabilizer. ... Mitsui Chemicals Tohcello Inc

Front face side substrate for thermal transfer image-receiving sheet, and thermal transfer sheet

A front face side substrate provided between a supporting member and a receiving layer of a thermal transfer image-receiving sheet. The front face side substrate includes a front face side layer provided on one surface of a substrate layer and a rear face side layer provided on another surface of the substrate layer. ... Mitsui Chemicals Tohcello Inc








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