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Mitsui Chemicals Tohcello Inc patents

Recent patent applications related to Mitsui Chemicals Tohcello Inc. Mitsui Chemicals Tohcello Inc is listed as an Agent/Assignee. Note: Mitsui Chemicals Tohcello Inc may have other listings under different names/spellings. We're not affiliated with Mitsui Chemicals Tohcello Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "M" | Mitsui Chemicals Tohcello Inc-related inventors

Semiconductor wafer surface protection film and method for manufacturing semiconductor device

This semiconductor wafer surface protection film has a substrate layer a, an adhesive absorption layer b, and adhesive surface layer c, in the stated order. The adhesive absorption layer b comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer b having a minimum value g′bmin of the storage elastic modulus g′b in the range of 25° c. ... Mitsui Chemicals Tohcello Inc

Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package

Provided are an electronic-device-protecting film used when semiconductor parts obtained by segmentation are to be sealed in the form of an array using a sealant after the semiconductor parts are rearranged, wherein the curing temperature of the sealant does not need to be adjusted downward; an electronic-device-protecting member; a method for manufacturing an electronic device; and a method for manufacturing a package. The electronic-device-protecting film includes a base layer and an adhesive layer, and the method includes: bonding the adhesive layer to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening; subsequently bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other; subsequently covering the semiconductor parts and the surface of the adhesive layer with a sealant; and heat-curing the sealant.. ... Mitsui Chemicals Tohcello Inc

Film for manufacturing semiconductor parts

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio re (=e′(160)/e′(−40)) of the elastic modulus of the base layer at 160° c. ... Mitsui Chemicals Tohcello Inc

Gas barrier laminate

A gas barrier laminate which includes a base material layer, and a gas barrier polymer layer having a thickness of from 0.01 μm to 0.45 μm provided over at least one surface of the base material layer and formed by heating a mixture including a polycarboxylic acid and a polyamine compound.. . ... Mitsui Chemicals Tohcello Inc

Gas barrier polymer, gas barrier film, and gas barrier laminate

A gas barrier polymer of the present invention is formed by heating a mixture including a polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum of the gas barrier polymer, when a total peak area in a range of an absorption band of equal to or more than 1493 cm−3 and equal to or less than 1780 cm−1 is a, and a total peak area in a range of an absorption band of equal to or more than 1598 cm−1 and equal to or less than 1690 cm−1 is b, an area ratio of an amide bond indicated by b/a is 0.370 or more.. . ... Mitsui Chemicals Tohcello Inc

Coating material for gas barrier, gas barrier film, and laminated body

A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —coo— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.. . ... Mitsui Chemicals Tohcello Inc

Resin composition for solar-cell encapsulating material, solar-cell encapsulating material, and solar cell module

According to the present invention, a resin composition for a solar-cell encapsulating material includes an ethylene•α-olefin copolymer of which an mfr measured based on astm d1238 under conditions of 190° c. And a load of 2.16 kg is equal to or less than 10 g/10 minutes, a silane coupling agent, and a hindered amine-based photostabilizer. ... Mitsui Chemicals Tohcello Inc

Front face side substrate for thermal transfer image-receiving sheet, and thermal transfer sheet

A front face side substrate provided between a supporting member and a receiving layer of a thermal transfer image-receiving sheet. The front face side substrate includes a front face side layer provided on one surface of a substrate layer and a rear face side layer provided on another surface of the substrate layer. ... Mitsui Chemicals Tohcello Inc

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Mitsui Chemicals Tohcello Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Mitsui Chemicals Tohcello Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by