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Omnivision Technologies Inc patents


Recent patent applications related to Omnivision Technologies Inc. Omnivision Technologies Inc is listed as an Agent/Assignee. Note: Omnivision Technologies Inc may have other listings under different names/spellings. We're not affiliated with Omnivision Technologies Inc, we're just tracking patents.

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Method and apparatus for data transmission in an image sensor

Methods and apparatuses for data transmission in an image sensor are disclosed herein. An example data transmission circuit may include a plurality of transmission banks coupled in series with a first one of the plurality of transmission banks coupled to function logic, where each of the plurality of transmission banks are coupled to provide image data to a subsequent transmission bank in a direction toward the function logic in response to a clock signal, a plurality of delays coupled in series, wherein each of the plurality of delays is associated with and coupled to a respective transmission bank of the plurality of transmission banks, and wherein the clock signal is received by each of the plurality of transmission banks after being delayed by a respective number of delays of the plurality of delays in relation to the function logic.. ... Omnivision Technologies Inc

Athermal doublet lens with large thermo-optic coefficients

An athermal lens system includes a converging lens element having a negative first thermo-optic coefficient, and a diverging lens element having a second thermo-optic coefficient more negative than the first thermo-optic coefficient, wherein the diverging lens element is coupled with the converging lens element to form a converging athermal doublet lens.. . ... Omnivision Technologies Inc

Backside illuminated image sensor with improved contact area

An image sensor includes a semiconductor material having a front side and a back side opposite the front side. The image sensor also includes a shallow trench isolation (sti) structure, an interlayer dielectric, an intermetal dielectric, and a contact area. ... Omnivision Technologies Inc

Edge reflection reduction

A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. ... Omnivision Technologies Inc

Edge reflection reduction

A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the transparent shield. ... Omnivision Technologies Inc

Methods for high-dynamic-range color imaging

A method for manufacturing a high-dynamic-range color image sensor includes (a) depositing a color filter layer on a silicon substrate having a photosensitive pixel array with a plurality of first pixels and a plurality of second pixels, to form (i) a plurality of first color filters above a first subset of each of the plurality of first pixels and the plurality of second pixels and (ii) a plurality of second color filters above a second subset of each of the plurality of first pixels and the plurality of second pixels, wherein thickness of the second color filters exceeds thickness of the first color filters, and (b) depositing, on the color filter layer, a dynamic-range extending layer including grey filters above the second pixels to attenuate light propagating toward the second pixels, combined thickness of the color filter layer and the dynamic-range extending layer being uniform across the photosensitive pixel array.. . ... Omnivision Technologies Inc

Feedback capacitor and method for readout of hybrid bonded image sensors

A hybrid-bonded image sensor has a photodiode die with multiple macrocells; each macrocell has at least one photodiode and a coupling region. The coupling regions couple to a coupling region of a macrocell unit of a supporting circuitry die where they feed an input of an amplifier and a feedback capacitor. ... Omnivision Technologies Inc

Two stage amplifier readout circuit in pixel level hybrid bond image sensors

A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit having a bond contact coupled to the bond contact of a macrocell of the photodiode die. Each macrocell unit lies within a supercell and has a reset transistor adapted to reset photodiodes of the macrocell of the photodiode die. ... Omnivision Technologies Inc

Exposure selector for high-dynamic range imaging and associated method

A method for generating an hdr image includes (i) generating, from a plurality of single-exposure images of a scene, having a respective one of a plurality of exposure values, a sharpness map of sharpness values of the single-exposure images, and (ii) generating, from the plurality of single-exposure images, an exposure-value map of composite exposure values of the single-exposure images. The method also includes (iii) determining an optimal exposure value from the sharpness map and the exposure-value map, and (iv) generating the hdr image by combining a reference image of the scene, captured with the optimal exposure value, and at least two of the plurality of single-exposure images. ... Omnivision Technologies Inc

Anti-reflective coating with high refractive index material at air interface

An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.. ... Omnivision Technologies Inc

Imaging system having dual image sensors

An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. ... Omnivision Technologies Inc

Four-surface near-infrared wafer-level lens systems

A four-surface, near-infrared wafer-level lens system for imaging a scene onto an image plane includes (a) a first wafer-level lens having a first convex lens surface facing the scene and a second concave lens surface facing the image plane, and (b) a second wafer-level lens disposed between the first wafer-level lens and the image plane and including a third concave lens surface facing the scene and a fourth aspheric convex lens surface facing the image plane. The four-surface, near-infrared wafer-level lens system is further characterized by an image resolution corresponding to at least 60% contrast of 2 line pairs per millimeter in object plane across a scene portion having at least 10 millimeters extent in the object plane.. ... Omnivision Technologies Inc

Random sampling for horizontal noise reduction

An example apparatus for random sampling for horizontal noise reduction includes readout circuitry coupled to receive image data from an array of pixels, the readout circuitry including a plurality of sample and hold (s&h) circuits coupled to respective ones of a plurality of bitlines to sample and hold the image data in response to a plurality of s&h control signals, each of the plurality of s&h circuits including an s&h capacitor and an s&h switch. The s&h capacitor samples and holds respective image data, and the s&h switch coupled between a respective bitline and to the respective s&h capacitor, and further coupled to receive a respective one of the plurality of s&h control signals to open/close the s&h switch, where each of the plurality of s&h switches are opened to decouple their respective s&h capacitors from the respective bitlines at a different.. ... Omnivision Technologies Inc

Backside metal grid and metal pad simplification

An image sensor includes a semiconductor material including a plurality of photodiodes disposed in the semiconductor material. The image sensor also includes a first insulating material disposed proximate to a frontside of the semiconductor material, and an interconnect disposed in the first insulating material proximate to the frontside of the semiconductor material. ... Omnivision Technologies Inc

06/28/18 / #20180182797

System-in-package image sensor

A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. ... Omnivision Technologies Inc

06/21/18 / #20180173456

Multiport memory architecture

Multiport memory architecture is disclosed herein. An example memory includes an input port, a memory array, and an output port. ... Omnivision Technologies Inc

06/14/18 / #20180167573

Current injection for fast ramp start-up during analog-to-digital operations

An example method for fast ramp start-up during analog to digital conversion (adc) includes opening a feedback bypass switch coupled to an amplifier to initiate an adc operation, providing an injection current pulse to an inverting input of the amplifier, where the non-inverting input is coupled to a feedback bypass switch, integrating a first reference current coupled to the inverting input of the amplifier, where the integrating of the first reference current occurs due to the opening of the feedback bypass switch, and providing a reference voltage in response to the injection current pulse, the integrating of the first reference current, and a reference voltage coupled to a non-inverting input of the amplifier, where a level of the reference voltage is increased at least at initiation of the adc operation in response to the injection current pulse.. . ... Omnivision Technologies Inc

06/07/18 / #20180160109

Image sensor failure detection

A novel image sensor includes error detection circuitry for detecting sequencing errors. In a particular embodiment a pattern is inserted into a captured image and an image processor detects sequencing errors by determining a location of the pattern. ... Omnivision Technologies Inc

05/31/18 / #20180152177

Self-biasing integrated oscillator without bandgap reference

. . An integrated oscillator has an r-s flipflop; a first and second capacitor; a current source transistor; first and second current-steering transistors, each having a source coupled to the current source transistor, with drains coupled to the first and second capacitor respectively. The first current-steering transistor has gate coupled to a first output of the r-s flipflop, and the second current-steering transistor has gate coupled to a second output of the r-s flipflop. ... Omnivision Technologies Inc

05/31/18 / #20180151610

Storage gate protection

A method of backside illuminated image sensor fabrication includes forming a plurality of photodiodes in a semiconductor material, where the plurality of photodiodes are disposed to receive image light through a backside of the backside illuminated image sensor. The method further includes forming a transfer gate coupled to extract image charge from a photodiode in the plurality of photodiodes, and forming a storage gate coupled to the transfer gate to receive the image charge. ... Omnivision Technologies Inc

05/31/18 / #20180151609

Through-semiconductor and through-dielectric isolation structure

An image sensor includes a semiconductor material including a photodiode disposed in the semiconductor material and an insulating material. A surface of the semiconductor material is disposed between the insulating material and the photodiode. ... Omnivision Technologies Inc

05/24/18 / #20180145099

Graded-semiconductor image sensor

A method of image sensor fabrication includes growing a semiconductor material having an illuminated surface and a non-illuminated surface, where the semiconductor material includes silicon and germanium and a germanium concentration increases in a direction of the non-illuminated surface. The method further includes forming a plurality of photodiodes, including a doped region and a heavily doped region, in the semiconductor material, where the doped region is of an opposite majority charge carrier type as the heavily doped region. ... Omnivision Technologies Inc

05/24/18 / #20180144710

System and method for protecting a liquid crystal display by controlling ion migration

A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. ... Omnivision Technologies Inc

05/24/18 / #20180143498

System and method for protecting a liquid crystal display by controlling ion migration

A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. ... Omnivision Technologies Inc

05/03/18 / #20180124372

Systems and methods for active depth imager with background subtract

An active depth imaging system and method of operating the same captures illuminator-on and illuminator-off image data with each of a first and second imager. The illuminator-on image data includes information representing an imaged scene and light emitted from an illuminator and reflected off of objects within the imaged scene. ... Omnivision Technologies Inc

04/12/18 / #20180103221

Fixed pattern noise reduction in image sensors

Systems and methods for fixed pattern noise reduction in image sensors is disclosed herein. An example method may include simultaneously providing a pixel reference voltage of a pixel to a reference sampling capacitor and a signal sampling capacitor, decoupling the reference sampling capacitor from the pixel, providing a signal voltage to the signal sampling capacitor, and decoupling the signal sampling capacitor from the pixel.. ... Omnivision Technologies Inc

04/12/18 / #20180100992

Six-aspheric-surface lens

A six-aspheric-surface lens has six coaxially aligned lenses including, in order, a positive first lens, a negative second lens, a negative third lens, a negative fourth lens, a negative fifth lens, and a plano-gull-wing sixth lens. The six-aspheric-surface lens also includes a first biplanar substrate between the first lens and the second lens, a second biplanar substrate between the third lens and the fourth lens, and a third biplanar substrate between the fifth lens and the sixth lens. ... Omnivision Technologies Inc

04/05/18 / #20180098008

Cmos image sensor with dual floating diffusions per pixel for flicker-free detection of light emitting diodes

Apparatuses and methods for image sensors with pixels that reduce or eliminate flicker induced by high intensity illumination are disclosed. An example image sensor may include a photodiode, a transfer gate, an anti-blooming gate, and first and second source follower transistors. ... Omnivision Technologies Inc

04/05/18 / #20180097132

Apparatus and method for single-photon avalanche-photodiode detectors with reduced dark count rate

An avalanche photodiode has a first diffused region of a first diffusion type overlying at least in part a second diffused region of a second diffusion type; and a first minority carrier sink region disposed within the first diffused region, the first minority carrier sink region of the second diffusion type and electrically connected to the first diffused region. In particular embodiments, the first diffusion type is n-type and the second diffusion type is p-type, and the device is biased so that a depletion zone having avalanche multiplication exists between the first and second diffused regions.. ... Omnivision Technologies Inc

04/05/18 / #20180097030

Stacked image sensor with shield bumps between interconnects

An image sensor includes a pixel array having plurality of pixel cells arranged into a plurality of rows and a plurality of columns of pixel cells in a first semiconductor die. A plurality of pixel support circuits are arranged in a second semiconductor die that is stacked and coupled together with the first semiconductor die. ... Omnivision Technologies Inc

04/05/18 / #20180095290

Wafer-level liquid-crystal-on-silicon projection assembly, systems and methods

A wafer-level liquid-crystal-on-silicon (lcos) projection assembly includes a lcos display for spatially modulating light incident on the lcos display and a polarizing beam-separating (pbs) layer for directing light to and from the lcos display. A method for fabricating a lcos projection system includes disposing a pbs wafer above an active-matrix wafer. ... Omnivision Technologies Inc

04/05/18 / #20180095235

Lens barrel, lens-barrel wafer, and associated method

A method for forming a lens barrel includes aligning each of a plurality of upper apertures of an upper wafer to (i) a respective one of a plurality of middle apertures of a middle wafer and (ii) a respective one of a plurality of lower apertures of a lower wafer. The middle wafer is between the upper wafer and the lower wafer. ... Omnivision Technologies Inc

04/05/18 / #20180095193

Yardless lens assemblies and manufacturing methods

A wafer-level method for manufacturing yardless lenses includes (a) depositing light-curable lens resin between a mold and a first side of a transparent substrate, wherein the first side of the transparent substrate has an opaque coating with a plurality of apertures respectively aligned with a plurality of lens-shaped recesses of the mold, and (b) exposing a second side of the transparent substrate, facing away from the first side, to light, thereby illuminating portions of the light-curable lens resin aligned with the plurality of apertures to form a respective plurality of yardless lenses.. . ... Omnivision Technologies Inc

03/29/18 / #20180091752

Comparator for double ramp analog to digital converter

Apparatuses and method for an image sensor with increased analog to digital conversion range and reduced noise are described herein. An example method may include disabling a first auto-zero switch of a comparator, the first auto-zero switch coupled to auto-zero a reference voltage input of the comparator, adjusting an auto-zero offset voltage of a ramp voltage provided to the reference voltage input of the comparator, and disabling a second auto-zero switch of the comparator, the second auto-zero switch coupled to auto-zero a bitline input of the comparator.. ... Omnivision Technologies Inc

03/29/18 / #20180090538

Self-aligned optical grid on image sensor

An image sensor includes a substrate, a plurality of light sensitive pixels, a first plurality of color filters, a plurality of reflective sidewalls, and a second plurality of color filters. The light sensitive pixels are formed on said substrate. ... Omnivision Technologies Inc

03/22/18 / #20180084185

Image sensor with asymmetric-microlens phase-detection auto-focus (pdaf) detectors, associated pdaf imaging system, and associated method

. . A pdaf imaging system includes an image sensor and an image data processing unit. The image sensor has an asymmetric-microlens pdaf detector that includes: (a) a plurality of pixels forming a sub-array having at least two rows and two columns, and (b) a microlens located above each of the plurality of pixels and being rotationally asymmetric about an axis perpendicular to the sub-array. ... Omnivision Technologies Inc

03/22/18 / #20180084167

Stacked-filter image-sensor spectrometer and associated stacked-filter pixels

A stacked-filter image-sensor spectrometer includes an image sensor, a first color filter array, and a second color filter array. The image sensor has a pixel array including a plurality of pixels. ... Omnivision Technologies Inc

03/22/18 / #20180082937

Microchip with cap layer for redistribution circuitry and method of manufacturing the same

A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. ... Omnivision Technologies Inc

03/22/18 / #20180081389

Reference clock-less cmos image sensor

Apparatuses and methods for a reference clock-less cmos image sensor are disclosed herein. An example apparatus may include a controller coupled to an image sensor via a serial bus, and the controller may provide an access burst to the image sensor over the serial bus, the access burst including a plurality of data signals and an associated clock signal, where the associated clock signal is a timing signal for the acquisition of bits of the plurality of data signals. ... Omnivision Technologies Inc

03/22/18 / #20180081163

Endoscope imager and associated method

An endoscope imager includes a system-in-package and a specularly reflective surface. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit. ... Omnivision Technologies Inc

03/15/18 / #20180076248

Short-resistant chip-scale package

A short-resistant csp includes an isolation layer, an electrically conductive rdl, and an insulating layer. The electrically conductive rdl is on the isolation layer and includes a first and a second rdl segment. ... Omnivision Technologies Inc

03/15/18 / #20180076247

Backside-illuminated color image sensors with crosstalk-suppressing color filter array

A backside-illuminated color image sensor with crosstalk-suppressing color filter array includes (a) a silicon layer including an array of photodiodes and (b) a color filter layer on the light-receiving surface of the silicon layer, wherein the color filter layer includes (i) an array of color filters cooperating with the array of photodiodes to form a respective array of color pixels and (ii) a light barrier grid disposed between the color filters to suppress transmission of light between adjacent ones of the color filters. The light barrier is spatially non-uniform across the color filter layer to account for variation of chief ray angle across the array of color filters. ... Omnivision Technologies Inc

03/15/18 / #20180076246

Cover-glass-free array camera with individually light-shielded cameras

A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.. . ... Omnivision Technologies Inc

03/15/18 / #20180075822

Display system and method supporting variable input rate and resolution

A display system includes a pixel array, a data buffer and a display driver. In a particular embodiment the data buffer receives and stores frames of image data and provides the frames of image data to the pixel array. ... Omnivision Technologies Inc

03/15/18 / #20180075587

Array camera image combination with feature-based ghost removal

A method for combining array camera images with feature-based ghost removal includes (a) receiving, from an array camera, a first image and a second image respectively captured by a first camera and a second camera of the array camera, (b) rectifying and aligning the first image and the second image, (c) after said rectifying and aligning, identifying features in the first image to produce at least one first feature image each indicating features in the first image, and identifying features in the second image to produce at least one second feature image each indicating features in the second image, (d) comparing the at least one first feature image with the at least one second feature image to determine a ghost mask defining combination weights for combination of the first image with the second image.. . ... Omnivision Technologies Inc

03/15/18 / #20180075586

Ghost artifact removal system and method

A method for removing a ghost artifact from a multiple-exposure image of a scene method includes steps of generating and segmenting a difference mask, determining a lower threshold and an upper threshold, generating a refined mask, and generating a corrected image. The difference mask includes a plurality of absolute differences in luminance-values between the multiple-exposure image and a first image of the scene. ... Omnivision Technologies Inc

03/08/18 / #20180069041

Fill factor enhancement

An image sensor includes a plurality of photodiodes disposed in a semiconductor material and a plurality of isolation structures disposed between individual photodiodes in the plurality of photodiodes. The plurality of isolation structures electrically isolate individual photodiodes in the plurality of photodiodes. ... Omnivision Technologies Inc

03/01/18 / #20180063424

Method and apparatus for high resolution digital photography from multiple image sensor frames

A camera system has a lens focusing incoming light through a deflector system having at least one deflector plate onto a photosensor array. An image processor captures at least a first image with the deflector system in a first position and a second image with the deflector system in a second position to provide a focal point offset in a first axis on the photosensor array, and the firmware is configured to prepare an enhanced image from at least the first and second images. ... Omnivision Technologies Inc

02/15/18 / #20180046867

Lane departure warning system and associated methods

A lane departure warning system includes a memory and a processor for validating a candidate region as including an image of a lane marker on the road is disclosed. The candidate region is identified within a latest road image of a temporal sequence of road images captured from the front of a vehicle traveling along a road. ... Omnivision Technologies Inc

02/08/18 / #20180041723

Linear-logarithmic image sensor

A pixel array for use in a high dynamic range image sensor includes a plurality of pixels arranged in a plurality of rows and columns in the pixel array. Each one of the pixels includes a linear subpixel and a log subpixel disposed in a semiconductor material. ... Omnivision Technologies Inc

02/08/18 / #20180041688

Camera and method with widescreen image on nearly-square aspect ratio photosensor array

A digital widescreen camera has an anamorphic lens focusing a field of view nearly twice as wide as tall on a photosensor array having nearly square aspect ratio. In embodiments, the photosensor array has an 8-pixel tiling unit organized as four pairs of adjacent left and right pixels, a first pair having two red-responsive pixels, a second pair having two blue-responsive pixels, and a third pair having two green-responsive pixels. ... Omnivision Technologies Inc

02/08/18 / #20180039126

Panel carrier and method for attaching a liquid-crystal-on-silicon panel thereto

A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the lcos panel. ... Omnivision Technologies Inc

02/01/18 / #20180033811

Biased deep trench isolation

An image sensor includes a plurality of photodiodes disposed in a semiconductor material, and a through-semiconductor-via coupled to a negative voltage source. Deep trench isolation structures are disposed between individual photodiodes in the plurality of photodiodes to electrically and optically isolate the individual photodiodes. ... Omnivision Technologies Inc

01/25/18 / #20180027196

High dynamic range image sensor with virtual high-low sensitivity pixels

An image sensor includes a plurality of photodetectors that are identically sized and fabricated in semiconductor material with identical semiconductor processing conditions. The photodetectors are organized into virtual high-low sensitivity groupings, each including a first photodetector and a second photodetector. ... Omnivision Technologies Inc

01/25/18 / #20180027194

Image sensor floating diffusion boosting by transfer gates

A shared pixel includes a plurality of transfer gates coupled between respective photodiodes and a shared floating diffusion. Each transfer gate is coupled to receive a transfer control signal to independently control a transfer of the image charge from the corresponding photodiodes to the shared floating diffusion. ... Omnivision Technologies Inc

01/25/18 / #20180026147

Vertical gate guard ring for single photon avalanche diode pitch minimization

A photon detection device includes a single photon avalanche diode (spad) including a multiplication junction defined at an interface between n doped and p doped layers of the spad in a first region of a semiconductor layer. A vertical gate structure surrounds the spad in the semiconductor layer to isolate the spad in the first region from a second region of the semiconductor layer on an opposite side of the vertical gate structure. ... Omnivision Technologies Inc

01/18/18 / #20180020131

Emi shield with a lens-sized aperture for camera modules and camera modules including the same

An emi shield for a camera module subassembly includes a first conductive portion covering an optical unit and a top surface of a circuit substrate of the camera module subassembly and a second conductive portion covering a bottom surface of the circuit substrate, such that the two portions are in contact. The emi shield can also include an extension to cover a flexible circuit substrate and its connector, as well as can include an emi attenuator over an aperture formed in the first conductive portion above the optical unit. ... Omnivision Technologies Inc

01/18/18 / #20180019278

Visible and infrared image sensor

A method of image sensor fabrication includes forming a second semiconductor layer on a back side of a first semiconductor layer. The method also includes forming one or more groups of pixels disposed in a front side of the first semiconductor layer. ... Omnivision Technologies Inc

01/18/18 / #20180019268

Stacked-chip backside-illuminated spad sensor with high fill-factor

A photon detection device includes a single photon avalanche diode (spad) disposed in a semiconductor layer. A guard ring structure is disposed in the semiconductor layer surrounding the spad to isolate the spad. ... Omnivision Technologies Inc

01/04/18 / #20180007324

Image sensor with big and small pixels and method of manufacture

An image sensor includes a substrate, a first set of sensor pixels formed on the substrate, and a second set of sensor pixels formed on the substrate. The sensor pixels of the first set are arranged in rows and columns and are configured to detect light within a first range of wavelengths (e.g., white light). ... Omnivision Technologies Inc

01/04/18 / #20180006076

Photogate for front-side-illuminated infrared image sensor and method of manufacturing the same

An image sensor includes a substrate and a plurality of infrared pixels formed in a front side of the substrate and configured to detect infrared light incident on the front side of the substrate. Each of the infrared pixels includes a photodiode, a region free of implants located above the photodiode, and a photogate formed over the substrate and above the photodiode. ... Omnivision Technologies Inc

12/28/17 / #20170374252

Bezels for die level packaging of camera modules, and associated camera modules and methods

A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.. . ... Omnivision Technologies Inc

12/28/17 / #20170373825

1-16 & 1.5-7.5 frequency divider for clock synthesizer in digital systems

A frequency divider unit has a digital frequency divider configured to divide by an odd integer, and a dual-edge-triggered one-shot coupled to double frequency of an output of the digital frequency divider. The frequency divider unit is configurable to divide an input frequency by a configurable ratio selectable from at least non-integer ratios of 1.5, 2.5, and 3.5. ... Omnivision Technologies Inc

12/28/17 / #20170373109

Resonant-filter image sensor and associated fabrication method

A resonant-filter image sensor includes a pixel array including a plurality of pixels and a microresonator layer above the pixel array. The microresonator layer includes a plurality of microresonators formed of a first material with an extinction coefficient less than 0.02 at a free-space wavelength of five hundred nanometers. ... Omnivision Technologies Inc

12/14/17 / #20170359545

Global shutter pixel with hybrid transfer storage gate-storage diode storage node

An image sensor pixel having a hybrid transfer storage gate-storage diode storage node is disclosed herein. An example image sensor includes a photodiode, a storage diode, a transfer gate, and a buried storage well. ... Omnivision Technologies Inc

12/14/17 / #20170359532

Image sensor pixel noise measurement

An image sensor pixel noise measurement circuit includes a pixel array on an integrated circuit chip. The pixel array includes a plurality of pixels including a first pixel to output a first image data signal, and a second pixel to output a second image data signal. ... Omnivision Technologies Inc

11/30/17 / #20170347047

Systems and methods for detecting light-emitting diode without flickering

An image sensor for detecting light-emitting diode (led) without flickering includes a pixel array with pixels. Each pixel including subpixels including a first and a second subpixel, dual floating diffusion (dfd) transistor, and a capacitor coupled to the dfd transistor. ... Omnivision Technologies Inc

11/30/17 / #20170345851

Graded-semiconductor image sensor

An image sensor includes a semiconductor material having an illuminated surface and a non-illuminated surface. A plurality of photodiodes is disposed in the semiconductor material to receive image light through the illuminated surface. ... Omnivision Technologies Inc

11/23/17 / #20170338941

Clock generator and method for reducing electromagnetic interference from digital systems

A spread-spectrum clock generator has a phase-locked loop locked to a reference signal that gives a stable-frequency output to a variable phase shifter. The variable phase shifter provides a spread-spectrum clock output because its phase-shift is determined by a pseudorandom sequence generator and the pseudorandom sequence generator changes its output regularly or irregularly within limits. ... Omnivision Technologies Inc

11/09/17 / #20170324910

Method and system for implementing h-banding cancellation in an image sensor

A method for implementing h-banding cancellation in an image sensor starts with a pixel array capturing image data. Pixel array includes a plurality of pixels to generate pixel data signals, respectively. ... Omnivision Technologies Inc

10/26/17 / #20170310890

Ultra-small camera module with wide field of view, and associate lens systems and methods

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.. . ... Omnivision Technologies Inc

10/26/17 / #20170307856

Compact three-surface wafer-level lens systems

A compact three-surface wafer-level lens system for imaging a scene onto an image plane includes a one-sided wafer-level lens and a two-sided wafer-level lens disposed between the one-sided wafer-level lens and the image plane. The total track length of the wafer-level lens system is no more than 2.2 millimeters. ... Omnivision Technologies Inc

10/12/17 / #20170294477

Interposer and chip-scale packaging for wafer-level camera

A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. ... Omnivision Technologies Inc

10/12/17 / #20170294471

Trenched device wafer, stepped-sidewall device die, and associated method

A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of devices. ... Omnivision Technologies Inc

10/12/17 / #20170293115

Slim imager, associated system-in-package, and associated method

In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. ... Omnivision Technologies Inc

10/05/17 / #20170289470

Horizontal banding reduction with ramp generator isolation in an image sensor

A readout circuit for use in an image sensor includes a system ramp generator coupled to generate a system ramp signal. A plurality of analog-to-digital converters is coupled to a plurality of column bitlines from a pixel array to receive corresponding analog column image signals. ... Omnivision Technologies Inc

10/05/17 / #20170287966

Image sensor contact enhancement

A method of image sensor fabrication includes providing a plurality of photodiodes disposed in a semiconductor material and a floating diffusion disposed in the semiconductor material. The method also includes providing peripheral circuitry disposed in the semiconductor material, including a first electrical contact to the semiconductor material, and forming a transfer gate disposed to transfer image charge from the photodiode to the floating diffusion. ... Omnivision Technologies Inc

09/28/17 / #20170280075

Flare-reducing imaging system and associated image sensor

An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. ... Omnivision Technologies Inc

09/21/17 / #20170272708

Image sensor with peripheral 3a-control sensors and associated imaging system

An imaging system includes a primary imager and plurality of 3a-control sensors. The primary imager has a first field of view and includes a primary image sensor and a primary imaging lens with a first optical axis. ... Omnivision Technologies Inc

09/21/17 / #20170272642

Phase-detection auto-focus pixel array and associated imaging system

A phase-detection auto-focus (pdaf) pixel array includes a first pixel and a second pixel. The first pixel, located at a first distance from a center of the pdaf pixel array, includes a first inner photodiode and a first outer photodiode with respect to the center. ... Omnivision Technologies Inc

09/21/17 / #20170271384

Biased deep trench isolation

An image sensor includes a plurality of photodiodes disposed in a semiconductor material, and a through-semiconductor-via coupled to a negative voltage source. Deep trench isolation structures are disposed between individual photodiodes in the plurality of photodiodes to electrically and optically isolate the individual photodiodes. ... Omnivision Technologies Inc

09/14/17 / #20170264839

Enhanced high dynamic range

An imaging system includes an image sensor configured to capture a sequence of images including at least one low dynamic range (ldr) image and at least one high dynamic range (hdr) image. The imaging system also includes readout circuitry. ... Omnivision Technologies Inc

09/07/17 / #20170256666

Back side illuminated image sensor with guard ring region reflecting structure

An imaging sensor system includes a pixel array having a plurality of pixel cells disposed in a first semiconductor layer, where each one of the plurality of pixel cells has a single photon avalanche diode (spad) disposed proximate to a front side of a first semiconductor layer. Each of the plurality of pixel cells includes a guard ring disposed in the first semiconductor layer in a guard ring region proximate to the spad, and also includes a guard ring region reflecting structure disposed in the guard ring region proximate to the guard ring and proximate to the front side of the first semiconductor layer. ... Omnivision Technologies Inc

08/03/17 / #20170221951

Through-semiconductor-via capping layer as etch stop layer

A method of image sensor fabrication includes providing a semiconductor material, an insulation layer, and a logic layer, where the semiconductor material includes a plurality of photodiodes. A through-semiconductor-via is formed which extends from the semiconductor material, through the insulation layer, and into the logic layer. ... Omnivision Technologies Inc

07/27/17 / #20170213864

Trenched-bonding-dam device and manufacturing method for same

Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. ... Omnivision Technologies Inc

07/27/17 / #20170213863

High dynamic range image sensor with reduced sensitivity to high intensity light

An image sensor includes first and second pluralities of photodiodes interspersed among each other in a semiconductor substrate. Incident light is to be directed through a surface of the semiconductor substrate into the first and second pluralities of photodiodes. ... Omnivision Technologies Inc

07/20/17 / #20170208276

Method and system for implementing dynamic ground sharing in an image sensor with pipeline architecture

A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. ... Omnivision Technologies Inc

07/20/17 / #20170207269

Image sensor contact enhancement

An image sensor includes a photodiode disposed in semiconductor material. The photodiode is one of a plurality of photodiodes formed in an array. ... Omnivision Technologies Inc

07/20/17 / #20170205653

Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby

A novel method of forming an alignment layer of a liquid crystal display device includes the steps of providing a substrate (e.g., a processed silicon wafer, etc.) having an alignment layer material deposited thereon and applying a series of pulses from a pulse laser to anneal portions of the alignment layer material and alter its surface morphology. The method can include the step of depositing the alignment layer material (e.g., a spin-on dielectric including sio2) over the substrate using a spin-on process prior to laser annealing. ... Omnivision Technologies Inc

07/13/17 / #20170201681

Imaging systems and methods with image data path delay measurement

An imaging system with image data path delay measurement includes (a) a first image sensor chip that includes a pixel array for generating a first image in response to light incident upon the pixel array, and a time mark generator for, upon receiving a time mark command, encoding a signature in the first image to generate a first marked image with the signature and image data from the first image, and (b) an image signal processing chip for processing the first marked image, wherein the image signal processing chip includes a data path delay measurement module for generating the time mark command and estimating image data path delay from the pixel array to the data path delay measurement module based upon time delay between (i) generating the time mark command and (ii) receipt of the signature as part of the first marked image.. . ... Omnivision Technologies Inc

07/13/17 / #20170200760

Plasmonic-nanostructure sensor pixel

A first plasmonic-nanostructure sensor pixel includes a semiconductor substrate and a plurality of metal pillars. The semiconductor substrate has a top surface and a photodiode region therebeneath. ... Omnivision Technologies Inc

07/13/17 / #20170200755

Flip-chip image sensor package

A flip-chip image-sensor package includes a substrate, a coverglass, a conductive layer, and an image sensor. The substrate has an aperture therethrough and a first region and a second region each at least partially surrounding the aperture. ... Omnivision Technologies Inc

07/13/17 / #20170199348

Four-surface narrow field-of-view compound lens

A four-surface narrow field-of-view compound lens includes a first biplanar substrate between a first lens and a second lens, the first lens being plano-convex and the second lens being plano-concave. The compound lens also includes a second biplanar substrate between a third lens and a fourth lens, the third lens being plano-convex and the fourth lens being plano-concave. ... Omnivision Technologies Inc

07/06/17 / #20170195607

Method and system for reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter

A method of reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter (adc) starts with a pixel array capturing image data. The pixel array includes pixels to generate pixel data signals, respectively. ... Omnivision Technologies Inc

07/06/17 / #20170195604

Method and system of implementing an uneven timing gap between each image capture in an image sensor

Stacked chip imaging system comprising pixel array partitioned into pixel sub-arrays (psas) disposed in first semiconductor die and adc circuitry including adc circuits disposed in second semiconductor die. Each psa is arranged into pixel groups. ... Omnivision Technologies Inc

07/06/17 / #20170195597

Method and system for reducing analog-to-digital conversion time for dark signals

A method for reducing adc time for dark signals starts with pixel array capturing image data of frames including first frame and second frame. Pixel array includes visible pixels and black pixels (opb). ... Omnivision Technologies Inc

07/06/17 / #20170195590

Method and system for reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter

A method of reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter (adc) starts with a pixel array capturing image data. The pixel array includes pixels to generate pixel data signals, respectively. ... Omnivision Technologies Inc

07/06/17 / #20170193895

Low latency display system and method

A novel display system includes a host and a display. In a particular embodiment the host includes a data scaler and a dual frame buffer. ... Omnivision Technologies Inc

06/22/17 / #20170180663

High speed rolling image sensor with adm architecture and method of implementing thereof

High speed rolling image sensor includes pixel array disposed in first semiconductor die, readout circuits disposed in second semiconductor die and conductors. Pixel array is partitioned into pixel sub-arrays (psas). ... Omnivision Technologies Inc

06/22/17 / #20170180662

Image sensor color correction

An image sensor includes a plurality of photodiodes disposed in a semiconductor material and a plurality of transfer transistors. Individual transfer transistors in the plurality of transfer transistors are coupled to individual photodiodes in the plurality of photodiodes. ... Omnivision Technologies Inc

06/22/17 / #20170178552

Frame timing

A display system includes a processor coupled to receive image data from an image source and a frame timing circuit. The processor is coupled to output the image data and first sync signals, where each one of the first sync signals is output after m number of pixel values of the image data are output from the processor. ... Omnivision Technologies Inc

06/22/17 / #20170177951

Lane detection system and method

A lane detection system includes a non-volatile memory storing machine-readable instructions and an image processor capable of receiving a road image. The image processor, when executing the machine-readable instructions, is capable of: (i) processing the road image to identify a lane candidate within a lane-existing region of the road image, the lane-existing region having (a) a near subregion including an imaged road region nearer to the vehicle and (b) a far subregion including an imaged road region farther from the vehicle, (ii) verifying the lane candidate as a true lane candidate when a minimum distance between (a) a line fit to a portion of the lane candidate in the near subregion and (b) a predetermined reference point in the road image is less than a neighborhood distance; and (iii) extending the true lane candidate into the far subregion to form a detected lane marker demarcating the lane marker.. ... Omnivision Technologies Inc

06/15/17 / #20170168270

Spacer wafer for wafer-level camera and method for manufacturing same

A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.. ... Omnivision Technologies Inc

06/15/17 / #20170168104

Image sensor power supply noise detection

A power supply noise measurement circuit includes a multiphase filter coupled to receive a power supply signal. The multiphase filter is coupled to output a first filtered power supply signal for a first phase, and a second filtered power supply signal for a second phase. ... Omnivision Technologies Inc

06/15/17 / #20170167978

Methods for high-throughput fluorescence imaging with sample heating capability

A method for high-throughput assay processing includes (a) modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer, including a plurality of image sensors, by heating the image sensor wafer using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples, and (b) capturing a plurality of fluorescence images of the samples, using the plurality of image sensors, to detect one or more components of the plurality of samples. A method for manufacturing a high-throughput fluorescence imaging system with sample heating capability includes (a) bonding a fluidic wafer, including a plurality of recesses, to an image sensor wafer including a plurality of image sensors, and (b) bonding a heating module, including a heater for generating heat, to the image sensor wafer to thermally couple the heater and the image sensor wafer.. ... Omnivision Technologies Inc

06/08/17 / #20170163912

Global shutter correction

A pixel circuit includes a photodiode disposed in a semiconductor material to accumulate image charge in response to incident light directed into the photodiode, and a transfer transistor coupled to the photodiode. The circuit also includes a noise correction circuit coupled to receive a transfer control signal and the noise correction circuit is coupled to selectively enable or disable the transfer transistor from receiving the transfer control signal. ... Omnivision Technologies Inc

06/08/17 / #20170162621

Light channels with multi-step etch

An image sensor includes a plurality of photodiodes disposed in a semiconductor layer, a first isolation layer, and a dielectric filler. The dielectric filler is disposed in a trench in the first isolation layer, and the first isolation layer is disposed between the semiconductor layer and the dielectric filler. ... Omnivision Technologies Inc

06/08/17 / #20170160534

Microscope attachment

A microscope attachment includes a lens apparatus with one or more lenses, a light source, and a sample holder. The sample holder is disposed between the lens apparatus and the light source and is positioned to transmit light from the light source through the sample holder and through the lens apparatus. ... Omnivision Technologies Inc

05/18/17 / #20170142360

Liquid crystal display and infrared image sensor on silicon

A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. ... Omnivision Technologies Inc

05/18/17 / #20170142356

Image sensor global shutter supply circuit with variable bandwidth

A pixel cell includes a photodiode to accumulate image charge. A global shutter transistor is coupled to the photodiode to reset the image charge in the photodiode in response to a global shutter control signal. ... Omnivision Technologies Inc

05/18/17 / #20170142355

Global shutter control signal generator with reduced driving requirements

A pixel cell includes a photodiode disposed in a semiconductor material to accumulate image charge in response to light. A global shutter transistor is disposed in the semiconductor material and is selectively resets the image charge in the photodiode in response to a global shutter control signal. ... Omnivision Technologies Inc

05/18/17 / #20170139086

Stacked-lens assembly and fabrication method for same

A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. ... Omnivision Technologies Inc

05/11/17 / #20170131554

Pupillary adjustable head mounted device

Embodiments of the present disclosure related to a head mounted display (hmd) that enable adjustment of lenses for a particular consumer. In some example embodiments, the hmd enables up to three-degrees of freedom of lens alignment with a consumer's pupils. ... Omnivision Technologies Inc

05/04/17 / #20170127003

Imaging systems including row-period compensators and associated methods

An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. ... Omnivision Technologies Inc

05/04/17 / #20170125467

Chip-scale packaged image sensor packages with black masking and associated packaging methods

A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask.. . ... Omnivision Technologies Inc

05/04/17 / #20170124429

System and method for evaluating a classifier implemented within an image signal processor

A system for evaluating a classifier of an image signal processor (isp) includes (i) a microprocessor and (ii) memory storing training images, the microprocessor being capable of sending each training image to the isp. The system includes machine-readable instructions stored within the memory and executed by the microprocessor capable of: (i) selecting a subset of images based upon a divider position, (ii) controlling the isp to classify each image as belonging or not belonging to an object class, (iii) determining a positive-match count, (iv) determining an error count based upon the positive-match count and total number of training images belonging to the object class, (v) repeating, for other divider positions, steps of selecting, controlling, and determining to identify an optimal divider position and a minimum-error count; and (vi) determining the classifier's optimality by comparing the optimal divider position to a predetermined optimal divider position and a predetermined minimum-error count.. ... Omnivision Technologies Inc

05/04/17 / #20170123190

Wafer-level hybrid compound lens and method for fabricating same

A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. ... Omnivision Technologies Inc

04/27/17 / #20170115436

Multi-layer color filter for low color error and high snr

Embodiments are described of a color filter array including a plurality of tiled minimal repeating units. Each minimal repeating unit includes an invisible-wavelength filter layer including a plurality of filters and a visible-wavelength filter layer positioned on the invisible-wavelength filter layer and having a plurality of filters such that each filter from the visible-wavelength layer is optically coupled to a corresponding filter in the invisible-wavelength layer.. ... Omnivision Technologies Inc

04/20/17 / #20170111560

Notched-spacer camera module and method for fabricating same

A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. ... Omnivision Technologies Inc

04/20/17 / #20170110608

Quantum dot image sensor

A photodetector includes a first doped region disposed in a semiconductor material and a second doped region disposed in the semiconductor material. The second doped region is electrically coupled to the first doped region, and the second doped region is of an opposite majority charge carrier type as the first doped region. ... Omnivision Technologies Inc

04/20/17 / #20170109115

Multi-projector display box

A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. ... Omnivision Technologies Inc

04/06/17 / #20170097499

Near-infrared hybrid lens systems with wide field of view

A near-infrared hybrid lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first cast lens positioned closest to the scene and at least partly transmissive to near-infrared light, (b) a second cast lens positioned closest to the image plane and at least partly transmissive to near-infrared light, and (c) a wafer-level lens at least partly transmissive to near-infrared light and disposed between the first cast lens and the second cast lens, wherein the wafer-level lens has (i) a planar substrate with a first surface facing away from the image plane and a second surface facing the image plane, (ii) a first lens element disposed on the first surface, and (iii) a second lens element disposed on the second surface.. . ... Omnivision Technologies Inc

04/06/17 / #20170097497

Three-surface wide field-of-view lens system

A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substrate having a second planar surface facing away from the image plane, (ii) a third substrate bonded to the second substrate and having a third planar surface facing the image plane, (iii) a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and (iv) a third lens element bonded to the third planar surface and having a third lens surface facing the image plane.. . ... Omnivision Technologies Inc

04/06/17 / #20170097491

Two-surface narrow field-of-view compounds lens

A two-surface narrow field-of-view (fov) compound lens for producing an image of an object at an image plane of an imaging system includes a biplanar substrate between a plano-convex lens and a plano-concave lens having a common optical axis. The plano-convex lens has a first planar surface on a first side of the biplanar substrate and is formed of a material having a first abbe number. ... Omnivision Technologies Inc

03/02/17 / #20170062511

Dual-mode image sensor with a signal-separating color filter array, and method for same

A dual-mode image sensor with a signal-separating cfa includes a substrate including a plurality of photodiode regions and a plurality of tall spectral filters having a uniform first height and for transmitting a first electromagnetic wavelength range. Each of the tall spectral filters is disposed on the substrate and aligned with a respective photodiode region. ... Omnivision Technologies Inc

02/23/17 / #20170054931

Readout circuitry to mitigate column fixed pattern noise of an image sensor

Techniques and mechanisms to mitigate fixed pattern noise in image sensor data. In an embodiment, readout circuitry includes an adaptive analog-to-digital converter (adc) comprising a differential amplifier and a feedback path coupled across the differential amplifier, where the adc is to receive a ramp signal, a control signal associated with a transition rate of the ramp signal, and an analog signal generated by one or more pixels. ... Omnivision Technologies Inc

02/16/17 / #20170047370

Cmos image sensor with peninsular ground contracts and method of manufacturing the same

A complementary metal oxide semiconductor (cmos) image sensor with peninsular ground contacts includes (a) a substrate having a plurality of pixel units arranged in rows of pixel units and (b) a plurality of ground contacts for grounding the pixel units, wherein the ground contacts are formed in respective peninsular regions of the substrate within respective ones of the pixel units, and wherein each of the peninsular regions is only partly enclosed by a shallow trench isolation and the peninsular regions have alternating orientation along each of the rows of pixel units.. . ... Omnivision Technologies Inc

02/09/17 / #20170041562

Method and system to implement a stacked chip high dynamic range image sensor

Method of implementing stacked chip hdr algorithm in image sensor starts with pixel array capturing first frame with first exposure time and second frame with a second exposure time that is longer or shorter than the first exposure time. Pixel array is disposed in first semiconductor die and is partitioned into pixel sub-arrays. ... Omnivision Technologies Inc

02/09/17 / #20170041525

Image sensor with symmetric multi-pixel phase-difference detectors, and associated methods

An imaging system with on-chip phase-detection includes an image sensor with symmetric multi-pixel phase-difference detectors. Each symmetric multi-pixel phase-difference detector includes (a) a plurality of pixels forming an array and each having a respective color filter thereon, each color filter having a transmission spectrum and (b) a microlens at least partially above each of the plurality of pixels and having an optical axis intersecting the array. ... Omnivision Technologies Inc

02/09/17 / #20170036407

Optical spacer including controlled located aperture and method of manufacturing the same

A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold from the optical spacer.. ... Omnivision Technologies Inc

01/26/17 / #20170025468

Photosensitive capacitor pixel for image sensor

A method of fabricating a pixel array includes forming a transistor network along a frontside of a semiconductor substrate. A contact element is formed for every pixel in the pixel array that is electrically coupled to a transistor within the transistor network. ... Omnivision Technologies Inc

01/26/17 / #20170023614

Image sensor testing probe card

A method of increasing uniformity in light from a light source at a plurality of targets of the light includes locating a plurality of movable aperture elements between the light source and the targets. Each aperture element defines an aperture through which the light passes from the light source to an associated one of the plurality of targets associated with the aperture element along a longitudinal axis of the aperture element. ... Omnivision Technologies Inc

01/19/17 / #20170018583

Isolated global shutter pixel storage structure

An imaging system includes a pixel array of pixel cells with each one of the pixel cells including a photodiode disposed in a semiconductor material, a global shutter gate transistor, disposed in the semiconductor material and coupled to the photodiode, a storage transistor disposed in the semiconductor material, an optical isolation structure disposed in the semiconductor material to isolate a sidewall of the storage transistor from stray light and stray charge. The optical isolation structure also includes a deep trench isolation structure that is filled with tungsten and a p+ passivation formed over an interior sidewall of the deep trench optical isolation structure. ... Omnivision Technologies Inc

01/05/17 / #20170006266

Color filter array with reference pixel to reduce spectral crosstalk

A color filter array includes a plurality of tiled minimal repeating units, each minimal repeating unit comprising an m×n set of individual filters. Each minimal repeating unit includes a plurality of imaging filters including individual filters having at least first, second, and third photoresponses, and at least one reference filter having a reference photoresponse, wherein the reference filter is positioned among the imaging filters and wherein the reference photoresponse transmits substantially the same percentage of wavelengths that remain unfiltered by filters of a different photoresponse than the incident wavelength. ... Omnivision Technologies Inc

01/05/17 / #20170006207

High dynamic range imaging with reduced frame buffer

A system and method for high dynamic range (hdr) imaging includes writing a first, second, and third sub-frame to a memory at a first, second, and third readout time, respectively, the first, second, and third sub-frame being generated by a same first sub-array of the array of image pixels. Subsequent to the third readout time, the first, second, and third sub-frames are sent to an image signal processor. ... Omnivision Technologies Inc

01/05/17 / #20170005133

Fractal-edge thin film and method of manufacture

A method of manufacturing a fractal-edge thin film includes determining an area shape to be covered by the fractal-edge thin film. The method also includes generating a thin-film perimeter based upon the area shape, the thin-film perimeter having a fractal dimension exceeding one. ... Omnivision Technologies Inc








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