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Nichia Corporation patents


Recent patent applications related to Nichia Corporation. Nichia Corporation is listed as an Agent/Assignee. Note: Nichia Corporation may have other listings under different names/spellings. We're not affiliated with Nichia Corporation, we're just tracking patents.

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Method for manufacturing light-emitting device

A method for manufacturing a light-emitting device includes: a first connecting step of forming a ball portion of the wire joined to a first connecting point on a light emitting element; a first transferring step of transferring the capillary to a first point located in a +z direction above the first connecting point; a second transferring step of transferring the capillary from the first point to a second point located in a −x direction opposite from a second connecting point on the substrate; a third transferring step of transferring the capillary from the second point to a third point located in a +x direction beyond the second connecting point and in the +z direction above the second connecting point; a second connecting step of transferring the capillary and joining the wire to the second connecting point; and forming an encapsulating member to encapsulate the wire.. . ... Nichia Corporation

Light emitting device

A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. ... Nichia Corporation

Light emitting device and method of manufacturing the same

A light emitting device includes a light emitting element, a light-transmissive member, a light guide member and a light reflective member. The light-transmissive member includes a first region directly above a top surface of the light emitting element, and a second region at a lateral side of the first region. ... Nichia Corporation

Light emitting device mounting board block, light emitting device, and method of producing the light emitting device

A light emitting device mounting board block includes: a lead frame having a plate-shape, the lead frame having a first surface, and a second surface located opposite to the first surface; and a resin molded body located on the first surface of the lead frame, the resin molded body having a recessed portion therein. The resin molded body includes a first lateral wall, a second lateral wall, a third lateral wall and a fourth lateral wall, the first and second lateral walls extending in a length direction, the third and fourth lateral walls extending in a width direction.. ... Nichia Corporation

Method of manufacturing light emitting element

A method of manufacturing a light emitting element includes: providing a wafer that includes a substrate having a first principal face and a second principal face, a dielectric multilayer film disposed on the first principal face, and a semiconductor structure disposed on the second principal face; forming modified regions in the substrate by focusing a laser beam inside the substrate via the dielectric multilayer film, and allowing cracks to form from the modified regions to the dielectric multilayer film; subsequent to forming the modified regions in the substrate, removing regions of the dielectric multilayer film that contain cracks; and cleaving the wafer along regions where cracks were formed in the substrate.. . ... Nichia Corporation

Package and package intermediate body

A package has a first electrode, a second electrode, and a first resin body. The first resin body has a retainer portion and a wall portion. ... Nichia Corporation

Light-emitting device

A light-emitting device includes a semiconductor layered structure; an upper electrode disposed on a portion of an upper surface of the semiconductor layered structure; a lower electrode disposed on a lower surface of the semiconductor layered structure in a region spaced from a region directly under the upper electrode, the lower electrode being reflective; and a protective film disposed continuously on a surface of the upper electrode and the upper surface of the semiconductor layered structure. A thickness of a first portion of the protective film, which is disposed at least in a region directly above the lower electrode, is smaller than a thickness of a second portion of the protective film, which is disposed continuously on the surface of the upper electrode and the upper surface of the semiconductor layered structure adjacent to the portion on which the upper electrode is disposed.. ... Nichia Corporation

Display device

A display apparatus time-divisionally expresses gradation values allocated to the sub-frames so that the gradation value of the single frame is expressed by a total of the gradation values of the sub-frames. Each of the plurality of sub-frames includes a plurality of weighted elements with different gradation values to express the gradation values by powers of two. ... Nichia Corporation

Light-emitting device

Provided is a light-emitting device including a light-emitting element having a peak emission wavelength in a range of from 400 nm to 470 nm, and a fluorescent member including a first fluorescent material including an aluminate that contains mg, mn, and at least one alkali earth metal selected from the group consisting of ba, sr, and ca, a second fluorescent material having a different composition from the first fluorescent material, and a third fluorescent material. The first, second and third fluorescent materials have a peak emission wavelength in a range of from 510 nm to 525 nm, from 510 nm to 550 nm, and from 620 nm to 670 nm, respectively. ... Nichia Corporation

Method of manufacturing light emitting device

A method of manufacturing a light emitting device, includes providing a light emitting element having an element upper surface, an element lower surface opposite to the element upper surface in a thickness direction of the light emitting element, and an element side surface between the element upper surface and the element lower surface. A wavelength converter having a converter lower surface is provided. ... Nichia Corporation

Method of manufacturing light emitting device

A method of manufacturing a light emitting device includes: mounting a plurality of light emitting elements on a base material; joining a plurality of translucent members respectively on upper surfaces of the light emitting elements; covering side surfaces of the light emitting elements and side surfaces of the translucent members with a light reflecting member at once; and forming a groove in the light reflecting member between adjacent ones of the light emitting elements.. . ... Nichia Corporation

Nitride fluorescent material, method for producing the same, and light emitting device

A method for producing a nitride fluorescent material having high emission luminance can be provided. The method includes heat-treating a raw material mixture containing silicon nitride, silicon, an aluminium compound, a calcium compound, and a europium compound.. ... Nichia Corporation

Light emitting device and method for manufacturing the same

A light emitting device includes a light emitting element having a first face positioned on an emission face side of the light emitting device, a second face opposing the first face, and lateral faces disposed between the first face and the second face, a light transmissive member formed from a resin-containing material, covering at least a portion of the lateral faces of the light emitting element and having a first face positioned on the emission face side, a covering member covering an exterior of the light transmissive member and having a first face positioned on the emission face side, a wavelength converting member covering the first face of the light emitting element, the first face of the light transmissive member, and the first face of the covering member, and a light reflective film including a first reflective film portion made of an inorganic material disposed between the exterior of the light transmissive member and the covering member, and a second reflective film portion made of an inorganic material disposed between the first face of the covering member and the wavelength converting member.. . ... Nichia Corporation

Fluoride fluorescent material, method for producing the same, and light emitting device

A method for producing a fluoride fluorescent material including: preparing a first solution containing manganese, a second solution containing at least one cation selected from the group consisting of k+, li+, na+, rb+, cs+, and nh4+, and a third solution containing at least one element selected from the group consisting of the elements from groups 4 and 14 of the periodic table, and adding the first and third solutions dropwise, each at a rate of 0.3% or less of the total volume of the solution per minute to the second solution to obtain particles having a composition represented by formula (i): a2[m1-amn4+af6] (i) wherein a denotes at least one cation selected from the group consisting of k+, li+, na+, rb+, cs+, and nh4+; m denotes at least one element selected from the group consisting of the elements from groups 4 and 14 of the periodic table; and a satisfies 0.04<a<0.20.. . ... Nichia Corporation

06/28/18 / #20180183205

Method for manufacturing laser package

A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials.. . ... Nichia Corporation

06/28/18 / #20180183049

Positive electrode material for non-aqueous secondary batteries, non-aqueous secondary battery, and method for producing positive electrode material for non-aqueous secondary batteries

A method for producing a positive electrode material for non-aqueous secondary batteries includes: performing a heat treatment on zirconium boride particles in an oxygen-containing atmosphere at a heat treatment temperature of not less than 220° c. And not more than 390° c., thereby obtaining heat-treated particles; and mixing the heat-treated particles with a positive electrode active material which contains a lithium transition metal complex oxide particles including at least one of cobalt and nickel in a composition thereof and having a layered structure, such that a content of the heat-treated particles relative to the lithium transition metal complex oxide particles is, as zirconium, not less than 0.25 mol % and not more than 2.2 mol %, thereby obtaining a positive electrode material for non-aqueous secondary batteries.. ... Nichia Corporation

06/28/18 / #20180182942

Light emitting device

A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak wavelength. A light transform layer is provided on the light emitting surface to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. ... Nichia Corporation

06/28/18 / #20180182941

Light emitting device

A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak emission wavelength in a wavelength range of 380 nm or longer and 430 nm or shorter. A light transform layer is disposed on the light emitting surface of the light emitting element to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. ... Nichia Corporation

06/28/18 / #20180182940

Light emitting device

A light emitting device includes a mounting board, light sources, a light diffuser, a wavelength conversion layer, and scatter reflection portions. Each of the light sources has an upper face on which a light reflecting layer is disposed. ... Nichia Corporation

06/28/18 / #20180182938

Light emitting device and method of manufacturing the same

There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an end face on substantially the same plane as an end face of the covering member, wherein the covering member has a recess portion or a convex portion on the upper surface, a light emitting surface of the light emitting element and an upper surface other than the recess portion or the convex portion of the covering member are arranged on substantially the same plane, and the light-transmissive member is provided in contact with the recess portion or the convex portion.. . ... Nichia Corporation

06/28/18 / #20180182936

Method of manufacturing light emitting device

A method of manufacturing a light emitting device include providing a mold with a mold recess having a bottom and an inner peripheral surface that is connected to the bottom. The bottom includes a bottom projection and a bottom recess surrounding the bottom projection to define the bottom projection that has a projection top surface and a projection peripheral surface opposing the inner peripheral surface. ... Nichia Corporation

06/28/18 / #20180182933

Light emitting device and method for manufacturing the same

A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent sealing material is provided in the recess to encapsulate the light emitting element. ... Nichia Corporation

06/28/18 / #20180182932

Method of producing wavelength conversion member

Provided is a method of producing a wavelength conversion member, comprising the steps of forming a fluorescent material layer on the top surface of a substrate and filling a translucent material into the fluorescent material layer. The fluorescent material layer contains fluorescent material particles and has voids between the fluorescent material particles. ... Nichia Corporation

06/28/18 / #20180182930

Filling material, resin composition, package, light-emitting device, and methods of manufacturing same

A filling material for a resin composition includes a base material and a coating material coating at least a portion of a surface of a particle of the base material. The base material comprises a first inorganic compound containing a group ii element. ... Nichia Corporation

06/28/18 / #20180182929

Light emitting device and method for manufacturing the same

A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. ... Nichia Corporation

06/28/18 / #20180182928

Light emitting device

A light-emitting device includes: a package made of a metal material and defining a recess, the package comprising a side wall defining a side of the recess; a plurality of light-emitting elements disposed in the recess; and a cover member disposed so as to close an opening of the recess, the cover member including: a light-transmitting member having a primary surface, a ceramic member having a loop-shape and having a first surface and a second surface opposite the first surface, the first surface bonded to the primary surface of the light-transmitting member via a bonding material, and a metal member having a loop-shape and including: a first portion bonded to the second surface of the ceramic member, and a second portion located outward of the first portion in a plan view and joined to an upper surface of the side wall of the package.. . ... Nichia Corporation

06/28/18 / #20180182924

Method of manufacturing light-emitting device

A method of manufacturing a light-emitting device includes: providing a light-emitting element, the light-emitting element comprising a layered semiconductor partially comprising an active layer in a plan view; mounting the light-emitting element on a supporting member; forming a phosphor layer so as to cover the light-emitting element; determining a surplus portion of the phosphor layer; and removing at least a portion of the phosphor layer in a region in the plan view in which the active layer is not disposed.. . ... Nichia Corporation

06/28/18 / #20180182922

Light-emitting element

A light-emitting element includes: a semiconductor structure; light-reflecting electrodes; a first insulating film having: one or more first n-side openings and one or more first p-side openings; one or more interconnect electrodes on an upper surface of the first insulating film; a first electrode on the upper surface of the first insulating film; a second electrode on the upper surface of the first insulating film; a second insulating film having: one or more second n-side openings and one or more second p-side openings; a first external connection portion; and a second external connection portion.. . ... Nichia Corporation

06/28/18 / #20180182917

Light emitting device and method for manufacturing the same

A method for manufacturing a light emitting device includes placing a light emitting element on a releasable base material so that a first face of the light emitting element is in contact with the releasable base material. An entire area of the first face is a first area. ... Nichia Corporation

06/28/18 / #20180182695

Package for semiconductor device and semiconductor device

A package for a semiconductor device includes: a plate-shaped base member having a substantially rectangular shape in a plan view; a first and second electrode solder pads configured to be electrically connected to a semiconductor element when the semiconductor element is mounted on an upper surface of the base member, the electrode solder pads being disposed at a lower surface side of the base member to face each other in a first direction; and first and second auxiliary solder pads disposed on a lower surface of the base member, the auxiliary solder pads being disposed at both sides of the electrode solder pads such that the first and second electrode solder pads are disposed between the first and second auxiliary solder pads in a plan view.. . ... Nichia Corporation

06/28/18 / #20180182617

Method for manufacturing restored substrate and method for manufacturing light emitting element

A method for manufacturing a restored substrate includes: removing a nitride semiconductor layer from a stacked-layer in which the nitride semiconductor layer has been laminated on a substrate; oxidizing material adhering to the substrate to produce an oxide deposit after the removing of the nitride semiconductor layer from the stacked-layer; and removing the oxide deposit from the substrate. A method for manufacturing a light emitting element includes stacking nitride semiconductor layers including an active layer on the restored substrate obtained by the above method.. ... Nichia Corporation

06/28/18 / #20180180263

Light emitting device

A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.. . ... Nichia Corporation

06/28/18 / #20180180255

Light emitting device

A light emitting device includes a base, light sources, wall portions, and a half mirror. The base has a light reflecting surface and has a first side on which the light reflecting surface is provided. ... Nichia Corporation

06/28/18 / #20180180254

Illumination device

An illumination device includes: a laser light source; a cylindrical body disposed such that light emitted from the laser light source enters the cylindrical body at a first end portion side of the cylindrical body and passes through the cylindrical body; a reflector disposed so as to reflect light passing through the cylindrical body; and a ring assembly comprising a ring-shaped inner circumferential surface configured to reflect and propagate light from the reflector. The reflector includes: a first reflecting surface configured to reflect a first portion of light emitted from the laser light source, and a second reflecting surface configured to reflect a second portion of light emitted from the laser light source. ... Nichia Corporation

06/28/18 / #20180180250

Light emitting device and integrated light emitting device

A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. ... Nichia Corporation

06/28/18 / #20180180249

Light-emitting device and integrated light-emitting device

A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (h/w) of a height (h) to a width (w) of the encapsulating member is smaller than 0.5.. ... Nichia Corporation

06/28/18 / #20180178247

Light emitting device and light irradiation apparatus including the same

A light emitting device is provided which includes a printed board, light emitting elements, and a light-transmissive member. The light emitting elements are arranged in three or more rows, and mounted on the printed board. ... Nichia Corporation

06/21/18 / #20180177060

Method for manufacturing light emitting device

. . . . . . A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces after separation; mounting the light emitting element joined to the light transmissive piece on a mounting unit, with a bottom surface of the light emitting element facing a top surface of the mounting unit; removing a portion of the light transmissive piece such that a top surface of the light transmissive piece becomes a predetermined shape; and providing a light reflective member around the top surface of the light transmissive piece that remains after the portion of the light transmissive piece is removed.. . ... Nichia Corporation

06/21/18 / #20180175263

Method of manufacturing light emitting device

A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.. . ... Nichia Corporation

06/21/18 / #20180175259

Method for manufacturing light-emitting device

A method of manufacturing a light-emitting device includes flip-chip mounting a plurality of light-emitting elements on a substrate separately from each other. A light-transmissive member is bonded on the plurality of light-emitting elements. ... Nichia Corporation

06/21/18 / #20180175258

Method for manufacturing light emitting device

A method for manufacturing a light emitting device, includes providing a light emitting element including an electrode-formed surface, a substrate surface opposite to the electrode-formed surface, and a light emitting surface connecting the electrode-formed surface and the substrate surface. A bottom mold including a mounting surface having a protrusion and mold recesses provided on both sides of the protrusion to define the protrusion is provided. ... Nichia Corporation

06/21/18 / #20180175255

Light emitting device

A light emitting device includes a first light emitting element configured to emit red light, a second light emitting element configured to emit green light, a third light emitting element configured to emit blue light, and a translucent member covering the first, second and third light emitting elements. The translucent member includes a wavelength conversion substance configured to absorb the blue light of the third light emitting element and to emit light. ... Nichia Corporation

06/21/18 / #20180175252

Light emitting device and method of producing the same

A light emitting device includes: a resin package including: a plurality of leads that includes: a first lead having an upper surface, and a second lead having an upper surface, and a resin body that includes: a first resin portion, a second resin portion, a third resin portion disposed between the first lead and the second lead, and a resin connection portion, the plurality of leads and the at least one inner lateral wall surface of the first resin portion defining a recess, the second resin portion surrounding an element mounting region, and the resin connection portion connecting the first resin portion and the second resin portion at the bottom of the recess; at least one light emitting element disposed on the element mounting region; and a light-reflective member disposed between the inner lateral wall surface and the second resin portion in the recess.. . ... Nichia Corporation

06/21/18 / #20180175251

Light emitting device and method of producing the same

A light emitting device includes: a resin package including: a plurality of leads that includes: a first lead, and a second lead, a first resin portion, a second resin portion, and a third resin portion, the leads and the at least one inner lateral wall surface of the first resin portion defining a recess, the third resin portion being located between the first lead and the second lead, the second resin portion disposed surrounding an element mounting region at the bottom of the recess; and at least one light emitting element disposed on an element mounting region. At least one inner lateral wall surface of the recess has at least one protruding portion that protrudes toward the at least one light emitting element. ... Nichia Corporation

06/21/18 / #20180175239

Method for manufacturing light-emitting device

A method for manufacturing a light-emitting device includes: providing a light-transmissive member comprising: a base portion, and a projecting portion on a first surface side of the base portion; providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface; disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and forming a light-reflective member that covers at least one of (i) lateral surfaces of the light-emitting element, and/or (ii) lateral surfaces of the projecting portion of the light-transmissive member.. . ... Nichia Corporation

06/21/18 / #20180175238

Method for manufacturing light emitting element

A method for manufacturing a plurality of light emitting elements includes: providing a semiconductor wafer comprising: a substrate, an n-side nitride semiconductor layer containing an n-type impurity and located on the substrate, and a p-side nitride semiconductor layer containing a p-type impurity and located on the n-side nitride semiconductor layer; forming a protective layer on an upper face of the p-side nitride semiconductor layer in regions that include borders of areas to become the plurality of light emitting elements; reducing a resistance of the p-side nitride semiconductor in areas where no protective layer has been formed by annealing the semiconductor wafer; irradiating a laser beam on the substrate so as to form modified regions in the substrate; and obtaining a plurality of light emitting elements by dividing the semiconductor wafer in which the modified regions have been formed in the substrate.. . ... Nichia Corporation

06/21/18 / #20180174502

Display apparatus

In a display apparatus having a plurality of light emitting elements, a single frame includes a plurality of sub-frames, each of which includes a plurality of weighted elements with different gradations expressed at powers of two. When the number of sub-frames in a single frame is x (x is an integer greater than 1) and a maximum gradation value that can be expressed in each of the sub-frames is 2y−1 (y is an integer greater than 1), and the single frame is expressed by the gradation value in a range of x·2y-1 to x(2y−1)−2y-1, a lighting controller allocates the gradation value to each of the sub-frames so that the weighted element at an end of a timeline of at least one sub-frame of the plurality of sub-frames in the single frame is turned off.. ... Nichia Corporation

06/21/18 / #20180171222

Fluorescent material and light emitting device

Provided are a fluorescent material including a high light emission intensity and a light emitting device using the same. The present fluorescent material includes at least an a element, a m element, a d element, a e element, and an x element, wherein the a element is at least one element selected from the group consisting of sr, mg, ca, and ba; the m element is at least one element selected from the group consisting of eu, mn, ce, pr, nd, sm, tb, dy, and yb; the d element is at least one element selected from the group consisting of si, ge, sn, ti, zr, and hf, the e element is at least one element selected from the group consisting of al, b, ga, in, sc, y, and la; the x element is at least one element selected from the group consisting of o, n, and f; and a molar ratio of the m element to the sum of the a element and the m element [m/(a+m)] is 0.06 or less.. ... Nichia Corporation

06/21/18 / #20180171221

Method of producing nitride fluorescent material

Provided is a production method of a nitride fluorescent material capable of producing a nitride fluorescent material having a higher emission intensity. The production method is for producing a nitride fluorescent material having a composition containing at least one element ma selected from the group consisting of sr, ca, ba and mg, at least one element mb selected from the group consisting of li, na and k, at least one element mc selected from the group consisting of eu, ce, tb and mn, and al and n, which includes subjecting a raw material mixture containing elements constituting the composition of the nitride fluorescent material, along with srf2 and/or lif added thereto as a flux, to a heat treatment, wherein the amount of the flux is in a range of 5.0% by mass or more and 15% by mass or less relative to the total amount, 100% by mass of the raw material mixture and the flux.. ... Nichia Corporation

06/14/18 / #20180166610

Semiconductor light emitting element

A semiconductor light emitting element includes a first semiconductor layer, an active layer, a second semiconductor layer, a first conducting layer, a second conducting layer, and an insulating layer. The insulating layer is disposed at least on or above the upper surface of the second conducting layer. ... Nichia Corporation

06/07/18 / #20180159007

Method of manufacturing light emitting device with exposed wire end portions

A method of manufacturing one or more light emitting devices includes: forming one or more emitting elements, each including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode, on a growth substrate; forming a first metal layer electrically connected to each first electrode, and a second metal layer electrically connected to each second electrode; forming a first resin layer covering the one or more light emitting elements so as to expose an upper surface of each first metal layer and an upper surface of each second metal layer; connecting a first wire to the upper surface of each first metal layer, and connecting a second wire to the upper surface of each second metal layer; and forming a second resin layer on the first resin layer so as to expose an end portion of each first wire and second wire.. . ... Nichia Corporation

06/07/18 / #20180159002

Light-emitting device

A light-emitting device includes: a substrate; and at least one light source comprising: a light-emitting element comprising a plurality of electrodes that face the substrate, and a resin member covering at least portions of lateral surfaces of the light-emitting element and not covering an upper surface of the light-emitting element, wherein, in a directivity diagram of the light source, a variation in light output of the light source in a range of −40° to 40° is 15% or less.. . ... Nichia Corporation

06/07/18 / #20180158991

Semiconductor element and method for manufacturing the same

A semiconductor element includes a semiconductor layer, a carbide substrate, and a reflective layer. The carbide substrate is provided on the semiconductor layer. ... Nichia Corporation

06/07/18 / #20180158988

Semiconductor light emitting device

A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. ... Nichia Corporation

06/07/18 / #20180156373

Heating device and method of heating an heated object using the same

A heating device for being attached to and heating a heated object that requires to be heated and has an uneven exterior shape. The heating device including: a conductive member having thermal conductivity and being configured to be attached to a recess of the heated object; and a heater configured to cover and heat the heated object and the conductive member in a state where the conductive member is attached to the recess of the heated object. ... Nichia Corporation

06/07/18 / #20180155619

Method of producing thiogallate-based fluorescent material, method of producing light-emitting device, thiogallate-based fluorescent material and light-emitting device

Provided are a method of producing a thiogallate-based fluorescent material, a method of producing a light-emitting device, a thiogallate-based fluorescent material, and a light-emitting device. The method of producing a thiogallate-based fluorescent material includes preparing a first solution containing at least one m1 ion selected from the group consisting of sr, be, mg, ca, ba and zn, and at least one m2 ion selected from the group consisting of eu and ce, and a second solution containing a sulfite ion, simultaneously supplying the first solution and the second solution to a reactor to obtain a powder containing a sulfite that contains an element m1 and an element m2, mixing a raw material that contains the powder containing the sulfite that contains the element m1 and the element m2 and a powder containing a gallium compound, with lithium chloride to obtain a mixture, and heat-treating the mixture to obtain a thiogallate-based fluorescent material.. ... Nichia Corporation

05/31/18 / #20180151788

Light emitting device and substrate

A substrate for a light emitting device includes: a plurality of wiring patterns, each including: a first conductive pattern including: a light emitting element mounting region defined by a first, second, third, and fourth sides in a plan view, and a contact region; and a second conductive pattern surrounding a portion of the first side where the contact region is not present, an entirety of the second side, and a portion of or an entirety of the third side, wherein a first end portion of the second conductive pattern at the third side is positioned nearer to the fourth side than a second end portion of the second conductive pattern at the first side is to the fourth side. The third side of a second wiring pattern faces the first side of a first wiring pattern.. ... Nichia Corporation

05/31/18 / #20180151786

Light emitting device and method for producing the same

A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.. ... Nichia Corporation

05/31/18 / #20180151785

Method for manufacturing light-emitting device

A method for manufacturing at last one light-emitting device including a light-transmissive member, a light-emitting element, and a reflective member, the method including: providing a holding member comprising a plurality of through-holes or recesses; disposing a light-transmissive member in at least one of the through-holes or at least one of the recesses; disposing a light-emitting element on the light-transmissive member in the at least one through-hole or the at least one recess; forming a reflective member in contact with a lateral surface defining the at least one through-hole or the at least one recess and covering a lateral surface of the light-emitting element; and removing the at least one light-emitting device from the holding member.. . ... Nichia Corporation

05/31/18 / #20180151782

Package and method for manufacturing package, light emitting device, and method for manufacturing light emitting device

A package includes an element placement region, a pair of leads and a resin molded body. The resin molded body holds the pair of leads. ... Nichia Corporation

05/31/18 / #20180151675

Field-effect transistor

A field-effect transistor includes a source electrode, a drain electrode, a semiconductor structure including a channel provided between the source electrode and the drain electrode in a first direction. Gate main portions have a first gate main portion length in the first direction and a second gate main portion length in a second direction. ... Nichia Corporation

05/31/18 / #20180151547

Method of manufacturing light-emitting element

A method of manufacturing a light emitting device includes: placing, on a supporting layer, a light-emitting element including an anode and a cathode at a first surface side of the light-emitting element; placing, on the supporting layer, a protective element including a first terminal and a second terminal at a third surface side of the protective element; placing a protecting layer above a second surface of the light-emitting element; covering at least a lateral portion of the light-emitting element and a lateral portion of the protecting layer with a resin composition; curing the resin composition; removing the supporting layer to expose the anode, the cathode, the first terminal, and the second terminal; and forming a first electrode, which is electrically connected to the anode and the first terminal, and a second electrode, which is electrically connected to the cathode and the second terminal.. . ... Nichia Corporation

05/31/18 / #20180151110

Display device

A display device including a display unit including a plurality of light emitting elements, and a control unit that individually controls the plurality of light emitting elements in each of a plurality of main frames according to the gradation data externally input based on output from an external device. The plurality of main frames each include a plurality of sub-frames. ... Nichia Corporation

05/31/18 / #20180149591

Light emitting device and method of producing the light emitting device

A light emitting device includes a fluorescent material, a first laser element and a second laser element. The first laser element is configured to emit a first laser light to excite the fluorescent material. ... Nichia Corporation

05/24/18 / #20180145233

Light-emitting device

. . A light-emitting device includes a support body having a wiring pattern; a light-emitting element mounted on the wiring pattern and having a planar shape that is approximately a regular hexagon; and a light transmissive member including: an approximately semispherical lens portion covering the light-emitting element, and a flange portion disposed around a periphery of the lens portion.. . ... Nichia Corporation

05/24/18 / #20180145232

Method for manufacturing light emitting device

A method for manufacturing a light emitting device includes: providing a substrate; placing a light emitting element on a top surface of the substrate; arranging on the top surface of the substrate a translucent frame body that is spaced apart from the light emitting element and that surrounds the light emitting element so that a top surface of the translucent frame body is at a position higher than a top surface of the light emitting element; arranging a wavelength conversion member in a region surrounded by the translucent frame body so as to cover the top surface and a side surface of the light emitting element and to be in contact with an inside surface of the frame body; and forming a translucent member that covers the substrate, the translucent frame body, and the wavelength conversion member.. . ... Nichia Corporation

05/24/18 / #20180145229

Composite board, light-emitting device, and manufacturing method of light-emitting device

A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. ... Nichia Corporation

05/24/18 / #20180142147

Fluorescent material, method of producing same, and light emitting device

Provided are a fluorescent material with excellent durability, which emits red light, a method of producing the same, and a light emitting device. The fluorescent material is a fluorescent material including a fluoride-containing fluorescent material core comprising mn, at least one element selected from the group consisting of an alkali metal element and nh4+, and at least one element selected from the group consisting of a group 4 element and a group 14 element in a composition thereof; and at least one of an aluminum hydroxide particle and a calcium hydroxide particle as disposed on a surface of the fluorescent material core.. ... Nichia Corporation

05/17/18 / #20180134955

Fluorescent material, light-emitting device, and method for producing fluorescent material

A method for producing a fluorescent material can be provided. The method includes preparing fluorescent material particles that contain a fluoride having a composition including mn, at least one selected from the group consisting of alkali metal elements and nh4+, and at least one selected from the group consisting of group 4 elements and group 14 elements; causing at least one cation selected from rare-earth elements and a phosphate ion to come into contact with each other in a liquid medium containing the fluorescent material particles to obtain rare-earth phosphate-adhered fluorescent material particles including the fluorescent material particles to which the rare-earth phosphate is adhered; and separating the rare-earth phosphate-adhered fluorescent material particles from the liquid medium.. ... Nichia Corporation

05/10/18 / #20180130935

Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device includes disposing a substrate metal film on an upper surface of a substrate made of a metal; disposing a first element metal film on a lower surface of a first element; disposing a second element metal film on a lower surface of a second element; bonding the first element and the second element to the substrate so that an upper surface of the substrate metal film is in contact with a lower surface of the first element metal film and a lower surface of the second element metal film; oxidizing at least a portion of a region of the upper surface of the substrate metal film other than regions in contact with the first element metal film and the second element metal film; and disposing a wiring electrically connecting the first element and the second element, across and above the region oxidized.. . ... Nichia Corporation

05/10/18 / #20180130776

Light emitting device

A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.. . ... Nichia Corporation

05/03/18 / #20180123006

Light emitting device and method for manufacturing light emitting device

A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).. . ... Nichia Corporation

05/03/18 / #20180123005

Light emitting device and method for manufacturing same

A light emitting device includes a light emitting element, a first light transmissive member, and a second light transmissive member. A first lower face of the first light transmissive member is bonded to a light extraction face of the light emitting element and has a first lower face perimeter positioned outside of a light extraction face perimeter of the light extraction face when viewed in a height direction of the light emitting device. ... Nichia Corporation

05/03/18 / #20180123000

Light emitting device

Provided is a light emitting device which includes a light emitting element having a peak emission wavelength in a range of 400 nm to 500 nm, and a fluorescent member containing a fluorescent material having a peak emission wavelength in a range of 630 nm to 670 nm, and a composition represented by the formula. Cassrteuusivalwnx. ... Nichia Corporation

05/03/18 / #20180122783

Light emitting device

A light emitting device includes a first light emitting element, a second light emitting element, a substrate, and a light reflective covering member. A first land is provided in a substrate front surface and includes a first terminal and a second terminal. ... Nichia Corporation

04/19/18 / #20180108822

Metal coating method, light-emitting device, and manufacturing method for the same

A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. ... Nichia Corporation

04/19/18 / #20180108815

Light emitting device and method of manufacturing same

A light emitting device includes a light emitting element, a reflective member, and a covering member. The light emitting element includes a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface. ... Nichia Corporation

04/19/18 / #20180108813

Method for manufacturing light emitting device

A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.. . ... Nichia Corporation

04/19/18 / #20180106943

Illumination device

An illumination device includes: an optical fiber, the optical fiber allowing light emitted from a light source to be introduced at a first end portion thereof and to be guided through the optical fiber while emitting a portion of the light through a side surface of the optical fiber; a light-transmissive tube, the light-transmissive tube covering the side surface of the optical fiber such that a gap is located between the tube and the side surface of the optical fiber; and a light-shielding cap covering a second end portion of the tube at a side opposite the light source such that a space is located between a bottom portion of the cap and the second end portion of the tube. A second end portion of the optical fiber projects past the second end portion of the tube and is located at an inner side of the cap.. ... Nichia Corporation

04/19/18 / #20180106942

Light-emitting device

A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. ... Nichia Corporation

04/12/18 / #20180102460

Semiconductor light emitting element and method of manufacturing the same

A semiconductor light emitting element having: a semiconductor laminated body; a full surface electrode containing an ag provided on an upper surface of the p-type semiconductor layer; a cover electrode that covers a surface of the full surface electrode, is provided to contact on the upper surface of the p-type semiconductor layer at an outer edge of the full surface electrode, and is made of an al-based metal material; a p-side electrode that is provided on a portion of a surface of the cover electrode; a metal oxide film that covers other surfaces of the cover electrode and contains an oxide of a metal material forming the cover electrode; and an insulation film that is made of an oxide and covers a surface of the metal oxide film, is provided.. . ... Nichia Corporation

04/05/18 / #20180098434

Method of manufacturing the printed board

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.. . ... Nichia Corporation

04/05/18 / #20180097165

Light emitting device

A light emitting device includes a flexible substrate, a light emitting element, a conductive connecting material, and a holding member. The flexible substrate includes a flexible base and a wire arranged on the flexible base. ... Nichia Corporation

04/05/18 / #20180097164

Printed board, light emitting device, and method for manufacturing same

A method for manufacturing a printed board includes steps of; providing a starting board comprising a base member having a plate-like shape, having an upper surface and a lower surface opposite the upper surface, and having an insulation property, a first metal layer disposed on the upper surface, and a second metal layer disposed on the lower surface; and laser machining a through-hole penetrating the starting board in a thickness direction of the starting board by irradiating a laser beam irradiation area of the starting board with a laser beam from a side of the starting board on which side the first metal layer is disposed. The method further includes a step of etching the second metal layer so as to remove a portion of the second metal layer located in the laser beam irradiation area, prior to the step of laser machining.. ... Nichia Corporation

04/05/18 / #20180097163

Light emitting device

A light emitting device includes a resin molded body, which includes a front surface having an opening, a bottom surface opposite to the opening a front-rear direction of the light emitting device, and first and second wall portions extending from the bottom surface to the front surface. A first lead includes a first bottom portion provided on the bottom surface, first and second side portions provided in the first and second wall portions, respectively. ... Nichia Corporation

04/05/18 / #20180097162

Light emitting device, package for light emitting device, and method for manufacturing light emitting device

A light emitting device includes: a light emitting element; and a light reflective member adapted to reflect light emitted from the light emitting element, the light reflective member comprising a base metal made of a crystallized metal, an amorphous layer located over the base metal and made of an amorphous metal, and an ag-containing layer located over the amorphous layer.. . ... Nichia Corporation

04/05/18 / #20180097161

Light emitting device

A light emitting device includes a light emitting element, a sealing member, and a first film. The light emitting element has a light emitting surface from which a light is emitted. ... Nichia Corporation

04/05/18 / #20180097155

Method for manufacturing light emitting device

A method for manufacturing a light emitting device includes: providing a substrate including a placement region for placing a light emitting element on a top surface; mounting the light emitting element in the placement region; and forming a frame body surrounding the placement region on the substrate. The step of forming the frame body is performed by arranging a first frame body and second frame body on the substrate to surround the placement region. ... Nichia Corporation

04/05/18 / #20180097153

Light emitting device

A light emitting device includes a light emitting element and a wavelength conversion layer covering the light emitting element. The wavelength conversion layer includes first wavelength conversion particles, second wavelength conversion particles, and filling particles. ... Nichia Corporation

04/05/18 / #20180097152

Light emitting device and a manufacturing method of the light emitting device

A method for manufacturing a light emitting device includes: mounting a first light emitting element whose emission peak wavelength is in a range of 430 nm to 490 nm and a second light emitting element whose emission peak wavelength is in a range of 490 nm to 570 nm; and providing a light transmitting member including a red phosphor and at least one of a green phosphor of which a half width of an emission spectrum is not more than 45 nm and a blue phosphor of which a half width of an emission spectrum is not more than 60 nm. The step of providing the light transmitting member includes adding at least one of a predetermined amount of the green phosphor and a predetermined amount of the blue phosphor based on the emission peak wavelength of the second light emitting element.. ... Nichia Corporation

04/05/18 / #20180097151

Light emitting device and display device

A light-emitting device includes a package and at least one light-emitting element. The package includes a front surface defined by a first side and a second side opposite from the first side. ... Nichia Corporation

04/05/18 / #20180097150

Package and light-emitting device

A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.. . ... Nichia Corporation

04/05/18 / #20180097149

Light emitting element

A light emitting element has semiconductor layers and first and second electrodes disposed. In plan view, the first electrode has a first connecting portion, a first extending portion, and two second extending portions, and the second electrode has a second connecting portion and two third extending portions. ... Nichia Corporation

04/05/18 / #20180097147

Light emitting device, and method for manufacturing thereof

Provided is a light emitting device comprising an optical member provided on a light extracting surface side of a semiconductor light emitting element via a first light transmissive layer, wherein bonding surfaces of the semiconductor light emitting element and the first light transmissive layer are roughened surfaces, bonding surfaces of the first light transmissive layer and the optical member are flat, and the first light transmissive layer and the optical member are directly bonded.. . ... Nichia Corporation

04/05/18 / #20180095285

Light source device

A light source device includes: a laser diode bar comprising a plurality of strips configured to emit light in a wavelength region with a predetermined width; a light guiding part comprising a plurality of cores, each of which corresponds to a respective one of the plurality of strips, and on each of which light emitted from the respective one of the strips is incident; a diffraction grating on which light emitted from the cores is incident; and a resonator mirror on which light emitted from the diffraction grating is incident. The cores are disposed such that light emitted from the cores is incident on a region of the diffraction grating at different angles. ... Nichia Corporation

04/05/18 / #20180095214

Lighting device

Alighting device includes an optical fiber having a first end portion from which a light emitted by a light source is introduced, and a second end portion, the optical fiber allowing the light to pass therethrough while radiating from a side surface of the optical fiber to an outside; a tube having light-transmissivity and covering the side surface of the optical fiber, such that a gap is located between the side surface of the optical fiber and the tube; a light-shielding cylindrical body covering the second end portion of the optical fiber, such that a space is located between the second end portion of the optical fiber and the cylindrical body, at least a portion of the light-shielding cylindrical body being disposed in the tube; and a light conductive part on a side surface of the cylindrical body, the light conductive part allowing light radiated from the second end portion of the optical fiber to be conducted to a portion of the tube at an outside of the cylindrical body in a diametrical direction of the cylindrical body.. . ... Nichia Corporation

04/05/18 / #20180094796

Method for manufacturing linear light emitting device and linear light emitting device

A method for manufacturing a linear light emitting device includes: providing a light transmissive member having a long side and a short side in a plan view; mounting a plurality of light emitting elements on the light transmissive member via a light transmissive adhesive, such that the light emitting elements are arranged in a row along the long side of the light transmissive member; and forming a reflective member that covers the light transmissive adhesive and lateral faces of the light emitting elements. The linear light emitting device has an emission face having a long side and a short side in a plan view, and a length of the short side of the light transmissive member is substantially equal to a length of the short side of the emission face of the linear light emitting device.. ... Nichia Corporation

03/29/18 / #20180090654

Metal-base substrate, semiconductor device and mehthod for manufacturing the same

. . A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.. . ... Nichia Corporation

03/29/18 / #20180090649

Light-emitting device and method of manufacturing the same

A light-emitting device includes a light-emitting element, a wavelength conversion member, a light-reflective member and a light-distributing member. The wavelength conversion member is arranged on the light-emitting element. ... Nichia Corporation

03/29/18 / #20180090648

Method for manufacturing light emitting device

A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.. . ... Nichia Corporation

03/29/18 / #20180090644

Light emitting device and method for manufacturing thereof

A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. ... Nichia Corporation

03/29/18 / #20180090643

Light emitting element

A light emitting element includes: an n-side semiconductor layer; a p-side semiconductor layer; an active layer comprising a plurality of well layers and a plurality of barrier layers, and being located between the n-side semiconductor layer and the p-side semiconductor layer. The plurality of barrier layers comprises a final barrier layer, which is a layer of the active layer that is closest to the p-side semiconductor layer. ... Nichia Corporation

03/29/18 / #20180090642

Nitride semiconductor device and method for producing the same

A method for producing a nitride semiconductor device. The method comprises providing a substrate made of a material other than a nitride semiconductor. ... Nichia Corporation

03/29/18 / #20180087726

Light emitting device

A light emitting device includes a support member, a semiconductor laser element, a light reflecting member, and a wavelength conversion member. The support member has a base and a cap that includes a light extraction window from which light is extracted upward. ... Nichia Corporation

03/29/18 / #20180086977

Method of producing nitride fluorescent material, and nitride fluorescent material

A method of producing a nitride fluorescent material including a step of first heat-treating a first compound containing at least one alkaline earth metal element selected from the group consisting of ba, sr, ca and mg, a second compound containing at least one element selected from the group consisting of eu, ce, tb and mn, and a si-containing compound, in an atmosphere containing nitrogen to obtain a calcined product of raw materials, and a step of second heat-treating the calcined product of raw materials, a ba-containing compound, a si-containing compound, and optionally a third compound containing at least one element selected from the group consisting of eu, ce, tb and mn, and optionally a fourth compound containing at least one alkaline earth metal element selected from the group consisting of sr, ca and mg, in an atmosphere containing nitrogen to obtain a nitride fluorescent material is provided, wherein the ratio of the charge-in molar amount of ba to the total charge-in molar amount of at least one alkaline earth metal element to be contained in the calcined product of raw materials in the step of obtaining the calcined product of raw materials is smaller than the ratio of the charge-in molar amount of ba to the total charge-in molar amount of at least one alkaline earth metal element to be contained in the nitride fluorescent material in the step of obtaining the nitride fluorescent material.. . ... Nichia Corporation

03/29/18 / #20180086975

Method of producing aluminate fluorescent material, aluminate fluorescent material and light emitting device

Provided are a method of producing an aluminate fluorescent material, an aluminate fluorescent material and a light emitting device. The production method includes heat-treating a mixture prepared by mixing a compound containing at least one alkaline earth metal element selected from the group consisting of ba, sr and ca, a mg-containing compound not acting as a flux, a mn-containing compound, an al-containing compound, a first flux containing at least one alkali metal element selected from the group consisting of na, k, rb and cs, and a mg-containing second flux to give an aluminate fluorescent material.. ... Nichia Corporation

03/29/18 / #20180086950

Electrically conductive adhesive and electrically conductive material

Disclosed is an electrically conductive adhesive containing: (a) a polyether polymer having a backbone comprising a repeating unit of the formula: —r1—o— wherein r1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (b) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.. ... Nichia Corporation

03/22/18 / #20180083169

Light emitting device and method of manufacturing light emitting device

A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. ... Nichia Corporation

03/22/18 / #20180083167

Method of manufacturing light emitting device

A method of manufacturing a light emitting device includes: mounting at least one light emitting element on a support member with a first surface of the light emitting element facing upward; applying an adhesive to the first surface of the light emitting element by holding the support member and dipping the first surface of the light emitting element in the adhesive; and disposing a light-transmissive member on the first surface of the light emitting element via the adhesive.. . ... Nichia Corporation

03/22/18 / #20180083159

Method of manufacturing light emitting element

A method of manufacturing a light emitting element includes: providing a wafer including a substrate and a semiconductor layered body formed at an upper surface of the substrate; irradiating the wafer with laser light by performing first and second patterns of scanning; and separating the substrate from the semiconductor layered body. In the first pattern of scanning, the wafer is irradiated with the laser light outwardly from an inner side of the wafer or inwardly from an outer side of the wafer, so that a region irradiated with the laser light enlarges. ... Nichia Corporation

03/22/18 / #20180080631

Phosphor-containing member and light emitting device containing thereof

A phosphor-containing member includes a base portion made of a diffuse reflective ceramic, and a plurality of phosphor portions each containing a phosphor and made of a ceramic. The plurality of phosphor portions are disposed directly on an upper surface of the base portion and are spaced apart from each other. ... Nichia Corporation

03/22/18 / #20180080625

Light emitting device

A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.. . ... Nichia Corporation

03/08/18 / #20180069164

Light emitting apparatus and method for producing the same

A light emitting apparatus includes a mount substrate; two or more light emitting devices mounted on the mount substrate such that adjacent light emitting devices face each other at lateral surfaces thereof; a light transparent member positioned on upper surfaces of the light emitting devices, the light transparent member having a plate shape and being positioned to receive incident light emitted from the light emitting devices; and a covering member. In a plan view, the light transparent member is larger than each of the light emitting devices. ... Nichia Corporation

03/08/18 / #20180069160

Method of manufacturing light emitting device including metal patterns and cut-out section

A light emitting device includes a substrate; a light emitting element mounted on an upper surface of the substrate; a light-reflecting member surrounding lateral surfaces of the light emitting element; and a sealing member disposed over an upper surface of the light emitting element and an upper surface of the light-reflecting member. An outer edge of the upper surface of the light-reflecting member coincides with an outer edge of a lower surface of the sealing member.. ... Nichia Corporation

03/08/18 / #20180069159

Light emitting device

A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. ... Nichia Corporation

03/08/18 / #20180066183

Semiconductor nanoparticles, method of producing semiconductor nanoparticles, and light-emitting device

Provided is a ternary or quaternary semiconductor nanoparticle that enables the band-edge emission and a less toxic composition. A semiconductor nanoparticle is provided that contains ag, in, and s and has an average particle size of 50 nm or less, wherein the ratio of the number of atoms of ag to the total number of atoms of ag and in is 0.320 or more and 0.385 or less, the ratio of the number of atoms of s to the total number of atoms of ag and in is 1.20 or more and 1.45 or less. ... Nichia Corporation

03/01/18 / #20180062036

Light-emitting element comprising a partitioned sapphire substrate

A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. ... Nichia Corporation

03/01/18 / #20180062032

Light emitting device method of manufacture

A method of manufacturing a light emitting device includes preparing a wafer having a sapphire substrate with semiconductor structures, forming a plurality of straight-line cleavage starting portions within the substrate by scanning a laser beam, and cleaving the wafer along the cleavage starting portions to obtain a plurality of light emitting devices each having a hexagonal shape. The forming step includes forming first cleavage starting portions with each first cleavage starting portion separated by a first interval from a common vertex point of three adjacent light emitting devices, forming second cleavage starting portions with each first cleavage starting portion separated by a second interval, which is shorter than the first interval, away from the common vertex point, and forming third cleavage starting portions with each first cleavage starting portion separated by a third interval, which is shorter than the first interval, away from the common vertex point.. ... Nichia Corporation

03/01/18 / #20180062025

Method for manufacturing light emitting element

A method for manufacturing a light emitting element includes: forming a semiconductor structure on a first substrate; providing a second substrate configured to be bonded above a side of the semiconductor structure opposite the first substrate; forming a metal layer above at least one of (i) a side of the semiconductor structure opposite the first substrate, and/or (ii) a side of the second substrate that is to be located closer to the semiconductor structure; bonding the second substrate above the semiconductor structure via a bonding member; removing the first substrate from the semiconductor structure to obtain a bonded body in which the second substrate is bonded above the semiconductor structure; and singulating the bonded body.. . ... Nichia Corporation

03/01/18 / #20180058660

Optical member, light source device, and irradiation system

An optical member includes one or more lens surfaces, each lens surface comprising a curved surface having: a curvature in a first direction, and a curvature in a second direction that is perpendicular to the first direction in an imaginary plane perpendicular to an optical axis of incident light. Each of the one or more lens surfaces has a substantially rectangular planar shape when viewed in an optical axis direction, the substantially rectangular planar shape being defined by two sides substantially parallel to the first direction and two sides substantially parallel to the second direction. ... Nichia Corporation

03/01/18 / #20180058645

Light emitting device

A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member. The light shielding member includes a protruded portion extending downward to a position that is lower than an upper end of the first optical member so as to face the exit-side lateral face of the first optical member.. ... Nichia Corporation

03/01/18 / #20180058644

Light emitting device

A light emitting device includes a substrate, a plurality of leds arranged in rows and columns above the substrate, and a wavelength converting member above the plurality of leds. The wavelength converting member includes a plurality of fluorescent portions arranged in rows and columns and a lattice-shaped light shielding portion between the plurality of fluorescent portions. ... Nichia Corporation

03/01/18 / #20180058642

Light emitting device

A light emitting device includes a semiconductor laser element configured to emit a first light, a wavelength converting member configured to emit a second light upon being irradiated by the first light, and a support member defining a through-hole allowing an optical path of the first light to pass through. The through-hole is defined by, in order from a light incident side to a light emitting side with respect to the first light, a lower portion with opening width decreasing from the light incident side to the light emitting side, and an upper portion where the wavelength converting member is fixed. ... Nichia Corporation

03/01/18 / #20180057739

Nitride fluorescent material and light emitting device

A nitride fluorescent material containing at least one element selected from the group consisting of ca, sr, ba and mg, at least one element selected from the group consisting of li, na and k, at least one element selected from the group consisting of eu, ce, tb and mn, al and n is provided, wherein when the maximum value of absorbance in 450 cm−1 or more and less than 900 cm−1 is taken as 1 in an ft-ir spectrum, an integrated value z1 of a domain surrounded by a base line a connecting absorbance values at 1,200 cm−1 and 1,600 cm−1 and an absorbance spectrum of 1,200 cm−1 or more and less than 1,600 cm−1 is 4.0 or less, and/or an integrated value z2 of a domain surrounded by a base line b connecting absorbance values at 2,700 cm−1 and 3,680 cm−1 and an absorbance spectrum of 2,700 cm−1 or more and less than 3,680 cm−1 is 5.0 or less.. . ... Nichia Corporation

03/01/18 / #20180057738

Nitride fluorescent material, method of producing nitride fluorescent material and light emitting device

Provided is a method of producing a nitride fluorescent material containing silicon nitride particles containing eu, at least one alkaline earth metal selected from the group consisting of mg, ca, sr, and ba, al, and fluorine in a composition of the silicon nitride particles. The method includes heat treating a raw material mixture containing an eu source, a source of the alkaline earth metal, an al source, an si source, and an alkaline earth metal fluoride containing at least one selected from the group consisting of mg, ca, sr, and ba, wherein a molar content ratio of fluorine atom to al is from 0.02 to 0.3.. ... Nichia Corporation

02/22/18 / #20180053886

Light emitting device

A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.. ... Nichia Corporation

02/22/18 / #20180053884

Composite base and method of manufacturing light emitting device

A method of manufacturing a light emitting device includes: providing a light emitting device set that includes a lead frame being plate-like and including pairs of supporting leads each of which pairs consists of a first supporting lead and a second supporting lead, packages respectively supported by the pairs of supporting leads, and light emitting elements respectively mounted on the packages; and removing the packages from the lead frame. The packages each include a resin molded body, the resin molded body includes a first recess open at the first and third outer surfaces, and a second recess open at the second and third outer surfaces. ... Nichia Corporation

02/15/18 / #20180047883

Light emitting element with light transmissive substrate having recess in cross-sectional plane

A light-emitting element includes a light transmissive substrate, a semiconductor layered body, and first and second light reflecting members. The semiconductor layered body is formed on a first main surface of the light transmissive substrate. ... Nichia Corporation

02/15/18 / #20180047874

Nitride semiconductor element and method for manufacturing the same

A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of −10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.. ... Nichia Corporation

02/08/18 / #20180040791

Light emitting device

A light emitting device includes a resin package and a light emitting element. The resin package includes a first lead, a second lead, and a molded body molded integrally with the first lead and the second lead. ... Nichia Corporation

02/08/18 / #20180040790

Light emitting device

A light emitting device including a substrate and a conductive member array including a plurality of conductive members arranged on an upper surface of the substrate in a first direction. Each of the plurality of conductive members including a wire-connected portion, one or more coupling portions connected to the wire-connected portion, an element mounting portion connected to said one or more coupling portions, and one or more extending portions connected to the element mounting portion. ... Nichia Corporation

02/08/18 / #20180040776

Light emitting device

A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. ... Nichia Corporation

02/08/18 / #20180040775

Light-emitting device and method for manufacturing light-emitting device

A light-emitting device includes a light-emitting element, a phosphor layer, a reflective film, and a light-transmissive member. The light emitting element emits first light. ... Nichia Corporation

02/08/18 / #20180040595

Composite substrate and light emitting device

The composite substrate includes: a lead frame including one or more pairs of support leads, each of the one or more pairs of support leads including a first support lead and a second support lead; and one or more packages supported by first and second support leads and including a resin molded body. The resin molded body includes: a first outer side surface; a second outer side surface; a third outer side surface; a fourth outer side surface; a front surface; a first recess; a second recess; a third recess disposed at a bottom surface of the first recess; and a fourth recess disposed at a bottom surface of the second recess. ... Nichia Corporation

02/08/18 / #20180040583

Method for manufacturing light emitting device

A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.. . ... Nichia Corporation

02/08/18 / #20180038024

Retainer material, manufacturing method thereof, and gas treatment device using the same

A holding material including: inorganic fibers that include 70 wt % or more of an alumina component an organic binder other than polyacrylamide of which the surface is negatively charged, alumina sol, and polyacrylamide having a weight-average molecular weight of 3,000,000 to 6,000,000, wherein the amount of the alumina sol is 2 to 8 parts by weight relative to 100 parts by weight of the amount of the inorganic fibers, and the amount of the polyacrylamide is 0.01 to 1.0 parts by weight relative to 100 parts by weight of the amount of the inorganic fibers.. . ... Nichia Corporation

02/08/18 / #20180037469

Aluminate fluorescent material and light emitting device

Provided is an aluminate fluorescent material having a composition represented by the formula x1amgbmncaldoa+b+c+1.5d, in which x1 is at least one element selected from the group consisting of ba, sr; and ca, a, b, c, and d satisfy 0.5≦a≦1.0, 0.0≦b<0.4, 0.3≦c≦0.7, 8.5≦d≦13.0, and 9.0≦b+c+d≦14.0.. . ... Nichia Corporation

02/08/18 / #20180036926

Production method for water jacket spacer

A method for producing a water jacket spacer includes using an injection mold that forms a molding space, the molding space producing an integrally molded product that includes at least a first water jacket spacer, a second water jacket spacer, and a bridge, the first water jacket spacer and the second water jacket spacer being provided so that the inner sides thereof are situated opposite to each other, and the bridge linking the inner side or the end of the first water jacket spacer, and the inner side or the end of the second water jacket spacer. The method for producing a water jacket spacer can produce a water jacket spacer having a shape that corresponds to half or part of half of the groove-like coolant passage along the circumferential direction by means of injection molding while preventing the occurrence of an adhesion-to-slide phenomenon when the mold is opened.. ... Nichia Corporation

02/01/18 / #20180033936

Light emitting device

A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The substrate includes an insulating base material which has a concave portion with an inner curved surface. ... Nichia Corporation

02/01/18 / #20180033934

Light-emitting device

A light-emitting device includes a light-emitting element that includes a layered structure including a semiconductor layer and a pair of electrodes on a first main surface of the layered structure, a light-transmissive member on a second main surface of the layered structure, the second main surface being opposite to the first main surface, a covering member covering lateral surfaces of the light-emitting element and the first main surface of the layered structure except for at least part of the pair of electrodes, a pair of first metal layers on the first main surface of the light-emitting element, the pair of first metal layers covering a surface of the covering member and being respectively connected with the pair of electrodes, and at least one second metal layer separated from the first metal layers.. . ... Nichia Corporation

02/01/18 / #20180033929

Method of manufacturing light emitting device

A method of manufacturing a light emitting device, includes mounting, on a support substrate, an element set that includes a plurality of light emitting elements on an element substrate. A light reflecting member is provided between the element set and the support substrate. ... Nichia Corporation

02/01/18 / #20180033922

Light emitting device and the manufacturing method for same

A light emitting device includes a light emitting element to emit a first light having a first peak wavelength. A second wavelength converting member contains a second phosphor to convert the first light into a third light having a third peak wavelength longer than the first peak wavelength and shorter than a second peak wavelength. ... Nichia Corporation

02/01/18 / #20180033917

Method of forming nanorods and method of manufacturing semiconductor element

A method of forming semiconductor nanorods includes: placing, in a chamber, a masking material and a base comprising a semiconductor, wherein an etching rate of the masking material in a chemical reaction with a reactant gas during dry etching is lower than an etching rate of a semiconductor in a chemical reaction with the reactant gas during dry etching; and performing dry-etching to form a plurality of dot-masks, each having a form of a dot containing the masking material, on a surface of the semiconductor and to remove a portion of the semiconductor exposed from the dot-masks, wherein the dry-etching is performed under a pressure in the chamber in a predetermined range that allows the masking material scattered by the etching to be adhered to a surface of the semiconductor with a predetermined size of the dots and a predetermined density of the dots.. . ... Nichia Corporation

02/01/18 / #20180033823

Light emitting device and display device

A light emitting device includes a first light emitting element, a second light emitting element, a third light emitting element, a fluorescent material, a film, a first lens, a second lens, and a third lens. The first light emitting element is to emit a first light having a peak wavelength in a range from 440 nm to 485 nm. ... Nichia Corporation

02/01/18 / #20180029523

Light-emitting device

A light emitting device includes a light emitting element, a first light transmissive member, a second light transmissive member, and a light reflective member. The first light transmissive member contains a first phosphor. ... Nichia Corporation

01/25/18 / #20180026169

Semiconductor device, base, and method for manufacturing same

A semiconductor device includes a base and a semiconductor element disposed on the base. The base includes: a base member, a reflective film located above the base member, the reflective film containing silver as a major component and containing particles formed of at least one material selected from the group consisting of an oxide, a nitride, and a carbide; and a dielectric multilayered film located above the reflective film.. ... Nichia Corporation

01/25/18 / #20180024006

Method of determining chromaticity rank of light emitting device

A method of determining a chromaticity rank of a light emitting device includes selecting the light emitting device having a chromaticity rank in a region surrounded by four defining points on a 1931 cie chromaticity diagram. A ratio of a distance in a y-direction between, of the four defining points, two defining points furthest from each other in the y-direction to a distance in an x-direction between, of the four defining points, two defining points furthest from each other in the x-direction is 0.5 or less a peak light emission wavelength of the blue light emitting element is in a range of 447 to 452 nm, a peak light emission wavelength of the green light emitting element is in a range of 520 to 541 nm, and a peak light emission wavelength of the red light emitting element is in a range of 630 to 632 nm.. ... Nichia Corporation

01/25/18 / #20180023784

Light emitting device

A light emitting device includes a mounting board on which a plurality of light sources are disposed; a partitioning member surrounding the light sources and including a plurality of walls that include top parts and form a plurality of areas; a diffuser sheet that is provided above the partitioning member and is supported directly or indirectly by at least one of the top parts of the partitioning member; a plurality of first reflectors that are provided directly above the light sources and are positioned on one of an upper surface and a lower surface of the diffuser sheet; and a second reflector that is provided directly above the top parts and is positioned on one of the upper surface and the lower surface of the diffuser sheet.. . ... Nichia Corporation

01/25/18 / #20180023706

Gasket and manufacturing method thereof

A gasket including a sheet part that includes exfoliated clay minerals, wherein the exfoliated clay minerals are irregularly dispersed in the sheet part without being oriented.. . ... Nichia Corporation

01/25/18 / #20180023657

Connector and shielding body

A connector (1) that comprises first and second surfaces (20a) and (30a) disposed opposingly with an interval therebetween, said interval allowing the shielding body 100 to be inserted therein; a pressing member (4) having a through hole (40) and formed so as to be capable of extending and contracting by winding a prescribed wire material spirally around the through hole (40) as center such that a curvature thereof varies continuously around the through hole; and a holding part (31) that is inserted into a hole (103) formed in the shielding body and the through hole (40) and maintains a specific distance between the first and second surfaces (20a, 30a); wherein the pressing member (4a) and (4b) comprises: a first pressing member (4a) disposed between the first surface (20a) and the shielding body (100) such that a small-curvature side thereof in the extension and contraction direction faces the shielding body (100); and a second pressing member (4b) disposed between the second surface (30a) and the shielding body (100) such that a small-curvature side thereof in the extension and contraction direction faces the shielding body (100). Due to such a configuration, vibration from the vibrating body (10) is absorbed and transmission of the vibration to the shielding body (100) can be suppressed.. ... Nichia Corporation








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