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Orbotech Ltd patents (2015 archive)


Recent patent applications related to Orbotech Ltd. Orbotech Ltd is listed as an Agent/Assignee. Note: Orbotech Ltd may have other listings under different names/spellings. We're not affiliated with Orbotech Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Orbotech Ltd-related inventors


12/31/15 / #20150382476

Two-step, direct-write laser metallization

A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. ... Orbotech Ltd

11/12/15 / #20150324968

Calibration of a direct-imaging system

Optical apparatus includes a mount, which holds a workpiece. An array of optical heads project respective patterns of radiation onto the workpiece. ... Orbotech Ltd

06/18/15 / #20150168749

System and method for direct imaging

A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.. . ... Orbotech Ltd

02/05/15 / #20150033557

System and method for producing a conductive path on a substrate

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.. . ... Orbotech Ltd








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