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Osram Gmbh patents


Recent patent applications related to Osram Gmbh. Osram Gmbh is listed as an Agent/Assignee. Note: Osram Gmbh may have other listings under different names/spellings. We're not affiliated with Osram Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Osram Gmbh-related inventors


 new patent  Circuit support for an electronic circuit and method for manufacturing a circuit support of said type

Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. ... Osram Gmbh

 new patent  Organic light-emitting component and method for producing an organic light-emitting component

An organic light-emitting component may include: a substrate, a first electrode arranged over the substrate, at least one organic functional layer stack configured to emit radiation and arranged over the first electrode, at least one conductive current spreading structure which is arranged on the first electrode and faces the at least one organic functional layer stack, and a second electrode arranged over the at least one organic functional layer stack. The at least one conductive current spreading structure may comprise at least one metal, and may be covered with an inorganic passivation layer. ... Osram Gmbh

 new patent  Optoelectronic component and a method of producing an optoelectronic component

An optoelectronic component includes a boundary layer is arranged between a semiconductor body and a metallic layer in a lateral direction, adjoins the semiconductor body at least in places, covers an active layer laterally, and has a lower refractive index compared to the semiconductor body, a metallic layer is configured to prevent the electromagnetic radiation generated during operation of the component and passes through the boundary layer from impinging on a mold body, the boundary layer is formed from a radiation-transmitting dielectric material having a refractive index of 1 to 2, and a layer thickness of the boundary layer is at least 400 nm and selected such that an amplitude of an evanescent wave, which is obtained in the event of total internal reflection at an interface between the boundary layer and the semiconductor body, is reduced to less than 37% of its original value within the boundary layer.. . ... Osram Gmbh

 new patent  Optoelectronic lamp device and method of producing same

An optoelectronic lamp device includes an optoelectronic semiconductor component including a top side including a light-emitting face, and a housing embedding the semiconductor component and leaving free the light-emitting face, wherein a housing face is coated with a light-scattering dielectric resist layer that may scatter light incident on a face of the resist layer facing away from the housing face.. . ... Osram Gmbh

 new patent  Method for producing optoelectronic conversion semiconductor chips and composite of conversion semiconductor chips

A method for producing optoelectronic conversion semiconductor chips and a composite of conversion semiconductor chips are disclosed. In an embodiment the method includes growing a semiconductor layer sequence on a growth substrate, applying an electric contact on to a rear side of the semiconductor layer sequence facing away from the growth substrate, thinning the growth substrate, after thinning, cutting the growth substrate at least to the semiconductor layer sequence thereby forming a first intermediate space, applying a conversion layer on to the thinned growth substrate and singulating at least the thinned growth substrate and the semiconductor layer sequence.. ... Osram Gmbh

 new patent  Optoelectronic component comprising a conversion element, method of producing an optoelectronic component comprising a conversion element, and use of an optoelectronic component comprising a conversion element

A method of producing an optoelectronic component including a conversion element includes: a) providing a layer sequence having an active layer, wherein the active layer is configured to emit electromagnetic primary radiation; b) providing quantum dots, wherein the quantum dots are functionalized with an organic group and/or the quantum dots dissolved or dispersed in a first solvent and/or are present as a powder; c*) providing a mixture including a precursor of an inorganic matrix material and of a second solvent; d) mixing the mixture obtained in step c*) with the quantum dots of step b); e) drying the mixture; and f) sintering the mixture to form the conversion element.. . ... Osram Gmbh

 new patent  Optoelectronic semiconductor chip

In one embodiment, the optoelectronic semiconductor chip (1) comprises a first semiconductor region (21) of a first conductivity type and a second semiconductor region (23) of a second conductivity type. An active zone (22) configured for generating light is situated between these two semiconductor regions (21, 23). ... Osram Gmbh

 new patent  Optoelectronic semiconductor component

An optoelectronic semiconductor component is disclosed, comprising: a semiconductor body (1) having a semiconductor layer sequence (2) with a p-type semiconductor region (3), an n-type semiconductor region (5), and an active layer (4) arranged between the p-type semiconductor region (3) and the n-type semiconductor region (5); a support (10) having a plastic material and a first via (11) and a second via (12); a p-contact layer (7) and an n-contact layer (8), at least some regions of which are arranged between the support (10) and the semiconductor body (1), wherein the p-contact layer (7) connects the first via (11) to the p-type semiconductor region (3) and the n-contact layer (8, 8a) connects the second via (12) to the n-type semiconductor region (5); and an esd protection element (15) which is arranged between the support (10) and the semiconductor body (1), wherein the esd protection element (15) is electrically conductively connected to the first via (11) and to the second via (12), and wherein a forward direction of the esd protection element (15) is anti-parallel to a forward direction of the semiconductor layer sequence (2).. . ... Osram Gmbh

 new patent  Lighting module

The invention relates to a lighting module (1) comprising an assembly body (3) extending between a rear side (31) and a front side (30) opposite the rear side, and comprising a plurality of semiconductor components (2) provided for generating radiation, wherein: the assembly body has a plurality of recesses (35) on the rear side, in which the semiconductor components are arranged; the assembly body is permeable to the radiation generated in the semiconductor components, and said radiation passes out of the front side of the assembly body; a contact layer (5) is arranged on the rear side of the assembly body, to which the semiconductor components are connected in an electrically conductive manner via connecting lines; and a reflector layer (6) is arranged on the rear side of the assembly body, said reflector layer entirely covering at least the recesses.. . ... Osram Gmbh

 new patent  Transom light arrangement and method for producing a transom light arrangement

In various embodiments, a transom light arrangement may include a transom, which is arranged between a construction element and a transom light, a light source arrangement, which is mounted at least one of on or in the transom, with the light source arrangement or the transom defining a horizontal plane, and a screen structure. The light source arrangement and the screen structure are arranged relative to one another and are configured such that a spatial region above the horizontal plane is illuminated using the light source arrangement.. ... Osram Gmbh

 new patent  Composite material with photoluminescent material embedded in a transparent matrix

A composite material includes at least one photoluminescent material embedded as a light source in a transparent matrix, wherein a refractive index (np) of the at least one photoluminescent material and a refractive index (nm) of the matrix differ by at most ±0.2.. . ... Osram Gmbh

Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type

A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. ... Osram Gmbh

Method for producing an optoelectronic semiconductor device and optoelectronic semiconductor device

A method for producing an optoelectronic semiconductor device and an optoelectronic semiconductor device are disclosed. In an embodiment the method includes providing a semiconductor layer sequence including a light-emitting and/or light-absorbing active zone and a top face downstream of the active zone in a stack direction extending perpendicular to a main plane of extension of the semiconductor layer sequence, applying a layer stack onto the top face, wherein the layer stack includes an oxide layer containing indium, and an intermediate face downstream of the top face in the stack direction and applying a contact layer onto the intermediate face, wherein the contact layer includes indium tin oxide, and wherein the layer stack is, within the bounds of manufacturing tolerances, free of tin.. ... Osram Gmbh

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

The invention relates to a method for producing an optoelectronic semiconductor chip (1). A semiconductor layer sequence (3) is provided, comprising a first semiconductor layer (3a) and a second semiconductor layer (3b). ... Osram Gmbh

07/05/18 / #20180190610

Method for joining at least two components

The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: a) providing at least a first component (1) and a second component (2), b) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), c) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), d) heating at least the metal layer (4) to a first temperature (t1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and e) heating the arrangement to a second temperature (t2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.. . ... Osram Gmbh

07/05/18 / #20180187865

Lamp

A lamp is disclosed. In an embodiment, the lamp includes a first light source and a second light source embodied as a light-emitting reflector, with a reflective layer and an electroluminescent layer sequence. ... Osram Gmbh

07/05/18 / #20180187855

Lighting device, corresponding lamp and method

A lighting device, which may be employed e.g. As a retrofit bulb for vehicle lamps, includes a light radiation source, e.g. ... Osram Gmbh

07/05/18 / #20180187853

Lighting device, corresponding lamp and method

A lighting device, which may be employed e.g. As a retrofit bulb for vehicle lamps, includes a light radiation source, e.g. ... Osram Gmbh

06/28/18 / #20180184496

Circuit arrangement for operating light sources and sensor for connection to a circuit arrangement

In various embodiments, a circuit arrangement for operating light sources is provided. The circuit arrangement includes an input for inputting an input voltage, an output for outputting an output current, a first interface for controlling the circuit arrangement, and a second interface. ... Osram Gmbh

06/28/18 / #20180183010

Organic light-emitting component

An organic light-emitting component is disclosed. In an embodiment, the component includes an organic functional layer stack between two electrodes, wherein the organic functional layer stack comprises at least two organic light-emitting layers and at least one charge generation layer, and wherein at least one of the at least two organic light-emitting layers is part of the charge generation layer.. ... Osram Gmbh

06/28/18 / #20180182946

Arrangement

An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.. ... Osram Gmbh

06/28/18 / #20180182943

Component and method of producing a component

A component comprising a support and a semiconductor body arranged on the support, the support formed by a molded body and a metal layer. The metal layer has a first subregion and a second subregion laterally spaced apart by an intermediate space and thereby electrically separated. ... Osram Gmbh

06/28/18 / #20180182934

Light emitting unit

A light emitting unit includes a light emitting semiconductor chip and a wavelength converter for the light of the semiconductor chip. The wavelength converter has a substrate with a first surface. ... Osram Gmbh

06/28/18 / #20180182926

Component having improved coupling-out properties

A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.. . ... Osram Gmbh

06/28/18 / #20180182739

Light-emitting diode arrangement and method for the production thereof

According to the present disclosure, a light-emitting diode arrangement provides a substrate, first leds, which are arranged on the substrate, second leds, which are arranged on the substrate laterally adjacent to the first leds, at least one cover body, which covers the first leds, at least one dam, which is arranged on the substrate and which encloses the first leds and the second leds in the lateral direction, and a first potting material, which covers the second leds and is delimited in the lateral direction by the dam and the cover body. The cover body and/or the first potting material include(s) a first converter material for converting electromagnetic radiation.. ... Osram Gmbh

06/28/18 / #20180180701

Operating of a transmission deviceof a lighting device comprising an illumination device

The invention relates to a method for operating a transmission device of a lighting device comprising an illumination device, wherein the transmission device is arranged in or immediately on the illumination device and wirelessly emits a radio signal with identification signals that are specific to the transmission device, wherein the radio signal is emitted according to exactly one predetermined radio standard, wherein the radio signal contains the specific identification data at least in two data formats that are different from each other.. . ... Osram Gmbh

06/28/18 / #20180180271

Lighting device and corresponding method

A lighting device may include a channel-shaped elongate housing with a web portion and two side portions extending along the elongate housing sidewise of web portion, wherein each side portion includes, facing inwardly of the channel shape of elongate housing, a proximal groove extending sidewise of web portion, one or more electrically conductive lines extending along web portion internally of the channel shape of said elongate housing, and a light radiation source assembly. The light radiation source assembly includes a support board having a back surface facing web portion of elongate housing with respective electrically conductive lines in order to make electrical contact with said electrically conductive lines and a front surface facing outwardly of the channel shape of elongate housing, and at least one electrically-powered light radiation source, on said front surface, being in electrical contact with said electrically conductive lines.. ... Osram Gmbh

06/28/18 / #20180180238

Lighting device having a lighting unit

A lighting device provides a lighting unit for emitting useful light and a sensor. The unit includes a laser diode for emitting pump radiation and a phosphor element, which during operation is irradiated by the laser diode and thereby excited and serves for converting the pump radiation into conversion light, which conversion light at least proportionally forms the useful light. ... Osram Gmbh

06/21/18 / #20180177018

Assembly for operating an organic radiation-emitting component

An arrangement for operating an organic radiation-emitting component (d) is specified. The arrangement comprises a driver circuit (t) with at least two driver outputs (ta1, tan), a decoupling unit (e) with at least two inputs (ee1, een) and outputs (ea1, ean) corresponding to the inputs (ee1, een), the radiation-emitting component (d) with at least two electrodes (de1, den), and a contact sensor (s) with a sensor electrode (se1) which is at least partially formed by one of the electrodes (de1, den) of the radiation-emitting component (d). ... Osram Gmbh

06/21/18 / #20180175260

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one metallic surface, a contacted optoelectronic semiconductor chip configured to emit radiation and a protective layer arranged on the at least one metallic surface, wherein the protective layer comprises a protective material of at least one n-heterocyclic carbene, and wherein a covalent bond is formed between the protective material and the at least one metallic surface.. ... Osram Gmbh

06/21/18 / #20180175243

Method for producing a nitride semiconductor component, and a nitride semiconductor component

The invention relates to a method for producing a nitride semiconductor component (100), comprising the steps of: —providing a growth substrate (1) having a growth surface (10) formed from a planar area (11) with a plurality of three-dimensionally shaped surface structures (12) on said planar area (11), —growing a nitride-based semiconductor layer sequence (30) on the growth surface (10), growth beginning selectively on a growth area (13) of said growth substrate, and the growth area (13) being less than 45% of the growth surface (10). The invention also relates to a nitride semiconductor component (100) which can be produced according to said method.. ... Osram Gmbh

06/21/18 / #20180175237

Components comprising a light emitting semiconductor chip

A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.. . ... Osram Gmbh

06/21/18 / #20180172220

Illumination device having phosphor wheel

An illumination device is provided. The illumination device includes a rotatable phosphor wheel, which is at least regionally provided with phosphor for converting primary light into secondary light, a primary light generator configured to generate at least one useful primary light beam incident on the phosphor wheel, and at least one measuring device configured to measure a measured variable which can be influenced by the phosphor and to determine damage of the phosphor on the basis of measured data of the at least one measuring device.. ... Osram Gmbh

06/21/18 / #20180171508

Method of making a single crystal wavelength conversion element, single crystal wavelength conversion element, and light source containing same

There is herein described a method of making a single crystal wavelength conversion element from a polycrystalline wavelength conversion element, a single crystal wavelength conversion element, and a light source containing same. By making the single crystal wavelength conversion element from a polycrystalline wavelength conversion element, the method provides greater flexibility in creating single crystal wavelength conversion elements as compared to melt grown methods for forming single crystals. ... Osram Gmbh

06/14/18 / #20180168010

Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device

A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (z1, z2) and a plurality of column lines (s1, s2, . . ... Osram Gmbh

06/14/18 / #20180168009

Printed circuit board, corresponding lighting module, lighting system and method for implementing lighting modules

The printed circuit board includes metallic zones including: a first, second and third positive terminal, a first and second negative terminal, wherein the second negative terminal is connected to the first negative terminal, and electric contacts for the mounting of one or more leds and electric traces such that the leds are connected in series forming a led string. The printed circuit board comprises selection means implemented with electric traces and metallic contacts adapted to be short-circuited via links in order to permit all of the following connections: a connection of the led string between the first and third positive terminal, a connection of the led string between the first positive terminal and the first negative terminal, a connection of the led string between the second and third positive terminal, and a connection of the led string between the second positive terminal and the first negative terminal.. ... Osram Gmbh

06/14/18 / #20180166854

Light-emitting semiconductor device, light-emitting semiconductor component and method for producing a light-emitting semiconductor device

The invention relates to, inter alia, a light-emitting semiconductor component comprising the following: —a first mirror (102, 202, 302, 402, 502), —a first conductive layer (103, 203, 303, 403, 503), —a light-emitting layer sequence (104, 204, 304, 404, 504) on a first conductive layer face facing away from the first mirror, and —a second conductive layer (105, 205, 305, 405, 505) on a light-emitting layer sequence face facing away from the first conductive layer, wherein —the first mirror, the first conductive layer, the light-emitting layer sequence, and the second conductive layer are based on a iii-nitride compound semiconductor material, —the first mirror is electrically conductive, and —the first mirror is a periodic sequence of homoepitaxial materials with varying refractive indices.. . ... Osram Gmbh

06/14/18 / #20180166614

Method of producing a converter component

A method of producing a converter component for an optoelectronic lighting apparatus includes forming a layer stack having an injection-molded or extruded conversion layer and an injection-molded or extruded diffuser layer. A converter component for an optoelectronic lighting apparatus includes a layer stack including an injection-molded or extruded conversion layer, and an injection-molded or extruded diffuser layer.. ... Osram Gmbh

06/14/18 / #20180166611

Method of producing a housing cover, method of producing an optoelectronic component, and optoelectronic component

A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.. . ... Osram Gmbh

06/14/18 / #20180166499

Display device having a plurality of pixels that can be operated separately from one another

A display device having a plurality of pixels that can be operated separately from one another is disclosed. In an embodiment the display includes a semiconductor layer sequence and a first contact structure for contacting a first semiconductor layer and a second contact structure for contacting a second semiconductor layer, wherein the first contact structure has first contacts configured to be operated separately from one another, each first contact extending laterally and uninterrupted along the first semiconductor layer and each first contact delimits a pixel in a lateral manner with its contour, wherein the semiconductor layer sequence and the first contact structure have at least one recess laterally bordering a respective pixel, which recess extends through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, and wherein the second contact structure has second contacts extending through the at least one recess.. ... Osram Gmbh

06/14/18 / #20180166428

Light source comprising a number of semi-conductor components

A light source includes a plurality of semiconductor components, wherein a semiconductor component includes a plurality of light-emitting diodes, the diodes are arranged in a predefined grid in at least one column in or on the semiconductor component, and a control circuit that drives the individual diodes is arranged on the semiconductor component.. . ... Osram Gmbh

06/14/18 / #20180164559

Optoelectronic component having a radiation source

An optoelectronic component includes at least one radiation source that produced electromagnetic radiation, a reflector, and a lens, wherein the reflector deviates a part of the radiation of the radiation source into a desired beam direction, the lens deviates at least a part of the radiation of the radiation source into the desired beam direction, the lens has a first side face which is conical at least in some areas, the first side face faces toward the radiation source, and the reflector has a concave first section and a second convex section.. . ... Osram Gmbh

06/14/18 / #20180163955

A support structure for lighting devices, corresponding lighting device and method

A support structure for electrically-powered lighting devices (e.g. Led modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. ... Osram Gmbh

06/07/18 / #20180159009

Method for producing an electronic component with a carrier element and electronic component with a carrier element

The invention relates to a method for producing an electronic component with a carrier element (100), with the steps: producing the carrier element (100), having the steps a) providing a first metal layer (1) comprising a first metal material, wherein the first metal layer (1) has a first and a second main surface (10, 11) which face away from one another, b) applying a second metal layer (2) comprising a second metal material on at least one of the main surfaces (10, 11), c) converting a part of the second metal layer (2) into a dielectric ceramic layer (3), wherein the second metal material forms a component of the ceramic layer (3), and the ceramic layer (3) forms a surface (30) which faces away from the first metal layer (1) and is above the second metal layer (2);—arranging at least one electronic semiconductor chip (21) on the carrier element (100). The invention further relates to an electronic component with a carrier element (100).. ... Osram Gmbh

06/07/18 / #20180158993

Method for producing at least one optoelectronic semiconductor component and optoelectronic semiconductor component

A method for producing at least one optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment, the method includes providing a semiconductor layer sequence comprising a first semiconductor material configured to emit a first radiation and applying a conversion element at least partially on the semiconductor layer sequence via a cold method, wherein the conversion element comprises a second semiconductor material, and wherein the second semiconductor material is configured to convert the first radiation into a second radiation.. ... Osram Gmbh

06/07/18 / #20180156436

Leadframe, luminaire, group of luminaires and method for producing a luminaire

In various embodiments, a leadframe is provided. The leadframe may include connection strips arranged alongside one another, said connection strips being connected via one or a plurality of holding webs. ... Osram Gmbh

06/07/18 / #20180156431

Electric driver and illumination device

The utility model relates to an electric driver and an illumination device. The electric driver comprises: a carrier; a first electrical component and a second electrical component, wherein the first electrical component and the second electrical component are provided on the carrier; and a heat insulation structure, wherein the second electrical component comprises a first heat insulator surrounding the second electrical component and a second heat insulator surrounding the first heat insulator, wherein a gap is provided between the first heat insulator and a second heat insulator. ... Osram Gmbh

06/07/18 / #20180156409

Illumination device including semiconductor primary light sources and at least one luminophore element

An illumination device includes multiple semiconductor primary light sources for emitting respective primary light beams, at least one movable mirror, which can be illuminated by means of the primary light beams, and which can assume at least two angle positions, and a luminophore element, which can be illuminated by means of primary light beams deflected by the at least one mirror. Light spots of the individual primary light beams are locally differentiable on the at least one luminophore element, an overall light spot composed of the light spots of the individual primary light beams is locally differentiable on the at least one luminophore element depending on the angle position of the at least one movable mirror, and at least one beam property of at least one primary light beam incident on the at least one luminophore element is variable during operation of the illumination device.. ... Osram Gmbh

06/07/18 / #20180156406

Primary optical unit, secondary optical unit, module, arrangement, vehicle headlight, and headlight system

In various embodiments, an optical unit for a radiation source matrix is provided. The optical unit may include a plurality of coupling surfaces, which are arranged in at least one line, and at least one decoupling surface. ... Osram Gmbh

05/31/18 / #20180153008

Electronic converter, and related method of operating an electronic converter

An electronic converter includes two input terminals for receiving an ac voltage, two output terminals for providing a regulated voltage or current, a rectifier circuit and a boost converter. The boost converter receives at input, via positive and negative input terminals, the dc voltage generated via the rectifier circuit, and provides at output, via positive and negative output terminals, the regulated voltage or current. ... Osram Gmbh

05/31/18 / #20180152002

Semiconductor laser diode and method for producing a semiconductor laser diode

A semiconductor laser diode and a method for manufacturing a semiconductor laser diode are disclosed. In an embodiment, the semiconductor laser diode includes a semiconductor layer sequence having an active zone, wherein the semiconductor layer sequence has a cylindrical shape, wherein a cylinder axis of the semiconductor layer sequence is perpendicular to a layer plane of the semiconductor layer sequence, and wherein the semiconductor laser diode is configured to emit radiation perpendicularly to the cylinder axis of the semiconductor layer sequence.. ... Osram Gmbh

05/31/18 / #20180151833

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. ... Osram Gmbh

05/31/18 / #20180151787

Method of producing an optoelectronic component and optoelectronic component

A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact by the contacts and the potting material.. . ... Osram Gmbh

05/31/18 / #20180151777

Method for producing an optoelectronic device with a contact area of accurately and reproducibly defined size

An optoelectronic device is disclosed. In an embodiment the device includes a semiconductor crystal with a surface having a first lateral region, a second lateral region and a third lateral region, a contact area arranged on the surface in the first lateral region, the contact area comprising a first metal and a first layer including a dielectric arranged on the surface in the third lateral region. ... Osram Gmbh

05/31/18 / #20180151548

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a semiconductor chip subdivided into a plurality of pixels, the pixels being arranged next to one another in a lateral direction and being configured to be activated individually and independently and a metallic connecting element having an upper side and an underside, the connecting element including a contiguous metallic connecting layer, which is completely passed through by a plurality of first metallic through-connections arranged next to one another in the lateral direction, wherein the first through-connections are electrically insulated and spaced from the connecting layer by insulating regions, wherein each first through-connection is unambiguously assigned to one pixel, is electrically-conductively connected to this pixel and forms a first electrical contact to this pixel, and wherein the semiconductor chip is connected by the connecting element to a carrier.. ... Osram Gmbh

05/31/18 / #20180148644

Phosphor

A phosphor is disclosed. In an embodiment the phosphor includes an inorganic compound having at least one activator e and n and/or o in its empirical formula, wherein e is selected from the group consisting of mn, cr, ni, ce, pr, nd, sm, eu, tb, dy, ho, er, yb, tm, li, na, k, rb, cs and combinations thereof, and wherein the inorganic compound crystallizes in a crystal structure with the same atomic sequence as in k2zn6o7.. ... Osram Gmbh

05/24/18 / #20180146534

Operating a ballast for a gas discharge lamp

A gas discharge lamp includes at least two electrodes arranged in a manner spaced apart with a spacing in a discharge vessel filled with gas. A method of operating a ballast includes applying electrical energy to the electrodes. ... Osram Gmbh

05/24/18 / #20180145274

Organic emitter layer, organic light-emitting diode and use of heavy atoms in an organic emitter layer of an organic light-emitting diode

The invention relates to an organic emitter layer (100) having organic emitter molecules (1), each of which has at least one excited triplet state (se1) and at least one excited singlet state (te1). The emitter layer (100) comprises an organic matrix material (10) with first matrix molecules (2), the first matrix molecules (2) having at least one excited triplet state (ta1) and at least one excited singlet state (sa1). ... Osram Gmbh

05/24/18 / #20180145235

Optoelectronic semiconductor component, optoelectronic arrangement and method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor component comprises an optoelectronic semiconductor chip (c1) having an electrically conductive substrate (t), an active part (at) containing epitaxially grown layers, and an intermediate layer (zs) which is arranged between the substrate (t) and the active part (at) and contains a solder material. The optoelectronic semiconductor component further comprises an electrical connection point, which at least partially covers an underside of the substrate (t), wherein the electrical connection point comprises a first contact layer (ks1) on a side facing the substrate (t), and the first contact layer (ks1) contains aluminium or consists of aluminium.. ... Osram Gmbh

05/24/18 / #20180145234

Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.. . ... Osram Gmbh

05/24/18 / #20180145230

Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.. ... Osram Gmbh

05/24/18 / #20180145225

Optoelectronic semiconductor chip and optoelectronic module

An optoelectronic semiconductor chip includes a carrier and a semiconductor body arranged on the carrier with a semiconductor layer sequence, wherein the semiconductor layer sequence includes an active region arranged between a first semiconductor layer and a second semiconductor layer and generates or receives electromagnetic radiation, the first semiconductor layer connects to a first contact in an electrically-conductive manner, the first contact is formed on a rear side of the carrier facing away from the semiconductor body, the second semiconductor layer connects to both a second contact and a third contact in an electrically-conductive manner, and the second contact is formed on the front side of the carrier facing towards the semiconductor body and the third contact on the rear side of the carrier facing away from the semiconductor body.. . ... Osram Gmbh

05/24/18 / #20180145211

Optoelectronic arrangement and depth measuring system

An optoelectronic arrangement that produces a light pattern includes a light-emitting diode chip configured to emit electromagnetic radiation on its upper side and forming a first two-dimensional pattern on the upper side of the light-emitting diode chip, and an optically imaging element configured to project electromagnetic radiation emitted by the light-emitting diode chip into an environment of the optoelectronic arrangement.. . ... Osram Gmbh

05/24/18 / #20180144933

Method for producing a nitride compound semiconductor device

A method for procuring a nitride compound semiconductor device is disclosed. In an embodiment the method includes growing a first nitride compound semiconductor layer onto a growth substrate, depositing a masking layer, growing a second nitride compound semiconductor layer onto the masking layer, growing a third nitride compound semiconductor layer onto the second nitride compound semiconductor layer such that the third nitride compound semiconductor layer has non-planar structures and growing a fourth nitride compound semiconductor layer onto the non-planar structures such that the fourth nitride compound semiconductor layer has an essentially planar surface. ... Osram Gmbh

05/24/18 / #20180143414

Method of producing a lens for an optoelectronic lighting device

A method of producing a lens for an optoelectronic lighting device, wherein the optoelectronic lighting device includes an optoelectronic semiconductor component having a light-emitting surface, including applying a curable lens material to the light-emitting surface, and curing the lens material to form a lens from a cured lens material, wherein after the application and before or during the curing, the light-emitting surface is arranged into a position in which a normal vector of the light-emitting surface oriented in the direction of the applied lens material and a normal force of a weight acting on the light-emitting surface are parallel to one another so that the lens material at least partially cures in the position.. . ... Osram Gmbh

05/24/18 / #20180142861

Automotive led module with heat sink and fan

Lamp module cooling system 10 contains vehicle solid-state light source 12 coupled to an extruded first heat sink 2 and an extruded second heat sink 20 in thermal communication with one another and with fluid flow directed from fan air outlet 42 of fan 40 over respective heat dissipation first and second ribs 8, 28 to direct warmed air through existing apertures 115 in headlamp bezel 110 aligned with headlamp optics 130 to defog or de-ice headlamp cover 100. Housing cover 30 and cover 32 define air flow path 50, 52, 54 improving warm air guidance and efficient spatial packaging of lightweight lamp module cooling system 10.. ... Osram Gmbh

05/17/18 / #20180138700

Supplying an electrical load with electrical energy from a voltage source

The invention relates to a method for supplying an electrical load with electrical energy from a voltage source, in which an electrical charge storage for storing electrical charge is supplied with a preset electrical current by means of a constant current circuit connected to a voltage source, wherein a regulated electrical potential is provided for the load by means of a linear regulator circuit connected to the charge storage, wherein the charge storage is supplied with an electrical bypass current by means of a bypass circuit in parallel with the current of the constant current circuit, wherein the bypass circuit is controlled by means of a control signal of a control unit, wherein an electrical charge storage voltage at the charge storage is captured and the control signal is provided depending on the captured charge storage voltage.. . ... Osram Gmbh

05/17/18 / #20180138156

Clips defining electrical pathway on a flexible sheet

A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.. . ... Osram Gmbh

05/10/18 / #20180130925

Optoelectronic semiconductor device, method of producing an electrical contact and method of producing a semiconductor device

An optoelectronic semiconductor device includes a semiconductor body having a semiconductor region and an active region, wherein the semiconductor region has a covering layer forming a radiation passage surface of the semiconductor body on a side facing away from the active region, the semiconductor region has a current-spreading layer arranged between the covering layer and the active region; the semiconductor device has a contact for the electrical contacting of the semiconductor region; the contact adjoins the current-spreading layer in a terminal area; the contact adjoins the covering layer in a barrier region; and the barrier region runs parallel to the active region and is arranged closer to the active region than the radiation passage surface.. . ... Osram Gmbh

05/10/18 / #20180128474

A lighting device and corresponding method

According to the present disclosure, a lighting device is provided with a support member with a fork-like shape with two prongs carrying mutually facing electrically powered light radiation sources, and an annular heat sink member fitted onto the prongs and extending around the light radiation sources.. . ... Osram Gmbh

05/03/18 / #20180123007

Radiation-emitting semiconductor component and production method of a plurality of semiconductor components

A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. ... Osram Gmbh

05/03/18 / #20180122997

Method of producing optoelectronic components and surface-mounted optoelectronic component

A method of producing optoelectronic components includes a) providing a carrier and optoelectronic semiconductor chips including contact elements arranged on a contact side of the semiconductor chip; b) applying the semiconductor chips laterally next to one another on to the carrier, wherein the contact sides face the carrier during application; c) applying an electrically-conductive layer at least on to subregions of the sides of the semiconductor chip not covered by the carrier; d) applying a protective layer at least on to subregions of side surfaces of the semiconductor chips running transversely to the contact surface; e) electrophoretically depositing a converter layer on to the electrically-conductive layer, wherein the converter layer is configured to convert at least part of radiation emitted by the semiconductor chip into radiation of a different wavelength range; and f) removing the electrically-conductive layer from regions between the converter layer and the semiconductor chips.. . ... Osram Gmbh

05/03/18 / #20180122990

Device and method for producing a device

A device and a method for producing a device are disclosed. In an embodiment the device includes a carrier and a semiconductor body arranged in a vertical direction on the carrier. ... Osram Gmbh

05/03/18 / #20180122493

Circuit assembly for time-discretizing an analog electrical signal

There is provided a circuit assembly for time-discretizing an analog electrical signal, including an input terminal supplying the analog electrical signal, an output terminal providing a time-discrete signal depending on the supplied analog electrical signal and a sample and hold circuit, which comprises a capacitor connected to the output terminal, an electronic switching unit connected between the input terminal and the output terminal and a control unit controlling the switching unit, wherein the switching unit provides an off-state due to an off-signal of the control unit and an on-state due to an on-signal of the control unit, wherein the switching unit provides an electrical resistance in the on-state, which cooperates with the capacitor and comprises a preset resistance value, such that the sample and hold circuit provides a low-pass with preset cut-off frequency. There is further provided a detection device and lighting device with such a circuit assembly.. ... Osram Gmbh

05/03/18 / #20180120157

Optoelectronic arrangement

An optoelectronic arrangement includes an optoelectronic semiconductor chip, a wavelength-converting element and a detector component, wherein the optoelectronic arrangement is configured to emit light with a first peak wavelength and to emit light with a second peak wavelength, the first peak wavelength is in the visible spectral range and the second peak wavelength is in the non-visible spectral range or the first peak wavelength is in the non-visible spectral range and the second peak wavelength is in the visible spectral range, and the optoelectronic arrangement emits the light whose peak wavelength is in the non-visible spectral range into a target area, and the detector component is configured to detect light backscattered from the target area and the peak wavelength of which is in the non-visible spectral range.. . ... Osram Gmbh

05/03/18 / #20180119929

Concrete casting system and a method for providing a lighting system in a building

According to the present disclosure, a concrete casting system including a large number of individual concrete casting boxes is provided. The concrete casting system has a grid-like structure in which the individual concrete casting boxes are arranged at the intersection points of the grid-like structure. ... Osram Gmbh

05/03/18 / #20180119902

Lighting devices including formed flexible light engines

Lighting devices, and methods of manufacturing the same, are provided. A lighting device includes a cover through which emitted light passes and a formed flexible light engine. ... Osram Gmbh

05/03/18 / #20180119897

Wavelength conversion of primary light by means of a conversion body

Wavelength conversion of primary light by means of a conversion body, a conversion device and an illumination apparatus is described herein. In some aspects, a conversion body may include a main body containing a wavelength-converting phosphor. ... Osram Gmbh

05/03/18 / #20180117706

Method for dividing a composite into semiconductor chips, and semiconductor chip

The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. ... Osram Gmbh

04/19/18 / #20180108849

Organic electronic component with dopant, use of a dopant and method for the production of the dopant

An organic electronic component with a dopant, a method for using a dopant and a method for producing a dopant are disclosed. In an embodiment the component includes a substrate and a first electrode arranged on the substrate. ... Osram Gmbh

04/19/18 / #20180108811

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer, wherein the p-doped semiconductor layer is electrically contacted by a p-type connection contact, wherein a first trench extending at least partially into the p-doped semiconductor layer is arranged below the p-type connection contact, wherein an electrically insulating first blocking element arranged at least partially below the p-type connection contact and at least partially within the trench is arranged at least between the n-doped semiconductor layer and the p-type connection contact, and wherein the electrically insulating first blocking element is configured to prevent a direct current flow between the p-type connection contact and the p-doped and n-doped semiconductor layers and the active layer.. ... Osram Gmbh

04/19/18 / #20180108695

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor component (100) comprising the following —an optoelectronic semiconductor chip (2), the lateral surfaces (2c) and lower face (2b) of which are at least partly covered by a molded body (3) that is electrically conductive and is designed to electrically contact the optoelectronic semiconductor chip (2), —at least one via (6) which comprises an electrically conductive material and is laterally spaced from the semiconductor chip (2), said via (6) completely passing through the molded body (3), wherein the via (6) extends from an upper face (3a) of the molded body (3) to a lower face (3b) of the molded body (3), —at least one insulating element (9) which is arranged within the molded body (3) between the via (6) and the semiconductor chip (2) and extends from the upper face (3a) of the molded body (3) to the lower face (3b) of the molded body (3), and —an electrically conductive connection (7) which is connected to the semiconductor chip (2) and the via (6) in an electrically conductive manner.. . ... Osram Gmbh

04/19/18 / #20180106436

Method for producing an optoelectronic device, and an optoelectronic device produced by the method

In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. ... Osram Gmbh

04/19/18 / #20180103857

Sensor for sensing a biometric function

A sensor that senses a biometric function includes at least one transmitter configured to transmit electromagnetic radiation in an emission direction, including at least one receiver configured to receive electromagnetic radiation in a receiving direction, wherein the transmitter and the receiver are configured such that the emission direction of the transmitter is inclined away from the receiving direction of the receiver by a defined angle, wherein the angle is 1° to 60°.. . ... Osram Gmbh

04/12/18 / #20180102466

Optoelectronic semiconductor chip, optoelectronic semiconductor component and method for producing an optoelectronic semiconductor chip

An optoelectronic semiconductor chip, an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment the chip includes a main body including a carrier having a top, a bottom opposite the top and side faces connecting the bottom with the top and a semiconductor layer sequence arranged on the top of the carrier, wherein the semiconductor layer sequence is configured to emit or absorb electromagnetic radiation and two contact faces arranged on the semiconductor layer sequence. ... Osram Gmbh

04/12/18 / #20180102348

Optoelectronic component and method of producing an optoelectronic component

An optoelectronic component includes a carrier, wherein a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are arranged above a top side of the carrier, the optoelectronic semiconductor chips each include a top side, an underside situated opposite the top side, and side faces extending between the top side and the underside, the undersides of the optoelectronic semiconductor chips face the top side of the carrier, a first potting material is arranged above the top side of the carrier, the first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, and a second potting material is arranged above the top side of the carrier, and the second potting material covering the first potting material.. . ... Osram Gmbh

04/12/18 / #20180102323

Arrangement for spatially limiting a reservoir for a marker material

An arrangement includes a confining layer, a metallization layer and a semiconductor component, wherein the metallization layer is arranged on the semiconductor component, and the confining layer is arranged on the metallization layer, the confining layer spatially establishes a reservoir for the marker material at least partially in a defined manner, the confining layer and the metallization layer include an identical material, and the marker material is arranged in the reservoir of the arrangement.. . ... Osram Gmbh

04/12/18 / #20180101016

Optisch wirksames element, verfahren zur herstellung eines optisch wirksamen elements und optoelektronisches bauelement

An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.. ... Osram Gmbh

04/12/18 / #20180100054

Optoelectronic device with a mixture having a silicone and a fluoro-organic additive

An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. ... Osram Gmbh

04/05/18 / #20180098395

Active damping circuit

An active damping circuit is disclosed, which includes a peak current limiter, a drain source voltage limiter, a turn-on driver, a resistor shunt circuit, and a peak current sensor. The peak current sensor detects a rising edge of an input voltage from a phase cut dimmer by detecting a higher peak current. ... Osram Gmbh

04/05/18 / #20180097335

Optoelectronic lamp device

An optoelectronic lamp device, including a carrier having a planar mounting face, at least one laser diode that emits laser radiation, wherein the laser diode has a fast axis and a slow axis, the laser diode is arranged on the mounting face such that the fast axis is formed extending parallel to the mounting face, a first collimator is provided for collimating laser radiation polarized in the direction of the fast axis, and a second collimator is provided for collimating laser radiation polarized in the direction of the slow axis, wherein, in the beam path of the laser radiation emitted by the laser diode, the first collimator is arranged proximally and the second collimator is arranged distally relative to the laser diode so that the laser radiation polarized in the direction of the fast axis can be collimated first, and only then can the laser radiation polarized in the direction of the slow axis be collimated.. . ... Osram Gmbh

04/05/18 / #20180097156

Optoelectronic lighting device and method for the production of an optoelectronic lighting device

An optoelectronic lighting device and a method for manufacturing an optoelectronic lighting device are disclosed. In an embodiment the device includes a carrier and a light-emitting diode arranged on the carrier having a light-emitting surface. ... Osram Gmbh

04/05/18 / #20180097154

Led emitter and method for manufacturing the same

In various embodiments, a light emitting component is provided. The light emitting component includes a plurality of light emitting semiconductor chips. ... Osram Gmbh

04/05/18 / #20180097146

Radiation-emitting semiconductor device

The invention describes a radiation-emitting semiconductor component (100) having a first semiconductor layer sequence (10) which is designed to generate radiation of a first wavelength, a second semiconductor layer sequence (20), a first electrode area (1) and a second electrode area (2). It is provided that the second semiconductor layer sequence (20) has a quantum pot structure (21) with a quantum layer structure (22) and a barrier layer structure (23) and is designed to generate incoherent radiation of a second wavelength by means of absorption of the radiation of the first wavelength, and an electric field can be generated in the second semiconductor layer sequence (20) by the first electrode area (1) and the second electrode area (2).. ... Osram Gmbh

04/05/18 / #20180096861

Method of machining a lead frame, and lead frame

A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.. . ... Osram Gmbh

04/05/18 / #20180094781

Illumination unit including leds

An illumination apparatus for emitting light is provided with a planar substrate, a conductor track structure on the substrate, and leds assembled on the substrate and connected to the conductor track structure in an electrically conductive manner. Portions of the substrate are partly separated from the remaining substrate by a separating joint that passes through the substrate in the thickness direction of the latter but is open in the direction of longitudinal extent of the latter, i.e. ... Osram Gmbh

03/29/18 / #20180090908

Arrangement having a substrate and a semiconductor laser

An arrangement having a substrate and a semiconductor laser and a method for manufacturing such an arrangement are disclosed. In an embodiment, the arrangement includes a substrate and a semiconductor laser, wherein the substrate has a top, side areas and a bottom, wherein at least one first recess is provided at the top, wherein the semiconductor laser is arranged on the top of the substrate such that a region of the side area of the semiconductor laser via which the electromagnetic radiation is emitted is arranged above the first recess.. ... Osram Gmbh

03/29/18 / #20180090652

Optoelectronic device array and method for producing a multiplicity of optoelectronic device arrays

The invention relates to an optoelectronic component array (100) with a plurality of adjacent optoelectronic semiconductor components (60) and a covering body (81). According to the invention—each of the optoelectronic semiconductor components (60) has a ceramic support element (19) and a semiconductor chip (50) which is arranged on an upper face of the ceramic support element and which comprises a semiconductor element (54) designed to generate and/or receive radiation—the covering body (81) surrounds each of the ceramic support elements (19) of the optoelectronic semiconductor components in some regions at least in a lateral direction and connects adjacent ceramic support elements (19) together, and—the lower face of each of the ceramic support elements (19) is electrically insulated from the semiconductor chip (50).. ... Osram Gmbh

03/29/18 / #20180090540

Method for producing a light-emitting diode display and light-emitting diode display

In at least one embodiment, the method is designed for producing a light-emitting diode display (1). The method comprises the following steps: •a) providing a growth substrate (2); •b) applying a buffer layer (4) directly or indirectly onto a substrate surface (20); •c) producing a plurality of separate growth points (45) on or at the buffer layer (4); •d) producing individual radiation-active islands (5), originating from the growth points (45), wherein the islands (5) each comprise an inorganic semiconductor layer sequence (50) with at least one active zone (55) and have a mean diameter, when viewed from above onto the substrate surface (20), between 50 nm and 20 μm inclusive; and •e) connecting the islands (5) to transistors (6) for electrically controlling the islands (5).. ... Osram Gmbh

03/29/18 / #20180088215

Measuring system, use of at least one individually operable led lighting unit as a sender unit in a measuring system, method for operating a measuring system and lighting source having a measuring system

Provided is a measuring system (1), which comprises a sender unit (10) with at least one individually operable led lighting unit (12) with a luminous area which has a characteristic longitudinal extent (107) of less than or equal to 100 μm and/or a surface area of less than or equal to 104 μm2, wherein the led lighting unit (12) is configured to emit at least one light pulse as a sender signal (11) during operation, and comprises the one receiver unit (20) with at least one detector unit (22) for receiving a return signal (21), which comprises at least a part of the sender signal (11) reflected by an external object. Furthermore, use of at least one individually operable led lighting unit as a sender unit in a measuring system, a method for operating a measuring system and a lighting source having a measuring system are provided.. ... Osram Gmbh

03/29/18 / #20180088207

Tracking system and method for tracking a carrier of a mobile communication unit

A tracking system provides light source(s), a mobile communication unit and light sensor(s) with cameras, and a central control unit at least coupled to the sensor(s). The communication unit receives with its camera an identification information item broadcast by the light source(s) and broadcasts an activation signal, including data correlated with the received item, to the control unit. ... Osram Gmbh

03/29/18 / #20180087743

Luminaire and arrangement with a plurality of luminaires

A luminaire includes a surface light source that emits light with a plane, effective emission surface e, from which the light generated in the surface light source is radiated, a reflector configured to suppress glare of the surface light source for emission angles above a glare angle a, with 40°≦a≦80°, and a plane, effective radiation surface f, from which light emitted by the surface light source emerges from the luminaire, wherein the emission surface is surrounded on all sides by the reflector and the reflector, starting from the emission surface, extends towards the radiation surface, the reflector, in a cross-sectional view perpendicular to the emission surface, is formed concave on average so that a width b of the reflector in a direction away from the emission surface is described by a function f (b) and the first derivative f′ (b) thereof increases either strictly monotonically or as an alternative monotonically as well as strictly monotonically in some places in the direction away from the emission surface, it applies with a tolerance of 5% at most: f=e/sin2(a) with e≧1 cm2, on at least one intersection line parallel to and in the emission surface, it applies for a height h of the reflector in the direction perpendicular to the emission surface with a tolerance of 10% at most: h=tan(90°−a) l, and l is a length of the intersection line from an edge of the emission surface facing away from the reflector to the edge of the facing radiation surface, in a plan view.. . ... Osram Gmbh

03/29/18 / #20180087146

Method for producing a coating and optoelectronic semiconductor component having a coating

What is specified is a method for producing a coating comprising the following steps: —providing a material source having a top surface and a main coating direction, —providing a substrate holder having a top surface, —providing at least one base layer, having a coating surface remote from the substrate holder, on the top surface of the substrate, —attaching the substrate holder to a rotating arm, which has a length along a main direction of extent of the rotating arm, —setting the length of the rotating arm in such a manner that a normal angle (φ) throughout the method is at least 30° and at most 75°, —applying at least one coating to that side of the base layer which has the coating surface by means of the material source, wherein—during the coating process with the coating, the substrate holder is rotated about a substrate axis of rotation running along the main direction of extent of the rotating arm.. . ... Osram Gmbh

03/22/18 / #20180083415

Laser diode

A laser diode has a layer arrangement including a first layer structure extending along a z axis in a longitudinal direction, along an x axis in a transverse direction and along a y axis in a height direction, and a second and third layer structure arranged along the z axis on opposite longitudinal sides of the first layer structure and adjoining the first layer structure, wherein the active zone of the first layer structure is arranged offset in height relative to the active zones of the second and third layer structures, and an intermediate layer is arranged laterally with respect to the first layer structure in the second and third layer structures, the intermediate layer configured as an electrically blocking layer that hinders or prevents a current flow, and the intermediate layer being arranged between the active zone and an n contact.. . ... Osram Gmbh

03/22/18 / #20180083222

Optoelectronic component and method for producing an optoelectronic component

According to the present disclosure, a method for producing an optoelectronic component is provided. The method includes forming an optically functional layer structure in accordance with at least one part of a geometric network of a body, and bending the part of the geometric network in the at least one desired bending region, such that at least one part of the body is formed. ... Osram Gmbh

03/22/18 / #20180083160

Component having a multiple quantum well structure

The invention relates to a component (10) having a semiconductor layer sequence, which has a p-conducting semiconductor layer (1), an n-conducting semiconductor layer (2), and an active zone (3) arranged between the p-conducting semiconductor layer and the n-conducting semiconductor layer, wherein the active zone has a multiple quantum well structure, which, from the p-conducting semiconductor layer to the n-conducting semiconductor layer, has a plurality of p-side barrier layers (32p) having intermediate quantum well layers (31) and a plurality of n-side barrier layers (32n) having intermediate quantum layers (31). Recesses (4) having flanks are formed in the semiconductor layer sequence on the part of the p-conducting semiconductor layer, wherein the quantum well layers and/or the n- and p-side barrier layers extend in a manner conforming to the flanks of the recesses at least in regions. ... Osram Gmbh

03/22/18 / #20180083063

Optoelectronic semiconductor component

An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.. ... Osram Gmbh

03/22/18 / #20180082899

Method of removing a growth substrate from a layer sequence

A method of detaching a growth substrate from a layer sequence includes introducing at least one wafer composite into an etching bath containing an etching solution such that the etching solution is located at least in regions within separating trenches, repeatedly varying a pressure of a base pressure prevailing in the etching bath with at least one pressure variation device, and detaching the growth substrate, wherein at least one of 1-3 is satisfied: 1) a buffer chamber attached to the etching bath and connected thereto is provided and the volume variation is effected by a movement of a piston or hydraulic plunger introduced into the buffer chamber, 2) the volume variation is at least partly effected with a compressor attached to the etching bath, and 3) the pressure variation is at least partly effected by at least one of removal of a gas and a liquid from the etching bath or by addition of at least one of the gas and the liquid thereto.. . ... Osram Gmbh

03/22/18 / #20180080637

Lighting device and corresponding fixing system

A lighting device may include an elongated body having at least one light emission surface. The body has at least one longitudinal groove extending along the elongated body. ... Osram Gmbh

03/22/18 / #20180080635

End cap for lighting devices, corresponding method and device

An end cap for elongate lighting modules having an exposed end surface and a front light emitting surface may include a body wall which may be brought into abutment against said end surface, and a peripheral wall extending sidewise of and around the body wall, the peripheral wall having a discontinuity therein positionable at the front light emitting surface. The body wall may include at least one sealing mass reception cavity facing towards the peripheral wall.. ... Osram Gmbh

03/15/18 / #20180076419

Organic light-emitting device and method for producing the organic light-emitting device

An organic light-emitting device and a method for producing an organic light-emitting device are disclosed. In an embodiment, the oled includes a substrate, a first electrode disposed on the substrate, at least one first organic functional layer stack disposed on the first electrode, the first organic functional layer stack configured to emit radiation in a first wavelength range, a second electrode disposed on the first organic functional layer stack and a filter layer arranged in a beam path of the first organic functional layer stack, wherein the first wavelength range comprises a low-energy sub-range and a high-energy sub-range and wherein the filter layer comprises an absorption range containing the low-energy or the high-energy sub-range of the first wavelength range.. ... Osram Gmbh

03/15/18 / #20180076370

Light-emitting component and method of producing a light-emitting component

A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.. . ... Osram Gmbh

03/15/18 / #20180076367

Optoelectronic component and method for the production thereof

An optoelectronic component includes an optoelectronic semiconductor chip at least partly enclosed by a molded body, wherein a front side of the molded body is covered by a reflecting film, at least in some sections, and a section of the reflecting film is enclosed between the optoelectronic semiconductor chip and the molded body.. . ... Osram Gmbh

03/15/18 / #20180076366

Optoelectronic component

An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation including a wavelength from a first spectral range, a wavelength-converting element configured to convert electromagnetic radiation including a wavelength from the first spectral range into electromagnetic radiation including a wavelength from a second spectral range, and a reflective element including a first reflectivity in the first spectral range and a second reflectivity in the second spectral range, wherein the first spectral range is below 1100 nm, and the second spectral range is above 1200 nm.. . ... Osram Gmbh

03/15/18 / #20180076359

Method for producing a semiconductor body

A method for producing a semiconductor body is disclosed. In an embodiment, the method includes providing a semiconductor body, applying a first mask layer and a second mask layer to the semiconductor body and forming at least one second mask opening in the second mask layer and at least one recess in the semiconductor body in a region of the at least one first mask opening in the first mask layer, wherein the recess comprises a side face and a bottom face and the recess forms an undercut with the second mask opening. ... Osram Gmbh

03/15/18 / #20180073703

Light module for providing effect light

A light module for providing light includes a plurality of excitation radiation sources, wherein each source is designed to emit an excitation radiation beam at least at times, at least one phosphor designed to convert the excitation radiation impinging on it into conversion light, a phosphor device, which includes the phosphor, and which is designed to re-emit excitation radiation beams impinging on it and at least at times as conversion light beams or unconverted excitation radiation beams, a deflection device having at least one deflection optical unit, which deflection device is designed to direct at least some of the excitation radiation beams coming from the respective excitation radiation sources at times onto different regions of the surface of the phosphor device, and an output, at which at least one of the conversion light beams coming from the different regions of the phosphor device or the unconverted excitation radiation beams can be provided.. . ... Osram Gmbh

03/15/18 / #20180073686

Solid state lighting device with electronically adjustable light beam distribution

A lighting device including one or more solid state light sources having an electronically adjustable light beam distribution is disclosed. The lighting device may be a lamp configured to include one or more light source modules, each including one or more solid-state emitters populated over a printed circuit board (pcb). ... Osram Gmbh

03/08/18 / #20180070426

Spatially and temporally smooth occupancy lighting

A system for providing spatially and temporally smooth occupancy lighting includes a sensor and a controller. The sensor is configured to determine a precise location of the occupant. ... Osram Gmbh

03/08/18 / #20180070418

Voltage-dependent operation of individual light sources

A method for operating a lighting device which has a plurality of light sources includes ascertaining a measure of a supply voltage, switching the light sources into one or more parallel strings. The light sources are in each case connected in series in each string, depending on the supply voltage. ... Osram Gmbh

03/08/18 / #20180069156

Optoelectronic device and method for the production of an optoelectronic device

The invention relates to an optoelectronic device (1) comprising at least one outer surface (2) containing silicone (20), chemical compounds, comprising an anchor group (3) and a head group (4), being bonded to the silicone via the anchor group, and the adhesion of the regions of the silicone (2) present on the outer surface being reduced owing to the head groups of the chemical compounds. A method for producing an optoelectronic device is also disclosed.. ... Osram Gmbh

03/08/18 / #20180069147

Method for producing a plurality of semiconductor chips and semiconductor chip

Disclosed is a method for producing a plurality of semiconductor chips (10). A composite (1), which comprises a carrier (4) and a semiconductor layer sequence (2, 3), is provided. ... Osram Gmbh

03/08/18 / #20180069061

Organic light-emitting diode

An organic light-emitting diode includes at least two segments arranged adjacent to one another, a scattering layer that at least partially scatters the light generated in each of the segments, and at least one separating region located in the scattering layer, wherein the separating region has a transmittance for light generated in the segments of at most 20%, the separating region, when viewed in a plan view, is arranged in a transitional region between adjacent segments such that within the scattering layer propagation of light between the segments is suppressed, the segments include organic layer sequences each located between a first electrode and a second electrode, the segments are distant from one another in a direction parallel to the main directions of extension, and the scattering layer directly adjoins the first electrode which is light-transmitting and directly adjoins a transparent layer on a side remote from the first electrode.. . ... Osram Gmbh

03/01/18 / #20180063919

Lighting device and corresponding method

According to the present disclosure, a lighting device provides: an elongate support element, a plurality of lighting units distributed along the length of said support element, each of said units including: a set of electrically powered light radiation sources, a driver supplying said set of light radiation sources with a supply current having an intensity which is a function of an impedance value sensed at a current control input of driver. At least one of said lighting units includes a mounting seat for a lighting adjustment impedance, said seat having an electrical connection to the current control input of at least one driver, so that the intensity of the current supplied by driver to a respective set of light radiation sources is a function of the impedance value of a lighting adjustment impedance arranged at said seat.. ... Osram Gmbh

03/01/18 / #20180062872

Remote configuration of lighting power supply

Systems, methods, and computer program products for remote configuration of one or more power supplies, particularly lighting power supplies, are disclosed. A configuration signal that includes a setting for a parameter is generated and then transmitted to a power supply. ... Osram Gmbh

03/01/18 / #20180062346

Laser component and method of producing it

A laser component includes a housing, the housing including a base surface and side walls which are perpendicular to the base surface, wherein a first carrier block and a second carrier block are arranged parallel to each other at the base surface, a first laser chip arranged on a longitudinal side of the first carrier block; and a further laser chip arranged on a longitudinal side of the second carrier block, wherein an emission direction of the first laser chip and the further laser chip is oriented perpendicular to the base surface.. . ... Osram Gmbh

03/01/18 / #20180062118

Method for producing an organic component

According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.. ... Osram Gmbh

03/01/18 / #20180062115

Method for producing a light-emitting device, and light-emitting device

A method for producing a light-emitting device and light-emitting device are disclosed. In an embodiment the method includes providing a carrier layer comprising a substrate, applying a first electrode layer, applying a layer sequence for generating light, applying a second electrode layer and structuring at least one layer for varying an optical thickness in a first region of the light-emitting device differently from the layer in a second region of the light-emitting device, wherein the second region is laterally arranged relative to the first region.. ... Osram Gmbh

03/01/18 / #20180062054

Method of manufacturing support structures for lighting devices and corresponding device

A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. ... Osram Gmbh

03/01/18 / #20180062051

Electromagnetic radiation-emitting assembly

An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.. ... Osram Gmbh

03/01/18 / #20180062031

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the chip includes an active zone with a multi-quantum-well structure, wherein the multi-quantum-well structure comprises multiple quantum-well layers and multiple barrier layers, which are arranged sequentially in an alternating manner along a growth direction, wherein the multi-quantum-well structure has at least one emission region and multiple transport regions which are arranged sequentially in an alternating manner in a direction perpendicular to the growth direction, wherein at least one of the quantum-well layers and the barrier layers are thinner in the transport regions than in the emission regions, and wherein the quantum-well layers in the transport regions and in the emission regions are oriented perpendicularly to the growth direction with exception of a junction region between adjacent transport regions and emission regions.. ... Osram Gmbh

03/01/18 / #20180062029

Optoelectronic semiconductor body and method for producing an optoelectronic semiconductor body

The invention relates to an optoelectronic semiconductor element (100) comprising a semiconductor layer sequence (1) with a first layer (10) of a first conductivity type, a second layer (12) of a second conductivity type, and an active layer (11) which is arranged between the first layer (10) and the second layer (12) and which absorbs or emits electromagnetic radiation when operated as intended. The semiconductor element (100) is equipped with a plurality of injection regions (2) which are arranged adjacently to one another in a lateral direction, wherein the semiconductor layer sequence (1) is doped within each injection region (2) such that the semiconductor layer sequence (1) has the same conductivity type as the first layer (10) within the entire injection region (2). ... Osram Gmbh

03/01/18 / #20180062027

Unknown

A method of producing optoelectronic semiconductor components includes a) providing a semiconductor layer sequence on a carrier top of a carrier, b) patterning the semiconductor layer sequence such that at least one mesa structure is formed with side faces, c) applying at least a portion of a cladding to the semiconductor layer sequence with the mesa structure by a conformal coating method such that all free surfaces are covered by the cladding), and d) anisotropically etching the cladding such that a flank coating is created from the cladding, which coating is limited with a tolerance of at most 200% of a mean thickness of the flank coating to the side faces of the mesa structure and completely encloses the mesa structure, wherein step d) takes place without an additional etching mask for the anisotropic etching.. . ... Osram Gmbh

03/01/18 / #20180058649

Flexible light engine with bus bars and interconnectors

A flexible light engine, comprising insulating lower and upper laminate sheets; first and second electrically conductive metallic bus bars between the sheets; a plurality of electrically conductive metallic conductors between the sheets being disposed laterally between the bus bars, wherein each conductor defines two metallic contacts exposed in register with adjacent perforations in the perforated upper sheet; wherein each of the bus bars further comprises respective at least two interconnectors, and wherein the conductors are connected to respective interconnectors to define at least two series circuits and connectable in parallel between the bus bars, wherein each of the series circuits comprises a subset of the plurality of metallic conductors; and a plurality of leds attached to the contacts defining at least two series led strings and connected in parallel between the bus bars, each said led string comprising a plurality of leds.. . ... Osram Gmbh

03/01/18 / #20180056850

Lighting system, vehicle headlight and method for controlling a lighting system

A lighting system includes a first luminous component, with the emittable light of which a first illumination region is formable, and including a second luminous component, with the emittable light of which a second illumination region is formable. The first luminous component is configured in such a way that its light is dimmable and/or switchable on and off in a partial region of the first illumination region. ... Osram Gmbh

02/22/18 / #20180054871

Optoelectronic component and method for exchanging an optoelectronic component

According to the present disclosure, an optoelectronic component is provided with an organic layer stack, in which light is generated in operation of the optoelectronic component, at least one marking element, by means of which the optoelectronic component is identifiable, wherein the at least one marking element can be read out under irradiation using electromagnetic radiation from the nonvisible spectral range, the at least one marking element can be read out at a main surface of the optoelectronic component, and wherein the at least one marking element is arranged at or under the main surface in the region of the illuminated area.. . ... Osram Gmbh

02/22/18 / #20180054256

Monitoring an optical converter

An optical converter is to be simply and reliably monitored. Thereto, a circuit device including a measurement bridge with a measurement branch, a first comparison branch and a second comparison branch is provided. ... Osram Gmbh

02/22/18 / #20180053801

Sensor device

A sensor device is disclosed. In an embodiment, the sensor device includes a carrier having a plane carrier surface, a plurality of photodetectors arranged on the carrier surface, each photodetector including a photosensitive sensor area and a lens arrangement arranged opposite the sensor areas, wherein the lens arrangement includes an optical axis, wherein the lens arrangement is configured to image electromagnetic radiation onto the sensor areas, wherein the plurality of photodetectors comprise at least one first photodetector having a first sensor area, the first sensor area comprises at least one property which differs from a property of a second sensor area of a second photodetector of the plurality of photodetectors, and wherein the second photodetector is arranged closer to the optical axis than the at least one first photodetector in order to reduce an optical imaging aberration of the lens arrangement.. ... Osram Gmbh

02/22/18 / #20180053646

Gas discharge lamp and spotlight system comprising gas discharge lamp

The preferred embodiments are directed to discloses a metal halide high-pressure discharge lamp comprising a burner which is enclosed by an outer bulb. In the outer bulb samarium is provided.. ... Osram Gmbh

02/15/18 / #20180048122

Method of producing an electronic component

A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.. . ... Osram Gmbh

02/15/18 / #20180048114

Edge-emitting semiconductor laser and method for the production thereof

An edge-emitting semiconductor laser includes a semiconductor structure laterally bounded by first and second facets and having a central section and a first edge section, a layer sequence offset relative to the central section in the growth direction in the first edge section such that, in the first edge section, one of the cladding layers or one of the waveguide layers is arranged in the growth direction at a height of the active layer in the central section, the layer sequence includes an epitaxially grown additional layer arranged between the upper side and the lower cladding layer, the additional layer is not arranged between the upper side and the lower cladding layer in the central section, and the additional layer is electrically insulating or has doping with the opposite sign to the lower cladding layer.. . ... Osram Gmbh

02/15/18 / #20180047936

Electronic component and method for producing an electronic component

In various embodiment examples, an electronic component is provided, the electrical component comprising an electrically active area, having a first contact pad; a second contact pad; an organic functional layer structure between the first contact pad and the second contact pad; at least one electrical connection, which is coupled to the first contact pad or to the second contact pad, and an encapsulation, which partially covers the electrically conductive area in such a way that part of the first contact pad or of the second contact pad is exposed.. . ... Osram Gmbh

02/15/18 / #20180047932

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. ... Osram Gmbh

02/15/18 / #20180047879

Method for producing a multiplicity of conversion elements, conversion element, and optoelectronic device

The invention relates to a method for producing a plurality of conversion elements (6) comprising the following steps: providing a substrate (1); applying a first mask layer (4) to the substrate (1), the first mask layer (4) being structured with through-holes (3) which completely penetrate the first mask layer (4); applying a conversion material (5) at least into the through-holes (3); and singulating the conversion elements (6) so as to produce a plurality of individual conversion elements (6). The invention also relates to two other methods, to a conversion element (6), and to an optoelectronic component.. ... Osram Gmbh

02/15/18 / #20180047873

Radiation body and method for producing a radiation body

A radiation body and a method for producing a radiation body are disclosed. In an embodiment, the radiation body includes a basic body configured to generate or absorb electromagnetic radiation, at least one main side having a rough structure of first elevations and at least one structured radiation surface structured with a fine structure of second elevations, wherein the fine structure brings about a gradual refractive index change for the radiation between materials adjoining the structured radiation surface, wherein the first elevations comprise heights and widths in each case of at least λmax/n, wherein each second elevation tapers toward a maximum of the respective second elevation and each second elevations has a height of at least 0.6·λmax/n and a width of λmax/(2n) at most in each case, and wherein a distance between neighboring second elevations is λmax/(2n) at most.. ... Osram Gmbh

02/15/18 / #20180047796

Method for producing an optoelectronic component and an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In embodiments, the method includes a) providing an auxiliary carrier; b) applying a sacrificial layer on the auxiliary carrier; c) applying a converter layer on the sacrificial layer, which includes quantum dots embedded in a matrix material or a luminescent polymer; d) providing a semiconductor layer sequence; e) optionally applying an adhesive layer on the semiconductor layer sequence; f) optionally bonding the converter layer on the semiconductor layer sequence by means of an adhesive layer, wherein the semiconductor layer sequence is configured to emit radiation; and g) removing the auxiliary carrier by means of optical, mechanical and/or chemical treatment and at least partially destroying the sacrificial layer.. ... Osram Gmbh

02/15/18 / #20180047628

Method for singulating an assemblage into semiconductor chips, and semiconductor chip

A method for singulating an assemblage into a plurality of semiconductor chips is specified, wherein an assemblage comprising a carrier, a semiconductor layer sequence and a metallic layer is provided. Separating trenches are formed in the carrier. ... Osram Gmbh

02/15/18 / #20180045864

Reflector element and a method for manufacturing same

A reflector element and a method for manufacturing a reflector element are disclosed. In an embodiment the reflector element includes a plastic substrate and a silver layer arranged on the plastic substrate. ... Osram Gmbh

02/15/18 / #20180045401

Organic lighting device and lighting equipment

A luminous means comprising a substrate having a first main surface, to which a first electrode is applied, a second electrode, an organic layer stack within an active region of the substrate between the first and the second electrode, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, and at least one reflective element, which is formed along a main plane of the luminous means, wherein the luminous means has two operating states, such that the luminous means is an illumination source in a first operating state and the luminous means is a mirror in a second operating state.. . ... Osram Gmbh

02/15/18 / #20180044585

Phosphor particles with a protective layer, and method for producing the phosphor particles with the protective layer

Phospher particles with a protective layer and a method for producing phosphor particles with a protective layer are disclosed. In an embodiment the method includes treating si-containing and/or al-containing phosphor with an acid solution, wherein a ph value of the acid solution is maintained within a range of ph 3.5 to ph 7 for a period of at least 1 h, wherein an si-containing layer is formed on the phosphor particles, wherein the si-containing layer has a higher content of si on a surface than the phosphor particles, and/or wherein an al-containing layer is formed on the phosphor particles, wherein the al-containing layer has a modified content of aluminum on the surface than the phosphor particles and tempering the treated phosphor particles at a temperature of at least 100° c. ... Osram Gmbh

02/08/18 / #20180042084

Active damping circuit

An active damping circuit and system including the same are disclosed. The active damping circuit includes a first resistor, a second resistor, a third resistor, a first transistor, a second transistor, a capacitor, and a microcontroller. ... Osram Gmbh








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