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Osram Gmbh patents (2016 archive)


Recent patent applications related to Osram Gmbh. Osram Gmbh is listed as an Agent/Assignee. Note: Osram Gmbh may have other listings under different names/spellings. We're not affiliated with Osram Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Osram Gmbh-related inventors


Component arrangement and method for producing a component arrangement

Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each of the electrical components have at least two electrical terminal contacts and the components arranged next to one another are mechanically connected to one another by an adhesive arranged between the components, and the component arrangement is designed for the individual components of the component arrangement to be applied together to a circuit carrier.. ... Osram Gmbh

Method for producing an led module and led module

Various embodiments may relate to a method for producing an led module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the led module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one led on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. ... Osram Gmbh

Wavelength converters and methods for making the same

Disclosed herein are wavelength converters and methods for making the same. The wavelength converters include a single layer of a polymeric matrix material, and one or more types of wavelength converting particles. ... Osram Gmbh

Enclosure with grommetless strain relief

Enclosures with grommetless strain relief are provided, each including a base and a cover. The base has a bottom and four sidewalls arranged to provide an open box-like structure. ... Osram Gmbh

Optoelectronic component and method for producing same

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.. . ... Osram Gmbh

Optoelectronic component and method for the production thereof

A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.. . ... Osram Gmbh

Optoelectronic device

The invention relates to an optoelectronic device (101), comprising: a semiconductor layer sequence (103) comprising an emitter layer (105) for emitting electromagnetic radiation, a converter (113) for converting electromagnetic radiation with a first wavelength into an electromagnetic radiation with a second wavelength which differs from the first wavelength, a scattering body (109) for scattering at least a part of the electromagnetic radiation emitted by the emitter layer (105) in the direction of the converter (113) in order to convert at least a part of the emitted electromagnetic radiation, wherein the scattering body (109) comprises a positive, temperature-dependent scattering cross-section and so, as the temperature increases, scattering of the electromagnetic radiation in the scattering body (109) in the direction of the converter can be increased. The invention also relates to a scattering body (109).. ... Osram Gmbh

Light converter assemblies with enhanced heat dissipation

The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. ... Osram Gmbh

Laser diode chip having coated laser facet

A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. ... Osram Gmbh

Connector for lighting devices and corresponding method

In various embodiments, a connector for lighting devices including an elongate planar support member having a front surface with electrically conductive lines and at least one electrically-powered light radiation source thereon, is provided. The connector includes a c-shaped body having a web portion and two side portions, said c-shaped body locatable astride said planar support member with said web portion facing said front surface, and electrical contact means extending from said web portion between said side portions configured to contact electrically conductive lines on said front surface of said planar support member.. ... Osram Gmbh

Connector for lighting devices, corresponding accessory and method

In various embodiments, a connector for a lighting device is provided. The lighting device has a planar support with at least one electrical contact formation at an edge of the planar support. ... Osram Gmbh

Glass item, glass item having luminescent-substance particles, device for producing a glass item, method for producing a glass item, and method for producing a glass item having luminescent-substance particles

In various embodiments, glassware is provided. The glassware may include a glass matrix having a surface, a first type of particles, and at least one second type of particles, wherein the particles of the second type have a higher refractive index than the particles of the first type, wherein the particles of the first type are completely surrounded by the glass matrix, such that the surface of the glass matrix is free of particles of the first type, and the particles of the second type are arranged above and/or between the particles of the first type at least partly in the glass matrix at the surface of the glass matrix in order to increase the refractive index of the glassware.. ... Osram Gmbh

Carrier, optoelectronic unit comprising a carrier, and methods for the production of both

A method for manufacturing a carrier and a carrier for an optoelectronic unit are disclosed. In various embodiments the carrier has a carrier material which includes polyethylene terephthalate which contains reflector particles and a filler.. ... Osram Gmbh

Lighting device and method of manugacturing it

In various embodiments, a lighting device is provided. The lighting device includes a channel-shaped elongate profiled body having a central or web portion and two side portions sidewise of the web portion, a profiled body having mutually opposed undercuts opening inwardly of the channel shape of profiled body, and a light radiation source assembly including an elongate support board carrying one or more light radiation sources, e.g. ... Osram Gmbh

12/08/16 / #20160359130

Organic optoelectronic component and method for producing an organic optoelectronic component

In various embodiments, an organic optoelectronic component is provided. The organic optoelectronic component may include a first electrode, an organic functional layer structure over the first electrode, and a second electrode over the organic functional layer structure. ... Osram Gmbh

12/08/16 / #20160359127

Method for producing an organic light-emitting diode, and organic light-emitting diode

The invention relates to a method for producing an organic light-emitting diode (1) comprising the following steps: providing a carrier (3) for the organic light-emitting diode (1), applying a solution (s) comprising a plurality of different emitter materials (e) to the carrier (1), wherein said emitter materials (e) are each formed by a certain type of organic molecule and have electrical charges that differ from each other, applying an electrical field (f), so that the solution is located in the electrical field (f), and drying the solution (s) into a plurality of emitter layers (20) in an organic layer stack (2), while the electrical field is applied, so that the emitter materials (e) are accommodated separately from each other, each in a certain emitter layer (20) of the organic stack (2).. . ... Osram Gmbh

12/08/16 / #20160354880

Making method for cooling body

A method for making a cooling body for a lighting device may include: a) providing multiple aluminum nitride ceramic radiators; b) putting the multiple aluminum nitride ceramic radiators into a mold; c) closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) opening the mold, and obtaining the cooling body.. . ... Osram Gmbh

12/01/16 / #20160351758

Optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor component (1) comprising:—an optoelectronic semiconductor chip (2), comprising—a growth substrate (21) having a growth surface (21a),—a layer sequence (22) with a semiconductor layer sequence (221, 222, 223) with an active zone (222) grown on the growth surface (21a),—contact points (29) for electrically contacting the semiconductor layer sequence (221, 222, 223) and—and insulation layer (26), which is formed in an electrically insulting manner—a connection carrier (4), which is mounted to the cover surface (2a) of the optoelectronic semiconductor chip facing away from the growth surface (21a), wherein—the semiconductor layer sequence (221, 222, 223) is connected to the connection carrier (4) in an electrically conducting manner and—a conversion layer (5) is applied to a bottom surface (21c) of the growth substrate (21) facing away from the growth surface (21a) and to all side surfaces (21b) of the growth substrate (21).. . ... Osram Gmbh

12/01/16 / #20160351550

Light-emitting arrangement and method of producing a light-emitting arrangement

A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.. . ... Osram Gmbh

12/01/16 / #20160347997

Wavelength converting compositions, wavelength converters and devices including the same

Disclosed herein are wavelength converting compositions, wavelength converters and light sources including the same. The wavelength converting compositions include at least one poly(silphenylene-siloxane) gel matrix that contains at least one wavelength conversion material, such as one or more phosphors in powdered and/or particulate form. ... Osram Gmbh

12/01/16 / #20160346857

Device comprising a connecting component and method for producing a connecting component

A device is specified, said device comprising a first component (1), a second component (2), and a connecting component (3) comprising at least a first region (31) and at least a second region (32). The composition of the first region (31) differs from the composition of the second region (32). ... Osram Gmbh

11/24/16 / #20160343972

Optoelectronic component and method of producing an optoelectronic component

The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).. . ... Osram Gmbh

11/24/16 / #20160343971

Light-emitting device and method of producing a light-emitting device

A light-emitting device includes a substrate having a substrate upper side, a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence includes a plurality of emission regions that emit light, current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emissionr egions of the layer sequence are arranged next to the current-conducting rails, an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass, and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.. . ... Osram Gmbh

11/24/16 / #20160343917

Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaving free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is absorbent and/or reflective and/or scattering for the primary radiation.. . ... Osram Gmbh

11/24/16 / #20160341673

Light-emitting apparatus

In various embodiments, a light-emitting apparatus is provided. The light-emitting apparatus includes at least one semiconductor light source configured to emit at least one primary light beam, a deflection device configured to deflect the at least one primary light beam onto respectively associated different positions on a phosphor body, at least one light detector configured to detect light that was emitted by the phosphor body, and an evaluation device. ... Osram Gmbh

11/17/16 / #20160336527

Method for producing an optoelectronic arrangement, and optoelectronic arrangement

A method for producing an optoelectronic arrangement and an optoelectronic arrangement. In an embodiment the method includes providing a connection carrier having a contact surface and two connection points, which are electrically conductively connected with the contact surface, providing an optoelectronic device having a connection surface, introducing an electrically conductive bonding material between the contact surface of the connection carrier and the connection surface of the optoelectronic device and heating the contact surface of the connection carrier by energizing the contact surface via the two connection points, wherein the electrically conductive bonding material is heated by the contact surface such that the bonding material melts or hardens.. ... Osram Gmbh

11/17/16 / #20160336495

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

The invention relates to an optoelectronic semiconductor component comprising an optoelectronic semiconductor chip. In particular, the optoelectronic semiconductor component is a radiation-emitting semiconductor component which is designed as a side emitter. ... Osram Gmbh

11/17/16 / #20160336491

Method for producing a ceramic conversion element and light-emitting device

A method for producing a ceramic conversion element and a light-emitting device are disclosed. In an embodiment the method includes providing at least four functional layers, each being a green body or a ceramic, wherein first functional layer is formed as a first luminous layer comprising an oxide and configured to at least partially convert light of a first wavelength range into light of a second wavelength range, wherein a second functional layer is formed as a second luminous layer comprising a nitride and configured to at least partially convert light of the first wavelength range into light of a third wavelength range, wherein a third functional layer is formed as a first intermediate layer, wherein the first intermediate layer comprises an oxide, wherein a fourth functional layer is formed as a second intermediate layer, and wherein the second intermediate layer comprises a nitride or an oxynitride.. ... Osram Gmbh

11/17/16 / #20160336307

Semiconductor component and method of producing a semiconductor component

A method of producing a semiconductor component includes providing a carrier with a first insulation layer, a mirror layer at least partially covered by the first insulation layer and a connection element, wherein the carrier includes an exposed planar mounting surface and the connection element extends through the first insulation layer to the mounting surface, providing a main body with a semiconductor body, a second insulation layer and a contact element to electrically contact the semiconductor body, wherein the main body has an exposed planar contact surface and the contact element extends through the second insulation layer to the contact surface, and connecting the main body to the carrier, wherein the planar contact surface and the planar mounting surface are brought together to form a connecting surface, and the contact element and the connection element electrically connect with one another.. . ... Osram Gmbh

11/17/16 / #20160336301

Surface-mountable multi-chip component

A surface-mountable multi-chip component includes a carrier having a first connection element, a second connection element and third connection element that are electrically insulated from one another. A first semiconductor chip is arranged on the first connection element and electrically connected to the first and second connection elements. ... Osram Gmbh

11/17/16 / #20160334552

Ceramic wavelength converter having a high reflectivity reflector

There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. ... Osram Gmbh

11/17/16 / #20160334090

Connector for lighting devices and corresponding method

A connector for connecting mutually facing ends of elongate lighting devices is provided. The connector includes a connector body having opposed end regions coupleable to the facing ends of said lighting devices. ... Osram Gmbh

11/10/16 / #20160330821

Power line communication for lighting systems

Techniques are provided for bi-directional communication between a power supply and one or more light engines (and/or other lighting system components) via the existing power lines so that no additional communication wires are needed. In particular, the power supply can transmit information by modulating its output (voltage or current) and the light engine (or other lighting componentry, such as a sensor) can communicate back by modulating how much power it draws from the power supply. ... Osram Gmbh

11/10/16 / #20160330807

Circuit arrangement for operating light sources

A circuit arrangement for operating light sources includes input terminals for a power supply system voltage, a first rectifying circuit, a boost converter having output terminals, a half-bridge arrangement having two switches, which is connected to the output terminals of the boost converter, an inductance, the first terminal of which is coupled to the centre point of the half-bridge, and a second rectifying circuit, the first input terminal of which is coupled to the second terminal of the inductance and the second input of which is coupled to one of the output terminals of the boost converter. The output terminals of the second rectifying circuit are coupled to the inputs of a current-compensated inductor. ... Osram Gmbh

11/10/16 / #20160330465

Coding method for data compression of power spectra of an optoelectronic component and decoding method

A coding method for data compression of a power spectra of an optoelectronic component and a decoding method are disclosed. In an embodiment, a coding method includes providing a power spectrum, sampling the power spectrum at particular sampling wavelengths in order to provide a discrete source spectrum, indexing the discrete source spectrum in order to provide a source graph having discrete source values, producing an image graph having discrete image values by transforming the source graph from a source range into an image range with a discrete frequency transform, performing compression of the image graph, and digitizing the compressed image graph in order to produce compressed spectral data.. ... Osram Gmbh

11/10/16 / #20160329526

Uv-protected component for oleds

The present invention relates to an organic radiation-emitting component with an active organic layer constituted to generate radiation and one or two radiation-output sides, characterised in that, on at least one radiation-output side of the component, a uv protective film is arranged and connected to the component, wherein the uv protective film contains at least one first layer (a) and a second layer (b), wherein the first layer (a) contains 0.01 to 20% by weight, with reference to the total weight of the first layer (a), of a uv absorber, and wherein the second layer (b) contains polycarbonate. Furthermore, the invention relates to the use of a component according to the invention as an organic light-emitting diode, and for lighting, especially for general lighting.. ... Osram Gmbh

11/10/16 / #20160329515

Organic light-emitting component and method for producing an organic light-emitting component

An organic light-emitting component may include a first electrode, an organic functional layer structure over the first electrode in order to generate light, and a second electrode over the organic functional layer structure. The organic functional layer structure includes at least one layer having an organic carrier material, which has a first refractive index, and having nano-additives which are embedded in the carrier material and have a second refractive index, which is greater than the first refractive index, and which have at least one external dimension which is less than one fourth of a predetermined wavelength of the light generated. ... Osram Gmbh

11/10/16 / #20160329511

Organic light-emitting component

An organic light-emitting component includes an organic light-emitting diode which has at least one organic layer arranged to generate light and a printed circuit board with electrical conductor tracks. The printed circuit board is an integral component of the organic light-emitting diode. ... Osram Gmbh

11/10/16 / #20160329470

Luminescence conversion element and optoelectronic semiconductor component comprising such a luminescence conversion element and method of producing same

A luminescence conversion element for wavelength conversion of primary electromagnetic radiation into secondary electromagnetic radiation includes first luminescent material particles that, when excited by the primary electromagnetic radiation, emit a first electromagnetic radiation, a peak wavelength of which is at least 515 nm to at most 550 nm of a green region of the electromagnetic spectrum; second luminescent material particles that, when excited by the primary electromagnetic radiation, emit a second electromagnetic radiation, a peak wavelength of which is at least 595 nm to at most 612 nm of a yellow-red region of the electromagnetic spectrum; and third luminescent material particles that, when excited by the primary electromagnetic radiation, emit a third electromagnetic radiation, a peak wavelength of which is at least 625 nm to at most 660 nm of a red region of the electromagnetic spectrum.. . ... Osram Gmbh

11/10/16 / #20160329316

Lighting module for emitting mixed light

A lighting module for emitting mixed light comprises at least one first semiconductor element which emits unconverted red light, at least one second semiconductor element which emits converted greenish white light having a first conversion percentage, at least one third semiconductor element which emits greenish white light having a second conversion percentage that is smaller than the first conversion percentage, and at least one resistor element having a temperature-dependent electric resistance, the second semiconductor element being connected in parallel to the third semiconductor element.. . ... Osram Gmbh

11/10/16 / #20160329205

Lamp

In various embodiments, a lamp is provided. The lamp includes a lamp vessel, and a sleeve which surrounds the lamp vessel. ... Osram Gmbh

11/10/16 / #20160327235

Irradiation apparatus having radiation unit

An irradiation apparatus includes a radiation unit for the emission of radiation in the form of a beam, a first microlens arrangement, downstream of the radiation unit, having a multiplicity of convergent microlenses, for dividing the beam into one partial beam per convergent microlens, and a convergent lens, downstream of the microlens arrangement, that overlays the partial beams, in an irradiated area. The microlenses have a first group and a second group. ... Osram Gmbh

11/10/16 / #20160327223

Lighting device and corresponding method

A lighting device includes a laminar support member bendable at bending lines extending in a common direction, said bending lines partitioning said laminar support member in a plurality of stripes. Said plurality of stripes includes at least one first stripe with electrically-powered light radiation sources therealong and at least one second stripe free from light radiation sources forming a side wing for said at least one first stripe.. ... Osram Gmbh

11/10/16 / #20160326430

Phosphor, method for producing a phosphor and use of a phosphor

A phosphor is disclosed. In an embodiment a phosphor includes an inorganic substance which includes, in its composition, at least an element d, an element al, an element ax, an element sx and an element nx where d includes one, two or more elements selected from the group consisting of mn, ce, pr, nd, sm, eu, tb, dy, ho, er, tm, alkali metals and yb, al includes one, two or more elements selected from the group consisting of divalent metals not included in d, sx includes one, two or more elements selected from the group consisting of tetravalent metals, ax includes one, two or more elements selected from the group consisting of trivalent metals, and nx includes one, two or more elements selected from the group consisting of o, n, s, c, cl, and f, wherein the inorganic substance has the same crystal structure as sr(sraca1−a)si2al2n61.. ... Osram Gmbh

11/10/16 / #20160325532

Uv-protective film for oleds

The present invention concerns a plastic foil, comprising at least one first layer of a plastic composition containing a first transparent plastic, as well as 0.01 to 15 wt. % transparent polymer diffusion particles, related to the total mass of the first layer, and at least one second layer of a plastic composition, containing a second transparent plastic and 0.01 to 5 wt. ... Osram Gmbh

11/03/16 / #20160323942

Optoelectronic component with protective circuit

An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.. . ... Osram Gmbh

11/03/16 / #20160322605

Organic light-emitting element and method of producing an organic light-emitting element

An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on a translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement, and the thin-film encapsulation arrangement is arranged directly on the translucent protective layer.. . ... Osram Gmbh

11/03/16 / #20160322551

Optoelectronic component with asymmetric carrier arms

An optoelectronic component includes a housing that includes a rectangular basic shape with four sides. The sides each merge into one another at a corner point. ... Osram Gmbh

11/03/16 / #20160322547

Silicone-grafted core-shell particles, polymer matrix, and led containing same

A silicone-grafted core-shell particle is described wherein the silicone-grafted core-shell particle comprises a core of an inorganic particle and a shell of a grafted poly(dimethylsiloxane) polymer formed from a bi-terminated poly(dimethylsiloxane) having reactive groups at each terminal end. The silicone-grafted core-shell particles may be dispersed in a polysiloxane polymer matrix and employed as an led encapsulant.. ... Osram Gmbh

11/03/16 / #20160320010

Motor vehicle accent lamp and methods of use thereof

A method of providing accent ornamental illumination to a lamp of a motor vehicle comprising providing an accent lamp comprising a housing and a light-emitting device disposed within the housing; mounting the housing to an exterior surface of the lens cover of the vehicle lamp; and arranging the light-emitting device such that, when the housing is mounted to the exterior surface of the lens cover of the lamp, light emitted from the light-emitting device passes through the lens cover from outside the lens cover towards a lamp reflector of the vehicle lamp and illuminates the reflector. A motor vehicle lamp combination comprising, in combination, a motor vehicle lamp and an accent lamp also provided wherein, when the accent lamp is mounted on a lens cover of the motor vehicle lamp, light emitted from the light-emitting device is directed towards the reflector.. ... Osram Gmbh

11/03/16 / #20160319998

Lamp with optoelectronic light source and improved isotropy of the radiation

The invention relates to an optoelectronic lamp with improved omi-directionality by using a reflector cap having an opening.. . ... Osram Gmbh

10/27/16 / #20160315446

Semiconductor laser diode, method for producing a semiconductor laser diode and semiconductor laser diode arrangement

A semiconductor laser diode is specified, comprising a semiconductor layer sequence (1) with semiconductor layers applied vertically one above another with an active layer (11), which emits laser radiation via a radiation coupling-out surface during operation, wherein the radiation coupling-out surface is formed by a side surface of the semiconductor layer sequence (1), and a heat barrier layer (2) and a metallic contact layer (5) laterally adjacent to one another on a main surface (12) of the semiconductor layer sequence (1), wherein the heat barrier layer (2) is formed by an electrically insulating porous material (9). As a result, the heat arising during operation is conducted via the p-type electrode (5) to a heat sink (20) and the formation of a two-dimensional temperature gradient is avoided. ... Osram Gmbh

10/27/16 / #20160315231

Conversion element, method of producing a conversion element, optoelectronic device comprising a conversion element

A conversion element includes a platelet including an inorganic glass, and first converter particles having a shell and a core, wherein the shell includes an inorganic material and the core includes a nitride or oxynitride luminescent material and the first converter particles are arranged on and/or in the platelet.. . ... Osram Gmbh

10/27/16 / #20160312118

Phosphor, method for producing a phosphor and use of a phosphor

A phosphor is disclosed. In an embodiment a phosphor includes an inorganic substance which includes, in its composition, at least an element d, an element al, an element ax, an element sx and an element nx where d includes one, two or more elements selected from the group consisting of mn, ce, pr, nd, sm, eu, tb, dy, ho, er, tm, alkali metals and yb, al includes one, two or more elements selected from the group consisting of divalent metals not included in d, sx includes one, two or more elements selected from the group consisting of tetravalent metals, ax includes one, two or more elements selected from the group consisting of trivalent metals, and nx includes one, two or more elements selected from the group consisting of o, n, s, c, cl, and f, wherein the inorganic substance has the same crystal structure as sr(sraca1−a)si2al2n61.. ... Osram Gmbh

10/20/16 / #20160309553

Controlling a lamp having at least two semiconductor light sources

A control device for an illuminant having at least two semiconductor light sources and connectable to an electrical energy source, for converting an electrical power provided by the electrical energy source, by the semiconductor light sources, into an emitted light power dependent on the electrical power provided is disclosed. The semiconductor light sources are connected to the control device, and the control device is designed to set the electrical power provided by virtue of the control device including a clock generator designed to apply electrical power to the semiconductor light sources in clocked operation and to control said semiconductor light sources in accordance with clock pulse sequences individually assigned to the semiconductor light sources. ... Osram Gmbh

10/20/16 / #20160309552

Controlling a luminous means having at least two semiconductor light sources

Various embodiments relate to a control device for a luminous means which has at least two semiconductor light sources, can be connected to an electrical energy source and is intended to use the semiconductor light sources to convert an electrical power provided by the electrical energy source into an emitted light power dependent on the electrical power provided. The semiconductor light sources are connected to the control device and the control device adjust the electrical power provided by virtue of the control device having a clock generator which is designed to apply electrical power to the semiconductor light sources during clocked operation. ... Osram Gmbh

10/20/16 / #20160308169

Organic light-emitting component

An organic light-emitting component (100) is specified, which comprises a carrier (1) and an organic layering sequence (2) arranged on the carrier (1). The organic layering sequence (2) comprises at least two organic layers, wherein at least one of the organic layers is designed as an emitting layer (23). ... Osram Gmbh

10/20/16 / #20160308102

Optoelectronic component

An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.. . ... Osram Gmbh

10/20/16 / #20160307972

Optoelectronic component

An optoelectronic component and a method to operate the optoelectronic component are disclosed. In an embodiment the optoelectronic component includes an organic light-emitting diode configured to emit radiation through a main emission surface and a liquid crystal element configured to adjust a colour location of the radiation, wherein the liquid crystal element is switchable into a first state and into a second state, wherein the liquid crystal element in the first state is suitable for selectively reflecting light of a first wavelength range and in the second state is transparent, and wherein the liquid crystal element is arranged on a rear side of the organic light-emitting diode facing the main emission surface so that light of the first wavelength range that is emitted towards the rear side is at least partially reflected in a direction of the main emission surface in the first state of the liquid crystal element.. ... Osram Gmbh

10/20/16 / #20160307674

Varistor paste, optoelectronic component, method of producing a varistor paste and method of producing a varistor element

A varistor paste includes a matrix material and particles embedded into the matrix material, wherein the matrix material without embedded particles has a viscosity of less than 0.8 pa·s, and the embedded particles include varistor particles. An optoelectronic component includes an optoelectronic semiconductor chip and a varistor element connected in parallel with the optoelectronic semiconductor chip, wherein the varistor element includes a matrix material and particles embedded into the matrix material, the embedded particles include varistor particles, and the matrix material has a glass transition temperature of more than 130° c. ... Osram Gmbh

10/20/16 / #20160306089

Holographic foil and method for producing same

Described is a holographic film (100) whose transmission and/or reflection properties vary periodically along at least one of its directions of principal extent, said film being designed for at least partial transmission (22, 28) of light (20, 26) of at least one first wavelength range that is irradiated from a multiplicity of periodically disposed illuminants (200) and that impinges on the holographic film (100). Also described are a lighting means (300), a backlighting means and a method for producing a holographic film (100).. ... Osram Gmbh

10/20/16 / #20160304780

Luminescent-substance mixture, light-emitting semiconductor component having a luminescent-substance mixture, and streetlamp having a luminescent-substance mixture

A luminescent material mixture has a first luminescent material and a second luminescent material, wherein, under excitation with blue light, an emission spectrum of the first luminescent material has a relative intensity maximum in a yellowish-green region of the spectrum at a wavelength of greater than or equal to 540 nm and less than or equal to 560 nm and an emission spectrum of the second luminescent material has a relative intensity maximum in an orange-red region of the spectrum at a wavelength of greater than or equal to 600 nm and less than or equal to 620 nm.. . ... Osram Gmbh

10/20/16 / #20160304776

Conversion element, component and process for producing a component

A conversion element, a component and a method for producing the component are disclosed. In an embodiment the conversion element includes a phosphor configured to convert electromagnetic primary radiation into electromagnetic secondary radiation and a glass composition as matrix material in which the phosphor is embedded. ... Osram Gmbh

10/20/16 / #20160304391

Glass composition, component, and method for producing a component

A glass composition, a device and a method for producing the device are disclosed. In an embodiment, the glass composition includes a tellurium oxide in a proportion of at least 65 mol. ... Osram Gmbh

10/13/16 / #20160302309

Support structure for lighting devices and corresponding method

In various aspects of this disclosure, a support structure for lighting devices is provided. The support structure includes a ribbon-like support member with electrically conductive lines with mounting locations for electrically powered light radiation sources. ... Osram Gmbh

10/13/16 / #20160300985

Optoelectronic device and method for producing an optoelectronic device

An optoelectronic device and a method for producing an optoelectronic device are disclosed. The optoelectronic device includes an optoelectronic semiconductor chip and a conversion element arranged on the optoelectronic semiconductor chip. ... Osram Gmbh

10/13/16 / #20160300983

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor component and a method for manufacturing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a plurality of active regions configured to generate a primary radiation and a plurality of luminescent material particles configured to convert the primary radiation into a secondary radiation, wherein the active regions are arranged spaced apart from each other, wherein each active region has a main extension direction, wherein each active region has a core region comprising a first semiconductor material, wherein each active region has an active layer covering the core region, wherein each active region has a cover layer comprising a second semiconductor material and covering the active layer, wherein at least some of the luminescent material particles are arranged between the active regions, and wherein a diameter of a majority of the luminescent material particles is smaller than a distance between two adjacent active regions.. ... Osram Gmbh

10/13/16 / #20160300887

Method for operating an organic optoelectronic component

A method is specified for operating an organic optoelectronic component, which has at least one organic light-emitting element having an organic functional layer stack with at least one organic light-emitting layer between two electrodes and at least one organic light-emitting element having an organic light-detecting layer. These elements are arranged on a common substrate in laterally adjacent area regions. ... Osram Gmbh

10/13/16 / #20160300829

Optoelectronic semiconductor chip with built-in esd protection

Described is an optoelectronic semiconductor chip (1) with a built-in bridging element (9, 9a) for overvoltage protection.. . ... Osram Gmbh

10/13/16 / #20160300825

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

The invention relates to a method for producing a plurality of optoelectronic semiconductor components (1), comprising the following steps: a) providing a semiconductor layer sequence (2) having a plurality of semiconductor body regions (200); b) providing a plurality of carrier bodies (3), which each have a first contact structure (31) and a second contact structure (32); c) forming a composite (4) having the semiconductor layer sequence and the carrier bodies in such a way that adjacent carrier bodies are separated from one another by interspaces (35) and each semiconductor body area is electrically conductive connected to the first contact structure and the second contact structure of the associated carrier body; and d) separating the composite into the plurality of semiconductor components, wherein the semiconductor components each have a semiconductor body (20) and a carrier body. The invention further relates to an optoelectronic semiconductor component (1).. ... Osram Gmbh

10/13/16 / #20160300820

Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component

A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: a) creating a blank by pultrusion from a glass melt, b) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, c) producing conductor tracks on the mounting side, d) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and e) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps a) to d) are performed in the stated sequence.. ... Osram Gmbh

10/13/16 / #20160298011

Optoelectronic component comprising a bonding layer and method for producing a bonding layer in an optoelectronic component

An optoelectronic component and a method for manufacturing an optoelectronic component are provided. In an embodiment, the optoelectronic component includes a layer sequence having an active layer configured to emit electromagnetic primary radiation, a converter lamina disposed in a beam path of the electromagnetic primary radiation and a bonding layer disposed between the layer sequence and the converter lamina, wherein the bonding layer comprises an inorganic-organic hybrid material having si—o—al bonds and/or si—o—zr bonds.. ... Osram Gmbh

10/06/16 / #20160293896

Organic light-emitting device and method for producing the organic light-emitting device

An organic light-emitting device and a method for producing an organic light-emitting device are disclosed. In an embodiment, the oled includes a substrate, a first electrode disposed on the substrate, at least one first organic functional layer stack disposed on the first electrode, the first organic functional layer stack configured to emit radiation in a first wavelength range, a second electrode disposed on the first organic functional layer stack and a filter layer arranged in a beam path of the first organic functional layer stack, wherein the first wavelength range comprises a low-energy sub-range and a high-energy sub-range and wherein the filter layer comprises an absorption range containing the low-energy or the high-energy sub-range of the first wavelength range.. ... Osram Gmbh

10/06/16 / #20160293812

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.. ... Osram Gmbh

10/06/16 / #20160293804

Housing for a semiconductor chip, housing composite, semiconductor component and method of producing a semiconductor component

A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.. . ... Osram Gmbh

10/06/16 / #20160293587

Optoelectronic semiconductor apparatus and carrier assembly

A semiconductor apparatus with an optoelectronic device and a further device is disclosed. Embodiments of the invention provide a semiconductor apparatus with an optoelectronic device and a further device, wherein the optoelectronic device and the further device are interconnected to one another in parallel when the semiconductor apparatus is in operation, wherein the optoelectronic device is connected to a first contact and a second contact, the first contact and the second contact being configured to externally contact the semiconductor apparatus, and wherein the further device is connected with at least one further contact of the semiconductor apparatus.. ... Osram Gmbh

10/06/16 / #20160290856

Device and method for light conversion device monitoring

A light converter for a light source is disclosed, having a substrate and a light converting layer disposed thereon for receiving laser radiation and converting the same into visible light. A sensor is functionally integrated with the light converting layer for purposes of detecting the condition of the light converting layer and modifying an operation of the laser radiation source in response thereto.. ... Osram Gmbh

10/06/16 / #20160290618

Illuminating unit with two modules

An illuminating unit includes at least two modules, wherein each module includes a housing and a light-emitting device that is fixed to the housing, each housing includes beam forming optics, each housing includes four side walls, the first side wall includes a first mechanical connector, the second side wall includes a second mechanical connector, the first mechanical connector of the first module connects with the second mechanical connector of the second module, and the first side wall and the second side wall of the housings of the first and second module have the same shape.. . ... Osram Gmbh

09/29/16 / #20160286625

Gesture-based control techniques for lighting systems

Techniques and architecture are disclosed for gesture-based control techniques for lighting systems. In some cases, the lighting system may include a camera and/or other suitable componentry to interpret gestures made by a user for controlling light output. ... Osram Gmbh

09/29/16 / #20160285032

Optoelectronic component, method for operating an optoelectronic component, and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component may include a first electrode having a first electrically conductive substance, a second electrode having a second electrically conductive substance, and at least one active substance. ... Osram Gmbh

09/29/16 / #20160285031

Electronic device

An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. ... Osram Gmbh

09/29/16 / #20160284943

Optoelectronic component

An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.. . ... Osram Gmbh

09/29/16 / #20160284931

Light emitting semiconductor component including an absorptive layer

A radiation-emitting semiconductor device includes a semiconductor body with a semiconductor layer sequence, wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorptive region, and the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength shorter than the peak wavelength.. . ... Osram Gmbh

09/29/16 / #20160284679

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. ... Osram Gmbh

09/29/16 / #20160282271

Method for the optical characterization of an optoelectronic semiconductor material and device for carrying out the method

A method is provided for a full-area optical characterization of an optoelectronic semiconductor material which is provided for producing a plurality of optoelectronic semiconductor chips and which has a band gap which specifies a characteristic wavelength of the semiconductor material. The method includes full-area irradiating a major surface of the optoelectronic semiconductor material with light having an excitation wavelength which is less than the characteristic wavelength of the semiconductor material, with the full-area irradiating generating electron-hole pairs in the semiconductor material. ... Osram Gmbh

09/22/16 / #20160277120

Radiation receiver apparatus

Radiation receiver apparatus with a radiation receiver and a radiation entrance face, wherein the radiation receiver includes an active region that detects radiation with a target wavelength in the near-infrared, an optical element is arranged between the radiation entrance face and the radiation receiver, an optical axis of the optical element extends through the radiation receiver, the optical element is shaped and arranged relative to the radiation receiver such that, of radiation incident on the radiation entrance face at an angle of greater than or equal to 40° to the optical axis, at most 10% is incident on the radiation receiver, and a visible light filter is formed between the radiation receiver and the radiation entrance face.. . ... Osram Gmbh

09/22/16 / #20160276630

Optoelectronic component, contact-making device, and optoelectronic subassembly

An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. ... Osram Gmbh

09/22/16 / #20160276605

Element for stabilising an optoelectronic device, method for producing an element and optoelectronic device

An element (1) is provided for stabilising an optoelectronic device (7), wherein the element (1) comprises a main body (1c), wherein the main body (1c) consists of a glass or at least comprises a glass and wherein the main body (1c) comprises a first and a second surface (1a, 1b). The first and second surface (1a, 1b) are opposite to one another and extend in each case in a lateral main direction of extension of the element (1), wherein a protective layer (2a, 2b) is formed at least at one of the surfaces (1a, 1b) and wherein the protective layer (2a, 2b) is configured and arranged in such a way that cracks (3) present in the main body (1c) are filled in by a material of the protective layer (2a, 2b). ... Osram Gmbh

09/22/16 / #20160276556

Optoelectronic component, optoelectronic arrangement, method of producing an optical element, and method of producing an optoelectronic component

An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the radiation-emitting face, wherein the optical element includes a material in which light-scattering particles are embedded, and a concentration of the embedded light-scattering particles has a gradient forming an angle not equal to 90° with the radiation emission face.. . ... Osram Gmbh

09/22/16 / #20160276552

Optoelectronic semiconductor chip and optoelectronic semiconductor component

An optoelectronic semiconductor chip has a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface and runs parallel to the top surface at least in places. The top surface includes a radiation exit surface, through which electromagnetic radiation generated during operation in the active zone emerges. ... Osram Gmbh

09/22/16 / #20160276545

Electronic component and method for producing an electronic component

In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially curing the adhesive layer applied to the carrier, providing a chip, wherein the chip has a substrate and a layer sequence arranged on the substrate, laying the chip onto the initially cured adhesive layer by way of a top side of the layer sequence, embedding the chip into a shaped body, wherein the top side of the layer sequence and a first side of the shaped body lie substantially in a plane, separating the embedded chip from the adhesive layer and the carrier, and applying an electrically conductive structure to the first side of the shaped body, the shaped body forming a vertical electrical insulation between the electrically conductive structure and the substrate.. ... Osram Gmbh

09/22/16 / #20160276534

Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

An optoelectronic semiconductor chip (1) is provided which has a semiconductor body comprising a semiconductor layer sequence (2) with an active region (20) provided for generating and/or receiving radiation, a first semiconductor region (21) of a first conduction type, a second semiconductor region (22) of a second conduction type and a cover layer (25). The active region (20) is arranged between the first semiconductor region (21) and the second semiconductor region (22) and comprises a contact layer (210) on the side remote from the active region. ... Osram Gmbh

09/22/16 / #20160276531

Semiconductor layer sequence and method of producing the same

A semiconductor layer sequence includes an n-conducting n-type side, a p-conducting p-type side, and an active zone between the sides, the active zone simultaneously generating a first radiation having a first wavelength and a second radiation having a second wavelength, the active zone including at least one radiation-active layer having a first material composition that generates the first radiation, the at least one radiation-active layer is oriented perpendicular to a growth direction of the semiconductor layer sequence, the active zone includes a multiplicity of radiation-active tubes having a second material composition and/or having a crystal structure that generates the second radiation, which crystal structure deviates from the at least one radiation-active layer, and the radiation-active tubes are oriented parallel to the growth direction, the radiation-active tubes having an average diameter of 5 nm to 100 nm and an average surface density of the radiation-active tubes of 108 1/cm2 to 1011 1/cm2.. . ... Osram Gmbh

09/22/16 / #20160274442

Extensive light-emitting element for a flash apparatus, flash apparatus and electronic device comprising a flash apparatus

An extensive light-emitting element, a flash apparatus and an electronic device having a flash apparatus are disclosed. In an embodiment the extensive light-emitting element includes at least one oled, wherein the oled comprises an organic light-emitting layer sequence arranged between a substrate and a covering layer, and wherein the organic light-emitting layer sequence comprises a recess in a region of the extensive light-emitting element.. ... Osram Gmbh

09/22/16 / #20160274351

Lighting device and method for operating a lighting device

A lighting device includes a carrier, in which a laterally extended cavity is formed, a light source arranged alongside the cavity and serving for generating light that propagates from the light source through the cavity, a fluid reservoir for receiving a fluid, and a microfluid pump, which is designed for shifting the fluid received in the fluid reservoir between the fluid reservoir and the cavity.. . ... Osram Gmbh

09/22/16 / #20160273736

Method for producing a multifunctional layer, electrophoresis substrate, converter plate and optoelectronic component

A method for producing a multifunctional layer, a method for producing an electrophoresis substrate, and a method for producing a converter plate and an optoelectronic component are disclosed. In an embodiment the method includes providing an electrophoresis substrate comprising a carrier having a front side and a back side, wherein a first electrically conductive layer and a second electrically conductive layer are located on the front side, electrophoretically depositing a first material onto the first electrically conductive layer, electrophoretically depositing a second material onto the second electrically conductive layer and arranging a filler material between the first material and the second material, wherein the filler material forms a common boundary surface with the first material and the second material.. ... Osram Gmbh

09/22/16 / #20160273726

Multimode color tunable light source and daylighting system

Described herein are day lighting systems that utilize a combination of at least one natural light source with at least one multimode artificial light source. Also disclosed are methods for designing and operating such systems.. ... Osram Gmbh

09/15/16 / #20160270167

Light source module, power supply unit for operating a light source module of this kind, and lighting system

A light source module may include at least one led cascade with a plurality of leds, a supply line, wherein at the input side the led cascade is coupled thereto, and a ground line. The light source module further includes a communications line for coupling to a control device for the current to be provided by the current source, a thermal derating unit coupled between a first voltage source and the communications line and including a temperature-sensitive element, wherein the thermal derating unit applies a temperature dependent current component determined depending on the temperature-sensitive element, to the communications line, at least one current measurement resistor connected in series between the led cascade and the reference potential, wherein the conductance of the current measurement resistor is proportional to the current requirement of the led cascade, and at least one coupling resistor coupled between the coupling point and the communications line.. ... Osram Gmbh

09/15/16 / #20160269120

Circuit arrangement, light-emitting diode assembly, and method of actuating an optoelectronic component

A circuit arrangement that actuates an optoelectronic component includes a first node, a second node, a third node, and a fourth node, wherein a supply voltage may be applied between the first node and the fourth node, the first node connects to the second node, an optoelectronic component is optionally arranged between the second node and the third node, a first transistor is arranged between the third node and the fourth node to switch a channel between the third node and the fourth node, and a series circuit including a first resistor, a coil and a second transistor is arranged between the first node and the third node.. . ... Osram Gmbh

09/15/16 / #20160268775

Semiconductor laser having a ridge structure widened on one side

A semiconductor laser includes a main body and a ridge structure arranged on the main body, the ridge structure being oriented along a longitudinal axis above an active zone, wherein the ridge structure has a first width, the ridge structure has two opposite end faces along the longitudinal axis, adjacent to at least one end face, the ridge structure has an end section arranged on one side with respect to a center axis of the ridge structure such that the ridge structure is widened on one side adjacent to the end face, and on an opposite side of the ridge structure relative to the end section a fracture trench is arranged adjacent to the end face and at a distance from the ridge structure in a surface of the main body.. . ... Osram Gmbh

09/15/16 / #20160268550

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component may include a light-transmissive carrier, a light-transmissive electrode above the carrier, an organic functional layer structure, which has a first refractive index, above the first electrode, a light-transmissive current distributing layer above the organic functional layer structure, a light-transmissive tir layer, which has a second refractive index, which is less than the first refractive index, above the current distributing layer, a specularly reflective current supply layer above the tir layer, and at least one current conducting element which extends through the tir layer and electrically couples the current supply layer and the current distributing layer to one another.. ... Osram Gmbh

09/15/16 / #20160268535

Organic light-emitting component

In various embodiments, an organic light-emitting component is provided. The organic light-emitting component has a carrier, a first electrode above the carrier, an organic functional layer structure above the first electrode and a second electrode above the organic functional layer structure. ... Osram Gmbh

09/15/16 / #20160268488

Wavelength conversion element, method of making, and light-emitting semiconductor component having same

In various embodiments, a wavelength conversion element is provided. The wavelength conversion element includes a ceramic grid material, which forms a grid having a plurality of openings, which are surrounded by the grid material in a main extension plane of the grid and reach through the grid in a direction perpendicular to the main extension plane of the grid, wherein the openings are filled with conversion segments.. ... Osram Gmbh

09/15/16 / #20160268186

Method of producing a large number of support apparatus which can be surface-mounted, arrangement of a large number of support apparatus which can be surface-mounted, and support apparatus which can be surface-mounted

A method of producing a multiplicity of surface-mountable carrier devices includes: a) providing a carrier plate having a first main face and a second main face located opposite the first main face, b) applying an electrically conductive layer to the first main face, c) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, d) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and e) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.. . ... Osram Gmbh

09/08/16 / #20160262234

Circuit assembly for operating at least a first and a second cascade of leds

A circuit assembly for operating at least a first and a second cascade of leds is disclosed. The led cascades have a different number of leds. ... Osram Gmbh

09/08/16 / #20160260920

Organic light-emitting device and method for producing an organic light-emitting device

Disclosed is an organic light-emitting, component which comprises a substrate, a first electrode on the substrate, a first organic functional layer stack on the first electrode, a charge carrier-generating layer stack on the first organic functional layer stack, a second organic functional layer stack on the charge carrier-generating layer stack, and a second electrode on the second organic functional layer stack. The charge carrier-generating layer stack comprises at least one hole-transporting layer, one electron-transporting layer and one intermediate layer, wherein the at least one intermediate layer comprises a naphthalocyanine derivative.. ... Osram Gmbh

09/08/16 / #20160260874

Producing a lighting module

A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light source, laterally surrounding the at least one semiconductor light source by a wall, applying at least one prefabricated diffuser element to at least one semiconductor light source, introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source, and potting at least part of the at least one diffuser element.. ... Osram Gmbh

09/08/16 / #20160260870

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. ... Osram Gmbh

09/08/16 / #20160260791

Double-sided emissive organic display device and method for producing a double-sided emissive organic display device

A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.. . ... Osram Gmbh

09/08/16 / #20160258588

Optoelectronic semiconductor component and adaptive headlight for a motor vehicle

An optoelectronic semiconductor component and an adaptive headlight are disclosed. In an embodiment an optoelectronic semiconductor component includes a carrier having a carrier top side and a carrier underside, a plurality of active zones, which are fitted at the carrier top side and which are designed for emitting radiation, electrical contact locations at the carrier underside, which are designed for electrically connecting the semiconductor component and a drive unit for electrically addressing the semiconductor component and for electrically driving the active zones, wherein the active zones are fitted in a regular grid at the carrier top side, wherein the grid has a grid pitch, wherein geometrical midpoints of radiation main sides of the active zones lie on grid points of the grid, and wherein a distance between the geometrical midpoints of marginal active zones and a closest edge of the carrier is at most 50% of the grid pitch.. ... Osram Gmbh

09/01/16 / #20160255684

Drive circuit and illumination device comprising the drive circuit

Various embodiments may relate to a drive circuit of an illumination device. The drive circuit has an output terminal connected to a load of the illumination device. ... Osram Gmbh

09/01/16 / #20160254427

Optoelectronic component and method for securing same

An optoelectronic component includes a light-emitting diode and a receiving device on which the light-emitting diode is received. The receiving device includes a securing device that has an adhesive to allow the receiving device to be adhered to a carrier which supports the receiving device. ... Osram Gmbh

09/01/16 / #20160254424

Optoelectronic lighting device

A method of producing an optoelectronic lighting device includes providing a carrier on which is arranged at least one light-emitting diode including a surface that emits light during operation of the light-emitting diode, carrying out an injection molding process to encapsulate the light-emitting diode by molding as far as the light-emitting surface such that a molded housing is formed within which the light-emitting diode is encapsulated by molding, wherein the light-emitting surface remains at least partly free, shaping a reflector that reflects light emitted by the light-emitting surface during the injection molding process such that the reflector is formed integrally with the housing, at least partly masking the light-emitting surface, coating the reflector with a light-reflecting layer after the masking, and demasking the light-emitting surface after the coating.. . ... Osram Gmbh

09/01/16 / #20160254415

Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chips

The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2a) facing the semiconductor body, a second main surface (2b) facing away from the semiconductor body, and a sidewall (2c) arranged between the first main surface and the second main surface. ... Osram Gmbh

09/01/16 / #20160252312

Two piece aluminum heat sink

A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. ... Osram Gmbh

08/25/16 / #20160248038

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component may include an electrode, and an organic functional layer structure formed for emitting an electromagnetic radiation or converting an electromagnetic radiation into an electric current. ... Osram Gmbh

08/25/16 / #20160247990

Optoelectronic component and method for the production thereof

A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side of the auxiliary carrier; providing a carrier structure having a top side and a rear side situated opposite the top side, wherein an insulation layer is arranged at the rear side of the carrier structure; connecting the sacrificial layer to the insulation layer by an electrically conductive connection layer; creating at least one blind hole extending from the top side of the carrier structure as far as the insulation layer; opening the insulation layer in a region of the at least one blind hole; arranging an electrically conductive material in the at least one blind hole; detaching the auxiliary carrier by separating the sacrificial layer; and patterning the electrically conductive connection layer.. . ... Osram Gmbh

08/25/16 / #20160247986

Semiconductor component and method of producing a semiconductor component

A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° c.; and curing the molding compound.. . ... Osram Gmbh

08/25/16 / #20160247966

Producing a light-emitting semiconductor component by connecting first and second semiconductor bodies

The invention relates to a light-emitting semiconductor component, comprising—a first semiconductor body (1), which comprises an active zone (11) in which during the operation of the light-emitting semiconductor component electromagnetic radiation is generated, at least some of which leaves the first semiconductor body (1) through a radiation exit surface (1a), and—a second semiconductor body (2), which is suitable for converting the electromagnetic radiation into converted electromagnetic radiation having a longer wavelength, wherein—the first semiconductor body (1) and the second semiconductor body (2) are produced separately from each other,—the second semiconductor body (2) is electrically inactive, and—the second semiconductor body (2) is in direct contact with the radiation exit surface (1a) and is attached there to the first semiconductor body (1) without connecting means.. . ... Osram Gmbh

08/25/16 / #20160247855

Display device and method for producing a display device

A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. ... Osram Gmbh

08/25/16 / #20160247789

Method of arranging a multiplicity of leds in packaging units, and packaging unit including a multiplicity of leds

A method of arranging a multiplicity of leds in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an led from the multiplicity of leds not yet arranged in one of the packaging units; measuring the at least one photometric measurement variable for the selected led; equipping one of the packaging units containing fewer than n−1 leds with the selected led; storing a measured value and a position of the selected led in the packaging unit in a memory; repeating until the packaging units are equipped with n−1 leds; repeating and calculating the average value of the photometric measurement variable, equipping a packaging unit for which the calculated average value of the variable lies in a defined range with the selected led; and storing the measured value and the position of the selected led.. . ... Osram Gmbh

08/25/16 / #20160245477

Lamp having a glass bulb and semiconductor light source

A lamp includes a tubular glass bulb with open end sides, at least one elongate carrier, inserted into the glass bulb, for at least one light strip, at least one elastic diffuser layer which is introduced into the glass bulb, and two bases which are fitted onto the open end sides of the glass bulb. The at least one light strip has a strip-shaped circuit board with a front-side conduction structure and with at least one semiconductor light source which is electrically connected thereto. ... Osram Gmbh

08/18/16 / #20160240815

Optoelectronic component, optoelectronic assembly, method for producing an optoelectronic component and method for producing an optoelectronic assembly

An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.. . ... Osram Gmbh

08/18/16 / #20160240813

Electronic component and method for producing an electronic component

The invention relates to an electronic component (1) with a substrate (2), on which an organic electronic functional area (3) is arranged, and a cover (4) which extends over the electronic functional area. Said cover is connected to the substrate by means of an electrically conductive solder layer (5). ... Osram Gmbh

08/18/16 / #20160240756

Optoelectronic component and method of producing same

An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.. . ... Osram Gmbh

08/18/16 / #20160240747

Optoelectronic component and method of production thereof

An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.. . ... Osram Gmbh

08/18/16 / #20160240736

Semiconductor chip and method of separating a composite into semiconductor chips

The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. ... Osram Gmbh

08/18/16 / #20160240734

Optoelectronic semiconductor device

An optoelectronic semiconductor component includes a layer stack based on a nitride compound semiconductor and has an n-type semiconductor region , a p-type semiconductor region and an active layer arranged between the n-type semiconductor region and the p-type semiconductor region. In order to form an electron barrier, the p-type semiconductor region includes a layer sequence having a plurality of p-doped layers composed of alxinga1-x-yn where 0<=x<=1, 0<=y<=1 and x+y<=1. ... Osram Gmbh

08/18/16 / #20160238234

Organic lighting device and lighting equipment

A glazing comprising a luminous means with a substrate having a first main surface, to which a first electrode is applied, a second electrode, and an organic layer stack within an active region of the substrate between the first and the second electrode, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the luminous means is arranged between two glass plates of the glazing of a window. Also, storage furniture is disclosed comprising a storage element shaped in planar fashion and having at least one storage surface and at least one radiation-emitting component, and at least one holding apparatus for holding the storage element.. ... Osram Gmbh

08/18/16 / #20160238203

Light source utilizing wavelength conversion

There is herein described a light source comprising a semiconductor device emitting a primary light, a thermally conductive optic having a reflective coating and a wavelength converter having a front surface and a rear surface. The optic is mounted to the rear surface of the wavelength converter and the primary light impinges on the wavelength converter in an emission region. ... Osram Gmbh

08/11/16 / #20160233786

Synchronous rectifier

Various embodiments may relate to a synchronous rectifier including at least one rectifier cell, to which power is supplied via a secondary winding of a transformer arranged between the input connections of the synchronous rectifier. The rectifier cell comprises a bipolar main switch operated in the inverse mode, wherein an energy store is provided in the base line of the bipolar main switch, which energy store, in conjunction with an auxiliary switch which is concomitantly controlled by the relevant secondary winding for the bipolar main switch, ensures that the main switch is switched off prior to the end of the inverse phase.. ... Osram Gmbh

08/11/16 / #20160233455

Component and method for producing a component

Various embodiments may relate to a component. The component includes an optically active region designed for electrically controllably transmitting, reflecting, absorbing, emitting and/or converting an electromagnetic radiation, and an optically inactive region formed alongside the optically active region, wherein the optically inactive region and/or the optically active region have/has an adaptation structure designed to adapt the value of an optical variable in the optically inactive region to a value of the optical variable in the optically active region.. ... Osram Gmbh

08/11/16 / #20160233398

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. ... Osram Gmbh

08/11/16 / #20160233276

Radiation-emitting device and method of producing same

A radiation-emitting device includes a substrate; and at least one layer sequence arranged on the substrate that generates electromagnetic radiation, including at least one first electrode area, at least one second electrode area, and at least one functional layer between the first electrode area and the second electrode area, wherein the functional layer generates electromagnetic radiation in a switched-on operating state, and at least one removal region is arranged between at least two points of the first electrode area conductively connected to one another by the first electrode area, the first electrode area being at least partly removed in the at least one removal region.. . ... Osram Gmbh

08/11/16 / #20160233200

Production of an optoelectronic component

A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips.. ... Osram Gmbh

08/11/16 / #20160230975

Safety switch for retrofit tube

A safety switch for a lighting device is disclosed. The lighting device includes a plurality of solid state light sources and a housing encompassing these. ... Osram Gmbh

08/04/16 / #20160227621

Techniques for lumen maintenance and color shift compensation

Techniques are disclosed for maintaining consistent lumen output of a lighting assembly over time. By maintaining a consistent lumen output, it is possible to maintain acceptable color stability where color mixing of multiple outputs is used. ... Osram Gmbh

08/04/16 / #20160226395

Solid state light source driver establishing buck or boost operation

A solid state light source driver circuit that operates in either a buck convertor or a boost convertor configuration is provided. The driver circuit includes a controller, a boost switch circuit and a buck switch circuit, each coupled to the controller, and a feedback circuit, coupled to the light source. ... Osram Gmbh

08/04/16 / #20160226028

Organic light-emitting device

An organic light-emitting device includes a substrate, on which a transparent electrode and a further electrode are applied. An organic light-emitting layer is arranged between the electrodes. ... Osram Gmbh

08/04/16 / #20160225964

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. ... Osram Gmbh

08/04/16 / #20160225957

Method for producing an optoelectronic semiconductor chip, and optoelectronic semiconductor chip

A method for producing an optoelectronic semiconductor chip is specified, comprising the following steps: providing an n-conducting layer (2), arranging a p-conducting layer (4) on the n-conducting layer (2), arranging a metal layer sequence (5) on the p-conducting layer (4),arranging a mask (6) at that side of the metal layer sequence (5) which is remote from the p-conducting layer (4),in places removing the metal layer sequence (5) and uncovering the p-conducting layer (4) using the mask (6), and in places neutralizing or removing the uncovered regions (4a) of the p-conducting layer (4) as far as the n-conducting layer (2) using the mask (6), wherein the metal layer sequence (5) comprises at least one mirror layer (51) and a barrier layer (52), and the mirror layer (51) of the metal layer sequence (5) faces the p-conducting layer (4).. . ... Osram Gmbh

08/04/16 / #20160225952

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer that generates radiation and at least one n-doped layer adjoining the active layer, the semiconductor layer sequence is based on alingan or on ingan, one or a plurality of central layers composed of algan each having thicknesses of 25 nm to 200 nm are grown at a side of the n-doped layer facing away from a carrier substrate, a coalescence layer of doped or undoped gan having a thickness of 300 nm to 1.2 μm is formed at a side of the central layer or one of the central layers facing away from the carrier substrate, a roughening extends from the coalescence layer as far as or into the n-doped layer, a radiation exit area of the semiconductor layer stack is formed partly by the coalescence layer, and the central layer is exposed in places.. . ... Osram Gmbh

08/04/16 / #20160225943

Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. ... Osram Gmbh

08/04/16 / #20160225749

Optoelectronic semiconductor chip and optoelectronic component

An optoelectronic semiconductor chip includes a semiconductor layer sequence. The semiconductor layer sequence includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, and an active zone having a p-n junction, which active zone is formed between the first semiconductor region and the second semiconductor region. ... Osram Gmbh

08/04/16 / #20160225747

Lighting module with semiconductor light sources and carrier plate

Various embodiments may relate to a lighting module which is equipped with several semiconductor light sources, in particular led-chips and includes a metallic carrier plate. Several metallic carrier substrates are arranged on the carrier plate and are electrically insulated therefrom. ... Osram Gmbh

08/04/16 / #20160223165

Optical unit for light-emitting structure, light-emitting structure, and light box including the light-emitting structure

Various embodiments may relate to an optical unit for a light-emitting structure, a light-emitting structure, and a light box comprising the light-emitting structure. The optical unit includes a body and a light-blocking structure, wherein the body includes at least one reflective surface, wherein the light-blocking structure includes a first light-blocking structure and a second light-blocking structure, wherein the first light-blocking structure is formed in one piece with the body, and the second light-blocking structure is arranged in the first light-blocking structure, wherein the first light-blocking structure is arranged to at least partially surround the reflective surface, to block the light leaks from the reflective surface by the second light-blocking structure.. ... Osram Gmbh

07/28/16 / #20160219673

Optoelectronic component device and method for operating an optoelectronic component

Various embodiments may relate to an optoelectronic component device, including an optoelectronic component and a control device for driving the optoelectronic component. The optoelectronic component includes a first optically active structure and a second optically active structure. ... Osram Gmbh

07/28/16 / #20160219659

Load driving circuit and illumination apparatus including the same

Various embodiments may relate to a load driving circuit and an illumination apparatus including the same. The load driving circuit includes a single-ended primary inductor converter (sepic) converter adapted to convert an input system voltage into a dc output voltage, and a buck converter 200 adapted to regulate a current and provide the regulated current to a load. ... Osram Gmbh

07/28/16 / #20160218265

Heat sink for an illumination device

A heat sink for an illumination device may include at least one heat sink portion which includes heat-conducting plastic. At least one metallic heat sink portion is at least partially embedded in the plastic material of the heat-conducting plastic.. ... Osram Gmbh

07/28/16 / #20160218261

Optoelectronic semiconductor component and method of fabricating an optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip including a light-transmissive carrier, a semiconductor layer sequence on the light-transmissive carrier and electrical connection points on a bottom portion remote from the light-transmissive carrier of the semiconductor layer sequence, a light-transmissive encapsulating material enclosing the optoelectronic semiconductor chip in places, and particles of a light-scattering and/or light-reflecting material, wherein the bottom of the semiconductor layer sequence is at least in places free of the light-transmissive encapsulating material, and the particles cover the bottom of the semiconductor layer sequence and an outer face of the encapsulating material in places.. . ... Osram Gmbh

07/28/16 / #20160218256

Light-emitting device

A light-emitting device is specified, said device comprising: a light-emitting semiconductor element (23) which emits greenish white light (10) during operation of the device, a filter element (4) which has a higher optical transmittance (11) in a spectral region of red light than in a spectral region of blue and green light, wherein the filter element (4) is arranged in such a way with respect to the light-emitting semiconductor element (23) that solely filtered light (12) which passes through the filter element (4) is emitted by the device during operation of the device, and the filtered light (12) is warm-white light.. . ... Osram Gmbh

07/28/16 / #20160218253

Radiation-emitting semiconductor device

A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.. . ... Osram Gmbh

07/28/16 / #20160218249

Optoelectronic component and method of production thereof

An optoelectronic component includes a carrier having an upper side which includes a first subarea and a second subarea, wherein the first subarea and the second subarea have different optical properties, and a method of producing an optoelectronic component includes providing a carrier having an upper side which includes a first subarea and a second subarea, and changing an optical property in the first subarea or in the second subarea.. . ... Osram Gmbh

07/28/16 / #20160218248

Optoelectronic light-emitting component and leadframe assemblage

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. ... Osram Gmbh

07/28/16 / #20160218241

Method of producing a semiconductor body

A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.. . ... Osram Gmbh

07/28/16 / #20160218097

Radiation-emitting semiconductor chip and method of producing radiation-emitting semiconductor chips

A radiation-emitting semiconductor chip having a semiconductor body including a semi-conductor layer sequence having an active region that generates radiation, a first semiconductor layer of a first conductor, and a second semiconductor layer of a second conductor different from the first conductor, and having a carrier on which the semiconductor body is arranged, wherein a pn junction is formed in the carrier, the carrier has a first contact and a second contact on a rear side facing away from the semiconductor body, and the active area and the pn junction connect to one another in antiparallel in relation to the forward-bias direction by the first contact and the second contact.. . ... Osram Gmbh

07/28/16 / #20160215959

Lighting device having light source and reflector having ellipsoidal reflection surface

A lighting device includes a light source, a reflector having an ellipsoidal reflection surface, an aspherical lens, and an exit pupil. The source is arranged at a first focal point of the reflection surface and a part of the emitted light is reflected from the reflection surface in the direction of a second focal point. ... Osram Gmbh

07/28/16 / #20160215949

Vehicle led bulb with polygonal light guide

An automotive led lamp having a light guide (28) having a single central bore (29) defined by a cylindrical wall (26) and an outer surface (31) defined by a plurality of outer wall segments (35) bounding, as seen in cross-section transverse the optical axis (18) a regular polygonal shape having more than four sides. The outer polygonal shape has between five sides and sixteen sides, preferably a ten-sided decagon.. ... Osram Gmbh

07/28/16 / #20160215948

Lighting device

A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.. ... Osram Gmbh

07/28/16 / #20160215934

Assembly of a semi-conductor lamp from separately produced components

Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. ... Osram Gmbh

07/21/16 / #20160211759

Electronic resonant and insulated half-bridge zeta converter

An electronic half-bridge zeta converter may include a transformer, wherein a half-bridge is connected to the primary winding of transformer, and wherein a respective capacitance and a respective diode are associated with the half-bridge switches. Moreover, the converter includes a zeta converter which is connected to secondary winding of transformer, so that the zeta converter includes a first inductance, which includes the magnetization inductance of transformer, and a second inductance. ... Osram Gmbh

07/21/16 / #20160211646

Semiconductor stripe laser

A semiconductor stripe laser has a first semiconductor region having a first conductivity type and a second semiconductor region having a different, second conductivity type. An active zone for generating laser radiation is located between the semiconductor regions. ... Osram Gmbh

07/21/16 / #20160211476

Optoelectronic component, optoelectronic component device and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component. The optoelectronic component may include a planar optically active structure and an electric circuit structure. ... Osram Gmbh

07/21/16 / #20160211421

Optoelectronic device

An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.. . ... Osram Gmbh

07/21/16 / #20160208997

Vehicle headlamp regulated airflow system and method

A headlamp duct 28 is connected with engine ducting 2 between air inlet 40 and ducting outlet 42 which is coupled to the engine. Headlamp duct 28 receives airflow 13 from engine ducting 2 and directs airflow to vehicle headlamp 30. ... Osram Gmbh

07/14/16 / #20160205732

Drive circuit for illuminating device and illuminating device having the drive circuit

Various embodiments may relate to a drive circuit for an illuminating device and an illuminating device including the drive circuit. The drive circuit includes a main control unit, configured to control power supply to a light-emitting unit, an output unit, connected with the main control unit and comprising a first output terminal and a second output terminal which supply power to the light-emitting unit, and a detecting unit, connected with the output unit for detecting a hot-plug state to obtain a detecting state, wherein the main control unit controls the power supply to the light-emitting unit according to the detecting state.. ... Osram Gmbh

07/14/16 / #20160205731

Hot plug module and driver for illuminating device and illuminating device

Various embodiments may relate to a hot plug module for an illuminating device, including a detection unit for detecting a hot plug state to obtain a detecting state, and an impedance adjusting unit for adjusting an impedance state of the hot plug module in accordance with the detecting state, and wherein the impedance adjusting unit includes an impedance conversion unit whose impedance can be converted, and a conversion drive unit converting the impedance of the impedance conversion unit in accordance with the detecting state to adjust the impedance state. Further, various embodiments relate to a driver for an illuminating device and an illuminating device.. ... Osram Gmbh

07/14/16 / #20160204700

Clocked electronic energy converter

A clocked electronic energy converter may include an electronic switching element, at least two electrical energy storage devices, connections for connecting an electrical energy source and for connecting an electrical energy sink, a clock generator for controlling the electronic switching element and a switch-on time unit for generating a first signal for the clock generator, which switch-on time unit sets the power of the energy converter to be transmitted in a first power range by the first signal. The switch-on time unit generates a first signal representing a switch-on time for the clock generator in a second power range in which the power lower can be set than in the first power range, and the clocked electronic energy converter has a switch-off time unit generating in the second power range a second signal for the clock generator, which signal represents a switch-off time depending upon the power to be transmitted.. ... Osram Gmbh

07/14/16 / #20160204693

Two-stage clocked electronic evergy converter

A two-stage clocked electronic energy converter for transmitting an electrical power may include a first connection for connecting an electrical energy source, a second connection for connecting a load, and an intermediate circuit capacitor, wherein a first stage of the energy converter has a first converter in the boost operating mode, which first converter converts an electrical voltage at the first connection into an electrical intermediate circuit voltage at the intermediate circuit capacitor, and wherein the intermediate circuit capacitor supplies a second stage of the energy converter, which second stage supplies the load with electrical energy controllably in terms of the power, wherein a control unit sets the power drawn from the intermediate circuit capacitor by the second stage in such a way that an instantaneous minimum of the intermediate circuit voltage that is brought about by the drawing of power is greater than a predefined voltage comparison value.. . ... Osram Gmbh

07/14/16 / #20160204600

Overvoltage protection apparatus and luminaire having such an overvoltage protection apparatus

An overvoltage protection apparatus may include a first connection for coupling to an n line, and at least one voltage-limiting element which is designed to block the current through the voltage-limiting element up to a predefinable threshold value of the voltage dropped across the voltage-limiting element and to conduct the current above this threshold value. The overvoltage protection apparatus may further include a second connection for coupling to a metal housing of an electrical apparatus, at least one capacitor, and at least one first non-reactive resistor. ... Osram Gmbh

07/14/16 / #20160204575

Laser diode with cooling along even the side surfaces

A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink.. . ... Osram Gmbh

07/14/16 / #20160204574

Optoelectronic component, optoelectronic device and method of producing an optoelectronic device

An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.. . ... Osram Gmbh

07/14/16 / #20160204573

Laser component and method of producing a laser component

A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.. . ... Osram Gmbh

07/14/16 / #20160204388

Method of producing an optoelectronic device and optoelectronic device

A method of producing an optoelectronic device includes a) providing a substrate, b) applying a first electrode to the substrate, c) applying a first organic layer stack to the first electrode, d) producing a charge-generating layer stack on the first organic layer stack, e) applying a second organic layer stack to the charge-generating layer stack, and f) applying a second electrode to the second organic layer stack, wherein step d) includes d1) applying a solution of a first metal oxide precursor to the first organic layer stack, d2) generating a first charge-generating layer comprising a first metal oxide, d3) applying a solution of a second metal oxide precursor to the first charge-generating layer, and d4) generating a second charge-generating layer comprising a second metal oxide.. . ... Osram Gmbh

07/14/16 / #20160204386

Radiation-emitting component with organic layer stack

A radiation-emitting component is disclosed. Embodiments of the invention relate to a radiation-emitting component with an organic layer stack which is arranged on a substrate. ... Osram Gmbh

07/14/16 / #20160204378

Organic optoelectronic component

The invention relates to an organic optoelectronic component comprising a substrate (101) on which a first electrode (102), then an organic functional layer stack (103) having at least one organic optoelectronic layer, and then a second electrode (104) are successively arranged. A thin film encapsulation (107) is arranged over the second electrode (104) and in addition to the second electrode (104), at least one first intermediate layer (121) having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack (103) and the thin-film encapsulation (107).. ... Osram Gmbh

07/14/16 / #20160204372

Optoelectronic element

The invention relates to an optoelectronic component with a first substrate, a second substrate, a functional layer stack, a lateral first recess and a first contact surface, the layer stack being arranged between the first substrate and the second substrate. Said layer stack comprises an organically active area for producing electromagnetic radiation, and the component has a first lateral surface. ... Osram Gmbh

07/14/16 / #20160204033

Method for separating substrates and semiconductor chip

Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. ... Osram Gmbh

07/14/16 / #20160204032

Method for dividing a composite into semiconductor chips, and semiconductor chip

The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. ... Osram Gmbh

07/14/16 / #20160202678

Human presence detection commissioning techniques

Techniques are disclosed for detecting stationary presence using ir sensor array. A number of ir images may be captured. ... Osram Gmbh

07/14/16 / #20160202407

Lighting device and corresponding method

A lighting device includes an elongated profiled body including at least one light permeable material, e.g. A polymeric material, having a mouth portion where an e.g. ... Osram Gmbh

07/07/16 / #20160197303

Organic light-emitting device

Various embodiments may relate to an organic light-emitting device, including at least one functional layer for generating electroluminescent radiation, an encapsulation structure formed on or over the at least one functional layer, and a heat conduction layer formed on or over the encapsulation structure. The heat conduction layer includes a matrix material and heat conducting particles embedded in the matrix material.. ... Osram Gmbh

07/07/16 / #20160197044

Method and apparatus that processes an optoelectronic component

A method of processing an optoelectronic component includes a light source having at least one luminous area formed by one or a plurality of light emitting diodes and a receptacle device that receives the light source, including determining a deviation of an actual position of the light source at the receptacle device from a desired position of the light source at the receptacle device, and forming at least one marking at the receptacle device that indicates the deviation.. . ... Osram Gmbh

07/07/16 / #20160195231

Lighting arrangement

A lighting arrangement includes a light source, a taper, and a two-dimensional image generator, wherein the taper guides light from the light source to the two-dimensional image generator, and the lighting arrangement is configured as a motor vehicle headlamp.. . ... Osram Gmbh

06/16/16 / #20160174334

Lighting system for contained environments

Techniques and architecture are disclosed for a lighting system for contained environments, such as elevators or other such environments. The lighting system can include one or more luminaires and/or one or more display devices that include tunable output controlled to automatically change the ambient lighting and/or presentable content (e.g., imagery, video, audio) based on one or more conditions related to the contained environment. ... Osram Gmbh

06/16/16 / #20160172630

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component includes an organic functional layer, having an active region that emits electromagnetic radiation, and a outcoupling element disposed in the beam path of the electromagnetic radiation emitted. The outcoupling element includes a matrix material and a separated phase disposed therein or a multitude of separated phases different than the matrix material. ... Osram Gmbh

06/16/16 / #20160172559

Method for producing an optoelectronic device

A method can be used for producing an optoelectronic device. A first leadframe section with a component is provide. ... Osram Gmbh

06/16/16 / #20160172555

Semiconductor chip that emits polarized radiation

A radiation emitting semiconductor chip is disclosed. Embodiments provide a semiconductor chip that emits radiation includes a semiconductor body having an active zone, which emits unpolarized radiation having a first radiation component of a first polarization and having a second radiation component of a second polarization. ... Osram Gmbh

06/16/16 / #20160172547

Surface-mountable optoelectronic semiconductor component and method for producing same

A surface-mountable optoelectronic semiconductor component is specified. The surface-mountable optoelectronic semiconductor component includes an optoelectronic semiconductor chip, a radiation-transmissive growth substrate, a housing body and an electrically conductive connection. ... Osram Gmbh

06/16/16 / #20160172546

Optoelectronic semiconductor chip, optoelectronic component, and method of producing semiconductor chips

An optoelectronic semiconductor chip includes a carrier and a semiconductor body having an active layer that generates electromagnetic radiation, wherein the semiconductor body is arranged on the carrier, the semiconductor body has a first main surface facing away from the carrier and a second main surface facing the carrier, the semiconductor chip has a side surface having an anchoring structure, and the second main surface is arranged between the first main surface and the anchoring structure.. . ... Osram Gmbh

06/16/16 / #20160172545

Optoelectronic semiconductor chip

An optoelectronic semi-conductor chip is disclosed in which an encapsulation layer, which is an ald layer, completely covers a first mirror layer on the side thereof facing away from a p-conductive region, and is arranged to be in direct contact with said first mirror layer in some sections.. . ... Osram Gmbh

06/16/16 / #20160170011

Method for operating an optoelectronic proximity sensor

A method can be used for operating an optoelectronic proximity sensor. The proximity sensor includes a radiation-emitting component, a radiation-detecting component and a control unit. ... Osram Gmbh

06/16/16 / #20160169499

Illuminating device

Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.. . ... Osram Gmbh

06/16/16 / #20160169487

Organic light-emitting diode and arrangement with such a light-emitting diode

An organic light-emitting diode includes a substrate with a top; an organic layer on the top that generates radiation; first and second electrical contact area at or on the top that electrically contacts the diode; a holding device by which the diode is mechanically supported and electrically contacted; and a cover sheet on a side of the organic layer remote from the substrate that protects the organic layer, wherein at least one opening is in the cover sheet and the opening, in plan view, is surrounded by the cover sheet and the organic layer; the areas are located at an edge of the opening and freely accessible; the device engages through the opening; the first area has a different average distance from the opening than the second area; and the electrical areas are each arranged concentrically around the opening and partially or completely surround the opening in plan view.. . ... Osram Gmbh

06/16/16 / #20160169480

Optical structure for a plurality of light sources

Various embodiments may relate to an optical structure for a plurality of light sources, wherein the optical structure includes a reflective structure and a scattering structure accommodated in the reflective structure, light from the plurality of light sources are at least scattered through the scattering structure to perform primary light mixing so as to produce mixed light beams, wherein the mixed light beams are at least partially reflected by the reflective structure and then emerge.. . ... Osram Gmbh

06/09/16 / #20160165194

Lighting device having phosphor wheel and excitation radiation source

Various embodiments may relate to a lighting device, including an excitation radiation source and a two-sided luminescent-material wheel. At least one luminescent material is provided on each of the two sides of the two-sided luminescent-material wheel, thus both on the front side and on the opposite back side. ... Osram Gmbh

06/09/16 / #20160164037

Radiation-emitting apparatus

A radiation emitting apparatus including a substrate, at least one layer sequence arranged on the substrate and producing electromagnetic radiation in a wavelength range, having at least one first electrode surface, at least one second electrode surface, and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer produces electromagnetic radiation in the wavelength range in a switched-on operating state, and a scatter layer having a first region and a second region, wherein radiation produced by the functional layer is directly incident on the scatter layer only in the first region of the scatter layer, and the scatter layer at least partially scatters radiation incident upon the first region of the scatter layer so that said radiation enters the second region of the scatter layer.. . ... Osram Gmbh

06/09/16 / #20160163939

Optoelectronic semiconductor chip, semiconductor component and method of producing optoelectronic semiconductor chips

An optoelectronic semiconductor chip includes a carrier, a semiconductor body having an active region that generates and/or receives radiation, and an insulation layer wherein the semiconductor body is fastened on the carrier with a connecting layer; the carrier extends in a vertical direction between a first main surface facing toward the semiconductor body, and a second main surface facing away from the semiconductor body, and a lateral surface connects the first main surface and the second main surface to one another; a first region of the lateral surface of the carrier has an indentation; a second region of the lateral surface runs in the vertical direction between the indentation and the second main surface; the insulation layer at least partially covers each of the semiconductor body and the first region; and the second region is free of the insulation layer.. . ... Osram Gmbh

06/09/16 / #20160163932

Method of producing an optoelectronic component

A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.. . ... Osram Gmbh

06/09/16 / #20160161835

Light module for a projection or illumination arrangement

A light module includes an excitation radiation source designed to emit an excitation radiation having a polarization, at least one first phosphor, an output, at which an output signal is providable, at least one first polarization beam splitter, a first polarization modulator arranged serially between the radiation source and the first splitter. The first modulator is designed to modify the polarization of the radiation source depending on a control signal. ... Osram Gmbh

06/09/16 / #20160161063

Retrofit-style lamp and fixture, each including a one-dimensional linear batwing lens

A retrofit-style lamp is disclosed. The retrofit-style lamp includes a plurality of light sources, and a one-dimensional linear batwing lens. ... Osram Gmbh

06/02/16 / #20160157323

Method for operating an organic light-emitting component and lighting device for implementing the method

A method can be used for operating an organic light-emitting component. The organic light-emitting component has a first electrode and a second electrode, between which an organic functional layer stack with at least one organic light-emitting layer is arranged. ... Osram Gmbh

06/02/16 / #20160155991

Organic light-emitting component and method for producing an organic light-emitting component

An organic light-emitting component has a substrate, a first electrode on the substrate, a first organic functional layer stack on the first electrode, a charge carrier generation layer stack on the first organic functional layer stack, a second organic functional layer stack on the charge carrier generation layer stack and a second electrode on the second organic functional layer stack. The charge carrier generation layer stack has at least one hole transport layer, one electron transport layer and one intermediate layer. ... Osram Gmbh

06/02/16 / #20160155981

Method for forming a conductor path structure on an electrode surface of an electronic component

Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.. ... Osram Gmbh

06/02/16 / #20160155912

Method of producing a cover element and an optoelectronic component, cover element and optoelectronic component

A method of producing a cover element for an optoelectronic component includes producing a frame having a multiplicity of openings, wherein the frame is made of a material having embedded particles of tio2, zro2, al2o3, aln, sio2, or another optically reflective material and/or an embedded colored pigment; introducing a material into a multiplicity of the openings; and dividing the frame.. . ... Osram Gmbh

06/02/16 / #20160155891

Optoelectronic component and method for the production thereof

An optoelectronic component includes an optoelectronic semiconductor chip embedded in a molded body such that an upper side of the optoelectronic semiconductor chip is at least partially not covered by the molded body, wherein a first metallization is arranged on an upper side of the molded body, wherein the first metallization is electrically insulated from the optoelectronic semiconductor chip, and a first material is arranged on the first metallization.. . ... Osram Gmbh

06/02/16 / #20160154178

Optoelectronic component device, method for producing an optoelectronic component device and method for operating an optoelectronic component device

Various embodiments may relate to an optoelectronic component device, including a first optically active structure, which is configured to provide an electromagnetic radiation, a measuring structure, which is configured to determine the luminance distribution of the electromagnetic radiation, wherein the measuring structure is configured to determine the luminance distribution in the first optically active structure, and wherein the measurement structure has a plurality of second optically active structures, wherein the plurality of second optically active structures are configured as optoelectric components and/or optoelectronic components, which receive the provided electromagnetic radiation.. . ... Osram Gmbh

05/26/16 / #20160150619

Method of operating an organic light-emitting component

A method of operating an organic light-emitting component having first and second electrodes that have arranged between them an organic functional layer stack having at least one organic light-emitting layer that, during operation, produces light emitted via a luminous area, the first and second electrodes and the organic functional layer stack are in an extensive form, in contact with the first electrode, at each of two opposite edges of the first electrode a respective conductor track is arranged that extends in a longitudinal direction along the respective edge, the two conductor tracks have contact made with them on a same side of the first electrode by a connection element so that during operation there is a voltage drop in each conductor track in the longitudinal direction, which voltage drop brings about a luminous density gradient on the luminous area in a direction following the longitudinal direction.. . ... Osram Gmbh

05/26/16 / #20160149162

Optoelectronic component, method for producing an optoelectronic component, and mirror device

Various embodiments may relate to an optoelectronic component, including a carrier, which is formed in a transparent fashion, an optoelectronic layer structure including a first electrode, which is formed above the carrier and which is formed in a transparent fashion, an optically functional layer structure, which is formed above the first electrode, and a second electrode, which is formed above the optically functional layer structure, wherein a mirror region is formed on a side of the optically functional layer structure facing away from the carrier, the mirror region being formed in a specularly reflective fashion as viewed at least from the carrier, and an intermediate layer, which is formed between the carrier and the mirror region and which has an optical layer thickness that is greater than a coherence length of external light.. . ... Osram Gmbh

05/26/16 / #20160149158

Method for processing an electronic component and electronic component arrangement

Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.. ... Osram Gmbh

05/26/16 / #20160149153

Electrode and optoelectronic component and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component, including an organic functional layer structure, and an electrode on or above the organic functional layer structure. The electrode is electrically conductively coupled to the organic functional layer structure. ... Osram Gmbh

05/26/16 / #20160149101

Optoelectronic semiconductor component

In at least one embodiment, the optoelectronic semiconductor component (1) comprises a cast body (4). At least one optoelectronic semiconductor chip (3) is designed to generate radiation and is situated in a recess (43) in the cast body (4). ... Osram Gmbh

05/26/16 / #20160149092

Optoelectronic component

An optoelectronic component includes a semiconductor chip that emits a primary radiation in the short-wave blue spectral range at a dominant wavelength of less than approximately 465 nm; and a phosphor that converts at least part of the primary radiation into a longer-wave secondary radiation in the green spectral range at a dominant wavelength of between approximately 490 nm and approximately 550 nm and at least partly surrounds the semiconductor chip, wherein a mixed light composed of primary radiation and secondary radiation has a dominant wavelength at wavelengths of approximately 460 nm to approximately 480 nm such that a luminous flux of the mixed light is up to 130% greater than a luminous flux in an optoelectronic component without a phosphor having the same dominant wavelength in a range of 460 nm to 480 nm, and the phosphor is arranged in a lamina that bears directly on the semiconductor chip.. . ... Osram Gmbh

05/26/16 / #20160149090

Radiation-emitting optoelectronic device

A radiation-emitting optoelectronic device is provided. The radiation-emitting optoelectronic device includes a semiconductor chip that, when the device is in operation, emits primary radiation of a wavelength of between 600 nm and 1000 nm. ... Osram Gmbh

05/26/16 / #20160148987

Optoelectronic component and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component, including an optoelectronic structure, which is designed to provide a first electromagnetic radiation, and a measuring structure, which is designed to measure electromagnetic radiation, wherein the measuring structure has an optically active structure and at least one electro-optical structure. The optically active structure is optically coupled to the optoelectronic structure. ... Osram Gmbh

05/26/16 / #20160146434

Conversion element including a separating structure

A conversion element includes a separating structure and a multiplicity of conversion regions, wherein each conversion region is at least partly enclosed by a part of the separating structure, and each conversion region converts electromagnetic primary radiation at least partly into a secondary radiation having a longer wavelength.. . ... Osram Gmbh

05/19/16 / #20160143146

Lens for illuminating device and illuminating device having said lens

Various embodiments may relate to a lens for an illuminating device and an illuminating device having a lens of the above mentioned type, wherein the lens includes a bottom plate and at least one optical part formed on the bottom plate, wherein the lens further includes at least two assembly parts that are position-fixedly formed on the bottom plate, and the assembly parts are configured to be respectively aligned with assembly positions on a circuit board of the illuminating device and configured to allow to be soldered to the circuit board.. . ... Osram Gmbh

05/19/16 / #20160143144

Optoelectronic assembly and method for producing an optoelectronic assembly

Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.. . ... Osram Gmbh

05/19/16 / #20160141837

Edge-emitting semiconductor laser and method for the production thereof

An edge-emitting semiconductor laser includes a semiconductor structure having a waveguide layer with an active layer, the waveguide layer extending in a longitudinal direction between first and second side facets of the semiconductor structure, the semiconductor structure has a tapering region adjacent to the first side facet, a thickness of the waveguide layer in the tapering region increases longitudinally, the waveguide layer is arranged between first and second cladding layers, a thickness of the second cladding layer in the tapering region of the semiconductor structure increases longitudinally, the tapering region includes first and second subregions, the first subregion is arranged closer to the first side facet than the second subregion, thickness of the waveguide layer increases longitudinally in the first subregion, thickness of the waveguide layer is constant in the longitudinal direction in the second subregion, and thickness of the second cladding layer increases longitudinally in the second subregion.. . ... Osram Gmbh

05/19/16 / #20160141286

Carrier for an optoelectronic semiconductor chip and optoelectronic component

A carrier (1) for an optoelectronic semiconductor chip comprising: (2) base body (10), which comprises a first main surface (10a) and a second main surface (10b), at least one recess (11), which is introduced into the base body (10) and completely penetrates the base body (10) from the first main surface to the second main surface, and a filler material (12), which is introduced into the at least one recess (11). The base body (10) is formed using silicon of a first conductivity type. ... Osram Gmbh

05/19/16 / #20160141277

Arrangement and method for generating mixed light

The invention relates to an arrangement for generating mixed light, which comprises three semiconductor chips, emitting in the blue spectral range, of three devices. Arranged in the light paths of the individual semiconductor chips are different conversion elements which are configured to convert primary radiation into secondary radiation. ... Osram Gmbh

05/19/16 / #20160138793

Lamp holder and manufacturing method thereof and illuminating device having the lamp holder

Various embodiments may relate to a lamp holder of a lighting module, including a first housing and a second housing made from different materials, wherein the second housing includes a body part and an assembling part in thermal contact with each other, wherein the second housing is embedded integrally in the first housing and in thermal contact with the first housing, and the assembling part and the body part are installed together. In addition, various embodiments further relate to a method for manufacturing the lamp holder and an illuminating device having the lamp holder.. ... Osram Gmbh

05/19/16 / #20160137917

Red phosphor, white light source, light emitting device, and method for forming the red phosphor

The present invention relates to a red phosphor, which includes an element a, magnesium, aluminum, oxygen, and manganese in chemical formula (1) that is (a1-xmgx)4ai14-yo25:γmn4+. The element a in the chemical formula (1) is at least one of strontium, barium, and calcium, and x and y in the chemical formula (1) satisfy the relational expressions 0<=x<1 and 0<y<1.. ... Osram Gmbh

05/12/16 / #20160133879

Optoelectronic component and method for producing an optoelectronic component

. . Various embodiments may relate to an optoelectronic component and a method for producing an optoelectronic component. In various embodiments, an optoelectronic component is provided, the optoelectronic component, including an optically active structure, which is designed for receiving and/or providing electromagnetic radiation, and at least one scattering structure, which is formed in the beam path of the electromagnetic radiation on or above the optically active structure. ... Osram Gmbh

05/12/16 / #20160133808

Method of producing an optoelectronic component

A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.. . ... Osram Gmbh

05/12/16 / #20160133802

Method of producing a conversion element

A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.. . ... Osram Gmbh

05/12/16 / #20160133798

Optoelectronic component including a conversion element and method of producing an optoelectronic component including a conversion element

An optoelectronic component includes a layer sequence having an active layer that emits electromagnetic primary radiation during operation, at least one conversion element arranged in a beam path of the primary radiation, wherein the at least one conversion element includes converter particles and a binder material, the converter particles are distributed in the binder material, the converter particles at least partly convert the primary radiation into electromagnetic secondary radiation, and the binder material is produced from a salt of two formulae or from a mixture of different salts of one of the two formulae, or from a mixture of different salts of the two formulae.. . ... Osram Gmbh

05/12/16 / #20160133794

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip includes a multiplicity of active regions arranged at a distance from one another, and a continuous current spreading layer, wherein at least one of the active regions has a main extension direction, one of the active regions has a core region formed with a first semiconductor material, the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region, the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and the current spreading layer covers all cover layers of the active region.. . ... Osram Gmbh

05/12/16 / #20160133612

Led module with led chips

Various embodiments may relate to an led module, including a number of first inherently unpackaged led chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged led chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The led chips are provided jointly in a housing, and the respective light emission area of a second led chip is at least 25% smaller than the respective light emission area of a first led chip. ... Osram Gmbh

05/12/16 / #20160133520

Method of severing a semiconductor device composite

A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.. . ... Osram Gmbh

05/12/16 / #20160133023

Method for image processing, presence detector and illumination system

A method for image processing is provided. The method includes acquiring at least one object in a recorded image, determining an orientation of the at least one acquired object, and classifying at least one acquired object, the orientation of which was determined, by comparison with a reference. ... Osram Gmbh

05/05/16 / #20160128140

Lighting techniques utilizing solid-state lamps with electronically adjustable light beam distribution

Solid-state lamps having an electronically adjustable light beam distribution are disclosed. In accordance with some embodiments, a lamp configured as described herein includes a plurality of solid-state emitters (addressable individually and/or in groupings) mounted over a non-planar interior surface of the lamp. ... Osram Gmbh

05/05/16 / #20160126704

Optoelectronic component having a housing with a plurality of openings

An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.. . ... Osram Gmbh

05/05/16 / #20160126702

Light-emitting assembly having a carrier

An assembly includes a carrier and a structure having a core formed on the carrier, wherein the core has a longitudinal extension having two end regions, a first end region is arranged facing the carrier and a second end region is arranged facing away from the carrier, the core is formed as electrically conductive at least in an outer region, the region is at least partially covered with an active zone layer, the active zone layer generates electromagnetic radiation, a mirror layer is provided at least in one end region of the core to reflect electromagnetic radiation in a direction, a first electrical contact layer contacts an electrically conductive region of the core, and a second contact layer contacts the active zone layer.. . ... Osram Gmbh

05/05/16 / #20160126486

Process for producing an optoelectronic component and optoelectronic component

Various embodiments may relate to a process for producing an optoelectronic component. In the process, a carrier is provided. ... Osram Gmbh

05/05/16 / #20160126221

Light-emitting diode module

A light-emitting diode module for emitting white light includes a first light emitting diode chip for generating radiation in the blue spectral range having a first peak wavelength, a second light emitting diode chip for generating radiation in the blue spectral range having a second peak wavelength, a third light emitting diode chip for generating radiation in the red spectral range having a third peak wavelength, a first and a second phosphors disposed downstream of the first and the second light emitting diode chips, respectively. The first light emitting diode chip with the first phosphor generates a first mixed radiation and the second light emitting diode chip with the second phosphor generates a second mixed radiation. ... Osram Gmbh

05/05/16 / #20160123564

Solid-state luminaire with electronically adjustable light beam distribution

A luminaire having an electronically adjustable light beam distribution is disclosed. In accordance with some embodiments, the disclosed luminaire includes a housing, for example, of hemi-cylindrical, oblate hemi-cylindrical, oblong elliptical, or polyhedral shape. ... Osram Gmbh

05/05/16 / #20160123543

End cap of lamp tube and illuminating device using said end cap

Various embodiments may relate to an end cap for a lamp tube of an illuminating device, including a mounting ring fixedly mounted to one end of the lamp tube by means of an assembled end, and a cover plate for closing the mounting ring at a free end. The end cap further includes a rotating ring mounted between the mounting ring and the cover plate at the free end, the cover plate rotatably closes the mounting ring by means of the rotating ring. ... Osram Gmbh

05/05/16 / #20160123541

Solid-state lamps with electronically adjustable light beam distribution

Solid-state lamps having an electronically adjustable light beam distribution are disclosed. In accordance with some embodiments, a lamp configured as described herein includes a plurality of solid-state emitters (addressable individually and/or in groupings) mounted over a non-planar interior surface of the lamp. ... Osram Gmbh

05/05/16 / #20160122637

Method for producing a luminescent material, luminescent material and optoelectronic component

A method for producing a luminescent material includes producing a mixture of starting substances, wherein the starting substances have a first component and a second component. The first component is selected from a group that comprises aluminum, silicon, at least one element of the 2nd main group of the periodic table and at least one element of the lanthanides and combinations thereof. ... Osram Gmbh

05/05/16 / #20160122636

Method for producing a pulverulent precursor material, pulverulent precursor material, and use of pulverulent precursor material

A method can be used for producing a powdery precursor material for an optoelectronic component having a first phase of the following general composition (ca1-a-b-c-d-ezndmgesrcbabxa)2si5n8, wherein x is an activator that is selected from the group of the lanthanoids and wherein the following applies: 0<a<1 and 0≦b≦1 and 0≦c≦ and 0≦d≦1 and 0≦e≦1. The method includes producing a powdery mixture of starting materials. ... Osram Gmbh

04/28/16 / #20160118622

Optoelectronic component and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.. . ... Osram Gmbh

04/28/16 / #20160118553

Optoelectronic component and method for the production thereof

An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.. . ... Osram Gmbh

04/07/16 / #20160099547

Semiconductor laser light source having an edge-emitting semiconductor body

A semiconductor laser light source comprising an edge-emitting semiconductor body (10) is provided. The semiconductor body (10) contains a semiconductor layer stack (110) having an n-type layer (111), an active layer (112) and a p-type layer (113) which is formed for generating electromagnetic radiation which comprises a coherent portion (21). ... Osram Gmbh

04/07/16 / #20160099390

Optoelectronic semiconductor component

An optoelectronic semiconductor component includes a luminescent diode chip including a radiation passage face through which primary electromagnetic radiation leaves the luminescent diode chip when in operation, and a filter element that covers the radiation passage face of the luminescent diode chip at least in places, wherein the filter element prevents passage of some of the primary electromagnetic radiation in the uv range, and the filter element consists of a ii-vi compound semiconductor material.. . ... Osram Gmbh

03/31/16 / #20160093783

Optoelectronic component and method of production thereof

. . . . An optoelectronic component includes an optoelectronic semiconductor chip embodied as a volume emitter, wherein the optoelectronic semiconductor chip is embedded into an optically transparent molded body, a soldering contact is arranged at an underside of the molded body, a bonding wire forms an electrically conductive connection between an electrical contact area of the optoelectronic semiconductor chip and the soldering contact, and the bonding wire is embedded into the molded body.. . ... Osram Gmbh

03/31/16 / #20160093769

Light-emitting diode with passivation layer

An optoelectronic semiconductor chip includes a carrier substrate; a semiconductor body having a circumferential lateral surface, including a first and a second semiconductor region and, arranged there between, an active zone that generates radiation; and a connection structure including a first and a second conductive connection layer, separated from one another, wherein the first connection layer electrically connects to the first semiconductor region and the second connection layer via at least one plated-through hole electrically connects to the second semiconductor region, wherein the semiconductor body is surrounded by a passivation layer arranged on the lateral surface, and at least one further layer is arranged in a region surrounding the passivation layer.. . ... Osram Gmbh

03/31/16 / #20160093765

Method for producing a nitride compound semiconductor device

A method is provided for producing a nitride compound semiconductor device. A growth substrate has a silicon surface. ... Osram Gmbh

03/31/16 / #20160091176

Illumination optical system with tunable beam angle

An illumination optical system with a tunable beam angle (iostba) is presented to achieve different beam angles without changing parts. The iostba includes a light source and a post having a proximal end and a distal end, the proximal end in optical communication with the light source, an internal area of the post having a reflective surface. ... Osram Gmbh

03/31/16 / #20160091157

Modular lighting device and corresponding method

A modular lighting device may include an elongated support member with electrically powered light radiation sources. The support member includes at least one electrically conductive layer with a covering layer applied thereon, wherein said covering layer exhibits discontinuities forming a marker array for cutting to length modular lighting device.. ... Osram Gmbh

03/24/16 / #20160088708

Wireless control of lighting systems

A communication protocol is disclosed to wirelessly control and configure an array of lighting fixtures. The protocol allows dynamic lighting of a group of light fixtures or a single light fixture such that the protocol can support unicasting, multicasting and broadcasting communications. ... Osram Gmbh

03/24/16 / #20160087524

Generation of drive current independent of input voltage

Systems and methods to generate drive current in a power supply, independent of the input voltage, are provided. The power supply includes front end circuitry, control circuitry, and drive circuitry. ... Osram Gmbh

03/24/16 / #20160087404

Laser light source

A laser light source, comprising a semiconductor layer sequence on a substrate and having an active region and a radiation coupling out area having first and second partial regions and a filter structure. The active region generates coherent first electromagnetic radiation and incoherent second electromagnetic radiation, the coherent first electromagnetic radiation is emitted by the first partial region along an emission direction, the incoherent second electromagnetic radiation is emitted by the first partial region and by the second partial region. ... Osram Gmbh

03/24/16 / #20160087399

Laser diode apparatus

Laser diode apparatus, comprising a carrier (1) having a carrier top (11), a laser diode chip (4) arranged on the carrier top (11) emitting, during operation, electromagnetic radiation through a radiating face (5), which radiating face (5) runs perpendicularly to the carrier top (11), and at least one optical element (6) to deflect at least some of the electromagnetic radiation radiated by the laser diode chip (4) perpendicularly to the carrier top (11). By the use of a plurality of laser diode chips having wavelengths that differ very slightly from one another, speckles can be reduced. ... Osram Gmbh

03/24/16 / #20160087182

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. ... Osram Gmbh

03/24/16 / #20160087177

Light-emitting semiconductor component and method of producing light-emitting semiconductor components

A radiation-emitting semiconductor device includes at least one semiconductor chip having a semiconductor layer sequence having an active region that produces radiation; a mounting surface on which at least one electrical contact for external contacting of the semiconductor chip is formed, wherein the mounting surface runs parallel to a main extension plane of the semiconductor layer sequence; a radiation exit surface running at an angle to or perpendicularly to the mounting surface; a radiation-guiding layer arranged in a beam path between the semiconductor chip and the radiation exit surface; and a reflector body adjacent to the radiation-guiding layer in regions and in a top view of the semiconductor device covers the semiconductor chip.. . ... Osram Gmbh

03/24/16 / #20160087161

Lighting apparatus including an optoelectronic component

The invention relates to an illumination device (1) specifically a packaged led (2), which is embedded in a casing body leaving the bottom side of the led (2) exposed; on the bottom side, a contacting element (7) is vacuum deposited onto the led (2), which contacting element protrudes laterally above the led (2) and allows on a macroscopic level for an electric contacting of the led (2), namely by connection of flat surfaces, such as welding.. . ... Osram Gmbh

03/24/16 / #20160087150

Light-emitting assembly having a semiconductor layer sequence having an active zone on a columnar structure

An assembly has a columnar structure arranged with one end on a substrate, wherein the structure is at least partly covered with a semiconductor layer structure having an active zone that generates electromagnetic radiation, the active zone has a band gap for a radiative recombination, and the band gap decreases along a longitudinal axis of the structure in a direction of a free end of the structure such that a diffusion of charge carriers in the direction of the free end of the structure and a radiative recombination of charge carrier pairs in the region of the free end of the structure are supported.. . ... Osram Gmbh

03/24/16 / #20160087142

Semiconductor layer sequence and method for operating an optoelectronic component

The semiconductor layer sequence includes an n-conductive layer, a p-conductive layer and an active zone located therebetween. The active zone comprises n quantum wells with n≧2. ... Osram Gmbh

03/24/16 / #20160084482

Tubular led lamp with flexible circuit board

There is herein described an led lamp suitable for replacing conventional fluorescent lamps. The led lamp has a tubular body and a flexible circuit board as compared to the rigid circuit boards used in other similar lamps. ... Osram Gmbh

03/24/16 / #20160084449

Tubular led lamp

There is herein described an led lamp comprising a thermoformed circuit board and a tubular lamp body having a diffuser. The thermoformed circuit board comprises a substrate, an intermediate circuit board having electrical conductors, and a coverlay laminated to the substrate. ... Osram Gmbh

03/24/16 / #20160084446

Tubular led lamp

There is herein described an led lamp comprising a tubular body having a diffuser portion and a circuit board portion. The circuit board portion has a plurality of light-emitting diodes mounted thereon and electric circuitry for providing power to the leds. ... Osram Gmbh

03/17/16 / #20160079734

Laser light source

. . . . A laser light source, comprising a semiconductor layer sequence having an active region and a radiation coupling out area having first and second partial regions, and a filter structure. The active region generates coherent first electromagnetic radiation and incoherent second electromagnetic radiation. ... Osram Gmbh

03/17/16 / #20160079733

Laser light source

A laser light source, comprising a semiconductor layer sequence having an active region and a radiation coupling out area having first and second partial regions, and a filter structure. The active region generates coherent first electromagnetic radiation and incoherent second electromagnetic radiation. ... Osram Gmbh

03/17/16 / #20160079563

Optoelectronic component

An optoelectronic component includes a substrate, a first electrode on the substrate, a radiation-emitting or radiation-absorbing layer sequence on the first electrode, a second electrode on the layer sequence, an encapsulation layer on the second electrode, and a covering layer on the encapsulation layer. The covering layer has a first main surface and second main surface. ... Osram Gmbh

03/17/16 / #20160079536

Radiation-emitting organic-electronic device and method for producing a radiation-emitting organic-electronic device

A radiation-emitting organic-electronic device is specified. The radiation-emitting organic-electronic device includes a substrate, a first electrode arranged above the substrate, a light-emitting layer arranged above the first electrode, and a second electrode arranged above the light-emitting layer. ... Osram Gmbh

03/17/16 / #20160079488

Wavelength-converting element, optoelectronic component and printing stencil

A wavelength-converting element having the shape of a small flat plate having a basic shape with an outer contour, wherein the wavelength-converting element includes a cut-out compared to the basic shape which is defined by a boundary edge, and at a conjunction of the boundary edge and the outer contour, an angle of less than 90° is enclosed.. . ... Osram Gmbh

03/17/16 / #20160079476

Semiconductor component comprising an interlayer

An optoelectronic semiconductor component includes a layer sequence including a p-doped layer, an n-doped layer and an active zone that generates electromagnetic radiation arranged between the n-doped layer and the p-doped layer, wherein the n-doped layer includes at least gan, an interlayer is arranged in the n-doped layer, wherein the interlayer includes alxga1-xn, wherein 0<x≦1, and the interlayer includes magnesium.. . ... Osram Gmbh

03/17/16 / #20160079470

Optoelectronic gan-based component having increased esd resistance via a superlattice and method for the production thereof

An optoelectronic component includes a semiconductor layer structure having a quantum film structure, and a p-doped layer arranged above the quantum film structure, wherein the p-doped layer includes at least one first partial layer and a second partial layer, and the second partial layer has a higher degree of doping than the first partial layer.. . ... Osram Gmbh

03/17/16 / #20160076749

Lighting system

Various embodiments may relate to a lighting system, including at least one lighting module which has a printed circuit board and at least one lighting means arranged on the printed circuit board, and at least one electrical component for operating the lighting means of the lighting module. The electrical component is electrically connected to the lighting module. ... Osram Gmbh

03/17/16 / #20160076731

Optical arrangement and display device

An optical arrangement includes a multiplicity of light-emitting chips on a carrier. In this case, first light-emitting chips respectively include pixels of a first group and second light-emitting chips respectively comprise pixels of a second group. ... Osram Gmbh

03/17/16 / #20160076728

Lighting device and a cleaning control method of the lighting device

Various embodiments may relate to a lighting device including a first lighting unit for emitting a first illuminating light, a cover, and a photosensitive coating configured to clean the cover. The lighting device further includes a control device which controls the photosensitive coating to enter an operating state on the basis of whether a situation of ambient environment reaches a first preset condition, and/or which controls the photosensitive coating to enter a non-operating state on the basis of whether the situation of the ambient environment reaches a second preset condition. ... Osram Gmbh

03/10/16 / #20160073459

Led lamp device

Various embodiments relate to an led lamp device. According to various embodiments, an led lamp device is provided, including an led unit for emitting light, a driving unit for driving the led unit, such that the led unit emits light at an operating point, and a resonance unit for receiving an input, providing ac power to the driving unit, and protecting the driving unit and the led unit from being damaged by the input.. ... Osram Gmbh

03/10/16 / #20160072097

Organic optoelectronic component

An organic optoelectronic component includes a first electrode which is made of an electrically conductive material, an active region which is made of an organic material, a second electrode which is made of an electrically conductive material, an encapsulating layer sequence which is made of a dielectric material, and a third electrode which is made of an electrically conductive material. The first electrode and the second electrode are arranged on different sides of the active region. ... Osram Gmbh

03/10/16 / #20160072030

Optical element and optoelectronic component

An optical element has a first surface and a second surface opposite the first surface. The first surface is subdivided into at least one first segment and a second segment. ... Osram Gmbh

03/10/16 / #20160069539

Method of producing a covnersion element, and conversion element

A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.. . ... Osram Gmbh

03/10/16 / #20160069533

Reflector assembly having a plurality of reflectors and semiconductor light sources

A reflector assembly for a lighting device including a plurality of reflectors for at least one semiconductor light source each, wherein the reflectors are reflector sub-regions of a common, continuous sheet-metal part and the reflector sub-regions have wing regions bent at least partially from the sheet-metal part. A lighting device includes at least one reflector assembly, wherein at least one semiconductor light source is arranged on the sheet-metal part. ... Osram Gmbh

03/03/16 / #20160064634

Optoelectronic component

An optoelectronic component includes a carrier substrate; at least one light emitting semiconductor chip arranged on a surface of the carrier substrate; and a frame part at least laterally partly surrounding the light emitting semiconductor chip; and comprising an injection-molded body, and wherein the frame part includes an injection-molded body and a diaphragm part, the diaphragm part including a protuberance enclosed by the injection-molded body.. . ... Osram Gmbh

03/03/16 / #20160064618

Optoelectronic component and method for the production thereof

An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.. . ... Osram Gmbh

03/03/16 / #20160064610

Optoelectronic device and method for producing same

A method for producing an optoelectronic component is disclosed. A first layer which has a dielectric to the surface of a semiconductor crystal. ... Osram Gmbh

03/03/16 / #20160061427

Lamp

In various embodiments, a lamp is provided. The lamp may include two mutually opposite end sections, which each form an electrical contact of the lamp. ... Osram Gmbh

03/03/16 / #20160061390

Led dental light source with variable chromaticity and method

A dental light having an array of light emitting diode (led) assemblies, at least one first led assembly having at least one first led element configured to emit light according to a first spectral distribution, a conversion phosphor configured to convert at least a portion of the first spectral distribution. At least one filter is fixed within said converted light, the filter configured to block at least a portion thereof. ... Osram Gmbh

03/03/16 / #20160060517

Method for producing a powdery precursor material, powdery precursor material and use thereof

A method can be used for producing a powdery precursor material of the following general composition i or ii or iii or iv: i: (caysr1-y)alsin3:x1 ii: (cabsrali1-a-b)alsi(n1-cfc)3:x2 iii: z5-δal4-2δsi8+2δn18: x3 iv: (zi-dlid)5-δal4-2δsi8+2δ(n1-xfx)18: x4. The method includes a) producing a powdery mixture of starting materials, wherein the starting materials comprise ions of the aforementioned compositions i and/or ii and/or iii and/or iv, b) annealing the mixture under a protective gas atmosphere, subsequent milling. ... Osram Gmbh

02/25/16 / #20160056607

Laser component and method for the production thereof

A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable smd component.. . ... Osram Gmbh

02/25/16 / #20160056358

Optoelectronic device

A method for producing an optoelectronic device comprises steps for providing a package with a first surface and a second surface, wherein an electrically conductive chip carrier is embedded in the package and is accessible at the first surface and at the second surface, and for applying an insulation layer on the second surface of the package by means of aerosol deposition.. . ... Osram Gmbh

02/25/16 / #20160056349

Assembly that emits electromagnetic radiation and method of producing an assembly that emits electromagnetic radiation

An electromagnetic radiation emitting assembly includes a carrier, an electromagnetic radiation emitting component arranged above the carrier, and a potting material at least partly surrounding the electromagnetic radiation emitting component and into which are embedded phosphor that converts the electromagnetic radiation and heat-conducting particles that conduct heat arising during operation of the electromagnetic radiation emitting assembly, wherein a phosphor concentration in the potting material near the electromagnetic radiation emitting component is greater than a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component, and a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component is greater than in the potting material remote from the electromagnetic radiation emitting component.. . ... Osram Gmbh

02/25/16 / #20160056346

Method of producing an optoelectronic component

A method of producing an optoelectronic component includes providing a substrate with an optoelectronic semiconductor chip arranged on a surface of the substrate; providing a mask having a lower layer and an upper layer, wherein the lower layer has a lower opening and the upper layer has an upper opening, which openings jointly form a continuous mask opening, and the lower opening has a larger area than the upper opening; arranging the mask above the surface of the substrate such that the lower layer faces the surface of the substrate and the mask opening is arranged above the optoelectronic semiconductor chip; spraying a layer onto the optoelectronic semiconductor chip through the mask opening; and removing the mask.. . ... Osram Gmbh

02/25/16 / #20160056344

Semiconductor component and method of fabricating a semiconductor component

An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.. . ... Osram Gmbh

02/25/16 / #20160056343

Optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.. . ... Osram Gmbh

02/25/16 / #20160056326

Optoelectronic semiconductor chip and method for the production thereof

A method for producing an optoelectronic semiconductor chip is disclosed. A substrate is provided and a first layer is grown. ... Osram Gmbh

02/18/16 / #20160050729

Drive circuit for illumination device and illumination device

Various embodiments relate to a drive circuit for an illumination device and an illumination device. The drive circuit includes a first drive module, wherein the first drive module is configured to convert an alternating current signal from a power supply to a constant current drive signal supplied to a light-emitting unit of the illumination device, and wherein the drive circuit further includes a second drive module, and wherein the second drive module is in series connection with the first drive module and the light-emitting unit and is configured to hold a voltage which is applied across the second drive module by the constant current drive signal, and the second drive module further includes a first switch means which is driven by the held voltage to turn on such that a current signal output from the second drive module is a direct current signal.. ... Osram Gmbh

02/18/16 / #20160049991

Energy delivery on paths used for communnication

Systems and methods for delivering energy on a bus used for communication between devices are provided. Systems and methods dynamically provide a predetermined recovery time between communication messages calculated from forward and response message types and/or length, and a model of the energy reserve in the network devices to allow time for energy storage circuits in the devices to charge. ... Osram Gmbh

02/18/16 / #20160049556

Radiation-emitting semiconductor chip

A radiation-emitting semiconductor chip (1) is specified, comprising—a semiconductor layer sequence (2) having a first main surface (3) and a second main surface (4) situated opposite the first main surface (3) wherein the semiconductor layer sequence (2) has an active zone (5) suitable for generating electromagnetic radiation, —a structured mirror layer (6), which is electrically non-conductive during operation and is arranged on the side of the first main surface (3) of the semiconductor layer sequence (2), wherein the mirror layer (6) has at least one mirror region (6a, 6b, 6c) which regionally covers the first main surface (3), —at least one encapsulation region (7a, 7b, 7c) which surrounds the at least one mirror region (6a, 6b, 6c) on all sides and is in direct contact with the mirror region (6a, 6b, 6c), wherein the at least one encapsulation region (7a, 7b, 7c); is electrically non-conductive during operation.. . ... Osram Gmbh

02/18/16 / #20160049550

Method for producing a thin-film semiconductor body and thin-film semiconductor body

A method for producing a thin-film semiconductor body is provided. A growth substrate is provided. ... Osram Gmbh

02/18/16 / #20160049547

Optoelectronic component and method for the production thereof

A method for producing an optoelectronic component includes creating a first layer of a polymer material. The method also includes applying crystals to a surface of the first layer. ... Osram Gmbh

02/18/16 / #20160049543

Optoelectronic component and method of producing an optoelectronic component

An optoelectronic device includes a carrier on which a semiconductor layer sequence is applied, said semiconductor layer sequence including an n-doped semiconductor layer and a p-doped semiconductor layer such that a p-n junction is formed which includes an active zone that generates electromagnetic radiation, wherein at least one of the n-doped semiconductor layer and the p-doped semiconductor layer includes a doped region having a first doping concentration greater than a second doping concentration in a surrounding area of the region in the semiconductor layer including the region.. . ... Osram Gmbh

02/18/16 / #20160048716

Passive light-based data communication

Techniques are disclosed for light-based communication using a passive light-reflective device having specially coded reflective or printed optics. The optics can be mounted to an object and configured to reflect light such that a receiver is able to receive the reflected light. ... Osram Gmbh

02/11/16 / #20160043658

Isolated transformer-less capacitive power supply

An isolated transformer-less capacitive power supply, and methods for using the same to generate power, are disclosed. The power supply includes first and second input terminals to receive an alternating current (ac) voltage. ... Osram Gmbh

02/11/16 / #20160043530

Semiconductor laser having improved index guiding

A semiconductor laser includes a main body, a strip having a narrower width provided on the main body, and an active zone that generates light radiation, wherein surfaces of the main body laterally with respect to the strip and side surfaces of the strip are covered with an electrically insulating protective layer, an electrically conductive layer as a contact is provided on a top side of the strip, a cavity is provided between a side surface of the strip and the protective layer at least in a delimited section.. . ... Osram Gmbh

02/11/16 / #20160043339

Method for producing an electronic component and electronic component

A method for producing an electronic component with at least one first electrode zone (21) and one second electrode zone (23), which are separated from one another by an insulator (9) and each comprise at least one sublayer of a first electrically conductive material. Also disclosed is an electronic component, which may be produced using the disclosed method.. ... Osram Gmbh

02/11/16 / #20160043291

Light-emitting semiconductor component

An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.. . ... Osram Gmbh

02/11/16 / #20160043271

Method for producing an assembly emitting electromagnetic radiation, and assembly emitting electromagnetic radiation

In various exemplary embodiments, a method is provided for producing an assembly emitting electromagnetic radiation. In this case, a component composite structure is provided which has components emitting electromagnetic radiation, which components are coupled to one another physically in the component composite structure. ... Osram Gmbh

02/04/16 / #20160036198

Housing and method for producing a housing

A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. ... Osram Gmbh

02/04/16 / #20160033852

Light source module for optical projection device and optical projection device including the light source module

The light source module may include a plurality of light-emitting units, at least two optical units, and at least two light conversion units. Light from a first light-emitting unit exits as first exiting light processed by a first and second optical units, light from a second light-emitting unit forms first converted light processed by the first optical unit and converted by a first light conversion unit, light from a third light-emitting unit forms second converted light processed by the second optical unit and converted by a second light conversion unit. ... Osram Gmbh

02/04/16 / #20160033689

Optical element and optoelectronic component comprising optical element

An optical element has a first surface and a second surface, wherein a tooth structure having a multiplicity of teeth oriented in a second direction is arranged on the first surface, a stepped lens having a multiplicity of steps oriented in a first direction is arranged on the second surface, and the tooth structure forms a total internal reflection lens.. . ... Osram Gmbh

02/04/16 / #20160033112

Lighting device with a phosphor body spaced apart from a light source

In various embodiments, a lighting device is provided. The lighting device includes at least one light source for emitting primary light, at least one phosphor body which is illuminatable by the primary light and is spaced apart from the at least one light source, and at least one light scattering body which is situated optically downstream of the phosphor body in a light propagation direction of the primary light that is uninfluenced by the phosphor body. ... Osram Gmbh

01/28/16 / #20160027980

Optoelectronic semiconductor chip and optoelectronic module

An optoelectronics semiconductor chip has a substrate and a semiconductor body arranged on the substrate and has a semiconductor layer sequence. The semiconductor layer sequence includes an active region arranged between a first semiconductor layer and a second semiconductor layer and is provided to generate or to receive radiation. ... Osram Gmbh

01/28/16 / #20160027979

Optoelectronic component and electronic device having an optoelectronic component

An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.. . ... Osram Gmbh

01/28/16 / #20160027976

Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

An optoelectronic semiconductor component has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has at least one side surface and wherein a part of the electromagnetic radiation exits through the side surface during operation of the semiconductor chip. ... Osram Gmbh

01/28/16 / #20160027972

Method of encapsulating an optoelectronic device and light-emitting diode chip

A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.. . ... Osram Gmbh

01/28/16 / #20160027971

Wavelength converters and methods for making the same

Disclosed herein are wavelength converters and methods for making the same. The wavelength converters include a single layer of a polymeric matrix material, and one or more types of wavelength converting particles. ... Osram Gmbh

01/28/16 / #20160027959

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

In at least one embodiment, a method is designed to produce optoelectronic semiconductor chips. A carrier assembly, which is a sapphire wafer, is produced. ... Osram Gmbh

01/28/16 / #20160027765

Display device

A display device includes at least one semiconductor body, which has a semiconductor layer sequence, which has an active region provided for producing radiation and forms a plurality of pixels. The device also includes a driver circuit that has a plurality of switches, which are each provided for controlling at least one pixel. ... Osram Gmbh

01/28/16 / #20160027759

Process for connecting joining parts

A method is provided for connecting parts to be joined. A first layer sequence is applied to a first part to be joined. ... Osram Gmbh

01/28/16 / #20160023242

Method of making wavelength converters for solid state lighting applications

Disclosed herein are technologies utilizing sacrificial material layers for producing and transferring wavelength converters for light emitting devices via lift-off. In some embodiments the technologies utilize a precursor in the form of a substrate having a sacrificial layer formed thereon. ... Osram Gmbh

01/21/16 / #20160020365

Optoelectronic component

An optoelectronic component includes a carrier substrate, a single optoelectronic semiconductor chip arranged on the carrier substrate, an emission surface that emits light radiation which is part of a front side of the optoelectronic component, and a reflective layer adjacent to the emission surface at the front side of the optoelectronic component, wherein the emission surface is arranged such that the emission surface forms a part of an edge of the front side of the optoelectronic component.. . ... Osram Gmbh

01/21/16 / #20160020201

Optoelectronic semiconductor chip and method for fabrication thereof

An optoelectronic semiconductor chip has a first semiconductor layer sequence which comprises a multiplicity of microdiodes, and a second semiconductor layer sequence which comprises an active region. The first semiconductor layer sequence and the second semiconductor layer sequence are based on a nitride compound semiconductor material, the first semiconductor layer sequence is before the first semiconductor layer sequence in the direction of growth, and the microdiodes form an esd protection for the active region.. ... Osram Gmbh

01/21/16 / #20160018062

Lighting device

Various embodiments may relate to a lighting device, which includes a lamp tube having two open ends, a light engine arranged in the lamp tube, a carrier supporting the light engine, and two end caps closing the open ends. The lighting device further includes a diffuser. ... Osram Gmbh

01/21/16 / #20160017489

Method for supplying a process with an enriched carrier gas

A method for supplying a process with an enriched carrier gas. A first apparatus and a second apparatus are provided. ... Osram Gmbh

01/14/16 / #20160013447

Radiation-emitting device

A radiation-emitting device includes a substrate, at least one layer sequence arranged on the substrate and adapted to generate electromagnetic radiation, including at least one first electrode surface, at least one second electrode surface, and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer is adapted to generate electromagnetic radiation in a switched-on operating state, at least one transparency region transparent to at least one partial spectrum of electromagnetic radiation at least in a switched-off operating state, and at least one non-transparency region non-transparent to the partial spectrum of electromagnetic radiation, wherein the transparency region and the non-transparency region are arranged such that electromagnetic radiation from the partial spectrum can pass through the radiation-emitting device through the transparency region.. . ... Osram Gmbh

01/14/16 / #20160013380

Optoelectronic component and method for producing same

The present application relates to a method of producing an optoelectronic component. An optoelectronic is produced by this method. ... Osram Gmbh

01/14/16 / #20160013369

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component, comprising: a carrier (1) and a semiconductor layer sequence (20) configured for emission of electromagnetic primary radiation and arranged on the carrier (10). The semiconductor layer sequence (20) comprises a radiation main side (21) facing away from the carrier. ... Osram Gmbh

01/14/16 / #20160010828

Lighting device with optoelectronic light source

Various embodiments relate to a lighting device with an optoelectronic light source, an optical body downstream thereof for distributing the light, and a diffuser downstream of the latter, onto the light entry surface of which the light emitted by the optical body falls and the light exit surface of which represents a light emission surface of the lighting device. To homogenize the luminous intensity on the light exit surface, in addition to distributing the light with the optical body, the diffuser is not provided to be uniformly scattering to such an extent that light falling thereon in a central region is scattered more intensely than light falling thereon in an edge region.. ... Osram Gmbh

01/14/16 / #20160010812

Lighting device with a pump laser matrix, and method for operating said lighting device

A lighting device comprising a pump laser matrix (2) and a phosphor arrangement. The pump laser matrix (2) is configured to emit pump radiation (7) having a controllable pump radiation power distribution for the irradiation of the phosphor arrangement (4). ... Osram Gmbh

01/14/16 / #20160010808

Led module including an led

An led module includes a carrier plate having an arrangement face and a wall on the upper side of the plate, the wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; an led arranged on the face; a contact element, to which the led is connected; and an at least partially transparent potted body covering the arrangement face and the led towards the top and laterally adjoins an inner face of the wall. The wall is formed monolithically with the remaining carrier plate and is interrupted over its periphery, and the potted body does not adjoin the inner wall face of the wall. ... Osram Gmbh

01/07/16 / #20160005940

Device having at least one optoelectronic semiconductor component

The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.. . ... Osram Gmbh

01/07/16 / #20160005936

Method for producing an optoelectronic component

A method can be used for for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. ... Osram Gmbh

01/07/16 / #20160005930

Optoelectronic semiconductor chip encapsulated with an ald layer and corresponding method of production

An optoelectronic semiconductor chip includes a semiconductor body including n-conducting and p-conducting regions, an active region generating electromagnetic radiation, a mirror layer reflecting the electromagnetic radiation, and an encapsulating layer sequence formed with an insulating material, wherein the mirror layer is arranged at an underside of the p-conducting region, the active region is arranged at a side of the p-conducting region facing away from the mirror layer, the n-conducting region is arranged at a side of the active region facing away from the p-conducting region, the encapsulation layer sequence covers the semiconductor body at the outer surface thereof in places, the encapsulation layer sequence extends at the outer surface of the semiconductor body from the active region along the p-conducting region as far as below the mirror layer, and the encapsulation layer sequence includes at least one encapsulation layer which is an ald layer or consists of an ald layer.. . ... Osram Gmbh

01/07/16 / #20160005722

Optoelectronic semiconductor component and method for producing same

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. ... Osram Gmbh

01/07/16 / #20160005720

Method for producing an optoelectronic device and optoelectronic device

A method for producing an optoelectronic device is specified. A housing base body is formed with a self-healing polymer material. ... Osram Gmbh

01/07/16 / #20160003890

Method and device for measuring and optimizing an optoelectronic component

A method can be used for measuring at least one optoelectronic component arranged on a connection carrier. The method includes exciting an electromagnetic oscillating circuit, which is formed by the optoelectronic component and the connection carrier, thus exciting the optoelectronic component in such a way that the optoelectronic component emits electromagnetic radiation, and measuring at least one electro-optical property of the optoelectronic component.. ... Osram Gmbh

01/07/16 / #20160003670

Techniques for lumen maintenance and color shift compensation

Techniques are disclosed for maintaining consistent lumen output of a lighting assembly over time. By maintaining a consistent lumen output, it is possible to maintain acceptable color stability where color mixing of multiple outputs is used. ... Osram Gmbh

01/07/16 / #20160003436

Optoelectronic lighting module, optoelectronic lighting apparatus and vehicle headlamp

An optoelectronic lighting module (100) is provided having at least two optoelectronic semiconductor chips (10) with a radiation outlet surface (11) and an electrically non-conductive back side (12) facing away from the radiation outlet surface,—a cooling body (20) with a cooling body top side (21) and a cooling body bottom side (22) facing away from the cooling body top side (21),—two contact strips (30) with a contact top side (31) and a contact bottom side (32) facing away from the contact top side (31), wherein—the optoelectronic semiconductor chips (10) are arranged with the electrically non-conductive back side (12) on the cooling body top side (21),—each optoelectronic semiconductor chip (10) comprises two electric contact points (13) formed in the direction of the radiation outlet surface (11), and—the optoelectronic semiconductor chips (10) are connected in series via the electric contact points (13).. . ... Osram Gmbh








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