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Osram Gmbh patents


Recent patent applications related to Osram Gmbh. Osram Gmbh is listed as an Agent/Assignee. Note: Osram Gmbh may have other listings under different names/spellings. We're not affiliated with Osram Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Osram Gmbh-related inventors


Organic light-emitting diode and vehicle exterior lighting

The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). ... Osram Gmbh

Organic electronic component having a charge carrier generation layer and the use of a zinc complex as a p-type dopant in charge carrier generation layers

The invention relates to an organic electronic component (100) comprising at least one charge generation layer (5) which has an organically p-doped region (5a) that contains a zinc complex as a p-dopant, said zinc complex in turn containing at least one ligand l of the following structure: formula (i) wherein r1 and r2 can be oxygen, sulphur, selenium, nh or nr4 independently from one another, wherein r4 is selected from the group containing alkyl or aryl and which can be bonded to r3; and wherein r3 is selected from the group containing alkyl, long-chain alkyl, cycloalkyl, halogen alkyl, at least partially halogenated long-chain alkyl, halogen cycloalkyl, aryl, arylene, halogen aryl, heteroaryl, heteroarylene, heterocyclic alkylene, heterocycloalkyl, halogen heteroaryl, alkenyl, halogen alkenyl, alkynyl, halogen alkynyl, ketoaryl, halogen ketoaryl, ketoheteroaryl, ketoalkyl, halogen ketoalkyl, ketoalkenyl, halogen ketoalkenyl, halogen alkyl aryl, and halogen alkyl heteroaryl, wherein, for suitable groups, one or a number of non-adjacent ch2 groups can be replaced by —o—, —s—, —nh—, —nr∘∘∘—, —sir∘r∘∘—, —co—, —coo—, —cor∘or∘∘—, —oco—, —oco—o—, —so2-, —s—co—, —co—s—, —o—cs—, —cs—o—, —cy1=cy2 or —c≡c— independently from one another, and in such a way that o and/or s atoms are not directly bonded to one another, and are replaced optionally with aryl- or heteroaryl preferably containing between 1 and 30 c atoms (terminal ch3 groups are understood to be ch2 groups in the sense of ch2-h). The invention further relates to the use of a zinc complex as a p-dopant in charge generation layers.. ... Osram Gmbh

Stable red ceramic phosphors and technologies including the same

Wavelength converters including coarse particles/grains of a red nitride phosphor are disclosed. In some embodiments the red nitride phosphor is a (ca,sr,ba)2si5n8:eu phosphor with a d50 grain size or a d50 particle size that is ≥5 microns. ... Osram Gmbh

Lighting device comprising a pump radiation source

According to the present disclosure, an illumination apparatus includes a pump radiation source for emitting pump radiation, a phosphor element for converting the pump radiation into conversion light and a carrier, on which the phosphor element is mounted, which carrier is made of a carrier material which is transparent at least for the pump radiation and has a refractive index ncarrier. The pump radiation passes through the carrier, exits at an exit surface of the carrier and is then incident on a pump radiation input coupling surface of the phosphor element that is arranged at the exit surface. ... Osram Gmbh

Optoelectronic semiconductor component and 3d printer

An optoelectronic semiconductor component and a 3d printer are disclosed. In an embodiment the component includes a carrier, a plurality of individually controllable pixels configured to emit radiation during operation, wherein the plurality of individual pixels is mounted on the carrier and is formed from at least one semiconductor material and a plurality of transport channels configured to transport a gas or a liquid through the semiconductor component in a direction transverse to and towards a radiation exit side of the semiconductor component, wherein the pixels are configured to emit radiation having a wavelength of maximum intensity of 470 nm or less, and wherein all pixels include the same semiconductor layer sequence and emit radiation of the same wavelength.. ... Osram Gmbh

Method of producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component

. . A method of producing a plurality of optoelectronic semiconductor components includes a) preparing a composite with a semiconductor layer sequence, wherein the composite includes a plurality of component areas mechanically connected to one another; b) forming a plurality of connecting surfaces on the semiconductor layer sequence, wherein at least one connecting surface is formed on each component area; c) forming a molding compound on the semiconductor layer sequence, wherein the molding compound fills interstices between the connecting surfaces; and d) singulating the composite with the molding compound, wherein during singulation a plurality of molded bodies is formed from the molding compound, each of which is associated with a semiconductor body obtained from a component area of the composite.. . ... Osram Gmbh

Method for producing an optoelectronic device

A method for producing an optoelectronic device is disclosed. The method include preforming an inductive excitation of a current by an inductive component of the optoelectronic device such that the optoelectronic device emits electromagnetic radiation, measuring of at least one electro-optical characteristic of the optoelectronic device and applying a converter material to an emission side of the optoelectronic device, wherein a quantity of the converter material is determined from the measurement of the electro-optical characteristic.. ... Osram Gmbh

Lighting device and corresponding method

A lighting device and corresponding method are described herein. In various aspects, the lighting device may be implemented as an electrically powered lighting device (e.g., a c5w lamp). ... Osram Gmbh

Lighting system and headlamp

In various embodiments, a lighting system is provided. The lighting system includes an optical unit having a plurality of light guides which are respectively provided for at least one light source and which respectively have an input coupling face. ... Osram Gmbh

Luminaire with programmable light distribution

A method of setting luminance levels of a solid-state light sources of a luminaire with programmable light distribution is provided. The method includes obtaining a file describing a desired light beam distribution, converting the desired light beam distribution into luminance levels for the solid-state light sources, and applying the luminance levels to the solid-state light sources to cause the luminaire to output the desired light beam distribution.. ... Osram Gmbh

Self-locating light-based communication enabled luminaires

Techniques are disclosed for programming a luminaire position for light-based communication (lcom) luminaires within an array of luminaires using position information provided by passing mobile computing devices. This position information can be received as, for example, as a specific coordinate (e.g., x-y coordinates of a grid-based map) or as movement data of the mobile computing device relative to an initial known reference location. ... Osram Gmbh

Laser component and method of producing same

A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.. . ... Osram Gmbh

Semiconductor component and method for producing a semiconductor component

The invention relates to a semiconductor component comprising: a semiconductor chip (10) which has a semiconductor body (1) with an active region (12) and a substrate (3) with a first conductor body (31), a second conductor body (32) and a first moulded body (33); and a second moulded body (5); wherein the second moulded body (5) completely surrounds the semiconductor chip (10) in lateral directions (l), the semiconductor chip (10) extends all the way through the second moulded body (5) in a vertical direction (v), at least some parts of an upper side and a lower side of the semiconductor chip (10) are not covered by the second moulded body (5), the substrate (3) is mechanically connected to the semiconductor body (2), the active region (12) is connected to the first conductor body (31) and the second conductor body (32) in an electroconductive manner, and the second moulded body (5) is directly adjacent to the substrate (3) and the semiconductor body (1).. . ... Osram Gmbh

Optoelectronic semiconductor component and method of producing same

An optoelectronic semiconductor component includes an active layer arranged between a p-type semiconductor region and an n-type semiconductor region, a carrier including a plastic and a first via and a second via, a p-contact layer and an n-contact layer arranged between the carrier and a semiconductor body at least in some regions, wherein the p-contact layer electrically joins the first via and the p-type semiconductor region, and the n-contact layer electrically joins the second via and the n-type semiconductor region, a metallic reinforcing layer arranged at least in some regions between the n-contact layer and the carrier, wherein the metallic reinforcing layer is at least 5 μm thick, and at least one p-contact feed-through arranged between the first via and the p-contact layer, wherein the p-contact feed-through is at least 5 μm thick and surrounded in a lateral direction by the reinforcing layer at least in some regions.. . ... Osram Gmbh

09/06/18 / #20180254385

Optoelectronic component and method of producing an optoelectronic component

An optoelectronic component includes a semiconductor chip, the semiconductor chip emitting infrared radiation; a reflector that reflects the infrared radiation of the semiconductor chip; and a filter configured in the form of a coating, the filter being transparent for the infrared radiation of the semiconductor chip, wherein visible light striking the optoelectronic component being absorbed to at least 75%.. . ... Osram Gmbh

09/06/18 / #20180254384

Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip

An optoelectronic semiconductor chip includes an active region arranged between a first semiconductor layer and a second semiconductor layer and generates or receives electromagnetic radiation, the first semiconductor layer electrically conductively connects to a first contact, the first contact is formed on a front side of the chip next to the active region, the second semiconductor layer electrically conductively connects to a second contact, the second contact is arranged on the front side of the chip next to the active region, and an electrically insulating separating layer that electrically insulates a rear side of the chip from the active region of the semiconductor chip, and an electrically insulating separating layer includes at least one first separating layer having at least one atomic layer or at least one molecular layer and is deposited by atomic layer deposition or molecular layer deposition.. . ... Osram Gmbh

09/06/18 / #20180254383

Method for producing an optoelectronic component

A method for producing an optoelectronic component is disclosed. In an embodiment the method includes a metallization with first mask structures is deposited directionally, and then a first passivation material is deposited non-directionally onto the metallization. ... Osram Gmbh

09/06/18 / #20180254378

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

A method for fabricating an optoelectronic semiconductor component is disclosed. A semiconductor chip is produced by singularizing a wafer. ... Osram Gmbh

09/06/18 / #20180254264

Light-emitting component and method for producing a light-emitting component

The invention relates to a component with at least one optoelectronic semiconductor chip (42), comprising: —a connection substrate (4), which has an assembly surface (4a) and electric contact structures, and —a plurality of structured semiconductor units (2), each of which has a plurality of monolithically connected pixels (21) with a respective active layer that emits light during operation, wherein: —the semiconductor units (2) are arranged at a lateral distance to one another on the assembly surface (4a), the distance (d) between adjacent semiconductor units (2) is at least 5 μm and maximally 55 μm, and the pixels (21) can be controlled in an electrically separated manner. The invention also relates to a method for producing said component.. ... Osram Gmbh

09/06/18 / #20180252390

Lighting device and corresponding method

A lighting device, such as a led module, comprising an elongated support structure having a longitudinal direction and electrically-powered light radiation sources distributed along the support structure, the support structure including at least one light-permeable layer, one or more optical signal sources coupled with the light-permeable layer, for injecting therein an optical signal propagating in the longitudinal direction, and one or more optical signal detectors coupled with the light-permeable layer, for detecting the optical signal injected by the optical signal source(s).. . ... Osram Gmbh

09/06/18 / #20180252389

Lenses and lighting devices including same

Optical components for lighting devices and lighting devices including such components are described. In some embodiments the optical components are in the form of a lens that alter the distribution of light produced by a lighting fixture. ... Osram Gmbh

08/23/18 / #20180241178

Laserdiode

A laser diode includes an active zone that emits radiation in a lateral emission angle range in a plane of the active zone via an emission side of a layer arrangement, an electrical contact is configured on a top side of the layer arrangement, the electrical contact includes a metallic adhesion layer and at least one metallic contact layer, the adhesion layer is arranged on the layer arrangement, the adhesion layer includes a layer stack including a first and a second layer, the first layer is arranged on the layer arrangement, the first layer is configured in a planar fashion, the second layer is subdivided into at least one first and at least one second partial surface, the adhesion layer is arranged in the first partial surface, and the contact layer is arranged on the first partial surface and in the second partial surface.. . ... Osram Gmbh

08/23/18 / #20180240994

Organic light-emitting component and lamp

The invention relates to an organic light-emitting component (100), comprising a functional layer stack (9) between two electrodes (1, 8), wherein the functional layer stack (9) has at least two organic light-emitting layers (2, 7) and at least one charge carrier generation zone (3), which is arranged between the two organic light-emitting layers (2, 7), wherein the charge carrier generation zone (3) comprises an electron-conducting organic layer (31) and a hole-conducting organic layer (32), between which an intermediate region (4) is arranged, wherein the intermediate region (4) comprises at least one organic intermediate layer (6) which has a first charge carrier transport mechanism and an inorganic intermediate layer (5) which has a second charge carrier transport mechanism, wherein the inorganic intermediate layer (5) is arranged between the organic intermediate layer (6) and the electron-conducting organic layer (31), and wherein the first charge carrier transport mechanism is at least partially different to the second charge carrier transport mechanism.. . ... Osram Gmbh

08/23/18 / #20180239965

Occupant position tracking using imaging sensors

Techniques are disclosed for locating an occupant within an area. The system includes a first sensor including a first plurality of pixels for receiving a thermal energy input from the occupant within a first field of view (fov) and a second sensor including a second plurality of pixels for receiving the input within a second fov. ... Osram Gmbh

08/23/18 / #20180239220

Method for operating a light source for a camera, light source, camera

A method for operating a light source for a camera, a light source and a camera are disclosed. In an embodiment the method for operating a light source for a camera comprises individually illuminating segments of the scene by the emitters, wherein an illumination parameter is determined for a segment of the scene and an emitter is individually driven on a basis of the illumination parameter, and wherein the illumination parameter is determined by a measurement of a physical variable and/or by an input of a user.. ... Osram Gmbh

08/23/18 / #20180238520

Laser activated remote phosphor target with low index coating on phosphor, method of manufacture and method for re-directing emissions

A laser-activated remote phosphor (larp) target with a first layer having a first index of refraction and a phosphor dispersed within the first layer. A second layer which has a second index of refraction different from the first index of refraction and adjoins the first layer at an interface. ... Osram Gmbh

08/23/18 / #20180238518

Solid-state luminaire reflector assembly

A reflector assembly for a solid-state luminaire is disclosed. The disclosed reflector assembly may be configured, in accordance with some embodiments, to be disposed over a given printed circuit board (pcb) of a host luminaire such that emissions of emitters populated over that pcb are reflected out of the luminaire via the reflector assembly. ... Osram Gmbh

08/23/18 / #20180238511

Vehicle headlight and method thereof

A vehicle headlight may include a plurality of selectively activatable light sources configured to emit laterally disjoint light beams, and a lens disposed optically downstream of the light sources and having a light entrance surface and a light exit surface for the light beams. The lens may include a first partial region having a first partial surface of the light entrance surface and a first partial surface of the light exit surface. ... Osram Gmbh

08/23/18 / #20180237689

Method for producing a conversion element

A method for producing a conversion element is disclosed. In an embodiment, the method includes providing an acidic medium having a ph value of less than 2, adding a conversion material into the acidic medium thereby forming a mixture and adding a silicate solution having a viscosity between 2 to 10 000 poise inclusive to the mixture such that the ph value during the addition of the silicate solution is smaller than 2. ... Osram Gmbh

08/16/18 / #20180235042

Clocked electronic energy converter

A clocked electronic energy converter having an electronic switching element, at least two electrical energy storage devices, a terminal for connecting an electrical energy source, a terminal for connecting an electrical energy sink, a clock generator for controlling and operating the electronic switching element during switching operation and an adjusting unit which provides a first signal for adjusting the power-to-be-transmitted by the energy converter, is disclosed. The clock generator is designed to adjust the power-to-be-transmitted by the energy converter in a first output range by means of the switch-on time of the electronic switching element and, in a second output range in which the power-to-be-transmitted by the energy converter is less than in the first output range, to adjust the power-to-be-transmitted by the energy converter in the second output range by a combination of the switch-on time and the supplemental switch-off time, the supplemental switch-off time being constant.. ... Osram Gmbh

08/16/18 / #20180234021

Electronic converter and related method of operating an electronic converter

An electronic converter comprising a switching stage comprising at least one electronic switch, wherein the switching stage is adapted to provide a current via a terminal; a first capacitor, wherein the first capacitor provides a first voltage. Specifically, converter further comprises: a second capacitor, wherein the second capacitor provides a second voltage, comparison means configured to detect the difference between the first voltage and the second voltage, and determine a comparison signal which indicates whether this difference is greater than a threshold, and switching means configured to transfer selectively current to the first capacitor or the second capacitor as a function of the comparison signal.. ... Osram Gmbh

08/16/18 / #20180233634

Method of producing a light-emitting arrangement

A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.. . ... Osram Gmbh

08/16/18 / #20180233627

Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips and optoelectronic component having a radiation-emitting semiconductor chip

Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. ... Osram Gmbh

08/16/18 / #20180231209

Illumination device

An illumination device is provided with an optoelectronic light source and an optical body. The optical body is divided into an inner lens part and an outer reflector part adjoining thereon outward in relation to directions perpendicular to a main direction, which body parts are formed monolithically with one another. ... Osram Gmbh

08/09/18 / #20180227994

Voltage-dependent connection of individual light sources

A method for operating a lighting device having multiple light sources may include determining a measure of a supply voltage and switching the light sources into one or more parallel strands, wherein the light sources in each strand are connected in series, in each case according to the measured value of the supply voltage. Automatic determination of a number of light sources in at least one of the strands, the number corresponding to the largest whole number which, when multiplied by a specifiable forward voltage of each of the light sources, is less than the measured value of the supply voltage. ... Osram Gmbh

08/09/18 / #20180226555

Electronic device

An electronic device includes a carrier and a semiconductor chip, wherein the carrier includes a first dielectric layer and a second dielectric layer, a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer, the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer, the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer, and the carrier includes a solder terminal for electrical contacting arranged on the second dielectric layer.. . ... Osram Gmbh

08/09/18 / #20180226534

Method for producing a nitride semiconductor component, and nitride semiconductor component

The invention relates to a method for producing a nitride semiconductor component (10), comprising the following steps: epitaxially growing a nitride semiconductor layer sequence (2) on a growth substrate (1), wherein recesses (7) are formed on a boundary surface (5a) of a semiconductor layer (5) of the semiconductor layer sequence (2), growing a p-doped contact layer (8) over the semiconductor layer (5), wherein the p-doped contact layer (8) at least partially fills the recesses, and wherein the p-doped contact layer (8) has a lower dopant concentration in first regions (81) arranged at least partially in the recesses (7) than in second regions (82) arranged outside of the recesses (7), and applying a connection layer (9), which has a metal, a metal alloy, or a transparent conductive oxide, to the p-doped contact layer (8). The invention further relates to a nitride semiconductor component (10) that can be produced by means of the method.. ... Osram Gmbh

08/09/18 / #20180226518

Method of manufacturing an optoelectronic component, and optoelectronic component

A method of manufacturing an optoelectronic component includes providing a carrier; arranging an ink on an upper side of the carrier; arranging an adhesive on the ink; and arranging the optoelectronic semiconductor chip on the adhesive. An optoelectronic component includes a carrier, an ink arranged on an upper side of the carrier, an adhesive arranged on the ink, and an optoelectronic semiconductor chip arranged on the adhesive.. ... Osram Gmbh

08/02/18 / #20180220535

Process of producing a component and apparatus that produces a component

A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a scratching process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.. . ... Osram Gmbh

08/02/18 / #20180220509

Optoelectronic assembly and method for operating an optoelectronic assembly

An optoelectronic assembly and method for operating an optoelectronic assembly are provided herein. The optoelectronic assembly may include an organic light-emitting component, a temperature sensor for recording a temperature value, and a controller coupled to the organic light-emitting component and to the temperature sensor. ... Osram Gmbh

08/02/18 / #20180219634

System and method for determining vehicle position based upon light-based communication and time-of-flight measurements

A system and method for determining vehicle position uses light based communication (lbc) signals and a time-of-flight (tof) pulse. Each vehicle includes a lbc system having light emitting diodes (leds) and receiver photodiodes capable of sending and receiving pulsed light binary messages. ... Osram Gmbh

08/02/18 / #20180219146

Method for producing a component, and a component

A method for producing a component may include providing a composite containing a semiconductor stack layer, a first exposed connection layer and a second exposed connection layer, where the connection layers are arranged on the semiconductor stack, assigned to different electrical polarities and are configured to electrically contact the component to be produced; forming a first through contact exposed in lateral directions on the first connection layer and a second through contact exposed in lateral directions on the second connection layer, where the through contacts are formed from an electrically conductive connection material; and applying a molded body material on the composite for forming a molded body, where each of the through contacts are fully and circumferentially enclosed by the molded body at least in the lateral directions, such that the molded body and the through contacts form a permanently continuous carrier which mechanically carries the component to be produced. . ... Osram Gmbh

08/02/18 / #20180219145

Method for producing a component and component

A method for producing a component having a semiconductor body includes providing the semiconductor body including a radiation passage surface and a rear side facing away from the radiation passage surface, wherein the semiconductor body comprises on the rear side a connection location for the electrical contacting of the semiconductor body, providing a composite carrier including a carrier layer and a partly cured connecting layer, applying the semiconductor body on the composite carrier, such that the connection location penetrates into the partly cured connecting layer, curing the connecting layer to form a solid composite, applying a molded body material on the composite carrier after curing the connecting layer, wherein the molded body covers side surfaces of the semiconductor body, forming a cutout through the carrier layer and the connecting layer in order to expose the connection location, and filling the cutout with an electrically conductive material.. . ... Osram Gmbh

08/02/18 / #20180219135

Component having a metal carrier and method for producing components

A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. ... Osram Gmbh

08/02/18 / #20180219134

Semiconductor element and method for production thereof

The invention relates to a method for producing a component wherein a composite, comprising a semiconductor layer stack and connection layers, is provided, wherein a molded article material is applied to the composite to form a molded article, such that the molded article covers the connection layers. Recesses for exposing the connection layers are formed through the molded article and the recesses are then filled with an electrically conductive material to form through-contacts. ... Osram Gmbh

08/02/18 / #20180219132

Optoelectronic component and method for producing an optoelectronic component

The invention relates to an optoelectronic component. The component comprises a semiconductor layer sequence having an active layer that is designed to emit electromagnetic radiation during operation of the component, at least one current-spreading layer on a radiation outlet surface of the semiconductor layer sequence, wherein the current-spreading layer is connected to a contact structure in an electrically conductive manner by means of an adhesion layer. ... Osram Gmbh

08/02/18 / #20180219127

Method for producing a plurality of semiconductor chips and radiation-emitting semiconductor

The invention relates, inter alia, to a method for producing a plurality of semiconductor chips, the method comprising the following steps: providing a substrate (1); applying a semiconductor layer sequence (2) to the substrate (1); generating a plurality of recesses (6) in the semiconductor layer sequence (2) on the side of the semiconductor layer sequence (2) that is facing away from the substrate (1); detaching the substrate (1) from the semiconductor layer sequence (2); thinning the semiconductor layer sequence (2) on the side that was facing the substrate (1) prior to detaching the substrate (1).. . ... Osram Gmbh

08/02/18 / #20180219125

Optoelectronic lighting device

An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.. . ... Osram Gmbh

08/02/18 / #20180217229

System and method for determining vehicle position based upon light-based communication using signal-to-noise ratio or received signal strength indicator

A system and method for determining vehicle position uses light based communication (lbc) signals and a received signal strength indicator (rssi) to determine the vehicle position. Each vehicle includes a lbc system having an array of transmitting light emitting diodes (leds) and an array of receiver photodiodes for transmitting and receiving pulsed light binary messages. ... Osram Gmbh

07/26/18 / #20180213617

Method for operating an optoelectronic assembly and optoelectronic assembly

A method for operating an optoelectronic assembly which includes at least one component string having at least one section, wherein the section includes at least one light emitting diode element, is provided. According to the method, the section is supplied with electrical energy, the supply of the section with electrical energy is interrupted, an input of the section is electrically coupled to an output of the section, wherein the section is short-circuited via the electrical coupling of the input to the output, a maximum value of an electrical discharge current which flows via the section is detected, and the fact of whether the section of the component string has a short circuit is determined depending on the detected maximum value.. ... Osram Gmbh

07/26/18 / #20180212404

Semiconductor laser, laser assembly and method of making a semiconductor laser

A semiconductor laser, a laser assembly and a method of making a semiconductor laser are disclosed. In an embodiment the surface-emitting semiconductor laser includes a carrier having a carrier main side mechanically carrying a semiconductor laser; a first bragg mirror and a second bragg mirror so that the second bragg mirror is further away from the carrier than the first bragg mirror; a semiconductor layer sequence between the first and the second bragg mirrors having at least one active zone for generating laser radiation; a metal mirror arranged directly on a side of the first bragg mirror facing the carrier for reflecting laser radiation generated during operation of the semiconductor laser; a bonding agent layer located between the carrier and the semiconductor layer sequence; a resonator oriented perpendicular to the carrier main side; and an electrically insulating passivation layer located in the metal mirror.. ... Osram Gmbh

07/26/18 / #20180212127

Optoelectronic component, assembly of optoelectronic components and method of producing an optoelectronic component

An optoelectronic component includes a semiconductor chip configured to emit radiation at least via a main radiation surface, a converter element arranged in a beam path of the semiconductor chip, an encapsulating element including a cover element and a side element and forming at least a seal for the converter element against environmental influences, wherein the cover element is arranged above the converter element and the side element, in the cross-section, is arranged laterally to the semiconductor chip and converter element and surrounds the semiconductor chip, the side element and the cover element are in direct contact at least in regions, and the side element includes at least one metal and is in direct contact with the converter element in the lateral direction.. . ... Osram Gmbh

07/26/18 / #20180212121

Component and method of producing components

A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which is formed at least in places by a surface of a shaped body, a metal layer contains a first sub-region and a second sub-region, wherein the first sub-region and the second sub-region adjoin the shaped body in a lateral direction, are electrically connectable in a vertical direction on the front side of the carrier, are assigned to different electrical polarities of the component and are thus configured to electrically contact the semiconductor body, and the carrier has a side face running perpendicularly or obliquely to the rear side of the carrier and is configured as a mounting surface of the component, wherein at least one of the sub-regions is electrically connectable via the side face and exhibits singulation traces.. . ... Osram Gmbh

07/26/18 / #20180212108

Optoelectronic arrangement and method for producing an optoelectronic arrangement

An optoelectronic arrangement is specified, comprising a moulded body (2) having a base surface (2b), a first pixel group (41) with a multiplicity of pixels (1) assigned thereto, each having a first semiconductor region (11), a second semiconductor region (12) and an active region (10), a multiplicity of separating structures (3) arranged between the pixels (1), and at least one first contact structure (51, 52, 53) having a first contact plane (51) and a first contact location (52), which is freely accessible at the base surface (2b), wherein the pixels (1) of the first pixel group (41) are arranged alongside one another at the top surface (2a), the first semiconductor regions (11) and/or the second semiconductor regions (12) of adjacent pixels (1) of the first pixel group (41) are electrically insulated from one another by means of the separating structures (3), a first contact structure (51, 52, 53) is assigned one-to-one to the first pixel group (41), and the first semiconductor regions (11) of the pixels (1) of the first pixel group (41) are electrically conductively connected to one another by means of the first contact plane (51) and are electrically contactable by means of the first contact location (52).. . ... Osram Gmbh

07/26/18 / #20180212107

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment, the chip includes a semiconductor layer sequence with a first side, a second side and an active zone and at least one via electrically contacting the first side with the second side through the active zone, wherein the via has a base region including a cylinder, a truncated cone or a truncated pyramid, wherein the via is surrounded in a lateral direction by an electric insulation layer, wherein the via has a contact region including a truncated cone, a truncated pyramid, or a spherical or aspherical body, wherein the contract region directly follows the base region, wherein the contact region is in direct contact with the second side, wherein a first flank angle of the base region is different from a second flank angle of the contact region, and wherein the first and second flank angles are related to the lateral direction.. ... Osram Gmbh

07/26/18 / #20180212003

Organic electronic component

An organic electronic component and a method for making an organic electronic component are disclosed. In an embodiment the component includes an anode, an active layer arranged above the anode, an electron injection layer arranged above the active layer and a cathode arranged above the electron injection layer. ... Osram Gmbh

07/26/18 / #20180209602

Converter, laser-activated remote phosphor (larp) system, headlight and method

A converter for a laser-activated remote phosphor system includes a phosphor for at least partially converting excitation radiation from a radiation source of the laser-activated remote phosphor system, and a substrate on which the phosphor is fixed. The phosphor and the substrate are connected by way of bonding.. ... Osram Gmbh

07/26/18 / #20180209591

Lighting device and corresponding manufacturing method

A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. Led sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. ... Osram Gmbh

07/19/18 / #20180206303

Lighting device and operating method for such a lighting device

In one embodiment, the lighting device (1) comprises at least one base chip (21) and a plurality of cover emitter regions (22). The base chip or chips (21) and the cover emitter regions (22) are realized by light-emitting diode chips and can be electrically controlled independently of one another. ... Osram Gmbh

07/19/18 / #20180205041

Method for producing an organic electronic device

A method for producing an organic electronic device is disclosed. In an embodiment the method includes applying an organic material to a substrate to form at least one organic functional layer, applying a patterned electrode material to the at least one organic functional layer by a first mask, and removing the organic material from regions which are free of the electrode material.. ... Osram Gmbh

07/19/18 / #20180205028

Organic optoelectronic component and method for producing the same

The invention relates to an organic optoelectronic component (10) comprising a first electrode layer (2), having a doped matrix material and metal nanowires, an organic active layer (3), which is suitable for emitting or detecting electromagnetic radiation, and a second electrode layer (6). The organic active layer (3) is directly adjacent to the first electrode layer (2). ... Osram Gmbh

07/19/18 / #20180204876

Optoelectronic component and a method of producing an optoelectronic component

A component includes a carrier with a mold body made of an electrically insulating plastic material and a metal layer, wherein the metal layer includes a first subregion and a second subregion, and at least one of the subregions extends in a vertical direction through a mold body to electrically contact a semiconductor body, and the first and second segments are spatially separated from one another in a lateral direction and electrically conductively connect to one another via a connecting structure, wherein the connecting structure, the first subregion and the second subregion adjoin the mold body and are arranged on the same side of the semiconductor body.. . ... Osram Gmbh

07/19/18 / #20180204823

Video wall module and method for producing same

A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.. ... Osram Gmbh

07/19/18 / #20180202643

Mounting profile, separable signage module capable of emitting light, and illumination system

According to the present disclosure, a mounting profile includes at least one wire fixed thereto. The mounting profile is configured to be adapted to mount at least one separable signage module on the mounting profile, and in a mounting state, each of the at least one wire contacts a corresponding power supply terminal of each of the at least one separable signage module.. ... Osram Gmbh

07/19/18 / #20180202625

Module, set of positioning elements, arrangement having a module, headlamp and method for producing a module

A module may include a housing in which a radiation source is arranged, where the radiation source is configured to emit an excitation radiation by virtue of a conversion element disposed downstream of the radiation source, and the conversion element is configured to convert, at least in part, the excitation radiation. The conversion element may be fastened to a holding section of the housing. ... Osram Gmbh

07/19/18 / #20180200934

Composite component and method for producing a composite component

A composite component and methods for producing a composite component are described herein. In some aspects, a method for producing a composite component may include molding a body from a plastic material, such that the molded body has at least one recess arranged adjacent to at least one respective projection. ... Osram Gmbh

07/12/18 / #20180199431

Circuit support for an electronic circuit and method for manufacturing a circuit support of said type

Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. ... Osram Gmbh

07/12/18 / #20180198087

Organic light-emitting component and method for producing an organic light-emitting component

An organic light-emitting component may include: a substrate, a first electrode arranged over the substrate, at least one organic functional layer stack configured to emit radiation and arranged over the first electrode, at least one conductive current spreading structure which is arranged on the first electrode and faces the at least one organic functional layer stack, and a second electrode arranged over the at least one organic functional layer stack. The at least one conductive current spreading structure may comprise at least one metal, and may be covered with an inorganic passivation layer. ... Osram Gmbh

07/12/18 / #20180198045

Optoelectronic component and a method of producing an optoelectronic component

An optoelectronic component includes a boundary layer is arranged between a semiconductor body and a metallic layer in a lateral direction, adjoins the semiconductor body at least in places, covers an active layer laterally, and has a lower refractive index compared to the semiconductor body, a metallic layer is configured to prevent the electromagnetic radiation generated during operation of the component and passes through the boundary layer from impinging on a mold body, the boundary layer is formed from a radiation-transmitting dielectric material having a refractive index of 1 to 2, and a layer thickness of the boundary layer is at least 400 nm and selected such that an amplitude of an evanescent wave, which is obtained in the event of total internal reflection at an interface between the boundary layer and the semiconductor body, is reduced to less than 37% of its original value within the boundary layer.. . ... Osram Gmbh

07/12/18 / #20180198044

Optoelectronic lamp device and method of producing same

An optoelectronic lamp device includes an optoelectronic semiconductor component including a top side including a light-emitting face, and a housing embedding the semiconductor component and leaving free the light-emitting face, wherein a housing face is coated with a light-scattering dielectric resist layer that may scatter light incident on a face of the resist layer facing away from the housing face.. . ... Osram Gmbh

07/12/18 / #20180198037

Method for producing optoelectronic conversion semiconductor chips and composite of conversion semiconductor chips

A method for producing optoelectronic conversion semiconductor chips and a composite of conversion semiconductor chips are disclosed. In an embodiment the method includes growing a semiconductor layer sequence on a growth substrate, applying an electric contact on to a rear side of the semiconductor layer sequence facing away from the growth substrate, thinning the growth substrate, after thinning, cutting the growth substrate at least to the semiconductor layer sequence thereby forming a first intermediate space, applying a conversion layer on to the thinned growth substrate and singulating at least the thinned growth substrate and the semiconductor layer sequence.. ... Osram Gmbh

07/12/18 / #20180198034

Optoelectronic component comprising a conversion element, method of producing an optoelectronic component comprising a conversion element, and use of an optoelectronic component comprising a conversion element

A method of producing an optoelectronic component including a conversion element includes: a) providing a layer sequence having an active layer, wherein the active layer is configured to emit electromagnetic primary radiation; b) providing quantum dots, wherein the quantum dots are functionalized with an organic group and/or the quantum dots dissolved or dispersed in a first solvent and/or are present as a powder; c*) providing a mixture including a precursor of an inorganic matrix material and of a second solvent; d) mixing the mixture obtained in step c*) with the quantum dots of step b); e) drying the mixture; and f) sintering the mixture to form the conversion element.. . ... Osram Gmbh

07/12/18 / #20180198028

Optoelectronic semiconductor chip

In one embodiment, the optoelectronic semiconductor chip (1) comprises a first semiconductor region (21) of a first conductivity type and a second semiconductor region (23) of a second conductivity type. An active zone (22) configured for generating light is situated between these two semiconductor regions (21, 23). ... Osram Gmbh

07/12/18 / #20180197843

Optoelectronic semiconductor component

An optoelectronic semiconductor component is disclosed, comprising: a semiconductor body (1) having a semiconductor layer sequence (2) with a p-type semiconductor region (3), an n-type semiconductor region (5), and an active layer (4) arranged between the p-type semiconductor region (3) and the n-type semiconductor region (5); a support (10) having a plastic material and a first via (11) and a second via (12); a p-contact layer (7) and an n-contact layer (8), at least some regions of which are arranged between the support (10) and the semiconductor body (1), wherein the p-contact layer (7) connects the first via (11) to the p-type semiconductor region (3) and the n-contact layer (8, 8a) connects the second via (12) to the n-type semiconductor region (5); and an esd protection element (15) which is arranged between the support (10) and the semiconductor body (1), wherein the esd protection element (15) is electrically conductively connected to the first via (11) and to the second via (12), and wherein a forward direction of the esd protection element (15) is anti-parallel to a forward direction of the semiconductor layer sequence (2).. . ... Osram Gmbh

07/12/18 / #20180197841

Lighting module

The invention relates to a lighting module (1) comprising an assembly body (3) extending between a rear side (31) and a front side (30) opposite the rear side, and comprising a plurality of semiconductor components (2) provided for generating radiation, wherein: the assembly body has a plurality of recesses (35) on the rear side, in which the semiconductor components are arranged; the assembly body is permeable to the radiation generated in the semiconductor components, and said radiation passes out of the front side of the assembly body; a contact layer (5) is arranged on the rear side of the assembly body, to which the semiconductor components are connected in an electrically conductive manner via connecting lines; and a reflector layer (6) is arranged on the rear side of the assembly body, said reflector layer entirely covering at least the recesses.. . ... Osram Gmbh

07/12/18 / #20180195696

Transom light arrangement and method for producing a transom light arrangement

In various embodiments, a transom light arrangement may include a transom, which is arranged between a construction element and a transom light, a light source arrangement, which is mounted at least one of on or in the transom, with the light source arrangement or the transom defining a horizontal plane, and a screen structure. The light source arrangement and the screen structure are arranged relative to one another and are configured such that a spatial region above the horizontal plane is illuminated using the light source arrangement.. ... Osram Gmbh

07/12/18 / #20180194996

Composite material with photoluminescent material embedded in a transparent matrix

A composite material includes at least one photoluminescent material embedded as a light source in a transparent matrix, wherein a refractive index (np) of the at least one photoluminescent material and a refractive index (nm) of the matrix differ by at most ±0.2.. . ... Osram Gmbh

07/05/18 / #20180192507

Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type

A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. ... Osram Gmbh

07/05/18 / #20180190874

Method for producing an optoelectronic semiconductor device and optoelectronic semiconductor device

A method for producing an optoelectronic semiconductor device and an optoelectronic semiconductor device are disclosed. In an embodiment the method includes providing a semiconductor layer sequence including a light-emitting and/or light-absorbing active zone and a top face downstream of the active zone in a stack direction extending perpendicular to a main plane of extension of the semiconductor layer sequence, applying a layer stack onto the top face, wherein the layer stack includes an oxide layer containing indium, and an intermediate face downstream of the top face in the stack direction and applying a contact layer onto the intermediate face, wherein the contact layer includes indium tin oxide, and wherein the layer stack is, within the bounds of manufacturing tolerances, free of tin.. ... Osram Gmbh

07/05/18 / #20180190711

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

The invention relates to a method for producing an optoelectronic semiconductor chip (1). A semiconductor layer sequence (3) is provided, comprising a first semiconductor layer (3a) and a second semiconductor layer (3b). ... Osram Gmbh

07/05/18 / #20180190610

Method for joining at least two components

The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: a) providing at least a first component (1) and a second component (2), b) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), c) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), d) heating at least the metal layer (4) to a first temperature (t1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and e) heating the arrangement to a second temperature (t2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.. . ... Osram Gmbh

07/05/18 / #20180187865

Lamp

A lamp is disclosed. In an embodiment, the lamp includes a first light source and a second light source embodied as a light-emitting reflector, with a reflective layer and an electroluminescent layer sequence. ... Osram Gmbh

07/05/18 / #20180187855

Lighting device, corresponding lamp and method

A lighting device, which may be employed e.g. As a retrofit bulb for vehicle lamps, includes a light radiation source, e.g. ... Osram Gmbh

07/05/18 / #20180187853

Lighting device, corresponding lamp and method

A lighting device, which may be employed e.g. As a retrofit bulb for vehicle lamps, includes a light radiation source, e.g. ... Osram Gmbh

06/28/18 / #20180184496

Circuit arrangement for operating light sources and sensor for connection to a circuit arrangement

In various embodiments, a circuit arrangement for operating light sources is provided. The circuit arrangement includes an input for inputting an input voltage, an output for outputting an output current, a first interface for controlling the circuit arrangement, and a second interface. ... Osram Gmbh

06/28/18 / #20180183010

Organic light-emitting component

An organic light-emitting component is disclosed. In an embodiment, the component includes an organic functional layer stack between two electrodes, wherein the organic functional layer stack comprises at least two organic light-emitting layers and at least one charge generation layer, and wherein at least one of the at least two organic light-emitting layers is part of the charge generation layer.. ... Osram Gmbh

06/28/18 / #20180182946

Arrangement

An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.. ... Osram Gmbh

06/28/18 / #20180182943

Component and method of producing a component

A component comprising a support and a semiconductor body arranged on the support, the support formed by a molded body and a metal layer. The metal layer has a first subregion and a second subregion laterally spaced apart by an intermediate space and thereby electrically separated. ... Osram Gmbh

06/28/18 / #20180182934

Light emitting unit

A light emitting unit includes a light emitting semiconductor chip and a wavelength converter for the light of the semiconductor chip. The wavelength converter has a substrate with a first surface. ... Osram Gmbh

06/28/18 / #20180182926

Component having improved coupling-out properties

A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.. . ... Osram Gmbh

06/28/18 / #20180182739

Light-emitting diode arrangement and method for the production thereof

According to the present disclosure, a light-emitting diode arrangement provides a substrate, first leds, which are arranged on the substrate, second leds, which are arranged on the substrate laterally adjacent to the first leds, at least one cover body, which covers the first leds, at least one dam, which is arranged on the substrate and which encloses the first leds and the second leds in the lateral direction, and a first potting material, which covers the second leds and is delimited in the lateral direction by the dam and the cover body. The cover body and/or the first potting material include(s) a first converter material for converting electromagnetic radiation.. ... Osram Gmbh

06/28/18 / #20180180701

Operating of a transmission deviceof a lighting device comprising an illumination device

The invention relates to a method for operating a transmission device of a lighting device comprising an illumination device, wherein the transmission device is arranged in or immediately on the illumination device and wirelessly emits a radio signal with identification signals that are specific to the transmission device, wherein the radio signal is emitted according to exactly one predetermined radio standard, wherein the radio signal contains the specific identification data at least in two data formats that are different from each other.. . ... Osram Gmbh

06/28/18 / #20180180271

Lighting device and corresponding method

A lighting device may include a channel-shaped elongate housing with a web portion and two side portions extending along the elongate housing sidewise of web portion, wherein each side portion includes, facing inwardly of the channel shape of elongate housing, a proximal groove extending sidewise of web portion, one or more electrically conductive lines extending along web portion internally of the channel shape of said elongate housing, and a light radiation source assembly. The light radiation source assembly includes a support board having a back surface facing web portion of elongate housing with respective electrically conductive lines in order to make electrical contact with said electrically conductive lines and a front surface facing outwardly of the channel shape of elongate housing, and at least one electrically-powered light radiation source, on said front surface, being in electrical contact with said electrically conductive lines.. ... Osram Gmbh

06/28/18 / #20180180238

Lighting device having a lighting unit

A lighting device provides a lighting unit for emitting useful light and a sensor. The unit includes a laser diode for emitting pump radiation and a phosphor element, which during operation is irradiated by the laser diode and thereby excited and serves for converting the pump radiation into conversion light, which conversion light at least proportionally forms the useful light. ... Osram Gmbh

06/21/18 / #20180177018

Assembly for operating an organic radiation-emitting component

An arrangement for operating an organic radiation-emitting component (d) is specified. The arrangement comprises a driver circuit (t) with at least two driver outputs (ta1, tan), a decoupling unit (e) with at least two inputs (ee1, een) and outputs (ea1, ean) corresponding to the inputs (ee1, een), the radiation-emitting component (d) with at least two electrodes (de1, den), and a contact sensor (s) with a sensor electrode (se1) which is at least partially formed by one of the electrodes (de1, den) of the radiation-emitting component (d). ... Osram Gmbh

06/21/18 / #20180175260

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one metallic surface, a contacted optoelectronic semiconductor chip configured to emit radiation and a protective layer arranged on the at least one metallic surface, wherein the protective layer comprises a protective material of at least one n-heterocyclic carbene, and wherein a covalent bond is formed between the protective material and the at least one metallic surface.. ... Osram Gmbh

06/21/18 / #20180175243

Method for producing a nitride semiconductor component, and a nitride semiconductor component

The invention relates to a method for producing a nitride semiconductor component (100), comprising the steps of: —providing a growth substrate (1) having a growth surface (10) formed from a planar area (11) with a plurality of three-dimensionally shaped surface structures (12) on said planar area (11), —growing a nitride-based semiconductor layer sequence (30) on the growth surface (10), growth beginning selectively on a growth area (13) of said growth substrate, and the growth area (13) being less than 45% of the growth surface (10). The invention also relates to a nitride semiconductor component (100) which can be produced according to said method.. ... Osram Gmbh

06/21/18 / #20180175237

Components comprising a light emitting semiconductor chip

A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.. . ... Osram Gmbh

06/21/18 / #20180172220

Illumination device having phosphor wheel

An illumination device is provided. The illumination device includes a rotatable phosphor wheel, which is at least regionally provided with phosphor for converting primary light into secondary light, a primary light generator configured to generate at least one useful primary light beam incident on the phosphor wheel, and at least one measuring device configured to measure a measured variable which can be influenced by the phosphor and to determine damage of the phosphor on the basis of measured data of the at least one measuring device.. ... Osram Gmbh

06/21/18 / #20180171508

Method of making a single crystal wavelength conversion element, single crystal wavelength conversion element, and light source containing same

There is herein described a method of making a single crystal wavelength conversion element from a polycrystalline wavelength conversion element, a single crystal wavelength conversion element, and a light source containing same. By making the single crystal wavelength conversion element from a polycrystalline wavelength conversion element, the method provides greater flexibility in creating single crystal wavelength conversion elements as compared to melt grown methods for forming single crystals. ... Osram Gmbh

06/14/18 / #20180168010

Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device

A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (z1, z2) and a plurality of column lines (s1, s2, . . ... Osram Gmbh

06/14/18 / #20180168009

Printed circuit board, corresponding lighting module, lighting system and method for implementing lighting modules

The printed circuit board includes metallic zones including: a first, second and third positive terminal, a first and second negative terminal, wherein the second negative terminal is connected to the first negative terminal, and electric contacts for the mounting of one or more leds and electric traces such that the leds are connected in series forming a led string. The printed circuit board comprises selection means implemented with electric traces and metallic contacts adapted to be short-circuited via links in order to permit all of the following connections: a connection of the led string between the first and third positive terminal, a connection of the led string between the first positive terminal and the first negative terminal, a connection of the led string between the second and third positive terminal, and a connection of the led string between the second positive terminal and the first negative terminal.. ... Osram Gmbh

06/14/18 / #20180166854

Light-emitting semiconductor device, light-emitting semiconductor component and method for producing a light-emitting semiconductor device

The invention relates to, inter alia, a light-emitting semiconductor component comprising the following: —a first mirror (102, 202, 302, 402, 502), —a first conductive layer (103, 203, 303, 403, 503), —a light-emitting layer sequence (104, 204, 304, 404, 504) on a first conductive layer face facing away from the first mirror, and —a second conductive layer (105, 205, 305, 405, 505) on a light-emitting layer sequence face facing away from the first conductive layer, wherein —the first mirror, the first conductive layer, the light-emitting layer sequence, and the second conductive layer are based on a iii-nitride compound semiconductor material, —the first mirror is electrically conductive, and —the first mirror is a periodic sequence of homoepitaxial materials with varying refractive indices.. . ... Osram Gmbh

06/14/18 / #20180166614

Method of producing a converter component

A method of producing a converter component for an optoelectronic lighting apparatus includes forming a layer stack having an injection-molded or extruded conversion layer and an injection-molded or extruded diffuser layer. A converter component for an optoelectronic lighting apparatus includes a layer stack including an injection-molded or extruded conversion layer, and an injection-molded or extruded diffuser layer.. ... Osram Gmbh

06/14/18 / #20180166611

Method of producing a housing cover, method of producing an optoelectronic component, and optoelectronic component

A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.. . ... Osram Gmbh

06/14/18 / #20180166499

Display device having a plurality of pixels that can be operated separately from one another

A display device having a plurality of pixels that can be operated separately from one another is disclosed. In an embodiment the display includes a semiconductor layer sequence and a first contact structure for contacting a first semiconductor layer and a second contact structure for contacting a second semiconductor layer, wherein the first contact structure has first contacts configured to be operated separately from one another, each first contact extending laterally and uninterrupted along the first semiconductor layer and each first contact delimits a pixel in a lateral manner with its contour, wherein the semiconductor layer sequence and the first contact structure have at least one recess laterally bordering a respective pixel, which recess extends through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, and wherein the second contact structure has second contacts extending through the at least one recess.. ... Osram Gmbh

06/14/18 / #20180166428

Light source comprising a number of semi-conductor components

A light source includes a plurality of semiconductor components, wherein a semiconductor component includes a plurality of light-emitting diodes, the diodes are arranged in a predefined grid in at least one column in or on the semiconductor component, and a control circuit that drives the individual diodes is arranged on the semiconductor component.. . ... Osram Gmbh

06/14/18 / #20180164559

Optoelectronic component having a radiation source

An optoelectronic component includes at least one radiation source that produced electromagnetic radiation, a reflector, and a lens, wherein the reflector deviates a part of the radiation of the radiation source into a desired beam direction, the lens deviates at least a part of the radiation of the radiation source into the desired beam direction, the lens has a first side face which is conical at least in some areas, the first side face faces toward the radiation source, and the reflector has a concave first section and a second convex section.. . ... Osram Gmbh

06/14/18 / #20180163955

A support structure for lighting devices, corresponding lighting device and method

A support structure for electrically-powered lighting devices (e.g. Led modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. ... Osram Gmbh

06/07/18 / #20180159009

Method for producing an electronic component with a carrier element and electronic component with a carrier element

The invention relates to a method for producing an electronic component with a carrier element (100), with the steps: producing the carrier element (100), having the steps a) providing a first metal layer (1) comprising a first metal material, wherein the first metal layer (1) has a first and a second main surface (10, 11) which face away from one another, b) applying a second metal layer (2) comprising a second metal material on at least one of the main surfaces (10, 11), c) converting a part of the second metal layer (2) into a dielectric ceramic layer (3), wherein the second metal material forms a component of the ceramic layer (3), and the ceramic layer (3) forms a surface (30) which faces away from the first metal layer (1) and is above the second metal layer (2);—arranging at least one electronic semiconductor chip (21) on the carrier element (100). The invention further relates to an electronic component with a carrier element (100).. ... Osram Gmbh

06/07/18 / #20180158993

Method for producing at least one optoelectronic semiconductor component and optoelectronic semiconductor component

A method for producing at least one optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment, the method includes providing a semiconductor layer sequence comprising a first semiconductor material configured to emit a first radiation and applying a conversion element at least partially on the semiconductor layer sequence via a cold method, wherein the conversion element comprises a second semiconductor material, and wherein the second semiconductor material is configured to convert the first radiation into a second radiation.. ... Osram Gmbh

06/07/18 / #20180156436

Leadframe, luminaire, group of luminaires and method for producing a luminaire

In various embodiments, a leadframe is provided. The leadframe may include connection strips arranged alongside one another, said connection strips being connected via one or a plurality of holding webs. ... Osram Gmbh

06/07/18 / #20180156431

Electric driver and illumination device

The utility model relates to an electric driver and an illumination device. The electric driver comprises: a carrier; a first electrical component and a second electrical component, wherein the first electrical component and the second electrical component are provided on the carrier; and a heat insulation structure, wherein the second electrical component comprises a first heat insulator surrounding the second electrical component and a second heat insulator surrounding the first heat insulator, wherein a gap is provided between the first heat insulator and a second heat insulator. ... Osram Gmbh

06/07/18 / #20180156409

Illumination device including semiconductor primary light sources and at least one luminophore element

An illumination device includes multiple semiconductor primary light sources for emitting respective primary light beams, at least one movable mirror, which can be illuminated by means of the primary light beams, and which can assume at least two angle positions, and a luminophore element, which can be illuminated by means of primary light beams deflected by the at least one mirror. Light spots of the individual primary light beams are locally differentiable on the at least one luminophore element, an overall light spot composed of the light spots of the individual primary light beams is locally differentiable on the at least one luminophore element depending on the angle position of the at least one movable mirror, and at least one beam property of at least one primary light beam incident on the at least one luminophore element is variable during operation of the illumination device.. ... Osram Gmbh

06/07/18 / #20180156406

Primary optical unit, secondary optical unit, module, arrangement, vehicle headlight, and headlight system

In various embodiments, an optical unit for a radiation source matrix is provided. The optical unit may include a plurality of coupling surfaces, which are arranged in at least one line, and at least one decoupling surface. ... Osram Gmbh

05/31/18 / #20180153008

Electronic converter, and related method of operating an electronic converter

An electronic converter includes two input terminals for receiving an ac voltage, two output terminals for providing a regulated voltage or current, a rectifier circuit and a boost converter. The boost converter receives at input, via positive and negative input terminals, the dc voltage generated via the rectifier circuit, and provides at output, via positive and negative output terminals, the regulated voltage or current. ... Osram Gmbh

05/31/18 / #20180152002

Semiconductor laser diode and method for producing a semiconductor laser diode

A semiconductor laser diode and a method for manufacturing a semiconductor laser diode are disclosed. In an embodiment, the semiconductor laser diode includes a semiconductor layer sequence having an active zone, wherein the semiconductor layer sequence has a cylindrical shape, wherein a cylinder axis of the semiconductor layer sequence is perpendicular to a layer plane of the semiconductor layer sequence, and wherein the semiconductor laser diode is configured to emit radiation perpendicularly to the cylinder axis of the semiconductor layer sequence.. ... Osram Gmbh

05/31/18 / #20180151833

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. ... Osram Gmbh

05/31/18 / #20180151787

Method of producing an optoelectronic component and optoelectronic component

A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact by the contacts and the potting material.. . ... Osram Gmbh

05/31/18 / #20180151777

Method for producing an optoelectronic device with a contact area of accurately and reproducibly defined size

An optoelectronic device is disclosed. In an embodiment the device includes a semiconductor crystal with a surface having a first lateral region, a second lateral region and a third lateral region, a contact area arranged on the surface in the first lateral region, the contact area comprising a first metal and a first layer including a dielectric arranged on the surface in the third lateral region. ... Osram Gmbh

05/31/18 / #20180151548

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a semiconductor chip subdivided into a plurality of pixels, the pixels being arranged next to one another in a lateral direction and being configured to be activated individually and independently and a metallic connecting element having an upper side and an underside, the connecting element including a contiguous metallic connecting layer, which is completely passed through by a plurality of first metallic through-connections arranged next to one another in the lateral direction, wherein the first through-connections are electrically insulated and spaced from the connecting layer by insulating regions, wherein each first through-connection is unambiguously assigned to one pixel, is electrically-conductively connected to this pixel and forms a first electrical contact to this pixel, and wherein the semiconductor chip is connected by the connecting element to a carrier.. ... Osram Gmbh

05/31/18 / #20180148644

Phosphor

A phosphor is disclosed. In an embodiment the phosphor includes an inorganic compound having at least one activator e and n and/or o in its empirical formula, wherein e is selected from the group consisting of mn, cr, ni, ce, pr, nd, sm, eu, tb, dy, ho, er, yb, tm, li, na, k, rb, cs and combinations thereof, and wherein the inorganic compound crystallizes in a crystal structure with the same atomic sequence as in k2zn6o7.. ... Osram Gmbh

05/24/18 / #20180146534

Operating a ballast for a gas discharge lamp

A gas discharge lamp includes at least two electrodes arranged in a manner spaced apart with a spacing in a discharge vessel filled with gas. A method of operating a ballast includes applying electrical energy to the electrodes. ... Osram Gmbh

05/24/18 / #20180145274

Organic emitter layer, organic light-emitting diode and use of heavy atoms in an organic emitter layer of an organic light-emitting diode

The invention relates to an organic emitter layer (100) having organic emitter molecules (1), each of which has at least one excited triplet state (se1) and at least one excited singlet state (te1). The emitter layer (100) comprises an organic matrix material (10) with first matrix molecules (2), the first matrix molecules (2) having at least one excited triplet state (ta1) and at least one excited singlet state (sa1). ... Osram Gmbh

05/24/18 / #20180145235

Optoelectronic semiconductor component, optoelectronic arrangement and method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor component comprises an optoelectronic semiconductor chip (c1) having an electrically conductive substrate (t), an active part (at) containing epitaxially grown layers, and an intermediate layer (zs) which is arranged between the substrate (t) and the active part (at) and contains a solder material. The optoelectronic semiconductor component further comprises an electrical connection point, which at least partially covers an underside of the substrate (t), wherein the electrical connection point comprises a first contact layer (ks1) on a side facing the substrate (t), and the first contact layer (ks1) contains aluminium or consists of aluminium.. ... Osram Gmbh

05/24/18 / #20180145234

Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.. . ... Osram Gmbh

05/24/18 / #20180145230

Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.. ... Osram Gmbh

05/24/18 / #20180145225

Optoelectronic semiconductor chip and optoelectronic module

An optoelectronic semiconductor chip includes a carrier and a semiconductor body arranged on the carrier with a semiconductor layer sequence, wherein the semiconductor layer sequence includes an active region arranged between a first semiconductor layer and a second semiconductor layer and generates or receives electromagnetic radiation, the first semiconductor layer connects to a first contact in an electrically-conductive manner, the first contact is formed on a rear side of the carrier facing away from the semiconductor body, the second semiconductor layer connects to both a second contact and a third contact in an electrically-conductive manner, and the second contact is formed on the front side of the carrier facing towards the semiconductor body and the third contact on the rear side of the carrier facing away from the semiconductor body.. . ... Osram Gmbh

05/24/18 / #20180145211

Optoelectronic arrangement and depth measuring system

An optoelectronic arrangement that produces a light pattern includes a light-emitting diode chip configured to emit electromagnetic radiation on its upper side and forming a first two-dimensional pattern on the upper side of the light-emitting diode chip, and an optically imaging element configured to project electromagnetic radiation emitted by the light-emitting diode chip into an environment of the optoelectronic arrangement.. . ... Osram Gmbh

05/24/18 / #20180144933

Method for producing a nitride compound semiconductor device

A method for procuring a nitride compound semiconductor device is disclosed. In an embodiment the method includes growing a first nitride compound semiconductor layer onto a growth substrate, depositing a masking layer, growing a second nitride compound semiconductor layer onto the masking layer, growing a third nitride compound semiconductor layer onto the second nitride compound semiconductor layer such that the third nitride compound semiconductor layer has non-planar structures and growing a fourth nitride compound semiconductor layer onto the non-planar structures such that the fourth nitride compound semiconductor layer has an essentially planar surface. ... Osram Gmbh

05/24/18 / #20180143414

Method of producing a lens for an optoelectronic lighting device

A method of producing a lens for an optoelectronic lighting device, wherein the optoelectronic lighting device includes an optoelectronic semiconductor component having a light-emitting surface, including applying a curable lens material to the light-emitting surface, and curing the lens material to form a lens from a cured lens material, wherein after the application and before or during the curing, the light-emitting surface is arranged into a position in which a normal vector of the light-emitting surface oriented in the direction of the applied lens material and a normal force of a weight acting on the light-emitting surface are parallel to one another so that the lens material at least partially cures in the position.. . ... Osram Gmbh

05/24/18 / #20180142861

Automotive led module with heat sink and fan

Lamp module cooling system 10 contains vehicle solid-state light source 12 coupled to an extruded first heat sink 2 and an extruded second heat sink 20 in thermal communication with one another and with fluid flow directed from fan air outlet 42 of fan 40 over respective heat dissipation first and second ribs 8, 28 to direct warmed air through existing apertures 115 in headlamp bezel 110 aligned with headlamp optics 130 to defog or de-ice headlamp cover 100. Housing cover 30 and cover 32 define air flow path 50, 52, 54 improving warm air guidance and efficient spatial packaging of lightweight lamp module cooling system 10.. ... Osram Gmbh

05/17/18 / #20180138700

Supplying an electrical load with electrical energy from a voltage source

The invention relates to a method for supplying an electrical load with electrical energy from a voltage source, in which an electrical charge storage for storing electrical charge is supplied with a preset electrical current by means of a constant current circuit connected to a voltage source, wherein a regulated electrical potential is provided for the load by means of a linear regulator circuit connected to the charge storage, wherein the charge storage is supplied with an electrical bypass current by means of a bypass circuit in parallel with the current of the constant current circuit, wherein the bypass circuit is controlled by means of a control signal of a control unit, wherein an electrical charge storage voltage at the charge storage is captured and the control signal is provided depending on the captured charge storage voltage.. . ... Osram Gmbh

05/17/18 / #20180138156

Clips defining electrical pathway on a flexible sheet

A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.. . ... Osram Gmbh

05/10/18 / #20180130925

Optoelectronic semiconductor device, method of producing an electrical contact and method of producing a semiconductor device

An optoelectronic semiconductor device includes a semiconductor body having a semiconductor region and an active region, wherein the semiconductor region has a covering layer forming a radiation passage surface of the semiconductor body on a side facing away from the active region, the semiconductor region has a current-spreading layer arranged between the covering layer and the active region; the semiconductor device has a contact for the electrical contacting of the semiconductor region; the contact adjoins the current-spreading layer in a terminal area; the contact adjoins the covering layer in a barrier region; and the barrier region runs parallel to the active region and is arranged closer to the active region than the radiation passage surface.. . ... Osram Gmbh

05/10/18 / #20180128474

A lighting device and corresponding method

According to the present disclosure, a lighting device is provided with a support member with a fork-like shape with two prongs carrying mutually facing electrically powered light radiation sources, and an annular heat sink member fitted onto the prongs and extending around the light radiation sources.. . ... Osram Gmbh

05/03/18 / #20180123007

Radiation-emitting semiconductor component and production method of a plurality of semiconductor components

A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. ... Osram Gmbh

05/03/18 / #20180122997

Method of producing optoelectronic components and surface-mounted optoelectronic component

A method of producing optoelectronic components includes a) providing a carrier and optoelectronic semiconductor chips including contact elements arranged on a contact side of the semiconductor chip; b) applying the semiconductor chips laterally next to one another on to the carrier, wherein the contact sides face the carrier during application; c) applying an electrically-conductive layer at least on to subregions of the sides of the semiconductor chip not covered by the carrier; d) applying a protective layer at least on to subregions of side surfaces of the semiconductor chips running transversely to the contact surface; e) electrophoretically depositing a converter layer on to the electrically-conductive layer, wherein the converter layer is configured to convert at least part of radiation emitted by the semiconductor chip into radiation of a different wavelength range; and f) removing the electrically-conductive layer from regions between the converter layer and the semiconductor chips.. . ... Osram Gmbh

05/03/18 / #20180122990

Device and method for producing a device

A device and a method for producing a device are disclosed. In an embodiment the device includes a carrier and a semiconductor body arranged in a vertical direction on the carrier. ... Osram Gmbh

05/03/18 / #20180122493

Circuit assembly for time-discretizing an analog electrical signal

There is provided a circuit assembly for time-discretizing an analog electrical signal, including an input terminal supplying the analog electrical signal, an output terminal providing a time-discrete signal depending on the supplied analog electrical signal and a sample and hold circuit, which comprises a capacitor connected to the output terminal, an electronic switching unit connected between the input terminal and the output terminal and a control unit controlling the switching unit, wherein the switching unit provides an off-state due to an off-signal of the control unit and an on-state due to an on-signal of the control unit, wherein the switching unit provides an electrical resistance in the on-state, which cooperates with the capacitor and comprises a preset resistance value, such that the sample and hold circuit provides a low-pass with preset cut-off frequency. There is further provided a detection device and lighting device with such a circuit assembly.. ... Osram Gmbh

05/03/18 / #20180120157

Optoelectronic arrangement

An optoelectronic arrangement includes an optoelectronic semiconductor chip, a wavelength-converting element and a detector component, wherein the optoelectronic arrangement is configured to emit light with a first peak wavelength and to emit light with a second peak wavelength, the first peak wavelength is in the visible spectral range and the second peak wavelength is in the non-visible spectral range or the first peak wavelength is in the non-visible spectral range and the second peak wavelength is in the visible spectral range, and the optoelectronic arrangement emits the light whose peak wavelength is in the non-visible spectral range into a target area, and the detector component is configured to detect light backscattered from the target area and the peak wavelength of which is in the non-visible spectral range.. . ... Osram Gmbh

05/03/18 / #20180119929

Concrete casting system and a method for providing a lighting system in a building

According to the present disclosure, a concrete casting system including a large number of individual concrete casting boxes is provided. The concrete casting system has a grid-like structure in which the individual concrete casting boxes are arranged at the intersection points of the grid-like structure. ... Osram Gmbh

05/03/18 / #20180119902

Lighting devices including formed flexible light engines

Lighting devices, and methods of manufacturing the same, are provided. A lighting device includes a cover through which emitted light passes and a formed flexible light engine. ... Osram Gmbh

05/03/18 / #20180119897

Wavelength conversion of primary light by means of a conversion body

Wavelength conversion of primary light by means of a conversion body, a conversion device and an illumination apparatus is described herein. In some aspects, a conversion body may include a main body containing a wavelength-converting phosphor. ... Osram Gmbh

05/03/18 / #20180117706

Method for dividing a composite into semiconductor chips, and semiconductor chip

The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. ... Osram Gmbh

04/19/18 / #20180108849

Organic electronic component with dopant, use of a dopant and method for the production of the dopant

An organic electronic component with a dopant, a method for using a dopant and a method for producing a dopant are disclosed. In an embodiment the component includes a substrate and a first electrode arranged on the substrate. ... Osram Gmbh

04/19/18 / #20180108811

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer, wherein the p-doped semiconductor layer is electrically contacted by a p-type connection contact, wherein a first trench extending at least partially into the p-doped semiconductor layer is arranged below the p-type connection contact, wherein an electrically insulating first blocking element arranged at least partially below the p-type connection contact and at least partially within the trench is arranged at least between the n-doped semiconductor layer and the p-type connection contact, and wherein the electrically insulating first blocking element is configured to prevent a direct current flow between the p-type connection contact and the p-doped and n-doped semiconductor layers and the active layer.. ... Osram Gmbh

04/19/18 / #20180108695

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor component (100) comprising the following —an optoelectronic semiconductor chip (2), the lateral surfaces (2c) and lower face (2b) of which are at least partly covered by a molded body (3) that is electrically conductive and is designed to electrically contact the optoelectronic semiconductor chip (2), —at least one via (6) which comprises an electrically conductive material and is laterally spaced from the semiconductor chip (2), said via (6) completely passing through the molded body (3), wherein the via (6) extends from an upper face (3a) of the molded body (3) to a lower face (3b) of the molded body (3), —at least one insulating element (9) which is arranged within the molded body (3) between the via (6) and the semiconductor chip (2) and extends from the upper face (3a) of the molded body (3) to the lower face (3b) of the molded body (3), and —an electrically conductive connection (7) which is connected to the semiconductor chip (2) and the via (6) in an electrically conductive manner.. . ... Osram Gmbh

04/19/18 / #20180106436

Method for producing an optoelectronic device, and an optoelectronic device produced by the method

In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. ... Osram Gmbh

04/19/18 / #20180103857

Sensor for sensing a biometric function

A sensor that senses a biometric function includes at least one transmitter configured to transmit electromagnetic radiation in an emission direction, including at least one receiver configured to receive electromagnetic radiation in a receiving direction, wherein the transmitter and the receiver are configured such that the emission direction of the transmitter is inclined away from the receiving direction of the receiver by a defined angle, wherein the angle is 1° to 60°.. . ... Osram Gmbh








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