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Nxp Usa Inc patents


Recent patent applications related to Nxp Usa Inc. Nxp Usa Inc is listed as an Agent/Assignee. Note: Nxp Usa Inc may have other listings under different names/spellings. We're not affiliated with Nxp Usa Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Nxp Usa Inc-related inventors


Doherty amplifiers with passive phase compensation circuits

An embodiment of a doherty amplifier includes first and second amplifier paths with first and second amplifiers, respectively, a power divider, a series delay element, and a short-circuited stub. The power divider is configured to receive a radio frequency (rf) signal and to divide the rf signal into first and second input signals that are produced at first and second power divider outputs. ... Nxp Usa Inc

Esd protection for depletion-mode devices

A device includes a transistor configured for depletion-mode operation, the transistor having a gate terminal and a drain terminal, and an electrostatic discharge (esd) protection circuit coupling the gate terminal and the drain terminal. The esd protection circuit includes a discharge path circuit and a trigger circuit coupled to, and configured to control, the discharge path circuit. ... Nxp Usa Inc

System and method for autonomous time-based debugging

A processing system includes a general purpose instruction based data processor, an input configured to receive a command written by the data processor, a timer manager controller configured to receive the command and to execute the command, and a debug interrupt timer controller (ditc) configured to determine that the command is directed to the ditc and to store configuration information that associates the command with an element of the processing system that is a source of the command, where the configuration information is included in the command.. . ... Nxp Usa Inc

Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication

Embodiments of sensing devices include one or more integrated circuit (ic) die, a housing, and a fluid barrier material. Each ic die includes an electrode-bearing surface and a contact surface. ... Nxp Usa Inc

Digitally controlled oscillator with temperature compensation

A device comprising: a voltage reference supply, configured to provide a reference voltage that varies in response to temperature according to a predefined relationship; a temperature sensor providing a temperature signal indicating a temperature; a first controller configured to receive the temperature signal and to output a control signal; an lc-dco receiving the reference voltage and providing an output signal with a frequency from an lc circuit, the lc-dco comprising a switched capacitor bank configured to provide temperature compensation by varying an effective capacitance in the lc circuit in response to the control signal.. . ... Nxp Usa Inc

Integrated circuit devices with selectively arranged through substrate vias and method of manufacture thereof

An integrated circuit device includes a device substrate having first and second opposing surfaces, a first component electrode coupled to the first surface, and a conductive plane coupled to the second surface. The integrated circuit device also includes a plurality of through substrate vias electrically coupling a first region of the first component electrode to the conductive plane through the device substrate, wherein a second adjacent region of the first component electrode is substantially devoid of through substrate vias. ... Nxp Usa Inc

Method of tuning components within an integracted circuit device

A method of tuning inductive and/or capacitive components within an integrated circuit device. The method comprises measuring bare-die mounted performance of such a component formed within a semiconductor die, determining a package distribution layer pattern for the at least one component for achieving a desired performance for the at least one component based at least partly on the measured bare-die mounted performance, and packaging the semiconductor die with the determined package distribution layer pattern for the at least one component.. ... Nxp Usa Inc

Distributed image cognition processing system

Embodiments of an image cognition processing system are provided, including a method that includes detecting an object in a first field of view of a first image sensor, wherein the first image sensor is coupled to a first image cognition processor; generating tracking metadata for the object, wherein the generating is performed by the first image cognition processor, and the tracking metadata describes movement of the object; determining that the object is moving toward a second field of view of a second image sensor, wherein the second image sensor is located adjacent to the first image sensor; and providing the tracking metadata for the object to a second image cognition processor coupled to the second image sensor.. . ... Nxp Usa Inc

Software watchpoints apparatus for variables stored in registers

A method, system, and apparatus are provided for debugging a compiled computer program having one or more variables by generating variable location information for a first variable stored in a cpu register that is parsed from runtime disassembly information for the compiled computer program and used to generate a pattern to search for the first variable in the runtime disassembly information to identify a program address for the first variable that can be used to set a software program watchpoint for the first variable.. . ... Nxp Usa Inc

Digital synthesizer, communication unit and method therefor

A digital synthesizer is described that comprises: a ramp generator configured to generate a signal of frequency control words, fcw, that describes a desired frequency modulated continuous wave; a digitally controlled oscillator, dco, configured to receive the fcw signal and output a dco signal; and a feedback loop that includes a dual time-to-digital converter, tdc, circuit configured to measure a delay between a representation of the dco signal and a reference signal. The tdc circuit comprises a medium-resolution tdc circuit coupled to a fine-resolution tdc circuit; and a phase comparator coupled to the ramp generator and configured to compare a phase of the fcw signal output from the ramp generator and a signal fed back from the dco via the feedback loop and output a n-bit oscillator control signal. ... Nxp Usa Inc

Ultrasonic transducer integrated with supporting electronics

Capacitive micromachined ultrasound transducer (cmut) module and method for manufacturing the cmut module are described. The cmut module includes a cmut array and an integrated circuit (ic) die. ... Nxp Usa Inc

Plated opening with vent path

A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. ... Nxp Usa Inc

Stateful backend drivers for security processing through stateless virtual interfaces

Methods and systems are disclosed for stateful backend drivers for security processing through stateless virtual interfaces within virtual machine (vm) host servers. A security application runs within a hosted vm, and a header is stored for the security application that includes a host backend identifier (bid). ... Nxp Usa Inc

Amplifiers and amplifier modules with shunt inductance circuits that include high-q capacitors

A doherty amplifier module includes first and second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input rf signal to produce an amplified first rf signal. ... Nxp Usa Inc

06/21/18 / #20180175801

Inter-stage network for radio frequency amplifier

A device includes a substrate and a package input terminal. The device includes a driver amplifier mounted to the substrate and configured to receive a radio frequency input signal. ... Nxp Usa Inc

06/21/18 / #20180175800

Rf power amplifier bias modulation with programmable stages

A doherty amplifier is able to enhance efficiency in low-power and high-power rf communication states by enabling carrier and peaking amplifiers as required, and controlling bias modulation, depending on traffic loading levels in each of a set of consecutive communications timeslots. For example, if, in a low-power state, traffic loading levels do not exceed a relatively lower threshold in a communications timeslot, carrier amplifiers are selectively enabled as needed, peaking amplifiers are not enabled, and carrier amplifier bias levels are kept substantially constant. ... Nxp Usa Inc

06/21/18 / #20180175799

Doherty amplifiers and amplifier modules with shunt inductance circuits that affect transmission line length between carrier and peaking amplifier outputs

A doherty amplifier module includes first and second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input rf signal to produce an amplified first rf signal. ... Nxp Usa Inc

06/21/18 / #20180175792

Radio frequency (rf) devices with resonant circuits to reduce coupling

The embodiments described herein use resonant circuits to provide isolation between closely proximate conductors. For example, these resonant circuits can be used to reduce unwanted electromagnetic coupling and minimize crosstalk energy between package leads, bonding wires, and circuit board traces on radio frequency (rf) electronic devices, including rf power amplifiers. ... Nxp Usa Inc

06/21/18 / #20180172533

Pressure sensor having a multiple wheatstone bridge configuration of sense elements

A pressure sensor includes a diaphragm suspended across a cavity in a substrate. A first group of piezoresistors is provided in the diaphragm proximate a first outer edge of the diaphragm, the piezoresistors of the first group being coupled to one another to form a first wheatstone bridge. ... Nxp Usa Inc

06/14/18 / #20180168008

Cooking apparatus

A cooking apparatus is provided. The cooking apparatus includes a cooking surface and a plurality of antennas coupled to the cooking surface. ... Nxp Usa Inc

06/14/18 / #20180167178

Signal transmission method and transmitting device

Embodiments include signal transmission methods and transmitting devices for a multi-antenna wireless communication system. The method comprises mapping one or more modulation symbols onto one or more transmission layers, thereby creating one or more modulated transmission layers and mapping the modulation symbols of the one or more modulated transmission layers onto resource elements of respective one or more time-frequency resource grids. ... Nxp Usa Inc

06/14/18 / #20180167047

Parallel lc resonator and method therefor

An integrated circuit (ic) includes an input pad and an output pad separated from the input pad by a predetermined distance. A plurality of capacitors are coupled in series between the input pad and the output pad. ... Nxp Usa Inc

06/14/18 / #20180165118

System and method for partitioning and managing timers in a virtualized system

A processing system includes a data processor, an input, an output, a memory, an operation parser, and a timer manager instance controller. The input receives create-timer-manager-instance (ctmi) commands identifying a number of timers supported by a timer manager instance. ... Nxp Usa Inc

06/14/18 / #20180164748

System and method for calibrating a time to digital converter device

A time to digital converter (tdc) may have a vernier architecture of multiple successive modules arranged in series. Each of the modules may output an indication of a differential in phase between two received signals. ... Nxp Usa Inc

06/07/18 / #20180159483

Segmented digital predistortion apparatus and methods

In an rf transmitter, a digital predistortion circuit receives a sequence of input sample blocks, and performs a digital predistortion process to produce a predistorted output signal. The digital predistortion process includes selecting a set of predistortion coefficients for an input sample block from a plurality of different sets of predistortion coefficients. ... Nxp Usa Inc

06/07/18 / #20180159480

Phase shift and attenuation circuits for use with multiple-path amplifiers

Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. ... Nxp Usa Inc

06/07/18 / #20180159479

Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die

An embodiment of a doherty amplifier module includes a substrate, a first amplifier die, and a second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input rf signal to produce an amplified first rf signal. ... Nxp Usa Inc

06/07/18 / #20180158786

Radio frequency (rf) inductive signal coupler and method therefor

A reference circuit includes an integrated circuit (ic) formed on a semiconductor substrate including a first spiral inductor and a second spiral inductor. The first spiral inductor is formed from a first metal layer over the substrate. ... Nxp Usa Inc

06/07/18 / #20180157848

Memory management

A system on a chip (soc) and method of operation are described. A data processor has a processor data word size of p×octets and is configured to handle data items having a data item size which is a non-integer multiple of the processor data word size. ... Nxp Usa Inc

05/31/18 / #20180153030

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

. . Methods for producing high thermal performance microelectronic modules containing sinter-bonded heat dissipation structures. In one embodiment, the method includes embedding a sinter-bonded heat dissipation structure in a module substrate. ... Nxp Usa Inc

05/31/18 / #20180152181

Clock generator for multi-channel analog to digital converter

Embodiments of a multi-stage clock generator architecture that generates multiple non-overlapping clock phase signals includes: a first stage clock generator configured to: divide an input clock signal into a number of clock signals, synchronize each clock signal to a transition edge of a synchronization signal to produce synchronized clock signals, wherein the synchronization signal is a delayed version of the input clock signal by at least an amount sufficient to ensure that each of the clock signals become stable in response to a transition edge of the input clock signal, and generate a number of clock phase signals based on the synchronized clock signals. The architecture also includes a later stage clock generator configured to: generate a set of mutually non-overlapping clock phase signals based on the input clock signal.. ... Nxp Usa Inc

05/31/18 / #20180152103

Current-mode dc/dc converter and method therefor

A current-mode dc-dc converter includes a power switch and a reset circuit for providing a resettable input signal to the switch. A first feedback loop, coupled to the switch, provides a control signal to the reset circuit to instigate the resettable input signal when a ramp voltage reaches a target peak current value. ... Nxp Usa Inc

05/31/18 / #20180151242

Sample and hold circuit

A sample and hold circuit including a charge path coupled to a voltage source. A first node of the charge path is located closer to the voltage source in the charge path than a second node of the charge path. ... Nxp Usa Inc

05/31/18 / #20180150098

Voltage reference circuit

A reference circuit includes a bandgap core circuit and a cascode amplifier. The bandgap core circuit includes a first bipolar junction transistor (bjt), a second bjt having a control electrode coupled to a control electrode of the first bjt, a first resistor coupled to the first bjt and the second bjt, and a second resistor coupled to the second bjt. ... Nxp Usa Inc

05/31/18 / #20180149526

Temperature sensor circuitry and method therefor

An on-chip temperature sensor generates a proportional to absolute temperature current and sloped bandgap reference current with transistor offset cancelled using chopping circuitry and dynamic element matching circuitry with resistor-based current mirrors. A digital successive approximation register (sar) code provided to a digital to analog converter (dac) is adjusted until current output by the dac matches the ptat current.. ... Nxp Usa Inc

05/24/18 / #20180146518

Establishing rf excitation signal parameters in a solid-state heating apparatus

In a solid-state heating system, once a load with specific load characteristics has been placed in a heating cavity, a processing unit produces control signals that indicate an excitation signal frequency and one or more phase shifts, which constitute a combination of parameter values. Multiple microwave generation modules produce rf excitation signals characterized by the frequency and the phase shift(s). ... Nxp Usa Inc

05/24/18 / #20180145692

Digital synthesizer, radar device and method therefor

A digital synthesizer is described that comprises: a ramp generator configured to generate a signal of frequency control words (fcw), that describes a desired frequency modulated continuous wave; a digitally controlled oscillator (dco) configured to receive the fcw signal and generate a dco output signal; a feedback loop comprising a time-to-digital converter (tdc), wherein the feedback loop is configured to feed back the dco output signal; a phase comparator coupled to the ramp generator and configured to compare a phase of the fcw signal output from the ramp generator with the dco output signal fed back from the dco via the feedback loop and output a n-bit oscillator control signal in response thereto. The tdc receives a representation of the dco output signal and a reference frequency signal to sample the dco output signal and outputs multiple selectable delays of the dco output signal. ... Nxp Usa Inc

05/24/18 / #20180144258

Network node, integrated circuit, and method for creating and processing information according to an n-ary multi output decision tree

A processor is configured to process information according to attribute value criteria organized as a decision tree, wherein an attribute value criterion of the attribute value criteria is a range of attribute values, wherein a portion of the attribute value criteria lead to a matching target value among target values of the decision tree, wherein each of the target values, including the matching target value, is assigned a respective priority value, wherein the processor is configured to count, for each specific attribute value, a respective number of particular attribute value appearances in a set of rules and a respective number of attribute value matches comprising range based matches based on range based appearances for the each specific attribute value, wherein the processor determines the decision tree based on information entropy values and information gain values.. . ... Nxp Usa Inc

05/24/18 / #20180143218

Microelectromechanical systems device and method

A micro-electro-mechanical system (mems) device and a method of testing a mems device. The device includes a mems sensor having first and second mobile elements, first and second electrodes arranged to deflect the mobile elements by the application of test voltages, and a differential detector circuit. ... Nxp Usa Inc

05/24/18 / #20180141805

Mems device and method for calibrating a mems device

A microelectromechanical systems (mems) device and a method for calibrating a mems device. The device includes a first semiconductor substrate including at least one mems component. ... Nxp Usa Inc

05/17/18 / #20180138903

Low power cmos buffer circuit

A cmos buffer circuit includes a first branch circuit having first and second transistors connected in parallel between a voltage source and ground, and a second branch having third and fourth transistors connected in parallel between the voltage source and ground. The gates of the first and second transistors receive an input signal. ... Nxp Usa Inc

05/17/18 / #20180138871

Impedance-matching circuit

An impedance-matching circuit includes a resonant circuit, first and second capacitors, and first through third inductive circuits. The resonant circuit includes a fourth inductive circuit connected in parallel with a capacitive circuit. ... Nxp Usa Inc

05/10/18 / #20180131329

Amplifier devices with back-off power optimization

The embodiments described herein include amplifier devices that are typically used in radio frequency (rf) applications. The amplifier devices described herein use a plurality of phase shifters to provide selectable back-off power. ... Nxp Usa Inc

05/10/18 / #20180130903

Semiconductor device isolation with resurf layer arrangement

A device includes a semiconductor substrate, a doped isolation barrier disposed in the semiconductor substrate, a body region disposed in the semiconductor substrate within the doped isolation barrier and in which a channel is formed during operation, an isolation contact disposed at the semiconductor substrate and to which a voltage is applied during operation, and a plurality of reduced surface field (resurf) layers disposed in the semiconductor substrate, the plurality of reduced surface field (resurf) layers being arranged in a stack between the body region and the isolation contact.. . ... Nxp Usa Inc

05/10/18 / #20180129624

Method and apparatus for handling outstanding interconnect transactions

A method and apparatus for handling outstanding interconnect transactions between a master device and an interconnect component. For example, a transaction intervention module coupled to an interconnect component and a master device of the interconnect component. ... Nxp Usa Inc

05/03/18 / #20180123605

Digital synthesizer, communication unit and method therefor

A digital synthesizer is described that comprises: a digitally controlled oscillator, dco; a feedback loop; a ramp generator configured to generate a signal of frequency control words, fcw, that describes a desired frequency modulated continuous wave; and a phase comparator configured to compare a phase of the fcw output from the ramp generator and a signal fed back from the dco via the feedback loop and output a n-bit oscillator control signal. The digital synthesizer comprises a gain circuit coupled to a multiplier located between the ramp generator and the dco and configured to apply a frequency-dependent gain signal to the n-bit oscillator control signal to maintain an open loop gain of the all-digital phase locked loop, adpll, and a pll loop bandwidth that is substantially constant across a frequency modulation bandwidth.. ... Nxp Usa Inc

05/03/18 / #20180123537

Digital synthesizer, communication unit and method therefor

A digital synthesizer is described that comprises: a ramp generator configured to generate a signal of frequency control words, fcw, that describes a desired frequency modulated continuous wave; a digitally controlled oscillator, dco configured to receive the fcw signal; a feedback loop; and a phase comparator coupled to the ramp generator and configured to compare a phase of the fcw output from the ramp generator and a signal fed back from the dco via the feedback loop and output a n-bit oscillator control signal. The digital synthesizer comprises a gain circuit coupled to a multiplier located between the ramp generator and the dco and configured to apply at least one gain from a plurality of selectable gains to the n-bit oscillator control signal that set a selectable loop gain of the digital synthesizer and thereby set a selectable loop bandwidth; and calculate and apply a gain offset dependent upon the selected gain that is adapted when the selected gain is changed.. ... Nxp Usa Inc

05/03/18 / #20180123536

Baseband amplifier circuit

A baseband amplifier circuit comprising a single-ended to differential converter followed by at least one boosted follower amplifier. The boosted follower amplifier comprises a first transconductance device arranged to control a first current between a first supply node and a first output node in response to a voltage at a first input node, a second transconductance device arranged to control a second current between the first output node and a second supply node in response to a voltage at a second input node, a third transconductance device arranged to control a third current between the first supply node and a second output node in response to a voltage at a third input node, and a fourth transconductance device arranged to control a fourth current between the second output node of the boosted follower amplifier and the second supply node in response to a voltage at a fourth input node.. ... Nxp Usa Inc

05/03/18 / #20180121385

Can module and method therefor

A can module comprising a bit duration compensation component arranged to generate a compensated transmit command signal for controlling the driver component to drive a dominant state on the can bus. The compensated transmit command signal comprises dominant bits of a compensated-bit duration tbit_cp=tbit_tx+tc, wherein tc comprises a compensation offset derived at least partly from a difference between a transmit-bit duration of a digital transmit command signal and a receive-bit duration of a received data signal.. ... Nxp Usa Inc

05/03/18 / #20180121282

Register error detection system

A system for register error detection is described, the system comprising: a plurality of addressable registers comprising sets of registers, the registers in each set having contiguous addresses; a cyclic redundancy check generator coupled to the addressable registers and configured to determine a cyclic-redundancy-check result for each set of registers from the values of each of the respective set of registers; a controller coupled to the registers and the cyclic-redundancy-check generator. The controller comprises a cyclic-redundancy-check calculator and is configured to determine an expected cyclic-redundancy-check result from expected values for each of the set of registers, to read the cyclic-redundancy-check result for each of the set of registers determined by the cyclic-redundancy-check generator, and to compare the generated cyclic-redundancy-check result with the calculated cyclic-redundancy-check result and wherein a difference between the generated cyclic-redundancy-check result and the calculated cyclic-redundancy-check result is indicative of an error condition.. ... Nxp Usa Inc

04/12/18 / #20180102421

Semiconductor device structure with non planar slide wall

A semiconductor device that includes a semiconductor structure having a side wall that is non planar and that extends farther outward at an upper portion than at a lower portion of the side wall. The semiconductor structure extends underneath a semiconductor layer wherein a top portion of the structure contacts the semiconductor layer.. ... Nxp Usa Inc

04/12/18 / #20180102305

Semiconductor device and lead frame with high density lead array

A semiconductor device includes a lead frame having leads arranged in an array that has columns extending in a first direction and rows extending in a second direction. Each lead includes a bond pad portion and a solder pad portion down-set from the bond pad portion. ... Nxp Usa Inc

03/29/18 / #20180091075

Electric motor drive apparatus and method therefor

An electric motor drive apparatus comprising a voltage converter component arranged to receive a supply voltage signal and output a bus voltage signal, and a motor driver component arranged to receive the bus voltage signal and generate at least one drive signal for an electric motor from the bus voltage signal. The motor driver component is arranged to output a bus voltage feedback signal to the voltage converter component. ... Nxp Usa Inc

03/08/18 / #20180069723

Method for transmitting messages in a data bus system, transceiver and electronic control unit for a motor vehicle

A method for transmitting messages in a data bus system, wherein the messages can be transmitted in the form of data frames by a data bus and a data frame that is to be sent by a bus subscriber is checked for a piece of changeover information, which method is furthermore distinguished in that changeover of the rise time and/or edge shape of edges of bit pulses of the data frame that is to be sent is performed on the basis of the presence of a defined value of the piece of changeover information. In addition, a corresponding transceiver and to an electronic control unit is disclosed.. ... Nxp Usa Inc

03/08/18 / #20180069531

Low temperature coefficient clock signal generator

A relaxation oscillator for generating a low temperature coefficient (ltc) clock signal includes a reference voltage generator and an oscillator. The reference voltage generator generates an ltc current and a bandgap reference voltage. ... Nxp Usa Inc

03/01/18 / #20180063948

Fan-out wafer level packages having preformed embedded ground plane connections

. . Fan-out wafer level packages (fo-wlps) having embedded ground plane (egp) connections are provided. In one embodiment, the fo-wlp includes a molded package body having a frontside and an opposing backside. ... Nxp Usa Inc

03/01/18 / #20180061785

Power transistor with harmonic control

A system and method for a packaged device with harmonic control are presented. In one embodiment, a device includes a substrate and a transistor die coupled to the substrate. ... Nxp Usa Inc

03/01/18 / #20180059178

Integrated circuit with low power scan system

An integrated circuit operable in a scan mode includes a scan chain formed by cascaded flip-flop cells. Each flip-flop cell includes a master latch that receives a first data signal and generates a first latch signal, a slave latch that receives the first latch signal and generates a second latch signal, and a multiplexer having first and second inputs respectively connected to the master and slave latches that receives a first input signal and the second latch signal, and generates a scan data output signal depending on an input trigger signal. ... Nxp Usa Inc

02/22/18 / #20180054198

Differential receiver

One example discloses a differential receiver, including: a set of high voltage differential inputs configured to receive a first range of differential voltages; a first level shifter configured to generate a second range of differential voltages that are less than the first range of differential voltages; and a first low voltage differential comparator coupled to the first level shifter and configured to generate a first differential receiver output based on the second range of differential voltages.. . ... Nxp Usa Inc

02/22/18 / #20180054000

Antenna modification to reduce harmonic activation

An arrangement for modifying a printed circuit antenna of the type used in mobile communication devices includes introducing one or more discontinuities into a printed circuit pattern of the antenna so that it is not activated at undesired frequencies. Examples of discontinuities include localized narrowing the printed circuit strip, localized widening of the printed circuit strip and localized changing of the shape of the printed circuit strip.. ... Nxp Usa Inc

02/22/18 / #20180053749

Apparatus and methods for multi-die packaging

A packaged semiconductor device includes a first package substrate having a first plurality of lead fingers, a first die attached to a first major surface of the first package substrate, a second package substrate having a second plurality of lead fingers, wherein each of the second plurality of lead fingers extends over the first die and the second package substrate is electrically isolated from the first package substrate. The device also includes a second die attached to a first major surface of the second package substrate, over the first die, and an encapsulant surrounding the first die, the first package substrate, the second die, and the second package substrate, wherein the encapsulant exposes a portion of the first package substrate and a portion of the second package substrate.. ... Nxp Usa Inc

02/15/18 / #20180047616

Method of forming inter-level dielectric structures on semiconductor devices

A semiconductor device and a method for making the semiconductor device are provided. The method of making the semiconductor device may include patterning a layer for a first conductor and a second conductor, plating patterned portions of the layer to form the first conductor and the second conductor, removing patterned material to form an air gap between the first conductor and the second conductor, applying a self-supporting film on top of the first conductor and the second conductor to enclose the air gap, and reacting the self-supporting film causing the self-supporting film to be substantially non-conductive.. ... Nxp Usa Inc

02/08/18 / #20180042074

Defrosting apparatus with lumped inductive matching network and methods of operation thereof

A defrosting system includes an rf signal source, an electrode proximate to a cavity within which a load to be defrosted is positioned, a transmission path between the rf signal source and the electrode, and an impedance matching network electrically coupled along the transmission path between the output of the rf signal source and the electrode. The system also includes power detection circuitry coupled to the transmission path and configured to detect reflected signal power along the transmission path. ... Nxp Usa Inc

02/08/18 / #20180042073

Apparatus and methods for detecting defrosting operation completion

A defrosting system includes an rf signal source, an electrode proximate to a cavity within which a load to be defrosted is positioned, and a transmission path between the rf signal source and the electrode. The system also includes power detection circuitry coupled to the transmission path and configured repeatedly to take forward and reflected rf power measurements along the transmission path. ... Nxp Usa Inc

02/08/18 / #20180041414

Multi-rate overlay mode in wireless communication systems

A method performed by a first wireless communication device is provided, which includes exchanging rate information with a second wireless communication device in response to a determination that the second wireless communication device is configured with the multi-rate extension mechanism, wherein the first and second wireless communication devices support two or more different data transfer rates that are faster or slower than a legacy data transfer rate specified by the legacy protocol; determining an appropriate data transfer rate based on the rate information and link quality information regarding a communication link between the first and second wireless communication devices; and communicating the appropriate data transfer rate to the second wireless communication device, wherein the appropriate data transfer rate is utilized during communication between the first and second wireless communication devices.. . ... Nxp Usa Inc

02/08/18 / #20180039544

Resource access management component and method therefor

A resource access management component arranged to manage access to resources within a processing system. The resource access management component comprises at least one resource access management device configurable to manage access to the resources by a plurality of interconnect-master devices of the processing system. ... Nxp Usa Inc

02/01/18 / #20180034421

Encapsulated semiconductor device package with heatsink opening

Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die. ... Nxp Usa Inc

02/01/18 / #20180034418

Doherty input power splitter and linearization method

Embodiments of a doherty amplifier device are provided, including a first amplifier stage having a first gain; a second amplifier stage having a second gain that is less than the first gain; and an input power splitter coupled to inputs of the first and second amplifier stages, wherein the input power splitter includes either an inductive element, a capacitive element, or both coupled between the inputs of the first and second amplifier stages, and a resistive element coupled to the input of the second amplifier stage, the input power splitter respectively delivers first and second power levels to inputs of the first and second amplifier stages, and the resistive element is configured to tune gain linearity of the doherty amplifier device by increasing the second power level to be greater than the first power level, based on a ratio of the second gain to the first gain.. . ... Nxp Usa Inc

02/01/18 / #20180034365

Accurate non-isolated high voltage dc-dc feedback

A method and apparatus for regulating a non-isolated high voltage converter applies a pwm signal to a power transistor that couples an input voltage to a floating ground node to charge an inductor and generate an output voltage which is measured with a first floating comparator to disable the pwm signal upon detecting a high threshold output voltage, the first floating comparator having inputs connected across first and second resistive elements to measure a voltage across a feedback resistor connected in series with a diode between the output voltage and a neutral ground reference. Subsequently, the output voltage is measured with a second floating comparator to enable the pwm signal upon detecting a low threshold output voltage, where the second floating comparator has inputs connected across the first and second resistive elements to measure the feedback voltage across the feedback resistor.. ... Nxp Usa Inc

02/01/18 / #20180033787

Methods of fabricating integrated circuits and devices with interleaved transistor elements

A monolithic integrated circuit includes first and second pluralities of parallel-connected transistor elements (e.g., transistor fingers). To spread heat in the ic, the first and second pluralities of transistor elements are interleaved with each other and arranged in a first row. ... Nxp Usa Inc

02/01/18 / #20180031635

Methods for switch health determination

The embodiments described herein provide systems and methods for determining the health status of a sensed switch. In general, the embodiments described herein determine a measure of a health status of the sensed switch by comparing a voltage on the sensed switch, ascertaining a first comparator state under one test condition and ascertaining a second comparator state under a second test condition. ... Nxp Usa Inc

01/25/18 / #20180026531

Tunable voltage regulator circuit

A voltage regulator has an output driver current mirror circuit and one or more control circuits. The output driver current mirror circuit includes an output driver transistor, a tunable resistance circuit, and a diode-connected transistor. ... Nxp Usa Inc

01/25/18 / #20180024614

Autonomous hardware for application power usage optimization

Self-configured, power-aware circuitry configured to enhance power efficiency within integrated circuitry by self-calibrating the power consumption utilized within the integrated circuitry according to the requirements of an application program running within the integrated circuitry. The power consumption is self-calibrated within the integrated circuitry on a per application-based manner so that the integrated circuitry can be implemented with a plurality of various generalized functionalities, each of which may or may not be utilized while a specific application program is running within the integrated circuitry. ... Nxp Usa Inc

01/18/18 / #20180019222

Flexible circuit leads in packaging for radio frequency devices and methods thereof

A packaged rf device is provided that utilizes flexible circuit leads. The rf device includes at least one integrated circuit (ic) die configured to implement the rf device. ... Nxp Usa Inc

01/18/18 / #20180019187

Method of integrating a copper plating process in a through-substrate-via (tsv) on cmos wafer

A semiconductor device composed of a through-substrate-via (tsv) interconnect, and methods for forming the interconnect.. . ... Nxp Usa Inc

01/18/18 / #20180018936

Method and apparatus for managing graphics layers within a graphics display component

A layer selection module for a graphics display component, and method therefor. The layer selection module is arranged to identify a set m of active layers to be blended for a pixel, configure a display controller to generate composite pixel data for the pixel based on a subset n of up to n layers from the set m, determine whether a number m of active layers in the set m exceeds n, and output an indication of which active layers within the set m were excluded from the subset n, if it is determined that the number m of layers in the set m exceeds n.. ... Nxp Usa Inc

01/18/18 / #20180017387

Segmented electrode structure for quadrature reduction in an integrated device

An integrated device includes a mems device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (ic) die having a surface coupled with the mems device such that the movable mass is interposed between the substrate and the surface of the ic die. ... Nxp Usa Inc

01/11/18 / #20180013436

Charge pump driver circuit

A charge pump driver circuit comprises an output stage and a current generator component. The output stage is arranged to receive at an input node thereof a control current signal and comprises a resistance network coupled between the input node thereof and a reference voltage node and arranged to provide a resistive path through which the control current signal flows. ... Nxp Usa Inc

01/11/18 / #20180013416

Igbt gate current slope measure to estimate miller plateau

A method and apparatus are provided for controlling a drive terminal of a power transistor by applying a turn-off voltage to the drive terminal at a turn-off time, measuring a gate current at the drive terminal to detect a predetermined gate current slope, determining a first time increment after the turn-off time when the predetermined gate current slope is detected, determining a second time increment which is proportional to the first time increment and which expires within a miller plateau for the power transistor, and lowering the gate current at the drive terminal to a predetermined current level upon expiration of the second time increment in order to reduce overvoltages at the power transistor.. . ... Nxp Usa Inc

01/11/18 / #20180013391

Multiple-path rf amplifiers with angularly offset signal path directions, and methods of manufacture thereof

An embodiment of a doherty amplifier module includes a substrate, an rf signal splitter, a carrier amplifier die, and a peaking amplifier die. The rf signal splitter divides an input rf signal into first and second input rf signals, and conveys the first and second input rf signals to first and second splitter output terminals. ... Nxp Usa Inc

01/11/18 / #20180012855

Pre-plated substrate for die attachment

A method for attaching a semiconductor die to a substrate includes providing a substrate that includes an attachment layer at a surface of the substrate. The attachment layer is covered by a protective flash plating layer. ... Nxp Usa Inc

01/11/18 / #20180012815

Semiconductor device package and methods of manufacture thereof

A method of manufacturing a packaged semiconductor device includes forming an assembly by placing a semiconductor die over a substrate with a die attach material between the semiconductor die and the substrate. A conformal structure which includes a pressure transmissive material contacts at least a portion of a top surface of the semiconductor die. ... Nxp Usa Inc

01/04/18 / #20180006001

Packaged devices with multiple planes of embedded electronic devices

A packaged semiconductor structure includes an interconnect layer and a first microelectronic device on a first major surface of the interconnect layer. The structure also includes a substrate having a cavity, wherein the cavity is defined by a vertical portion and a horizontal portion, wherein the vertical portion surrounds the first device, the horizontal portion is over the first device, and the first device is between the horizontal portion and the first major surface of the interconnect layer such that the first device is in the cavity. ... Nxp Usa Inc

01/04/18 / #20180004616

Fast write mechanism for emulated electrically eraseble (eee) system

An embodiment for operation of an emulated electrically erasable (eee) memory system includes a memory controller configured to identify a first quick record of a stack of quick records as a present record, wherein the stack of quick records are stored in a non-volatile portion of memory, the first quick record has a quick record status identifier (id) that indicates the stack of quick records has not been qualified, determine a record status of a next record after the present record in the non-volatile portion of memory, and in response to a determination that the next record has a blank record status id: update the next record from the blank record status id to the quick record status id, wherein the blank record status id indicates that the next record is part of the stack of quick records, and qualify the present record using the plurality of program steps.. . ... Nxp Usa Inc

01/04/18 / #20180003734

Compensation and calibration of multiple mass mems sensor

A system includes a mems sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass. ... Nxp Usa Inc

12/28/17 / #20170373893

Frequency shift keying (fsk) demodulator and method therefor

A method of operating frequency shift keying (fsk) demodulator for demodulating symbols includes providing current and previous buffered portions of an input signal to correlation circuits of the fsk demodulator, where each buffered portion persists for a symbol duration time period. The correlation circuits output first correlation metrics that indicate a likelihood of whether the buffered portions match a respective target pattern. ... Nxp Usa Inc

12/21/17 / #20170366171

Switched current control module and method therefor

A switched current control module comprises a hysteretic control component arranged to receive high and low threshold values and an indication of a current flow through a load, and to output a switched current control signal based on a comparison of the current flow indication to the high and low threshold values. A threshold generator is arranged to generate the high and low threshold values based on a base threshold value and a hysteretic excursion value. ... Nxp Usa Inc

12/21/17 / #20170366141

Rf power transistor circuits

A radio frequency (rf) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an rf input signal, a first current electrode for providing an rf output signal at an output terminal, and a second current electrode coupled to a voltage reference. ... Nxp Usa Inc

12/21/17 / #20170365355

Memory controller for selecting read clock signal

A memory controller includes a clock delay generator, a set of flip-flops, and a control circuit, and is connected to a processor and a memory. The clock delay generator receives a clock signal from the processor, delays the clock signal by a set of delay time intervals, and generates a set of delayed clock signals. ... Nxp Usa Inc

12/21/17 / #20170364398

Data processing system having messaging

A method of handling requests between contexts in a processing system includes, in a current context of a source processing system element (pse): executing a send-and rendezvous instruction that specifies a destination pse, a queue address in the destination pse, a set of source registers, and a set of receive registers; and sending a send-and-rendezvous message (srm) to the destination pse, wherein the srm includes an address of the destination pse, a destination queue address, a source pse address, and an identifier of the current context in the source pse.. . ... Nxp Usa Inc

12/21/17 / #20170362077

Cavity type pressure sensor device

A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. ... Nxp Usa Inc

12/14/17 / #20170359098

Configurable correlator for joint timing and frequency synchronization and demodulation

At least one embodiment of a correlator comprising a plurality of correlator taps is configurable to provide synchronization and symbol modulation for a plurality of modulation systems. Among other uses, at least one embodiment of the correlator can provide a coarse symbol timing value. ... Nxp Usa Inc

12/14/17 / #20170359032

Doherty amplifiers with minimum phase output networks

A doherty amplifier includes an output combining network that has a first combining network input coupled to a main amplifier path, a lowest-order combining network input coupled to a lowest-order peaking amplifier path, and n−2 additional combining network inputs coupled to other peaking amplifier paths. A final summing node is coupled to the combining network output, and is directly coupled to the first combining network input. ... Nxp Usa Inc

12/14/17 / #20170358525

Flexible semiconductor device with graphene tape

A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. ... Nxp Usa Inc

12/14/17 / #20170358329

Method and apparatus for generating a charge pump control signal

A charge pump driver circuit (320) arranged to output a charge pump control signal (325). The charge pump driver circuit (320) includes a bias current source component (330) arranged to generate a bias current (335), a control stage (340) and an output stage (350). ... Nxp Usa Inc

12/14/17 / #20170356928

Microelectromechanical device and a method of damping a mass thereof

A microelectromechanical device comprising a mass, an electromechanical transducer configured to convert, after damping the mass during a first damping period, displacement of the mass in the first and second directions into corresponding first and second electrical signals during corresponding first and second conversion time periods, a derivative unit configured to generate first and second control signals indicative of the velocity of the mass in the first and second direction, and a controller for providing the first and second control signals to respective first and second one or more electrodes of the electromechanical transducer for simultaneously damping the mass in the first and second directions with a first and second damping forces corresponding to the first and second velocity during the damping time period.. . ... Nxp Usa Inc

11/30/17 / #20170346499

Analogue to digital converter

A sar adc is disclosed. The sar adc includes a plurality of sar-capacitors. ... Nxp Usa Inc

11/30/17 / #20170344477

Data processor

A data processor comprises a memory-management-unit for receiving external-operation-data from a cpu. The memory-management-unit sets a deterministic-quantity value for the external-operation-data based on the external-operation-data. ... Nxp Usa Inc

11/30/17 / #20170344089

Safety circuit

An integrated circuit comprising: an input terminal configured to receive a failure-event-signal representative of a failure event; a first output terminal configured to provide a first-failure-signal; and a second output terminal configured to provide a second-failure-signal; and a processing block configured to: set the first-failure-signal based on the failure-event-signal; and set the second-failure-signal, at a predetermined time interval after the first-failure-signal is set. The processing block further comprises a switch configured selectively, based on a received digital-error-signal to either: set the second-failure-signal based on a digital-counter-output-signal; or set the second-failure-signal based on an analogue-trigger-signal.. ... Nxp Usa Inc

11/23/17 / #20170338942

Preamble detection in wireless systems with intermittent reception

Disclosed is receiver apparatus including a first input configured to receive a first signal, a second input configured to receive a second signal, a switching circuit configured to alternate between the first and second signal from the first and second inputs, a receiver configured to sample the input signal to produce a plurality of input samples, a reference sequence generator configured to generate a reference signal, and a correlator configured to correlate the first and second signals with the reference signal to detect a correlation event, the correlator including a first buffer configured to receive signals from the first input and a second buffer configured to receive signals from the second input, wherein the correlator is configured to process the first signal in the first buffer, while the second buffer receives the second signal.. . ... Nxp Usa Inc

11/23/17 / #20170338809

Circuit arrangement for fast turn-off of bi-directional switching device

Embodiments of a transistor control device for controlling a bi-directional power transistor are disclosed. In an embodiment, a transistor control device for controlling a bi-directional power transistor includes a resistor connectable to a body terminal of the bi-directional power transistor and a transistor body switch circuit connectable to the resistor, to a drain terminal of the bi-directional power transistor, and to a source terminal of the bi-directional power transistor. ... Nxp Usa Inc

11/23/17 / #20170338778

Rf power transistor circuits

A radio frequency (rf) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an rf input signal, a first current electrode for providing an rf output signal at an output terminal, and a second current electrode coupled to a voltage reference. ... Nxp Usa Inc

11/23/17 / #20170337960

Sense path circuitry suitable for magnetic tunnel junction memories

A memory includes a first memory cell; and a second memory cell. A selectable current path is coupled between the first memory cell and the second memory cell. ... Nxp Usa Inc

11/23/17 / #20170336823

Compensation circuit

A compensation circuit configured for coupling to a voltage source and a reference circuit. The voltage source is configured for supplying a supply voltage to the compensation circuit and the reference circuit. ... Nxp Usa Inc

11/16/17 / #20170332104

System encoder and decoder for verification of image sequence

The present application relates to a system for verifying integrity of a stream of image frames including an encoder logic module and a decoder logic module. On source side, a test line insertion logic module receiving the stream is arranged upstream to the encoder logic module encoding the stream. ... Nxp Usa Inc

11/16/17 / #20170331650

Noise-shaping crest factor reduction (cfr) methods and devices

Embodiments of a noise-shaping crest factor reduction method for a carrier signal (and a device that performs the method) include (a) clipping the carrier signal by selecting at least one carrier signal peak that has a magnitude exceeding a predetermined crest factor reduction threshold, (b) subtracting the resulting clipped signal from the carrier signal, (c) confining, by a noise shaping filter, the resulting clipping noise signal in a frequency band corresponding to that of the carrier signal, and (d) subtracting the resulting spectrally shaped clipping noise signal from a delayed version of the carrier signal. The confining process includes selecting first sub-areas of the noise shaping filter response at one or more guard bands, selecting at least one second sub-area of the noise shaping filter response elsewhere in the frequency band, and setting the first sub-areas to a first predetermined magnitude higher than the magnitude of the second sub-area.. ... Nxp Usa Inc

11/16/17 / #20170331646

Methods and apparatus for processing digital composite signals

Embodiments include methods and devices for processing a digital composite signal generated at a first sampling rate. The signal includes at least first and second carrier-bands arranged to define a first inner gap between the carrier-bands. ... Nxp Usa Inc

11/16/17 / #20170331478

Integrated circuit with spare cells

The disclosure relates to an integrated circuit comprising: a first voltage terminal; a second voltage terminal; and a plurality of logic cells, comprising one or more field effect transistors having a p-type channel and one or more field effect transistors having an n-type channel. The plurality of logic cells comprises a regular subset of cells and a spare subset of cells. ... Nxp Usa Inc

11/16/17 / #20170330899

Semiconductor on insulator (soi) block with a guard ring

A semiconductor device includes a bulk substrate of a first conductivity type, a first semiconductor on insulator (soi) block in the bulk substrate, a first well of the first conductivity type in the first soi block, a second well of a second conductivity type in the first soi block, a first guard ring of the first conductivity type in the first soi block around at least a portion of a periphery of the first soi block, and a second guard ring of the second conductivity type in the first soi block around at least a portion of the periphery of the first soi block. The first conductivity type is different than the second conductivity type.. ... Nxp Usa Inc

11/16/17 / #20170328735

Quadrature error compensation circuit for a mems gyroscope

Mems gyroscopes are often integrated in modern electronic products for measuring orientation or rotation in those products. However, these mems gyroscopes are often inaccurate. ... Nxp Usa Inc

11/16/17 / #20170328713

System comprising a mechanical resonator and method therefor

A system is provided that includes a mechanical resonator, and an analog circuit coupled to the mechanical resonator. The analog circuit is arranged to receive a mechanical resonator measurement signal having a quadrature error from the mechanical resonator, and to extract a quadrature error signal from the mechanical resonator measurement signal using a quadrature clock. ... Nxp Usa Inc

11/09/17 / #20170322895

Dma controller with arithmetic unit

A digital signal processor (dsp) includes a cpu, and a dma controller. The dma controller transfers data from a source to a destination as a function of an initialization command from the cpu. ... Nxp Usa Inc

10/26/17 / #20170310159

Supply-switching system

A system for providing a first voltage generated by a main supply and a second voltage generated by a battery to an integrated circuit (ic) includes supply-selection, control logic and switching circuits. The supply-selection circuit includes first, second, and third transistors. ... Nxp Usa Inc

10/26/17 / #20170308480

Cache organization and method

A method and information processing system with improved cache organization is provided. Each register capable of accessing memory has associated metadata, which contains the tag, way, and line for a corresponding cache entry, along with a valid bit, allowing a memory access which hits a location in the cache to go directly to the cache's data array, avoiding the need to look up the address in the cache's tag array. ... Nxp Usa Inc

10/26/17 / #20170307451

Temperature sensor and calibration method thereof having high accuracy

Disclosed is a temperature sensor including a first current generator configured to generate a proportional to absolute temperature (ptat) current, a second current generator configured to generate an inverse ptat (iptat) current, the ptat current and iptat current being combined to form a reference current having a sensitivity relative to temperature, a plurality of current mirrors to adjust the sensitivity and gain of the reference current, and a variable resistor to set an output calibration voltage based on the generated current.. . ... Nxp Usa Inc

10/12/17 / #20170294889

System and method to directly couple to analog to digital converter having lower voltage reference

A device includes a variable gain amplifier, a voltage shifter, a variable gain amplifier half replica module, and an analog to digital converter. The variable gain amplifier includes an input terminal to receive an input signal, an output terminal to provide a first output signal that is biased based on a first common-mode voltage reference. ... Nxp Usa Inc

10/12/17 / #20170294531

Semiconductor devices with integrated schotky diodes and methods of fabrication

An embodiment of a semiconductor device includes a semiconductor substrate that includes an upper surface and a channel, a gate electrode disposed over the substrate electrically coupled to the channel, and a schottky metal layer disposed over the substrate adjacent the gate electrode. The schottky metal layer includes a schottky contact electrically coupled to the channel which provides a schottky junction and at least one alignment mark disposed over the semiconductor substrate. ... Nxp Usa Inc

10/12/17 / #20170293265

Calibration method and apparatus for high tdc resolution

Various embodiments include a time to digital converter device comprising: a medium resolution delay unit including a plurality of buffers, the medium resolution delay unit configured to receive as inputs a reference clock signal and a data clock signal and configured to output a plurality of delayed data clock signals wherein the delay between the plurality of delayed data clock signal is a medium resolution delay value; a fine resolution delay unit including a plurality of cores configured to receive as inputs the reference clock signal and the plurality of delayed data clock signals from the medium resolution delay unit, wherein the plurality of cores includes: a first bank of delays configured to receive one of the plurality of the delayed data clock signals, a second bank of delays configured to receive the reference clock signal, and; and a fast flip flop connected to the outputs of the first bank of delays and the second bank of delays, wherein the output of the fast flip flop is used to check the phase alignment.. . ... Nxp Usa Inc

10/12/17 / #20170292884

Pressure-sensing integrated circuit device with diaphragm

An integrated circuit (ic) device includes a pressure sensor die, a flexible gel covering a least a pressure-sensing region of the die, and a flexible diaphragm covering the gel. The ic device has encapsulant and a lid that define a cavity above the diaphragm. ... Nxp Usa Inc

10/05/17 / #20170288051

Trench mosfet shield poly contact

A recess is formed at a semiconductor layer of a device to define a plurality of mesas. An active trench portion of the recess residing between adjacent mesas. ... Nxp Usa Inc

09/21/17 / #20170271908

Determination of q-factor of resonant tank network

A power converter having a switch network, a resonant tank network, and a controller performs in situ determination of the q-factor of the resonant tank network. The controller excites transitory damped oscillations of the resonant tank network by applying a limited number of on-pulses to the transistor switches of the switch network. ... Nxp Usa Inc

09/21/17 / #20170271292

High power semiconductor package subsystems

A method and apparatus for incorporation of high power device dies into smaller system packages by embedding metal “coins” having high thermal conductivity into package substrates, or printed circuit boards, and coupling the power device dies onto the metal coins is provided. In one embodiment, the power device die can be attached to an already embedded metal coin in the package substrate or pcb. ... Nxp Usa Inc

09/14/17 / #20170263572

Emi/rfi shielding for semiconductor device packages

An encapsulated semiconductor device package with an overlying conductive emi or rfi shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.. . ... Nxp Usa Inc

09/14/17 / #20170263529

Thick-silver layer interface

A semiconductor device and a method of manufacturing the same include a die and a planar thermal layer, and a thick-silver layer having a thickness of at least four (4) micrometers disposed directly onto a first planar side of the planar thermal layer, as well as a metallurgical die-attach disposed between the thick-silver layer and the die, the metallurgical die-attach directly contacting the thick-silver layer.. . ... Nxp Usa Inc

09/07/17 / #20170257091

Devices with signal and temperature characteristic dependent control circuitry and methods of operation therefor

An embodiment of a device includes a terminal, an active transistor die electrically coupled to the terminal, a detector configured to sense a signal characteristic on the terminal, and control circuitry electrically coupled to the active transistor die and to the detector, wherein the active transistor die, detector, and control circuitry are coupled to a package. The control circuitry may include a control element and a control device. ... Nxp Usa Inc

09/07/17 / #20170256525

Localized redistribution layer structure for embedded component package and method

An embedded component package includes an embedded component substrate. The embedded component substrate includes an electronic component having an active surface including bond pads and a package body encapsulating the electronic component. ... Nxp Usa Inc

08/31/17 / #20170250276

Semiconductor devices with vertical field floating rings and methods of fabrication thereof

A semiconductor device includes a semiconductor substrate having a first conductivity type. A gate structure is supported by a surface of the semiconductor substrate, and a current carrying region (e.g., a drain region of an ldmos transistor) is disposed in the semiconductor substrate at the surface. ... Nxp Usa Inc

08/24/17 / #20170242803

Systems and methods for performing instruction fetches based on privilege states and code memory regions

Embodiments include processing systems that determine, based on an instruction address range indicator stored in a first register, whether a next instruction fetch address corresponds to a location within a first memory region associated with a current privilege state or within a second memory region associated with a different privilege state. When the next instruction fetch address is not within the first memory region, the next instruction is allowed to be fetched only when a transition to the different privilege state is legal. ... Nxp Usa Inc

08/17/17 / #20170236929

Semiconductor device with selectively etched surface passivation

A semiconductor device includes a semiconductor substrate configured to include a channel, a gate supported by the semiconductor substrate to control current flow through the channel, a first dielectric layer supported by the semiconductor substrate and including an opening in which the gate is disposed, and a second dielectric layer disposed between the first dielectric layer and a surface of the semiconductor substrate in a first area over the channel. The second dielectric layer is patterned such that the first dielectric layer is disposed on the surface of the semiconductor substrate in a second area over the channel.. ... Nxp Usa Inc

08/17/17 / #20170236817

Esd protection device

An electrostatic discharge protection clamp includes a substrate and a first electrostatic discharge protection device over the substrate. The first electrostatic discharge protection device includes a buried layer over the substrate. ... Nxp Usa Inc

08/17/17 / #20170236305

Apparatus, method and system for adjusting predefined calibration data for generating a perspective view

The present application relates to a system for generating a surround view and a method of operating the system. A synthesizer module synthesizes an output frame from input frames in accordance with predefined calibration data. ... Nxp Usa Inc

08/10/17 / #20170225949

Mems device with isolation sub-frame structure

An embodiment of a microelectromechanical systems (mems) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.. . ... Nxp Usa Inc

08/03/17 / #20170220519

Universal spi (serial peripheral interface)

A universal spi interface is provided that is compatible, without the need for additional interface logic or software, with the spi bus, existing dsa and other serial busses similar to (but not directly compatible with) the spi bus, and parallel busses requiring compatibility with 74xx164-type signaling. In an additional aspect, a red universal spi interface is provided that provides the same universal interface, but using fewer external output pins. ... Nxp Usa Inc

07/27/17 / #20170213584

Sense amplifier

In a non-volatile memory, a method of performing a sensing operation to read a non-volatile (nv) element includes a first and a second phase. During the first phase, the nv element is coupled via a sense path transistor to a first capacitive element at a first input of an amplifier stage and a reference cell is coupled via a reference sense path transistor to a second capacitive element at a second input of the amplifier stage. ... Nxp Usa Inc

07/20/17 / #20170207142

Semiconductor devices with a thermally conductive layer and methods of their fabrication

An embodiment of a semiconductor device includes a semiconductor substrate that includes a host substrate and an upper surface, an active area, a substrate opening in the semiconductor substrate that is partially defined by a recessed surface, and a thermally conductive layer disposed over the semiconductor substrate that extends between the recessed surface and a portion of the semiconductor substrate within the active area. A method for fabricating the semiconductor device includes defining an active area, forming a gate electrode over a channel in the active area, forming a source electrode and a drain electrode in the active area on opposite sides of the gate electrode, etching a substrate opening in the semiconductor substrate that is partially defined by the recessed surface, and depositing a thermally conductive layer over the semiconductor substrate that extends between the recessed surface and a portion of the semiconductor substrate over the channel.. ... Nxp Usa Inc

07/13/17 / #20170200794

Segmented field plate structure

A device includes a transistor formed over a substrate. The transistor includes a source structure, a drain structure, and a gate structure. ... Nxp Usa Inc

07/13/17 / #20170200701

Method of fabricating 3-dimensional fan-out structure

A method of fabricating a 3d fan-out structure for an integrated circuit device includes providing a substrate carrier having first and second opposing surfaces and an aperture extending between the first and second surfaces. A first semiconductor die is bonded to the first surface of the substrate carrier such that the first die covers the aperture of the substrate carrier. ... Nxp Usa Inc

07/06/17 / #20170194444

Methods and structures for a split gate memory cell structure

A method of forming a split gate memory cell structure using a substrate includes forming a gate stack comprising a select gate and a dielectric portion overlying the select gate. A charge storage layer is formed over the substrate including over the gate stack. ... Nxp Usa Inc

07/06/17 / #20170194420

High voltage semiconductor devices and methods for their fabrication

Semiconductor devices include a semiconductor substrate containing a source region and a drain region, a gate structure supported by the semiconductor substrate between the source region and the drain region, a composite drift region in the semiconductor substrate, the composite drift region extending laterally from the drain region to at least an edge of the gate structure, the composite drift region including dopant having a first conductivity type, wherein at least a portion of the dopant is buried beneath the drain region at a depth exceeding an ion implantation range, and a well region in the semiconductor substrate. The well region has a second conductivity type and is configured to form a channel therein under the gate structure during operation. ... Nxp Usa Inc

07/06/17 / #20170194264

Semiconductor device with graphene encapsulated metal and method therefor

A method for forming a semiconductor structure includes forming a first metal layer over a first dielectric layer, forming a first graphene layer on at least one major surface of the first metal layer, and forming a second dielectric layer over the first metal layer and the first graphene layer. The method further includes forming an opening in the second dielectric layer which exposes the first metal layer, forming a second metal layer over the second dielectric layer and within the opening, and forming a second graphene layer on at least one major surface of the second metal layer, wherein the second graphene layer is also formed within the opening.. ... Nxp Usa Inc

06/29/17 / #20170187372

Half-bridge circuit, h-bridge circuit and electronic system

A half-bridge circuit comprises a high supply contact and a low supply contact. A half-bridge output contact is connectable to drive a load and has a high-side between the high supply contact and the half-bridge output contact and a low-side between the half-bridge output contact and the low supply contact. ... Nxp Usa Inc

06/22/17 / #20170180169

Method and apparatus for generating phase shift control signals

A phase shifter controller arranged to generate phase shift control signals for at least one phase shifter. The phase shifter controller is arranged to receive a first phase value θ1, receive a second phase value θ2, and output phase shift control signals. ... Nxp Usa Inc

06/22/17 / #20170179111

Semiconductor device and an integrated circuit comprising an esd protection device, esd protection devices and a method of manufacturing the semiconductor device

A semiconductor device is provided which comprises an esd protection device. The structure of the semiconductor device comprises a p-doped isolated region in which a structure is manufactured which operates as a silicon controlled rectifier which is coupled between an i/o pad and a reference voltage or ground voltage. ... Nxp Usa Inc

06/22/17 / #20170179063

Coupling element, integrated circuit device and method of fabrication therefor

A coupling element for providing external coupling to a semiconductor die within an integrated circuit package. The coupling element comprises a flexible laminate structure comprising a flexible, electrically insulating substrate layer, a first conductive layer bonded to a first surface of the substrate layer, and a second conductive layer bonded to a second surface of the substrate layer. ... Nxp Usa Inc

06/22/17 / #20170179038

Semiconductor device package substrate having a fiducial mark

A method for forming a semiconductor device package substrate including a fiducial mark is provided. The method of forming the package substrate includes forming a dielectric layer over a lower portion of the package substrate. ... Nxp Usa Inc

06/22/17 / #20170177529

Serial data communications switching device and a method of operating thereof

The present application relates to a serial data communications switching device and a method of operating the serial data communications switching device. The serial data communications switching device comprises one host port for connecting to a host device; a plurality of client ports each for connecting to one of a plurality of client devices; an arbiter configured to arbitrate the permission to send a message sequence between the plurality of the client devices according to an arbitration scheme; and a tx flow analyzer adapted to detect a client transmission received at one of the client port from a current client device currently having granted the permission and to instruct the arbiter to maintain the granted permission for the current client device for the ongoing client transmission.. ... Nxp Usa Inc

06/22/17 / #20170174509

Mems sensor with side port and method of fabricating same

A mems sensor package comprises a mems die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. ... Nxp Usa Inc

06/15/17 / #20170170163

Charge pump circuit for providing multiplied voltage

A charge pump comprises one or more pump stages for providing a negative boosted output voltage. Each of the one or more pump stages comprises a p-channel transistor formed in an isolated p-well and an n-channel transistor coupled in series with the p-channel transistor. ... Nxp Usa Inc

06/08/17 / #20170162275

Compensation circuit for compensating for an input charge in a sample and hold circuit

A compensation circuit for compensating for an input charge at a first input of a sample and hold circuit, comprising: a first buffer, a first compensation capacitor comprising a first compensation terminal switchable between a first buffer input and a first buffer output, and a second compensation terminal switchable between the first buffer output and a reference terminal, and a control circuit to switch the first compensation terminal to the first buffer output and the second compensation terminal to the reference terminal during sampling, for storing a compensation charge into the first compensation capacitor, and to switch the first compensation terminal to the first buffer input and the second compensation terminal to the first buffer output during holding, for discharging the first compensation capacitor into the first input. The compensation charge is substantially equal to the input charge.. ... Nxp Usa Inc

06/08/17 / #20170160326

Electrostatic discharge tester

Apparatus for testing a device by delivering an electrostatic discharge signal to one or more device terminals, comprising a first part configured for mechanically mounting the device and comprising one or more first part connectors for electrically coupling to the one or more device terminals and thus providing electrical access to the one or more device terminals, a second part comprising one or more second part connectors configured for electrically coupling the one or more first part connectors to the one or more second part connectors for testing the device via the second part connectors, and a guide arranged for mechanically moving the first part relative to the second part. The guide is configured to physically disconnect the one or more first part connectors from the one or more second part connectors while the electrostatic discharge signal is delivered to the one or more device terminals.. ... Nxp Usa Inc








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