A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. ... Orthodyne Electronics Corporation
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. ... Orthodyne Electronics Corporation
A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. ... Orthodyne Electronics Corporation