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Orthodyne Electronics Corporation patents (2017 archive)

Recent patent applications related to Orthodyne Electronics Corporation. Orthodyne Electronics Corporation is listed as an Agent/Assignee. Note: Orthodyne Electronics Corporation may have other listings under different names/spellings. We're not affiliated with Orthodyne Electronics Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Orthodyne Electronics Corporation-related inventors

Wedge bonding tools, wedge bonding systems, and related methods

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. ... Orthodyne Electronics Corporation

Ribbon bonding tools, and methods of designing ribbon bonding tools

A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. ... Orthodyne Electronics Corporation

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Orthodyne Electronics Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Orthodyne Electronics Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by