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Namics Corporation patents


Recent patent applications related to Namics Corporation. Namics Corporation is listed as an Agent/Assignee. Note: Namics Corporation may have other listings under different names/spellings. We're not affiliated with Namics Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Namics Corporation-related inventors


Resin composition

The present invention provides a resin composition that is thermally curable at a temperature of approximately 80° c., excellent in pct tolerance, and, therefore, suitable as a one-component adhesive to be used during manufacture of image sensor modules or electronic components. The resin composition contains (a) an epoxy resin; (b) a compound represented by formula (1) below; (c) a curing accelerator; and (d) a silane coupling agent. ... Namics Corporation

High performance, thermally conductive surface mount (die attach) adhesives

A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (i) a polyorganosilsesquioxane and (ii) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.. . ... Namics Corporation

Resin composition, copper paste, and semiconductor device

An object of the present invention is to provide a resin composition suitable for copper pastes, which can be cured in an ambient atmosphere and has a viscosity within an appropriate range and a low specific resistance after curing. This resin composition includes (a) a copper powder, (b) a thermosetting resin, (c) a fatty acid, (d) an amine, and (e) 4-aminosalicylic acid. ... Namics Corporation

Resin composition, paste for forming a varistor element, and varistor element

A resin composition which includes (a) an epoxy resin, (b) a curing agent, and (c) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.. ... Namics Corporation

Method of manufacturing bonded body

A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (a) and a solvent (b). ... Namics Corporation

Resin composition, conductive resin conposition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (a) a compound having in its molecule an oh group and any one of primary to tertiary amines, (b) dicyandiamide and/or imidazoles, (c) bismaleimides, and (d) a compound having in its molecule one or more epoxy groups, or cyanate ester.. ... Namics Corporation

Conductive copper paste, conductive copper paste cured film, and semiconductor device

The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (a) a copper powder, (b) a thermosetting resin, (c) a fatty acid that is liquid at normal temperature, and (d) triethanolamine. ... Namics Corporation

Solar cell module and method for producing same

A method for producing a solar cell module is obtained that allows a wiring material to be wired by a highly productive wiring method when a solar cell module is formed by arranging the wiring material on an electrode of a solar cell. The method for producing a solar cell module includes preparing a plurality of solar cells having an electrode on at least one of a first main surface and a second main surface, arranging the plurality of solar cells so that the first main surfaces of the plurality of solar cells face roughly in the same direction, connecting the linear conductor for electrically connecting one of the electrode on the first main surface and the electrode on the second main surface of each solar cell with one continuous linear conductor, and electrically disconnecting the continuous linear conductor after the connecting the linear conductor so that the electrodes of at least one pair of adjacent solar cells among the plurality of solar cells are connected in series.. ... Namics Corporation

Resin composition

There is provided a resin composition which can be thermoset at a temperature of approximately 80° c., and has excellent pct resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. ... Namics Corporation

Semiconductor device and image sensor module

The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (a) thermosetting resin, (b) a particular thiol compound, and (c) a latent curing agent.. ... Namics Corporation

Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (a) a compound having in its molecule an oh group and any one of primary to tertiary amines, (b) dicyandiamide, and (c) bismaleimides.. ... Namics Corporation

Resin composition, adhesive agent, and sealing agent

There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (a) an acrylic resin, (b) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (c) a latent curing agent, (d) a radical polymerization inhibitor, and (e) an anionic polymerization retarder. ... Namics Corporation

Film adhesive and semiconductor device including the same

Provided is a film adhesive which is preferably used as a ncf, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an ncf during the manufacture of the semiconductor device. ... Namics Corporation

Heat conductive paste and method for producing the same

A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. ... Namics Corporation

11/23/17 / #20170335090

Liquid sealing material for copper bump, and resin composition for use as same

Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. ... Namics Corporation

08/24/17 / #20170243849

Conductive composition and electronic parts using the same

A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (a) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (b) a solvent, and (c) thermoplastic resin particles having a maximal value of an endothermic peak in a dsc chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° c. To 170° c.. ... Namics Corporation

05/11/17 / #20170129058

Conductive paste, laminated ceramic part, printed wiring board and electronic device

A conductive paste including (a) a silver powder, (b) a glass frit, (c) an organic binder and (d) a powder containing cu and at least one metal element selected from the group consisting of v, cr, mn, fe and co. The powder (d) may thus contain cu and mn, cu and fe or cu and co. ... Namics Corporation

03/16/17 / #20170073459

Resin composition

A resin composition containing (a) an epoxy resin; (b) a compound represented by formula (1) below; (c) a curing accelerator; and (d) a silane coupling agent is provided. The compound of the (b) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (a) component and thiol groups in the compound of the (b) component, the silane coupling agent of the (d) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (a) component, the (b) component, the (c) component, and the (d) component, and an equivalent ratio between thiol groups in the compound of the (b) component and si in the silane coupling agent of the (d) is 1:0.002 to 1:1.. ... Namics Corporation

02/09/17 / #20170040472

Process for producing conductive pastes for forming solar cell electrodes

A process for producing conductive pastes for forming solar cell electrodes, including a step of measuring binding energies of oxygen in a glass frit by x-ray photoelectron spectroscopy, a step of selecting a glass frit providing an x-ray photoelectron spectrum representing binding energies of oxygen in which the signal intensity of a peak with a peak top at a range from 529 ev to less than 531 ev has a proportion of 40% or more relative to the total of signal intensities from 526 ev to 536 ev, and a step of mixing together a conductive powder, the glass frit and an organic vehicle.. . ... Namics Corporation

01/26/17 / #20170022356

Epoxy resin composition, semiconductor sealing agent, and semiconductor device

An epoxy resin composition includes: (a) epoxy resin; (b) a curing agent; (c) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (d) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (e) 0.1 to 8 mass % of elastomer, wherein the component (c) and the component (d) are contained by 50.1 to 77 mass % in total.. . ... Namics Corporation

01/05/17 / #20170005021

Epoxy resin composition, semiconductor sealing agent, and semiconductor device

An epoxy resin composition includes: (a) epoxy resin; (b) a curing agent; (c) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (d) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component (c) and the component (d) are contained by 40.1 to 77 mass % in total.. ... Namics Corporation








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