Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Osram Gmbh patents (2017 archive)


Recent patent applications related to Osram Gmbh. Osram Gmbh is listed as an Agent/Assignee. Note: Osram Gmbh may have other listings under different names/spellings. We're not affiliated with Osram Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Osram Gmbh-related inventors


Lead frame

A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side includes an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.. ... Osram Gmbh

Optoelectronic component

An optoelectronic component is disclosed. In an embodiment the optoelectronic component includes an active zone configured to produce electromagnetic radiation, wherein the active zone has at least two quantum films, wherein the first quantum film is arranged between a first barrier layer and a second barrier layer, wherein the second quantum film is arranged between the second barrier layer and a last barrier layer, and wherein bandgaps of the first barrier layer and of the second barrier layer are related differently to one another than bandgaps of the second barrier layer and of the last barrier layer.. ... Osram Gmbh

Optoelectronic assembly and method for operating an optoelectronic assembly

According to the present disclosure, an optoelectronic assembly is disclosed with at least one optoelectronic component, and a sensor circuit. The sensor circuit includes at least one energy supply circuit and an ascertainment circuit having at least one energy storage unit and a detection unit. ... Osram Gmbh

Support structure for lighting devices, corresponding lighting device and method

According to the present disclosure, a support structure for lighting devices, e.g. Led lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.. ... Osram Gmbh

Heat sink, corresponding lighting device and method of use

Accroding to the present disclosure, a heat sink, which may be used e.g. For led lamps or bulbs for motor vehicle lights, includes: a plate-like portion extending along an axis with opposed mounting surfaces for at least one heat source, such as e.g. ... Osram Gmbh

Edge-emitting semiconductor laser and method for operating a semiconductor laser

An edge-emitting semiconductor laser and a method for operating a semiconductor laser are disclosed. In an embodiment, the edge-emitting semiconductor laser includes an active zone within a semiconductor layer sequence and a stress layer. ... Osram Gmbh

Edge assembly for attaching to flexible substrates

There is described an edge assembly for attaching to flexible substrates. An example assembly may comprise at least a first edge component and a compression retainer component. ... Osram Gmbh

Conversion element, optoelectronic semiconductor device and method for producing conversion elements

Disclosed is a conversion element (100). The conversion element (100) comprises: a conversion coating (16), which contains a wavelength-converting conversion material; a first encapsulation coating (30) on a first main surface (20) of the conversion coating, said first encapsulation coating having a thickness of between 10 μm and 500 μm; and a second encapsulation coating (32) on a second main surface (22) of the conversion coating, said second encapsulation coating having a thickness of between 0.1 μm and 20 μm. ... Osram Gmbh

Optoelectronic element and optoelectronic component

The invention relates to an optoelectronic element comprising a semiconductor chip (12) that emits a blue-green light (4) during operation and has at least one light passage surface (12a) through which the blue-green light (4) emitted during operation passes and comprising a conversion element (3) which comprises fluorescent particles (31), in particular fluorescent particles of only one type, and which is arranged on the light passage surface (12a) at least in some areas. The fluorescent particles (31) at least partly convert the blue-green light (4) into a red light (5), and the optoelectronic element emits a white mixed light (6) which contains non-converted components of the blue-green light (4) and components of the red light (5).. ... Osram Gmbh

Optoelectronic arrangement having a radiation conversion element and method for producing a radiation conversion element

An optoelectronic arrangement having a radiation conversion element and a method for producing a radiation conversion element are disclosed. In an embodiment, an optoelectronic arrangement includes a semiconductor chip having an active region configured to generate radiation, a radiation conversion element arranged downstream of the semiconductor chip in an emission direction and a reflective polarization element arranged downstream of the radiation conversion element in the emission direction. ... Osram Gmbh

Semiconductor chip, method for producing a plurality of semiconductor chips and method for producing an electronic or optoelectronic device and electronic or optoelectronic device

A method for producing a multiplicity of semiconductor chips (13) is provided, comprising the following steps: providing a wafer (1) comprising a multiplicity of semiconductor bodies (2), wherein separating lines (9) are arranged between the semiconductor bodies (2), depositing a contact layer (10) on the wafer (1), wherein the material of the contact layer (10) is chosen from the following group: platinum, rhodium, palladium, gold, and the contact layer (10) has a thickness of between 8 nanometres and 250 nanometres, inclusive, applying; the wafer (1) to a film (11), at least partially severing the wafer (1) in the vertical direction along the separating lines (9) or introducing fracture nuclei (12) into the wafer (1) along the separating lines (9), and breaking the wafer (1) along the separating lines (9) or expanding the film (11) such that a spatial separation of the semiconductor chips (13) takes place, wherein the contact layer (10) is also separated. A semiconductor chip, a component and a method for producing the latter are also provided.. ... Osram Gmbh

Optical unit for a headlight, optics arrangement and headlight

In various embodiments, an optical unit is provided. The optical unit includes a first optics element which act as a lens and is made of silicone, and a second optics element. ... Osram Gmbh

Holding device for lamps in vehicle lights and vehicle light

In various embodiments, a holding device for lamps in vehicle lights is provided. The holding device may include a plate-like section that is provided with at least one receptacle for a lamp, and socket contacts for the energy supply of the lamp arranged in the receptacle. ... Osram Gmbh

Light-emitting apparatus and method for producing a light-emitting apparatus

An light-emitting apparatus and a method for producing a light-emitting apparatus are disclosed. In an embodiment, the apparatus includes at least one organic device and an outcoupling layer, wherein the at least one organic device emits electromagnetic radiation during operation, wherein the outcoupling layer contains optical structures, and wherein the apparatus has a non-lambertian radiation distribution curve during operation. ... Osram Gmbh

12/14/17 / #20170358747

Method for producing an organic light-emitting component

A method for producing an organic light-emitting component is disclosed with providing a carrier, forming a first electrode over the carrier, forming an organic functional layer structure over the first electrode, and forming a second electrode over the functional layer structure. The first and second electrodes and the functional layer structure overlap in an optically active region which extends in the lateral direction and is embodied to generate light. ... Osram Gmbh

12/14/17 / #20170358719

Semiconductor layering sequence for generating visible light and light emitting diode

In at least one embodiment, the semiconductor layering sequence (1) is designed for generating light and comprises semiconductor columns (2). The semiconductor columns (2) have a respective core (21) made of a semiconductor material of a first conductivity type, and a core shell (23) surrounding the core (21) made of a semiconductor material of a second conductivity type. ... Osram Gmbh

12/14/17 / #20170358718

Optoelectronic semiconductor chip, method for producing an optoelectronic semiconductor chip, conversion element and phosphor for a conversion element

An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a wavelength-converting joining layer (7) that connects the conversion platelet (6) to the radiation exit face (3), wherein the wavelength-converting joining layer (7) has luminescent material particles (4) that are suitable for converting radiation in the first wavelength range into radiation in a third wavelength range, which is different from the first wavelength range and the second wavelength range. ... Osram Gmbh

12/14/17 / #20170356616

Lighting device, corresponding lamp and method

A lighting device, which may be used e.g. To produce motor vehicle lamps, may include a light radiation source, e.g. ... Osram Gmbh

12/07/17 / #20170352838

Organic light-emitting diode and method for producing an organic light-emitting diode

In one embodiment the organic light-emitting diode includes a substrate having a substrate upper side, an electrically conductive grid structure for a current distribution and an electrically conductive particle layer, which are located at the substrate upper side. The grid structure may be embedded in the particle layer. ... Osram Gmbh

12/07/17 / #20170352700

Display device and method for producing a display device

A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. ... Osram Gmbh

12/07/17 / #20170352535

Method of producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

A method of producing an optoelectronic semiconductor chip includes in order: a) creating a nucleation layer on a growth substrate, b) applying a mask layer on to the nucleation layer, c) growing a coalescence layer, wherein the coalescence layer is grown starting from regions of the nucleation layer not covered by mask islands having a first main growth direction perpendicular to the nucleation layer so that ribs are formed, d) further growing the coalescence layer with a second main growth direction parallel to the nucleation layer to form a contiguous and continuous layer, e) growing a multiple quantum well structure on the coalescence layer, f) applying a mirror having metallic contact regions that impress current into the multiple quantum well structure and mirror islands for the total reflection of radiation generated in the multiple quantum well structure, and g) detaching the growth substrate and creating a roughening by etching.. . ... Osram Gmbh

12/07/17 / #20170350570

Illumination apparatus with sensor at the absorber

An illumination apparatus is provided. The illumination apparatus includes a light-emitting device including one or more light sources, a mirror device including at least one pivotable mirror for directing light from the one or more light sources in a defined first pivot state into a first solid angle region in which the light is utilized in accordance with operation, and a defined second pivot state into a second solid angle range that differs from the first one and in which the light is directed onto an absorber device of the illumination apparatus. ... Osram Gmbh

12/07/17 / #20170350569

Lighting device with a luminescent material

A lighting device is disclosed with an electromagnetic radiation source for irradiating a conversion element arranged in the lighting device with an excitation radiation. The conversion element has a first element side and a second element side. ... Osram Gmbh

12/07/17 / #20170350568

Luminaire

Disclosed is a lighting fixture comprising at least three light functions, said lighting fixture being a trifunctional projector. In particular, a vehicle headlight is disclosed, which has in addition to a dipped beam and a main beam a daytime running light and/or a position light as a further light function.. ... Osram Gmbh

12/07/17 / #20170350562

Lighting device having a pumping light unit and luminescent element

A lighting device provides a pump light unit for emitting pump light, a phosphor element for generating conversion light in response to excitation by the pump light, and a wavelength-dependent beam splitter which is reflective to the pump light and transmissive to the conversion light. The first pump light portion is incident on a light incidence surface of the beam splitter and is reflected from the beam splitter to the phosphor element. ... Osram Gmbh

11/30/17 / #20170347437

Lighting device

A lighting device with a conversion element is provided. It may be irradiated with excitation radiation from an electromagnetic radiation source. ... Osram Gmbh

11/30/17 / #20170346040

Process for producing an optoelectronic component, optoelectronic component and protective layer

Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.. ... Osram Gmbh

11/30/17 / #20170346033

Method for producing an organic optoelectronic component, and organic optoelectronic component

A method of producing an organic optoelectronic component includes: forming a first electrode layer comprising a contact region, arranging an electrically conductive contact lug on the first electrode layer. A first section of the contact lug is secured in the contact region on the first electrode layer such that a second section projects beyond the contact region. ... Osram Gmbh

11/30/17 / #20170345977

Conversion element and production method thereof

A method for the production of a conversion element (3) is disclosed, which comprises the following steps: a) provision of a first covering member (1) which has a first connecting surface (1a) and of a second covering member (2), b) insertion of at least one cavity (10) into the first covering member (1) on the first connecting surface (1a), c) filling of the at least one cavity (10) with a filling compound (30), which comprises a conversion material (31), d) applying of the second covering member (2) to the first connecting surface (1a) of the first covering member (1), e) cohesive connection of the first covering member (1) and of the second covering member (2).. . ... Osram Gmbh

11/30/17 / #20170345966

Method of producing a semiconductor body

A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.. . ... Osram Gmbh

11/30/17 / #20170343179

Lighting apparatus

A lighting apparatus is disclosed with a light generating device, at least one collimator lens, first and second parabolic mirrors, an optical diaphragm embodied in a light reflecting fashion, and a spherical mirror. The diaphragm is arranged between the parabolic mirrors, extending as far as a common focus of them. ... Osram Gmbh

11/30/17 / #20170343163

Lamp comprising a driver circuit board and a base

Disclosed is a lamp (1) comprising a driver circuit board (16) and a base (2) which are electrically connected to one another by a plug connector (3, 17). The invention applies to semiconductor lamps, for example, especially led lamps, in particular retrofit lamps, e.g. ... Osram Gmbh

11/30/17 / #20170339844

Cover member for a greenhouse, greenhouse, and use of a layer for a cover member

A cover member for an in-store greenhouse is disclosed, with which radiation exiting the in-store greenhouse can be influenced or modified.. . ... Osram Gmbh

11/23/17 / #20170338626

Laser diode chip

A laser diode chip is described. In an embodiment the laser diode chip includes an n-type semiconductor region, a p-type semiconductor region and an active layer arranged between the n-type semiconductor region and the p-type semiconductor region, wherein the active layer is in the form of a single quantum well structure. ... Osram Gmbh

11/23/17 / #20170338384

Semiconductor device and method for producing a plurality of semiconductor devices

A semiconductor device and a method for producing a plurality of semiconductor devices are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. ... Osram Gmbh

11/23/17 / #20170338217

Optoelectronic semiconductor chip and method for fabrication thereof

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a first semiconductor layer sequence having a plurality of microdiodes, and a second semiconductor layer sequence having an active region. ... Osram Gmbh

11/23/17 / #20170337031

Optoelectronic lighting device, video wall module and signal transmitter for a light signaling installation

An optoelectronic lighting device includes a carrier, a plurality of light-emitting optoelectronic components arranged on an upper side of the carrier, and at least one layer of a hydrophobic aerogel that protects the plurality of light-emitting optoelectronic components from influences of moisture. A video wall module includes the optoelectronic light device. ... Osram Gmbh

11/23/17 / #20170334338

Projection lamp for illumination

A projection lamp for illumination includes a pump radiation unit configured to emit pump radiation, a phosphor element for the at least partial conversion of the pump radiation into a conversion light, and a micromirror array having a multiplicity of micromirror actuators which are arranged in the form of a matrix. The projection lamp is set up such that, during operation, the phosphor element is irradiated by the pump radiation from the pump radiation unit. ... Osram Gmbh

11/16/17 / #20170331426

Photovoltaic module and photovoltaic system

. . A photovoltaic module is specified, comprising: a cylindrical light-transmissive tube enclosing an interior and having a main extension direction and a curved inner surface facing the interior, and a mechanically flexible photovoltaic component comprising a solar cell arrangement applied on a carrier film, wherein the photovoltaic component is arranged in the interior, the solar cell arrangement has a curvature, wherein the curvature follows the curved course of the inner surface of the tube at least in places and the solar cell arrangement at least partly covers the inner surface, wherein the covered inner surface forms a light passage surface of the photovoltaic module.. . ... Osram Gmbh

11/16/17 / #20170331257

Light-emitting semiconductor chip and method for producing a semiconductor light-emitting chip

A light-emitting semiconductor chip (100) is provided, having a first semiconductor layer (1), which is at least part of an active layer provided for generating light and which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).. ... Osram Gmbh

11/16/17 / #20170331074

Optoelectronic component and method for producing an optoelectronic component

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a metal substrate having a surface, an electrically conductive planarization layer on the surface of the metal substrate, wherein the planarization layer comprises a surface, an organically functional layer structure on or above the surface of the planarization layer, and an electrode layer formed in a transparent fashion on or above the organically functional layer structure. ... Osram Gmbh

11/16/17 / #20170331064

Light-emitting component and method for producing a light-emitting component

A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.. ... Osram Gmbh

11/16/17 / #20170331019

Optoelectronic semiconductor component and method of producing an optoelectronic semiconductor component

An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.. . ... Osram Gmbh

11/16/17 / #20170331018

Optoelectronic component and method for the production thereof

An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.. . ... Osram Gmbh

11/16/17 / #20170331015

Optoelectronic component and illumination device

An optoelectronic component includes an optoelectronic semiconductor chip and an optical element, wherein the optical element includes a prism structure configured to split light emitted by the semiconductor chip into two beams and deflect the beams in a first direction relative to one another, and the optical element includes a beam deflecting structure configured to deflect both beams jointly in a second direction perpendicular to the first direction.. . ... Osram Gmbh

11/16/17 / #20170330997

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a layer structure having an active zone for producing electromagnetic radiation, wherein the active zone is arranged in a first plane, wherein a recess is introduced into the surface of the layer structure, wherein the recess adjoins an end surface of the component, wherein the end surface is arranged in a second plane, wherein the second plane is arranged substantially perpendicularly to the first plane, wherein the recess has a bottom surface and a lateral surface wherein the lateral surface is arranged substantially perpendicularly to the end surface, wherein the lateral surface is arranged tilted at an angle not equal to 90° to the first plane of the active zone, and wherein the bottom surface is arranged in the region of the first plane of the active zone.. ... Osram Gmbh

11/16/17 / #20170330996

Semiconductor chip and method for producing a semiconductor chip

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).. ... Osram Gmbh

11/16/17 / #20170330981

Component and method for producing a component

A component with a semiconductor body, and first and second metal layer is disclosed. The first metal layer is arranged between the semiconductor body and the second metal layer, the semiconductor body has a first semiconductor layer on a side which is averted from the first metal layer, a second semiconductor layer on a side facing towards the first metal layer, and an active layer arranged between the first semiconductor layer and the second semiconductor layer, the component has a through-connection, which extends through the second semiconductor layer and the active layer for the electrical bonding of the first semiconductor layer. ... Osram Gmbh

11/16/17 / #20170330757

Method for producing a semiconductor chip and semiconductor chip

A method for producing a semiconductor chip (100) is provided, in which, during a growth process for growing a first semiconductor layer (1), an inhomogeneous lateral temperature distribution is created along at least one direction of extent of the growing first semiconductor layer (1), such that a lateral variation of a material composition of the first semiconductor layer (1) is produced. A semiconductor chip (100) is additionally provided.. ... Osram Gmbh

11/16/17 / #20170328540

Lighting device having a wavelength conversion assembly

A lighting device is disclosed with excitation light source(s) for emitting excitation light along an excitation light path; a wavelength conversion assembly including wavelength conversion element(s) for converting the excitation light into conversion light and emitting it into the same half-space from which the excitation light is radiated onto the surface of the element, and reflection element(s) for reflecting, in unconverted fashion, the excitation light intermittently radiated onto the reflection element from the source(s) along the portion of the excitation light path onto a reflection light path as reflection light; and a dichroic mirror for deflecting the excitation light coming from the source(s) onto the portion of the excitation light path on which the excitation light is radiated onto the wavelength conversion element(s) or the reflection element(s). The mirror is configured such that the conversion light is transmitted through the mirror and the reflection light is guided past the mirror.. ... Osram Gmbh

11/16/17 / #20170328525

Light-emitting diode and lighting module

A light-emitting diode and a light module are disclosed. In an embodiment the light-emitting diode includes at least one light-emitting diode chip and a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation, wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view. ... Osram Gmbh

11/16/17 / #20170325729

Pulse oximetry device and method of operating a pulse oximetry device

A pulse oximetry device includes a light emission device configured to emit light with a wavelength in a first wavelength interval and light with a wavelength in a second wavelength interval, a first light detector configured to detect light with a wavelength in the first wavelength interval, but not to respond to light with a wavelength in the second wavelength interval, and a second light detector configured to detect light with a wavelength in the first wavelength interval and detect light with a wavelength in the second wavelength interval, wherein the first light detector has a first light reception surface, the second light detector has a second light reception surface, and the first light reception surface and the second light reception surface are arranged in a common plane and are interleaved with one another.. . ... Osram Gmbh

11/09/17 / #20170325313

Optoelectronic circuit and method for operating an optoelectronic circuit

An optoelectronic circuit includes at least one first and second light emitting diodes; a switch arrangement connected between the first and second diodes and configured to switch over the first and second diodes between series and parallel circuits depending on a predefined ambient parameter; and a current matching circuit for matching the currents through the first and second diodes in case of parallel connection. The current matching circuit includes a current mirror circuit, including first and second current mirror transistors connected via its collector terminal to the first/second diodes, respectively. ... Osram Gmbh

11/09/17 / #20170324065

Organic light-emitting diode, organic light module, and method for producing an organic light-emitting diode

An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. ... Osram Gmbh

11/09/17 / #20170324012

Optoelectronic component and method of producing an optoelectronic component

An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.. . ... Osram Gmbh

11/09/17 / #20170324007

Optoelectronic device, use of a dual emitter as wavelength conversion material

An optoelectronic apparatus is disclosed. In an embodiment, the apparatus includes at least one wavelength conversion region which includes at least one dual emitter as wavelength conversion material, wherein the wavelength conversion region converts primary radiation at least in part into secondary radiation, and wherein the dual emitter includes a first electronic base state and a second electronic base state, together with a first electronically excited state and a second electronically excited state which may be reached from the first electronically excited state. ... Osram Gmbh

11/09/17 / #20170324006

Method of producing a carrier and method of producing an optoelectronic component

A method of producing a carrier for an optoelectronic component includes providing a lead frame having an upper side and a lower side; arranging a first film on the lower side of the lead frame; arranging a second film on the upper side of the lead frame; forming a molded body from a molding material, the lead frame being embedded in the molded body; and removing the first film and the second film.. . ... Osram Gmbh

11/09/17 / #20170324005

Optoelectronic semiconductor chip

According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.. ... Osram Gmbh

11/09/17 / #20170324001

Light-emitting semiconductor chip

A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. ... Osram Gmbh

11/09/17 / #20170324000

Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. ... Osram Gmbh

11/09/17 / #20170323872

Optoelectronic component and method of producing same

An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body, the chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, the optoelectronic component includes an upper insulation layer extending over the first top side metallization, and the optoelectronic component includes a second top side metallization arranged above the upper insulation layer and electrically insulated with respect to the first top side metallization by the upper insulation layer.. . ... Osram Gmbh

11/09/17 / #20170322155

Lighting device

In various embodiments, a lighting device is provided. The lighting device includes a phosphor volume for at least partial wavelength conversion of primary light into secondary light, a primary light semiconductor light source for irradiating the phosphor volume with primary light, a measurement light generating arrangement for generating measurement light having a spectral composition outside the primary light and the secondary light, a measurement light detector sensitive to the measurement light, and a measurement light filter, which is fixedly connected to the phosphor volume and is optically arranged between the measurement light generating arrangement and the measurement light detector.. ... Osram Gmbh

11/09/17 / #20170322154

Detecting damage to a converter device

A method for detecting damage to a converter device of a lighting apparatus is provided. The method may include irradiating the converter device with input light, detecting a useful light portion emitted principally by a first section of the converter device by means of a first sensor element. ... Osram Gmbh

10/26/17 / #20170311412

Multi-standard lighting control interface circuit

Lighting control interface techniques and corresponding circuitry are provided. The techniques include receiving a first signal potentially representative of a first lighting control signal, and receiving a second signal potentially representative of a second lighting control signal, and determining if either of the first and second signals complies with a first or second lighting control protocol. ... Osram Gmbh

10/26/17 / #20170310081

Semiconductor laser diode

A semiconductor laser diode is provided. In an embodiment the semiconductor laser diode includes a semiconductor layer sequence having semiconductor layers disposed vertically one above the other. ... Osram Gmbh

10/26/17 / #20170310079

Laser component and method of producing same

A laser component has a housing, which includes a carrier having a cavity with a bottom surface and a sidewall, wherein the cavity widens starting from the bottom surface, the side wall is inclined relative to the bottom surface by an angle different from 45°, a laser chip, an emission direction of which is oriented parallel to the bottom surface, is arranged on the bottom surface in the cavity, a reflective element is arranged in the cavity and bears on an edge between the bottom surface and the side wall, a reflective surface of the reflective element defines an angle with the bottom surface of the cavity, and the emission direction defines an angle of 45° with the reflective surface of the reflective element.. . ... Osram Gmbh

10/26/17 / #20170309851

Light-emitting component

A light emitting component is disclosed. In an embodiment a light-emitting device includes at least one active layer stack configured to generate light, a first electrode electrically contacting the at least one active layer stack, a second electrode electrically contacting the at least one active layer stack and at least one light-emitting face for emitting light. ... Osram Gmbh

10/26/17 / #20170309794

Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip

In at least one embodiment, the optoelectronic semiconductor chip (100) comprises a semiconductor layer sequence (1) comprising a top side (2), a bottom side (3) diametrically opposite the top side (2), and an active layer (11) for generating electromagnetic radiation at a first wavelength (10), wherein the semiconductor chip (100) is free of a growth substrate for the semiconductor chip layer sequence (1). The semiconductor chip (100) further comprises a plurality of contact elements (30) which are arranged on the bottom side (3) and can be electronically controlled individually and independently from each other. ... Osram Gmbh

10/26/17 / #20170309777

Optoelectronic semiconductor chip comprising a multi-quantum well comprising at least one high barrier layer

An optoelectronic semiconductor chip including a multi-quantum well including at least one high barrier layer is disclosed. In an embodiment, the chip includes a p-type semiconductor region, an n-type semiconductor region and an active layer suitable for emission of radiation arranged between the p-type region and the n-type region, wherein the active layer is in the form of a multiple quantum well structure. ... Osram Gmbh

10/26/17 / #20170309481

Method for producing a plurality of semiconductor chips and semiconductor chip

A method for producing a plurality of semiconductor chips and a semiconductor chip are disclosed. The method includes applying a mask material on a growth surface of a growth substrate, wherein the growth surface includes sapphire, patterning the mask material into a multiply-connected mask layer by introducing openings into the mask material, wherein the growth surface is exposed at the bottom of at least some of the openings, applying a semiconductor layer sequence on the mask layer and on the growth surface and singulating at least the semiconductor layer sequence into the plurality of semiconductor chips, wherein each semiconductor chip includes lateral dimensions and the lateral dimensions are large compared to an average distance of the openings to the nearest opening.. ... Osram Gmbh

10/26/17 / #20170307177

Lighting assembly comprising a shutter that consists of a plurality of apertures

A light assembly includes a light source, and a micromechanical shutter arrangement having a two-dimensional arrangement of closable shutter openings, wherein at least one shutter opening has a rectangular shape with a length and a width, and the length is greater than the width. The light assembly may be configured as a headlamp for a motor vehicle.. ... Osram Gmbh

10/26/17 / #20170307169

Lighting device for a motor vehicle and motor vehicle having the lighting device

In various embodiments, a lighting device for a motor vehicle is provided. The lighting device includes at least one light source, and at least one layer of a lacquer embodied such that light may be coupled into the lacquer for achieving a luminous effect. ... Osram Gmbh

10/26/17 / #20170307167

Lighting apparatus

A lighting apparatus includes at least one primary light source for emitting primary light, at least one phosphor body arranged at a distance from the primary light source, for converting the wavelength of primary light into secondary light, and at least one at least partly dichroic mirror, which at least partly deflects primary light radiated thereon onto at least one phosphor body and which passes secondary light radiated by the phosphor body. Used light radiated by the lighting apparatus contains the secondary light and primary light radiated by at least one primary light source, and the dichroic mirror includes at least one first and second mirror regions, in such a way that the first mirror region deflects primary light onto at least one phosphor body and passes secondary light incident from the phosphor body, and that the second mirror region deflects primary light in a manner circumventing the phosphor body.. ... Osram Gmbh

10/26/17 / #20170307161

Lighting apparatus

A lighting apparatus including a light generating device and at least one light wavelength conversion element and also at least one light directing means is provided. The light generating device and the at least one light directing means are configured in such a way that linearly polarized light is generated and directed from different directions to the at least one light wavelength conversion element, such that the linearly polarized light impinges on a surface of the at least one light wavelength conversion element from different directions in each case at an angle of incidence which corresponds to a brewster angle, wherein the polarization direction of the linearly polarized light is parallel to the plane of incidence thereof.. ... Osram Gmbh

10/26/17 / #20170307150

Formable three-dimensional lighting devices

A formed lighting device having a shape that extends in three dimensions is provided. The formed lighting device includes a formed flexible substrate having a shape, and a stretchable conductive trace located on the formable flexible substrate. ... Osram Gmbh

10/26/17 / #20170306224

Phosphor, method for producing a phosphor and use of a phosphor

A phosphor and a lighting device are disclosed. In an embodiment a lighting device includes a first phosphor disposed in a beam path of the primary radiation source, wherein the first phosphor has the formula sr(sram1−a)si2al2(n,x)6:d,a,b,e,g,l, wherein element m is selected from ca, ba, mg or combinations thereof, wherein element d is one or more elements selected from mn, ce, pr, nd, sm, eu, tb, dy, ho, er, tm, alkali metals or yb, wherein element a is selected from divalent metals different than those of the elements m and d, wherein element b is selected from trivalent metals, wherein element e is selected from monovalent metals, wherein element g is selected from tetravalent elements, wherein element l is selected from trivalent elements, wherein element x is selected from o or halogen, and wherein a parameter a is between 0.6 and 1.0.. ... Osram Gmbh

10/12/17 / #20170294630

Verfahren zum herstellen eines lateral strukturierten, organischen, lichtemittierenden bauelementes und lateral strukturierte, organische, lichtemittierende bauelmente

In various embodiments, a method for producing an organic light-emitting component is provided. The method includes forming an electrically active region and applying an adhesion-medium layer on or above the electrically active region. ... Osram Gmbh

10/12/17 / #20170294552

Optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.. . ... Osram Gmbh

10/12/17 / #20170294428

Method of producing optoelectronic modules and an assembly having a module

A method produces a plurality of optoelectronic modules, and includes: a) providing a metallic carrier assembly with a plurality of carrier units; b) applying a logic chip, each having at least one integrated circuit, to the carrier units; c) applying emitter regions that generate radiation, which can be individually electrically controlled; d) covering the emitter regions and the logic chips with a protective material; e) overmolding the emitter regions and the logic chips so that a cast body is formed, which joins the carrier units, the logic chips and the emitter regions to one another; f) removing the protective material and applying electrical conductor paths to the upper sides of the logic chips and to a cast body upper side; and g) dividing the carrier assembly into the modules.. . ... Osram Gmbh

10/05/17 / #20170288667

Lighting device

The invention relates to a lighting device comprising an illuminant embodied as an oled, and comprising a capacitive switching means, which are arranged on a substrate, wherein the illuminant has a first electrically conductive electrode and a second electrically conductive electrode, wherein a layer comprising organic, electroluminescent material is arranged between the first electrode and the second electrode, wherein the switching means has an electrode, wherein one electrode from the first electrode or the second electrode of the illuminant together with the electrode of the switching means is arranged in one plane, wherein a nonconductive spacing amounting to between 100 μm and 700 μm, more particularly between 400 μm and 600 μm, is present between said one electrode of the illuminant and the electrode of the switching means in the plane.. . ... Osram Gmbh

10/05/17 / #20170288108

Light-emitting diode device

An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein the light-emitting diode is at least partly enclosed by molding by a potting compound.. . ... Osram Gmbh

10/05/17 / #20170288094

Optoelectronic semiconductor component

Disclosed is an optoelectronic semiconductor component (1) comprising a semiconductor member (2) that has a succession of semiconductor layers including an active region (20) for generating radiation, a first semiconductor layer (21), and a second semiconductor layer (22). The active region is located between the first semiconductor layer and the second semiconductor layer; the semiconductor member has a plurality of cavities (25) which extend through the second semiconductor layer and the active region; and from a bird's eye view onto the semiconductor member, the cavities are elongate and have a longitudinal axis (250).. ... Osram Gmbh

10/05/17 / #20170288091

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: •a) arranging at least one semiconductor chip (2) on a carrier (1), •b) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), •c) curing the photoresist (3) with a baking step, •d) patterning the photoresist (3) by exposure, •f) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), •g) again curing the photoresist (3) with a baking step, and •h) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (a) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip (2) is exposed in places.. . ... Osram Gmbh

10/05/17 / #20170285162

Lighting device for a vehicle and vehicle headlight

A lighting device for a vehicle is provided. The lighting device includes a light source with which at least one of useful light or assist light can be emitted into the surroundings, a sensor with which at least one of useful light or assist light reflected by the surroundings can be at least partially detected, and an electronic unit for evaluating at least one of the useful light or assist light sensed by the sensor.. ... Osram Gmbh

10/05/17 / #20170284858

Acoustic sensor

An acoustic sensor includes a layer sequence which can be caused to vibrate, and at least one detection element which is in mechanical contact with the layer sequence and is designed to convert vibrations into electrical signals. The layer sequence is a radiation-emitting layer sequence.. ... Osram Gmbh

10/05/17 / #20170284647

Flexible interconnection between substrates and a multi-dimensional light engine using the same

Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. ... Osram Gmbh

10/05/17 / #20170284637

Illumination apparatus for producing a rectangular light distribution in an illumination plane

An illumination apparatus for providing light and for illuminating an illumination plane with a rectangular light distribution is provided. The illumination apparatus includes at least one light source configured to generate light, a collimation optical unit configured to collimate the light, a condenser optical unit configured to shape a rectangular angular distribution of the light coming from the collimation optical unit, and a freeform optical unit having at least one freeform area for modifying the angular distribution such that a rectangular light distribution is produced in an illumination plane that is optically connected downstream.. ... Osram Gmbh

10/05/17 / #20170284628

Optoelectronic module and method for producing an optoelectronic module

A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. ... Osram Gmbh

10/05/17 / #20170284622

Illumination device for variable illumination

An illumination device for variable illumination in different spatial directions is provided. The illumination device includes a pump radiation unit, which has a pump radiation source for emitting pump radiation, a luminescent element for at least partial conversion of the pump radiation into illumination light, which is emitted in response to excitation with the pump radiation on an illumination light emission surface of the luminescent element, and optics which are assigned to the luminescent element and respectively direct illumination light ray bundles, which come from different positions of the illumination light emission surface and strike the optics on a luminescent material side, into a different spatial direction of the propagation on an illumination side opposite to the luminescent material side, the pump radiation unit is configured to respectively emit a pump ray bundle adjustably in different spatial directions, which pump ray bundles are coupled in on the illumination side.. ... Osram Gmbh

09/28/17 / #20170279011

Method for producing a conversion lamina and conversion lamina

A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. In an embodiment, the conversion lamina includes a base material and a conversion substance embedded in the base material, wherein the conversion lamina has a thickness between 60 μm inclusive and 170 μm inclusive.. ... Osram Gmbh

09/28/17 / #20170278829

Optoelectronic semiconductor component and flashlight

Optoelectronic semiconductor component includes at least four different light sources each including at least one optoelectronic semiconductor chip, which during operation emit radiation having mutually different colour loci in the cie standard chromaticity diagram, wherein the semiconductor component is designed to emit white or coloured light having a variable correlated colour temperature during operation.. . ... Osram Gmbh

09/28/17 / #20170276860

Retrofit lamp and vehicle headlight with retrofit lamp

In various embodiments, a retrofit lamp for vehicle headlight is provided. The retrofit lamp includes at least one semiconductor light source, a plurality of light output coupling optical units, and a light-guide apparatus which is embodied to guide light from the at least one semiconductor light source to the light output coupling optical units. ... Osram Gmbh

09/21/17 / #20170271553

Light emitting diode chip having temperature compensation of the wavelength

. . An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a p-type semiconductor region, an n-type semiconductor region, and an active layer arranged between the p-type semiconductor region and the n-type semiconductor region. ... Osram Gmbh

09/21/17 / #20170271438

Method of producing semiconductor chips

A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.. . ... Osram Gmbh

09/21/17 / #20170271295

Electronic device and method for producing an electronic device

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.. ... Osram Gmbh

09/21/17 / #20170269146

Method for identifying a short circuit in a first light emitting diode element, and optoelectronic subassembly

A method for identifying a short in a first light emitting diode element may include providing a first actuating circuit being a switched-off condition, wherein an output thereof is coupled to a first electrode of the first light emitting diode element, providing a second actuating circuit being a switched-off condition, wherein an output thereof is coupled to a first electrode of a second light emitting diode element and wherein inputs of the first and second actuating circuits, second electrodes of the first and second light emitting diode elements are electrically coupled to a first node, coupling the first electrode of the first light emitting diode element to a first connection of a test energy source, operating the first light emitting diode element in the off-state region using the test energy source, performing a check whether an electric current flows via the first light emitting diode element, and identifying the short.. . ... Osram Gmbh

09/21/17 / #20170268740

Retrofit lamp and vehicle headlight with retrofit lamp

In various embodiments, a retrofit lamp for vehicle headlights is provided. The retrofit lamp includes at least one semiconductor light source, a light output coupling optical unit, and a light guide configured to guide light from the at least one semiconductor light source to the light output coupling optical unit. ... Osram Gmbh

09/14/17 / #20170265267

Method for setting illumination light

Various embodiments relate to a method for setting the illumination light emitted by an illuminating unit for illuminating an object to be illuminated, wherein, from a color image of the object to be illuminated, recorded by means of a digital camera, a mean value color locus is ascertained from the respective pixel color information items for a pixel set containing at least some of the pixels of the color image, an associated white light color locus with the most similar correlated color temperature is ascertained for said mean value color locus and wherein, further, the illumination light is selected in such a way that an illumination light color locus of the illumination light substantially corresponds to the white light color locus.. . ... Osram Gmbh

09/14/17 / #20170264080

Laser diode assembly

A laser diode arrangement comprising: at least one semiconductor substrate; at least two laser stacks based on the alingan material system, each laser stack having an active zone, wherein at least one of the at least two laser stacks comprises a two-dimensional structure of laser diodes; and at least one intermediate layer. The laser stacks and the intermediate layer are grown monolithically on the semiconductor substrate. ... Osram Gmbh

09/14/17 / #20170264073

Method of producing a laser chip

A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.. . ... Osram Gmbh

09/14/17 / #20170263882

Optoelectronic device with an organic active layer

Optoelectronic device comprising an organic active layer provided for generating electromagnetic radiation, and first and second electrodes contacting the active layer. The second electrode has a second electrode layer. ... Osram Gmbh

09/14/17 / #20170263836

Production of a device having a strip-type leadframe

A method of producing a device includes providing a strip-shaped leadframe, wherein the leadframe includes leadframe sections arranged in a row next to one another and connection structures connecting the leadframe sections, the connection structures each connecting two adjacent leadframe sections; forming molded bodies on the leadframe, the molded bodies each mechanically connecting two adjacent leadframe sections; arranging semiconductor chips on the leadframe; and interrupting the connections of the leadframe sections realized by the connection structures.. . ... Osram Gmbh

09/14/17 / #20170263830

Optoelectronic component

An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.. . ... Osram Gmbh

09/14/17 / #20170263829

Optoelectronic component

An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.. . ... Osram Gmbh

09/14/17 / #20170263825

Method for producing an optoelectronic component, and optoelectronic component

A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector and forming a molded body, wherein the optoelectronic semiconductor chip, the reflector and the potting material are embedded into the molded body.. ... Osram Gmbh

09/14/17 / #20170263687

Organic device

An organic device is disclosed. In an embodiment the organic device includes an organic component designed to emit and/or detect radiation, wherein the organic component has a first layer stack and a radiation passage surface and an organic protection diode having a second layer stack, wherein the organic protection diode is arranged directly after the organic component in a stacking direction (z), and wherein the organic protection diode is designed to protect the organic component from an electrostatic discharge and/or from a polarity reversal of the organic component.. ... Osram Gmbh

09/14/17 / #20170261184

Enclosure with grommetless strain relief

Enclosures with grommetless strain relief are provided, each including a base and a cover. The base has a bottom and four sidewalls arranged to provide an open box-like structure. ... Osram Gmbh

09/07/17 / #20170257919

Circuit arrangement for operating at least a first and a second cascade of leds

A circuit arrangement for operating at least a first and a second cascade of leds is provided including an input having a first and a second input connection for coupling to a rectified ac supply voltage, a voltage equalization series impedance, and at least a higher and a lower led units which include cascades. The connection of the led cascade that is not coupled to a first diode is a second node, and the second node of the lowest led unit is coupled to a voltage equalization series impedance such that the impedance is coupled in series between the second node and the second input connection. ... Osram Gmbh

09/07/17 / #20170256735

Optoelectronic device and method of producing an optoelectronic device

An optoelectronic device includes a covering layer, a first electrode, a functional layer stack arranged between the covering layer and the first electrode and a plurality of spacers, wherein the functional layer stack has an organic active layer that generates electromagnetic radiation; the first electrode has conductor tracks with branching points, the spacers are each arranged on one of the branching points, and the functional layer stack is arranged in places between the covering layer and the spacers.. . ... Osram Gmbh

09/07/17 / #20170256715

Optoelectronic device

An optoelectronic device is disclosed. In an embodiment the optoelectronic device includes a light-transmissive first electrode, an electrically conductive track including a metal, and a functional organic region having at least one active region, wherein the electrically conductive track is arranged between the first electrode and the functional organic region and wherein the electrically conductive track is in direct contact with the first electrode and the functional organic region.. ... Osram Gmbh

09/07/17 / #20170256691

Optoelectronic component

An optoelectronic component includes a housing including a base section and a cover section that delimit an interior of the housing, wherein an optoelectronic semiconductor chip is arranged on the base section, the cover section is formed by an optical element, and a reflective element including openings is arranged between the optoelectronic semiconductor chip and an outer side of the optical element.. . ... Osram Gmbh

09/07/17 / #20170256592

Radiation-emitting apparatus and method for producing same

The invention relates to a radiation-emitting device (600), which comprises a substrate (100), an inner optoelectronic component (300) and an outer optoelectronic component (200) which at least partially laterally surrounds the inner optoelectronic component (300). Further, the radiation-emitting device (600) has a cover element (500) which is arranged on the optoelectronic components (200, 300) and comprises a first contact element (521), connected to a first electrode surface of the inner optoelectronic component (300) in an electrically conductive manner, and a second contact element (522) connected to a second electrode surface of the inner optoelectronic component (300) in an electrically conductive manner.. ... Osram Gmbh

09/07/17 / #20170254525

Light module

A light module (1) serves for inserting into a housing (23) of a semiconductor lamp (24) and comprises: a driver (2), a cooling element (10), a light generator (15), abutting the cooling element, with at least one semiconductor light source (17), which is electrically connected with the driver (2), and an optical refraction element (18) covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator (15) onto the cooling element. A semiconductor lamp (24) comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. ... Osram Gmbh

09/07/17 / #20170254484

Retrofit lamp

A retrofit lamp (1) comprises a heat sink (8), a light source module (10) with a circuit board (11), whose rear side lies two-dimensionally on the heat sink (8) and at the front side of which at least one semiconductor light source (12) is arranged, and a ring (6) partially covering the front side of the light source module (10), wherein the ring (6) presses the light source module (10) onto the heat sink (8). A method serves for producing a retrofit lamp (1), wherein the rear side of the circuit board (11) of the light source module (10) is laid on the heat sink (8) and the ring (6) is put on the retrofit lamp (1) from the front such that it presses the light source module (10) onto the heat sink (8). ... Osram Gmbh

09/07/17 / #20170254483

Semiconductor lamp

A semiconductor lamp (1) comprises a housing (2) in which a driver (3) is accommodated and at least one contact pin (6) protruding from the housing (2) outwards, wherein the contact pin (6) is tubular and riveted to the housing (2) and the driver (3) is connected to the contact pin (6) via an electrically conductive connection element (12) which is inserted into a cavity (13) of the contact pin (6). A method serves for producing a semiconductor lamp (1), wherein at least one tubular contact pin (6) is inserted into a feedthrough (5) of a housing (2) from outside till the contact pin (6) abuts the housing (2), the contact pin (6) is next riveted with the housing (2) on the inside and a driver (3) is inserted into the housing (2), whereby an electrically conductive connection element (12) is inserted into the contact pin (6). ... Osram Gmbh

09/07/17 / #20170253970

Ald coating system and method for operating an ald coating system

A method for operating an ald coating system is disclosed. In an embodiment the method includes lowering a temperature of an intermediate container by a device for cooling the intermediate container so that a temperature of the intermediate container is below a temperature of a storage container, flowing a partial amount of the organometallic starting material into the intermediate container, heating the partial amount of the organometallic starting material by a device for heating the organometallic starting material so that a pressure of the partial amount of the organometallic starting material is constant over time and/or is greater than a pressure of the organometallic starting material in the storage container and opening a second multiway valve so that the partial amount of the organometallic starting material partially flows as a gas into a process chamber.. ... Osram Gmbh

08/31/17 / #20170250323

Method of producing an optoelectronic semiconductor component

A method of producing an optoelectronic semiconductor component includes providing a semiconductor body; applying a photoconductive layer on a radiation exit surface of the semiconductor body, wherein the semiconductor body emits electromagnetic radiation during operation; exposing at least one sub-region of the photoconductive layer with electromagnetic radiation generated by the semiconductor body; and depositing a conversion layer on the sub-region of the photoconductive layer by an electrophoresis process.. . ... Osram Gmbh

08/24/17 / #20170245340

Techniques for gesture-based control of color-tunable lighting

Techniques are disclosed herein for a lighting interface system configured to adjust tunable lighting characteristics output by one or more lighting devices based on a plurality of simple, intuitive touch-gestures without necessarily providing visual indicators via a display screen or other feedback elements. The lighting interface system may be implemented as a relatively simple touchpad device that may be wall-mounted and/or portable depending on a desired configuration. ... Osram Gmbh

08/24/17 / #20170244053

Oled and method for producing an oled

An oled and a method for producing an oled are disclosed. In an embodiment, the oled includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. ... Osram Gmbh

08/24/17 / #20170244011

Lighting device and method for producing such a lighting device

A method for producing a lighting device is provided. According to the method, a plurality of semiconductor emitters arranged alongside one another are embedded in a light-transmissive filling compound apart from a side having their electrical connections, trenches are introduced into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, is covered with a dielectric material, electrical lines are led through the dielectric material to the electrical connections, and at least some of the trenches are severed.. ... Osram Gmbh

08/24/17 / #20170243850

Electronic arrangement

An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.. . ... Osram Gmbh

08/24/17 / #20170240094

Lighting device with primary light source and phosphor volume

Various embodiments may relate to a lighting device, including at least one primary light source for generating primary light, a phosphor volume spaced apart from the at least one primary light source and serving for at least partly converting the primary light into secondary light having a different wavelength, at least one light sensor for detecting light generated by the at least one primary light source, and an evaluation unit for determining a case of damage of the phosphor volume on the basis of sensor data of at least one light sensor. The lighting device includes at least one additional light source for irradiating the phosphor volume, and is designed to operate the at least one additional light source, the at least one light sensor and the evaluation unit with the primary light source switched off. ... Osram Gmbh

08/17/17 / #20170238402

Method for operating a discharge lamp of a projection arrangement and projection arrangement

According to the present disclosure, a method for operating a discharge lamp of a projection arrangement is provided. The method includes storing the first commutation scheme in the ballast, such that the first commutation scheme fulfils a specification with respect to a first criterion, wherein the first criterion represents an electrode burnback; storing of the second commutation scheme in the ballast, such that the second commutation scheme fulfils a specification with respect to a second criterion; and operation of the discharge lamp with the alternation of the first and the second commutation schemes; characterized in that, a periodic brightness fluctuation in the discharge lamp is employed as the second criterion.. ... Osram Gmbh

08/17/17 / #20170236980

Optoelectronic semiconductor chip and method for producing the same

An optoelectronic semiconductor chip and a method for producing the same are disclosed. In an embodiment an optoelectronic semiconductor chip includes a support substrate, a semiconductor layer sequence having a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active layer arranged therebetween, and a mirror layer arranged between the support substrate and the semiconductor layer sequence. ... Osram Gmbh

08/10/17 / #20170230082

Energy delivery on paths used for communnication

Systems and methods for delivering energy on a bus used for communication between devices are provided. Systems and methods dynamically provide a predetermined recovery time between communication messages calculated from forward and response message types and/or length, and a model of the energy reserve in the network devices to allow time for energy storage circuits in the devices to charge. ... Osram Gmbh

08/10/17 / #20170229678

Organic light-emitting component and method of producing an organic light-emitting component

A light-emitting device includes a carrier, an organic layer sequence arranged on the carrier and having at least one emitter layer containing a light-emitting material configured to emit light of a first wavelength range, a first electrode and a second electrode, and a multiplicity of nanostructures, wherein the nanostructures have a refractive index smaller than a refractive index of the light-emitting material of the emitter layer and at least some of the nanostructures project into the emitter layer or pierce through the emitter layer.. . ... Osram Gmbh

08/10/17 / #20170229675

Organic light-emitting device

An organic light-emitting device and a method for producing an organic light emitting device are disclosed. In an embodiment the device includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. ... Osram Gmbh

08/10/17 / #20170229669

Organic light-emitting diode

The invention relates to an organic light-emitting diode (1000) with an organic layer sequence (100). The organic layer sequence (100) comprises a first organic emitter layer (1) for generating electromagnetic radiation of a first wavelength range (10) and a second organic emitter layer (2) for generating electromagnetic radiation of a second wavelength range (20). ... Osram Gmbh

08/10/17 / #20170229437

Optoelectronic component device and method for producing an optoelectronic component device

In various exemplary embodiments, an optoelectronic component device is provided. The optoelectronic component device includes a first organic light emitting diode and a second organic light emitting diode, which are connected to one another in physical contact one above the other. ... Osram Gmbh

08/10/17 / #20170227206

Semiconductor lamp having a heat sink

The semiconductor lamp (1) is equipped with a heat sink (2, 3) which has a first part (2) and a second part (3) connected to each other by way of a press fit and which together delimit a receptacle (10, 12) for a driver (5), the first part (2) having an insert region (8) for insertion into the second part (3), which insert region consists of spring elements (21) that can be pushed inwards. The invention is particularly useful for retrofit lamps, in particular incandescent or halogen retrofit lamps.. ... Osram Gmbh

08/10/17 / #20170227189

Illumination apparatus

The present invention relates to an illumination apparatus (100) comprising a light engine (3) and a first lampshade (1) for accommodating the light engine (3), wherein the first lampshade (1) has a first expansion coefficient, wherein the illumination apparatus (100) further comprises a second lampshade (2) for accommodating the first lampshade (1), wherein the second lampshade (2) has a second expansion coefficient smaller than the first expansion coefficient, and is configured such that the changes in size or shape of the first lampshade (1) can be restrained under a high temperature.. . ... Osram Gmbh

08/10/17 / #20170227179

Support structure for light radiation sources, corresponding device and method

A support structure for electrically-powered light radiation sources, e.g. Led sources, includes a ribbon-like flexible substrate with a front surface having, distributed therealong, mounting locations for light radiation sources. ... Osram Gmbh

08/03/17 / #20170222105

Semiconductor device, illuminating device, and method of producing a semiconductor device

A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding molded in places onto the semiconductor chip and that, at least in places, forms at least one side face of the semiconductor device; a mounting surface provided to mount the semiconductor device; and a spacer projecting beyond the radiation exit face in a vertical direction extending perpendicular to the radiation exit face.. . ... Osram Gmbh

08/03/17 / #20170222103

Optoelectronic component

An optoelectronic component includes a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged, wherein the cavity includes at least one side wall at least partly reflecting light rays incident on the side wall and reflectivity of which decreases as an operating period of the component increases, conversion particles are embedded into the potting material, which conversion particles convert light rays having a first wavelength incident on the conversion particles into light rays having a second wavelength, and scattering particles are embedded into the potting material, which scattering particles scatter light rays incident on the scattering particles and the scattering capability of which scattering particles increases as the operating period increases.. . ... Osram Gmbh

08/03/17 / #20170222094

Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.. ... Osram Gmbh

08/03/17 / #20170222092

Housing for an optical component, assembly, method for producing a housing and method for producing an assembly

A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. ... Osram Gmbh

08/03/17 / #20170222088

Optoelectronic semiconductor chip and method of producing the same

An optoelectronic semiconductor chip includes a semiconductor layer sequence and a carrier substrate, wherein the semiconductor layer sequence includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active layer arranged between the first semiconductor region and the second semiconductor region, wherein the first semiconductor region faces the carrier substrate, the semiconductor layer sequence includes first recesses formed in the first semiconductor region and that do not separate the active layer, the semiconductor layer sequence includes second recesses that at least partially separate the first semiconductor region and the active layer, and the second recesses adjoin a first recess or are arranged between two first recesses.. . ... Osram Gmbh

08/03/17 / #20170222087

Optoelectronic component and method for the production thereof

An optoelectronic component and a method for the producing an optoelectronic component are disclosed. In an embodiment, the component comprises an active zone for generating electromagnetic radiation, wherein the active zone adjoins at least one layer arrangement of a semiconductor material, wherein the layer arrangement comprises at least two layers, wherein the two layers are formed in such a way that at an interface between the two layers a piezoelectric field is provided, the piezoelectric field configured to provide an electrical voltage drop at the interface, wherein a peak doping region is provided at the interface of the two layers in order to reduce the electrical voltage drop, wherein, in the direction away from the active zone, a doping of the peak doping region increases at least by a first percentage value and then decreases by at least a second percentage value, and wherein the first percentage value and the second percentage value are greater than 10% of a maximum doping of the peak doping region.. ... Osram Gmbh

08/03/17 / #20170221869

Method of producing optoelectronic component with integrated protection diode

A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.. . ... Osram Gmbh

08/03/17 / #20170219763

Optelectonic arrangement and lighting device

An optelectonic arrangement and a lighting device are disclosed. In an embodiment the arrangement includes a semiconductor chip for generating radiation and a radiation conversion element located downstream of the semiconductor chip with respect to a radiation direction, wherein the radiation conversion element includes a plurality of conversion bodies each with a longitudinal extension axis, and wherein a spatial orientation of the longitudinal extension axes has a preferred direction.. ... Osram Gmbh

08/03/17 / #20170219195

Led holder for holding an led module

An led holder for holding an led module includes a leadframe, which is populated with electrical and/or electronic components for operating the led module, wherein the leadframe is at least partially enclosed by potting material, and includes at least two exposed first contact regions for electrically contacting the led module and at least two exposed second contact regions for electrical contacting.. . ... Osram Gmbh

08/03/17 / #20170219185

Phosphor element

In various embodiments, a phosphor element is provided. The phosphor element includes a monocrystal composed of a phosphor element material for at least partly converting a pump radiation into a conversion radiation. ... Osram Gmbh

08/03/17 / #20170219171

Conversion device

In various embodiments, a conversion device is provided. The conversion device may include a phosphor element made of a phosphor element material for converting pump radiation into conversion radiation; and a scattering element embodied as a volume scatterer. ... Osram Gmbh

07/27/17 / #20170215249

Optoelectronic assembly and method for detecting an electrical short circuit

In various embodiments, an optoelectronic assembly may include at least one organic light emitting diode including a first light emitting diode element and a second light emitting diode element, and an electronic circuit. The first light emitting diode element and the second light emitting diode element are electrically connected in parallel and are deposited monolithically on a common substrate, and the electronic circuit is designed to compare an electric current through the first light emitting diode element that flows during operation with an electric current through the second light emitting diode element that flows during operation and, depending on the comparison, to detect a short circuit of the first light emitting diode element or of the second light emitting diode element and to initiate an electrical switching off of one of the light emitting diode elements and/or of the assembly.. ... Osram Gmbh

07/27/17 / #20170215248

Method for operating an optoelectronic assembly and optoelectronic assembly

A method for operating an optoelectronic assembly which includes at least one component string having at least one section, wherein the section includes at least one light emitting diode element, is provided. According to the method, the component string is supplied with electrical energy, the supply of the component string with electrical energy is interrupted, a total voltage is detected, which is present between an input and an output of the section of the component string, the total voltage is compared with a sum of threshold voltages of all the light emitting diode elements. ... Osram Gmbh

07/27/17 / #20170214002

Optoelectronic assembly and method for producing an optoelectronic assembly

An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.. ... Osram Gmbh

07/27/17 / #20170213995

Optoelectronic component and a method for producing an optoelectronic component

An optoelectronic component may include a first electrode having one outer electrode segment formed at a lateral edge of the first electrode, and one inner electrode segment formed apart from the lateral edge of the first electrode, an electrically conductive current distribution structure formed above the first electrode and having one outer substructure extending over the outer electrode segment, and one inner substructure extending over the inner electrode segment and electrically insulated from the outer substructure, one current lead extending from the lateral edge of the first electrode toward the inner substructure, electrically coupled to the inner substructure, electrically insulated from the outer substructure and which structure corresponds to the current distribution structure, an insulation structure, which covers the current distribution structure and the current lead, an organic functional layer structure, and a second electrode above the organic functional layer structure.. . ... Osram Gmbh

07/27/17 / #20170211770

Vehicle lamp

In various embodiments, a vehicle lamp is provided. The vehicle lamp includes at least one semiconductor light source, at least one light emission body, and a concentrator arranged between the at least one semiconductor light source and the respective light emission body. ... Osram Gmbh

07/27/17 / #20170211757

Illuminating device comprising a pump radiation source

An illuminating device includes a pump radiation source for emitting pump radiation as a beam bundle, a phosphor element for converting the pump radiation into conversion light, and a lens system between the pump radiation source and the phosphor element, which is penetrated by the pump beam bundle, wherein the lens system has a focus and the phosphor element is arranged at the focus, and wherein furthermore a lens of the lens system has a scattering means which scattering means the pump beam bundle penetrates and is widened at the same time, so that the pump beam bundle is incident on the phosphor element in a manner widened around a focus point.. . ... Osram Gmbh

07/27/17 / #20170211752

Twistable base for a lamp tube

The invention relates to a base (3, 4, 22) for a lamp tube (1), comprising a securing part (3, 4) for stationarily securing to a front side of the lamp tube (1), and a connection part (22) having at least one electrical contact element (26) for electrically contacting a lamp holder, which connection part (22) can be twisted against the securing part (3, 4), wherein the securing part (3, 4) and the connection part (22) are electrically connected to one another by means of at least one sliding contact (4, 28). A tubular lamp (l) having a lamp tube (1) comprises a base (3, 4, 22) on at least one open end of the lamp tube (1). ... Osram Gmbh

07/20/17 / #20170207411

Optoelectronic component and method for manufacturing the same

An optoelectronic component includes a first electrically conductive contact layer, an electrically insulating layer above the first electrically conductive contact layer, a second electrically conductive contact layer above the electrically insulating layer, a first electrically conductive electrode layer above the second electrically conductive contact layer, at least one optically functional layer structure above the first electrically conductive electrode layer, and a second electrically conductive electrode layer above the optically functional layer structure, wherein the second electrically conductive contact layer has a first cutout, the electrically insulating layer has a second cutout, which overlaps the first cutout, an electrically conductive plated-through hole is arranged in the first cutout and in the second cutout, said electrically conductive plated-through hole being led to the first electrically conductive contact layer, and the electrically conductive plated-through hole is electrically insulated with respect to the second electrically conductive contact layer.. . ... Osram Gmbh

07/20/17 / #20170207373

Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a carrier, a multi-pixel semiconductor chip that emits electromagnetic radiation during operation, wherein the semiconductor chip is arranged on the carrier, and wherein the semiconductor chip has a plurality of individually activatable pixels capable of generating primary radiation and a wavelength conversion element for at least partially converting the primary radiation emitted from the semiconductor chip into electromagnetic secondary radiation, wherein an active zone of the multi-pixel semiconductor chip extends continuously over the plurality of pixels, and wherein the wavelength conversion element is implemented in one piece.. ... Osram Gmbh

07/20/17 / #20170207363

Method of producing optoelectronic semiconductor chips

A method of producing optoelectronic semiconductor chips includes growing a semiconductor layer sequence on a growth substrate; applying at least one metallization to a contact side of the semiconductor layer sequence, which contact side faces away from the growth substrate; attaching an intermediate carrier to the semiconductor layer sequence, wherein a sacrificial layer is attached between the intermediate carrier and the semiconductor layer sequence; removing the growth substrate from the semiconductor layer sequence; structuring the semiconductor layer sequence into individual chip regions; at least partially dissolving the sacrificial layer; and subsequently removing the intermediate carrier, wherein, in removing the intermediate carrier, part of the sacrificial layer is still present, removing the intermediate carrier includes mechanically breaking remaining regions of the sacrificial layer, and the sacrificial layer is completely removed after removing the intermediate carrier.. . ... Osram Gmbh

07/20/17 / #20170205065

Method of producing lighting devices and corresponding lighting device

A lighting device may be produced by providing a protected elongate light emitting module, including a substrate with at least one electrically-powered light radiation source, and at least one sealing mass protecting light radiation source(s), and by coupling to said light emitting module a channel-shaped cover member with a body portion including light permeable material and side portions, with the side portions of the cover member embracing and locking therebetween the light emitting module and with light radiation source(s) facing towards body portion of cover member, whereby the light permeable material provides a propagation path for the light radiation from light radiation source(s).. . ... Osram Gmbh

07/20/17 / #20170205049

Irradiation device including a pump radiation source

Various embodiments relate to an irradiation device including a pump radiation source for emitting pump radiation, a conversion element for converting the pump radiation into conversion radiation of longer wavelength, and a reflection surface, which is reflective to the conversion radiation and on which backscattered conversion radiation emitted at a backscatter emission surface and thus counter to a useful direction is incident and is reflected therefrom back to the conversion element; said reflection surface is concavely curved relative to the conversion element in such a way that at least the backscattered conversion radiation emitted divergently from a surface centroid of the backscatter emission surface is incident on the reflection surface at an angle of incidence of at most 20° in terms of absolute value.. . ... Osram Gmbh

07/20/17 / #20170205033

Lighting device comprising phosphor arrangement and laser

A lighting device comprising a phosphor arrangement (2) having a phosphor region (31-33), a first laser (5) for irradiating a part of the phosphor region (31-33) with a first laser radiation. The phosphor region (31-33) has at least one phosphor which can be irradiated by the first laser radiation and re-emits the first laser radiation at least partly in a manner wavelength-converted into colored light having a first light color. ... Osram Gmbh

07/13/17 / #20170200875

Optoelectronic component and method of producing same

. . An optoelectronic component includes a carrier strip and an optoelectronic semiconductor chip, a first electrical connection surface formed on a front side of the chip and a second electrical connection surface is formed on a rear side of the chip, first and second electrically conductive contact regions are formed on the strip, the first region is arranged on a folding section of the strip, the rear side of the chip faces toward an upper side of the strip, the upper side faces toward the front side of the chip, the first electrical connection surface electrically conductively connects to the first region, the second electrical connection surface electrically conductively connects to the second region by a second connecting material, the strip has a second through-opening that lies next to the second region, and the second connecting material extends through the second contact opening to a lower side of the strip.. . ... Osram Gmbh

07/13/17 / #20170200869

Optoelectronic semiconductor component

An optoelectronic semiconductor component is disclosed. In an embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip for generating primary radiation in a near-ultraviolet or in a visible spectral range, at least one phosphor for partial or complete conversion of the primary radiation into a longer-waved secondary radiation which is in the visible spectral range and at least one filter substance for partial absorption of the secondary radiation, wherein the phosphor and the filter substance are closely connected to the semiconductor chip.. ... Osram Gmbh

07/13/17 / #20170200861

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the chip includes a semiconductor layer sequence having a bottom face and a top face, wherein the semiconductor layer sequence comprises a first layer of a first conductivity type, an active layer for generating electromagnetic radiation, and a second layer of a second conductivity type and a bottom contact element located at the bottom face and a top contact element located at the top face for injecting current into the semiconductor layer sequence. ... Osram Gmbh

07/06/17 / #20170194536

Method of producing an optoelectronic component and optoelectronic component

A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip, selecting a wavelength-converting element in dependence on a dominant wavelength of an electromagnetic radiation that can be emitted by the optoelectronic semiconductor chip, and situating the selected wavelength-converting element in a beam path of the optoelectronic semiconductor chip to form an optoelectronic arrangement, wherein the wavelength-converting element is selected such that chromaticity coordinates of an electromagnetic radiation that can be emitted by the optoelectronic arrangement lie within a specified value range of chromaticity coordinates, a peak wavelength of a blue peak of the electromagnetic radiation that can be emitted by the optoelectronic arrangement lies within a specified value range of peak wavelengths, and the value range of peak wavelengths is 438 nm to 458 nm.. . ... Osram Gmbh

07/06/17 / #20170194305

Method for producing an optoelectronic semiconductor chip

A method for producing an optoelectronic semiconductor chip is disclosed. In an embodiment, the method includes providing a semiconductor body with a pixel region including different subpixel regions, each subpixel region having a radiation exit face, applying an electrically conductive layer onto the radiation exit face of a subpixel region, wherein the electrically conductive layer is suitable at least in part for forming a salt with a protic reactant, and depositing a conversion layer on the electrically conductive layer using an electrophoresis process, wherein the deposited conversion layer comprises pores.. ... Osram Gmbh

07/06/17 / #20170191636

Lighting device having at least one light sensor

Various embodiments relate to a lighting device including at least one light source for emitting a polarized primary light beam (p), at least one luminescent material volume for at least partially converting primary light of the primary light beam (p) into secondary light (s) having a different wavelength, which luminescent material volume is arranged in a path of at least a primary light beam (p), and at least one light sensor, which is arranged at least in a part of an original path of the primary light beam (p) after the location of the luminescent material volume, wherein the light sensor is sensitive at least to the primary light and is polarization-sensitive. Various embodiments can, in particular, be applied to vehicle lighting devices, in particular vehicle lamps, e.g., headlamps, or modules thereof.. ... Osram Gmbh

06/29/17 / #20170188454

Conductor pad for flexible circuits and flexible circuit incorporating the same

A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. ... Osram Gmbh

06/29/17 / #20170187456

Commissioning a luminaire with location information

Techniques are disclosed for programming a luminaire with location information, referred to herein as commissioning. Location information may include relative location information (e.g., the position of the luminaire relative to a reference point) and/or absolute location information (e.g., global coordinates for the luminaire). ... Osram Gmbh

06/29/17 / #20170186911

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

A method is specified for producing an optoelectronic semiconductor component, comprising the following steps: a) providing a structured semiconductor layer sequence (21, 22, 23) having —a first semiconductor layer (21) with a base region (21c), at least one well (211), and a first cover region (21a) in the region of the well (211) facing away from the base surface (21c), —an active layer (23), and —a second semiconductor layer (22) on a side of the active layer (23) facing away from the first semiconductor layer (21), wherein —the active layer (23) and the second semiconductor layer (22) are structured jointly in a plurality of regions (221, 231) and each region (221, 231) forms, together with the first semiconductor layer (21), an emission region (3), b) simultaneous application of a first contact layer (41) on the first cover surface (21a) and a second contact layer (42) on a second cover surface (3a) of the emission regions (3) facing away from the first semiconductor layer (21) in such a way that —the first contact layer (41) and the second contact layer (42) are electrically separated from each other, and —the first contact layer (41) and the second contact layer (42) run parallel to each other.. . ... Osram Gmbh

06/22/17 / #20170180046

Techniques for indoor navigation with emergency assistance via light-based communication

Techniques are disclosed for enhancing indoor navigation using light-based communication (lcom). In some embodiments, an lcom-enabled luminaire configured as described herein may include access to a sensor configured to detect a given hazardous condition. ... Osram Gmbh

06/22/17 / #20170180045

Techniques for indoor navigation with hazard avoidance via light-based communication

Techniques are disclosed for enhancing indoor navigation using light-based communication (lcom). In some embodiments, an lcom-enabled luminaire configured as described herein may include or have access to a sensor configured to detect a hazardous condition. ... Osram Gmbh

06/22/17 / #20170179353

Electronic component, leadframe, and method for producing an electronic component

An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.. ... Osram Gmbh

06/22/17 / #20170179091

Optoelectroic semiconductor chip and method of producing an optoelectronic semiconductor chip

An optoelectronic semiconductor chip includes a semiconductor layer sequence with an upper face and a lower face opposite the upper face, wherein the semiconductor layer sequence has an active layer that generates electromagnetic radiation, and a plurality of contact elements that electrically contact the semiconductor layer sequence arranged on the upper face, wherein the semiconductor chip is a thin-film semiconductor chip, the lower face is a radiation decoupling surface through which the radiation generated in the semiconductor layer sequence is decoupled, the contact elements can be electrically actuated individually and independently from one another, and the semiconductor layer sequence has a thickness of at most 3 μm.. . ... Osram Gmbh

06/22/17 / #20170179016

Carrier for an electrical component

A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the substrate, a solder pad disposed on the contact zone, and a solder stop structure disposed laterally next to the solder pad. The solder stop structure has a surface that is less wettable with liquid solder than a surface of the contact zone. ... Osram Gmbh

06/22/17 / #20170172660

Irradiation unit for providing radiation pulses for irradiating a skin surface and method for operating an irradiation unit

An irradiation unit for providing radiation pulses for irradiating a skin surface is provided. The irradiation unit includes a light source unit configured to provide the radiation pulses with a specifiable pulse duration, with a specifiable pulse height and with a specifiable temporal pulse spacing. ... Osram Gmbh

06/15/17 / #20170170899

Techniques for raster line alignment in light-based communication

Techniques are disclosed for providing proper raster line alignment of a camera or other light-sensing device of a receiver device relative to a transmitting light-based communication (lcom)-enabled luminaire to establish reliable lcom there between. In accordance with some embodiments, proper alignment can be provided automatically (e.g., by the receiver device and/or other suitable controller). ... Osram Gmbh

06/15/17 / #20170170625

Semiconductor laser device and camera

Various embodiments may relate to a semiconductor laser device, including at least one laser diode, and at least one reflection surface which reflects diffusely and which is irradiated by the laser diode during operation, and an additional light-nontransmissive housing body having a cutout. The laser diode is the sole light source of the semiconductor laser device. ... Osram Gmbh

06/08/17 / #20170162749

Optoelectronic semiconductor chip and method of producing same

An optoelectronic semiconductor chip which is a light emitting diode includes a semiconductor layer sequence having an n-conducting layer sequence, a p-conducting layer sequence, an active zone, at least one etching signal layer, and an etching structure, wherein the etching structure extends at least right into the etching signal layer, the etching signal layer has a signal constituent, the active zone generates radiation and is based on inalgap or on inalgaas, the etching signal layer is situated in the p-conducting layer sequence and is based on in1−x−yalygaxp or on in1−x−yalygaxas where x+y<1, the signal constituent is ga and 0.005≦x≦0.2, the signal constituent is not present in the layer adjoining the etching signal layer in a direction toward the etching structure, a thickness of the etching signal layer is 50 nm to 800 nm.. . ... Osram Gmbh

06/08/17 / #20170160590

Backlighting device

In various embodiments, a backlighting device is provided. The backlighting device may include a plurality of semiconductor light sources arranged in a plane and serving for generating light radiation, and a side wall arranged laterally with respect to the semiconductor light sources, where the side wall is inclined with respect to the plane predefined by the semiconductor light sources, and wherein the side wall is retroreflective at a side which can be irradiated with light radiation of the semiconductor light sources.. ... Osram Gmbh

06/08/17 / #20170159893

Light-emitting device and method for manufacturing the light-emitting device

Various embodiments may relate to a light-emitting device. The light-emitting device includes an encapsulation housing and a light engine arranged in the encapsulation housing. ... Osram Gmbh

06/01/17 / #20170155096

Method for producing an optoelectronic component

In various exemplary embodiments, a method for producing an optoelectronic component is provided. In this case, a high temperature solid is provided which is stable at least up to a predefined first temperature. ... Osram Gmbh

05/18/17 / #20170142788

Illumination device

Various embodiments may relate to an illumination device that includes a rectifier unit connected to a power supply and at least one illumination unit connected to the rectifier unit via a buck circuit unit, wherein the illumination device further includes a main control unit connected with the buck circuit unit and the illumination unit, respectively, wherein the main control unit is configured to control, according to change of an input voltage from the rectifier unit, an input current from the rectifier unit to selectively flow through a lighting element of the illumination unit so as to adjust a total forward voltage of the lighting elements, and when the input voltage exceeds the total forward voltage, the buck circuit unit reduces the voltage across the illumination unit and enables the illumination device to enter into a buck state.. . ... Osram Gmbh

05/18/17 / #20170141265

Semiconductor chip and method for producing a semiconductor chip

A semiconductor chip and a method for producing a semiconductor chip are disclosed. In an embodiment, the semiconductor chip includes a semiconductor layer sequence and a structured substrate including a surface, wherein the surface is in contact with the semiconductor layer sequence, wherein the surface has a structure of depressions, each depression is delimited at an underside by a smooth end region, or wherein the surface has a structure of elevations, each elevation is delimited at a top side by a smooth end region, and wherein the end regions are laterally spaced apart with respect to one another.. ... Osram Gmbh

05/18/17 / #20170138556

Generating a light emission pattern in a far field

Various embodiments may relate to a lighting apparatus for a headlight for generating a light emission pattern in a far field, including at least one light source for emitting primary light onto an illumination surface, at least two different phosphor surfaces which are introducible into the illumination surface, at least partly alternately by at least one translational movement, and a control device for positioning the phosphor surfaces in relation to the illumination surface. A respectively associated light emission pattern is generatable in a predetermined position of the phosphor surfaces. ... Osram Gmbh

05/18/17 / #20170137328

Method of making a ceramic wavelength converter assembly

There is herein described a method for forming a ceramic wavelength converter assembly which achieves a direct bonding of an alumina-based ceramic wavelength converter to an alumina-based ceramic substrate such as polycrystalline or sapphire. The method comprises applying a silica-containing layer between the converter and the substrate and then applying heat to bond the converter to the substrate to form the ceramic wavelength converter assembly. ... Osram Gmbh

05/11/17 / #20170135184

Circuit assembly for operating lighting means via a master-slave system

The invention relates to a circuit assembly for operating at least one lighting means, comprising at least one master device; at least one slave device; and a bus system having at least one bus, by means of which bus system the at least one master device and the at least one slave device are coupled; wherein the bus is designed as a two-wire cable, wherein the at least one master device has at least one feeding connection, which is coupled to the bus and is designed to place a control signal on the bus, wherein the at least one master device is coupled to a first voltage supply; wherein the at least one slave device comprises a non-feeding connection, which is coupled to the bus, wherein the slave device comprises a connection for at least one lighting means, a second voltage supply, and a read-out device for reading out the control signal on the bus, wherein the read-out device comprises a potential-isolating device and wherein the connection for the at least one lighting means and the second voltage supply are provided on the side of the read-out device isolated from the bus with regard to potential.. . ... Osram Gmbh

05/11/17 / #20170133566

Optoelectronic component and method for producing optoelectronic semiconductor components

What is specified is: an optoelectronic semiconductor component (1) comprising a carrier (5) and a semiconductor body (2), wherein the semiconductor body is fastened on the carrier and has a semiconductor layer sequence having an active region (20) provided for generating and/or receiving radiation, a first semiconductor layer (21) and a second semiconductor layer (22). The active region is arranged between the first semiconductor layer and the second semiconductor layer. ... Osram Gmbh

05/11/17 / #20170133561

Optoelectronic semiconductor device, method for producing an optoelectronic semiconductor device, and light source comprising an optoelectronic semiconductor device

An optoelectronic semiconductor device, a method for manufacturing an optoelectronic semiconductor device and light source having an optoelectronic semiconductor device are disclosed. In an embodiment, an optoelectronic semiconductor device includes a light-emitting diode component having at least one light-emitting diode chip and a top face, the top face arranged downstream of the light-emitting diode chip in an emission direction, wherein the light-emitting diode component further includes a molding and connection points, a conversion element arranged downstream of the light-emitting diode component in the emission direction, the conversion element includes wavelength-converting quantum dots, a frame member enclosing all side faces of the conversion element in a frame-like manner and a cover member arranged downstream of the conversion element in the emission direction, the cover member including a radiation-transmissive material, wherein the cover member covers the conversion element at a top face remote from the light-emitting diode chip.. ... Osram Gmbh

05/11/17 / #20170133555

Method for separating regions of a semiconductor layer

The invention relates to a method for separating regions of a semiconductor layer and for introducing an outcoupling structure into an upper side of the semiconductor layer, the outcoupling structure being provided to couple light out of the semiconductor layer. The upper side of the semiconductor layer is covered by a mask having first openings for introducing the outcoupling structure and at least a second opening, which is provided to introduce a separating trench into the semiconductor layer. ... Osram Gmbh

05/04/17 / #20170125882

Wirelessly programmable electronic control gear

Various embodiments provide a wirelessly programmable electronic control gear, which may include an essentially enclosed metal or metallized housing. The housing is a punched and curved sheet-metal housing. ... Osram Gmbh

05/04/17 / #20170125722

Lighting device, method for producing a lighting device

A lighting device may include a substrate having a carrier, a first electrical busbar, a second electrical busbar, and an optically functional structure on or above the carrier, wherein the optically functional structure is formed laterally between the first and the second electrical busbar, and a first electrode electrically coupled to the first electrical busbar and/or the second electrical busbar, on or above the carrier, and an organic functional layer structure on or above the first electrode, wherein the organic functional layer structure is formed for converting an electric current into an electromagnetic radiation, and a second electrode on or above the organic functional layer structure. The optically functional structure is formed in such a way that the beam path of the electromagnetic radiation which passes through the substrate and/or the spectrum of the electromagnetic radiation passing through the substrate are/is variable by means of the optically functional structure.. ... Osram Gmbh

05/04/17 / #20170125695

Organic optoelectronic apparatus

The invention relates to an organic optoelectronic apparatus comprising: a first electrode (2), a radiation-emitting region (4) arranged between the first and second electrodes, and a second electrode (9), wherein the first and second electrodes can inject charge carriers of different polarity into the radiation-emitting region, wherein the radiation-emitting region (4) has a dual emitter and a further emitter, wherein the further emitter is transferred by the charge carrier into an electronically excited state and, on the transition into the basic electronic state from this electronically excited state, emits radiation, and wherein the dual emitter has a first electronically excited state and a second electronically excited state, which can be reached from the first electronically excited state by intramolecular proton transfer or intramolecular charge transfer, and the dual emitter has an emission starting from the second electronically excited state into a second basic state. The radiation emitted by this apparatus has an improved cri value owing to the simultaneous use of a dual emitter and a further emitter.. ... Osram Gmbh

05/04/17 / #20170125648

Method for producing a plurality of conversion elements, conversion element and optoelectronic component

A method for producing a plurality of conversion elements (10) is specified, comprising providing a carrier substrate (1), introducing a converter material (3) into a matrix material (2), applying the matrix material (2) with the converter material (3) to individual regions (8) of the carrier substrate (1) in a non-continuous pattern, applying a barrier substrate (5) to the matrix material (2) and to the carrier substrate (1), and singulating the carrier substrate (1) with the matrix material (2) and the barrier substrate (5) into a plurality of conversion elements (10) along singulation lines (v), wherein the conversion elements (10) in each case comprise at least one of the regions (8) of the matrix material (2).. . ... Osram Gmbh

05/04/17 / #20170125646

Optoelectronic device

The invention relates to an optoelectronic component (10) comprising—a radiation-emitting semiconductor chip (2), —a conversion element (8) which is suitable for converting at least one part of the radiation (12) emitted by the semiconductor chip (2) into a converted radiation (13), said converted radiation (13) having a longer wavelength than the emitted radiation (12), and—a cover (9) which is permeable at least to the converted radiation (13) and which follows the conversion element (8) in a main emission direction, wherein—the conversion element (8) comprises a quantum dot converter material (7), —the conversion element (8) is arranged on a cover (9) inner face (15) facing the semiconductor chip, and—the cover has silicon (9) or consists of silicon.. . ... Osram Gmbh

05/04/17 / #20170125643

Light emitting semiconductor device

A light emitting semiconductor device includes at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face. The light emitting semiconductor device further includes a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner. ... Osram Gmbh

05/04/17 / #20170122533

Integrated light engines including flexible optics and flexible light sources

An integrated light engine including flexible optics and a flexible light source, and lighting devices including the same, are provided. The integrated light engine includes a flexible light source configured to emit light, and flexible optics coupled to the flexible light source. ... Osram Gmbh

05/04/17 / #20170122526

A lens and an illumination device including the lens

Various embodiments relate to a lens for an illumination device and an illumination device including the lens, wherein the lens has an incident surface and an exiting surface, and the lens is designed in rotation symmetry, wherein, the incident surface includes a central recessed portion which is recessed towards the exiting surface and through which the rotation axis of the lens passes and a circumferential protrusion portion which protrudes in a direction away from the exiting surface and encompasses the central recessed portion.. . ... Osram Gmbh

05/04/17 / #20170122518

Vehicle headlamp with light passage

An accent lamp (10) having a solid state light source (4), such as leds, is attachable to a rear surface of an automotive headlamp (40) opposite the light-generating capsule (44). Accent lamp (10) has first retaining member (20), such as a clamp, formed above printed circuit board (8) on which led (4) is mounted. ... Osram Gmbh

05/04/17 / #20170122516

Luminaire with light source and spaced-apart luminescent body

Various embodiment may relate to a luminaire, including at least one light source, in particular a semiconductor light source, for emitting a primary light beam onto at least one spaced-apart luminescent body, wherein the luminescent body includes at least one hole and a direct light component of the respective primary light beam can be radiated through the at least one hole.. . ... Osram Gmbh

05/04/17 / #20170122514

Attachable vehicle accent lamp

An accent lamp (10) having a solid state light source (4), such as leds, is attachable to a rear surface of an automotive headlamp (40) opposite the light-generating capsule (44). Accent lamp (10) has first retaining member (20), such as a clamp, formed above printed circuit board (8) on which led (4) is mounted. ... Osram Gmbh

05/04/17 / #20170122513

Vehicle headlamp and light-injecting accent lamp combination and method

An accent lamp (10) having a solid state light source (4), such as leds, is attachable to a rear surface of an automotive headlamp (40) opposite the light-generating capsule (44). Accent lamp (10) has first retaining member (20), such as a clamp, formed above printed circuit board (8) on which led (4) is mounted. ... Osram Gmbh

04/27/17 / #20170118819

Circuits for phase-cut analog dimming of solid state light sources

Circuits to provide phase-cut analog dimming of solid state light sources are presented. Each circuit comprises an anchoring circuit to communicate with a dimming controller circuit, the anchoring circuit having a proportional direct current (dc) voltage input, a biasing voltage input, a connection to a ground reference, and an output in communication with a dimming controller circuit. ... Osram Gmbh

04/27/17 / #20170117444

Light-emitting device and method for producing a light-emitting device

A light-emitting device includes a light-emitting semiconductor component that emits first light in a first wavelength range during operation a wavelength conversion element converts the first light at least partly into second light in a second wavelength range is arranged in the beam path of the first light. The second wavelength range differs from the first wavelength range. ... Osram Gmbh

04/27/17 / #20170114983

Hybrid optical systems including flexible optical systems and light control films

A hybrid optical system, and lighting devices including the same, are provided. The hybrid optical system includes a cellular optical element a light control film. ... Osram Gmbh

04/27/17 / #20170114444

Method for producing a coating and optoelectronic semiconductor component having a coating

What is specified is a method for producing a coating comprising the following steps:—providing a material source having a top surface and a main coating direction,—providing a substrate holder having a top surface,—providing at least one base layer, having a coating surface remote from the substrate holder, on the top surface of the substrate,—attaching the substrate holder to a rotating arm, which has a length along a main direction of extent of the rotating arm,—setting the length of the rotating arm in such a manner that a normal angle (φ) throughout the method is at least 30° and at most 75°,—applying at least one coating to that side of the base layer which has the coating surface by means of the material source, wherein—during the coating process with the coating, the substrate holder is rotated about a substrate axis of rotation running along the main direction of extent of the rotating arm.. . ... Osram Gmbh

04/20/17 / #20170111993

Organic light emitting diode and arrangement having an organic light emitting diode

In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. ... Osram Gmbh

04/20/17 / #20170111966

Power supply unit and related lighting system

The power supply unit comprises an output providing electrical power between a positive power supply line and a common ground line and a communication line. An adjustable current generator responsive to an internal measurement signal generates an output current at the output, and a voltage source is coupled to the communication line. ... Osram Gmbh

04/20/17 / #20170111965

Circuit arrangement and method for operating semiconductor light sources

Various embodiment may relate to a circuit arrangement for operating a load, including an input for inputting a mains input ac voltage, a power converter circuit, a converter circuit which converts the mains input ac voltage rectified by the power converter circuit into an output voltage, a control circuit for controlling the converter circuit, and a linear regulating circuit which sets a predetermined load current at the load. The load current is a direct current with a uniform current intensity. ... Osram Gmbh

04/20/17 / #20170110520

Organic radiation-emitting component

An organic radiation-emitting component and a method for manufacturing an organic radiation-emitting component are disclosed. In an embodiment, the component includes a base substrate and a plurality of light-emitting units disposed on the base substrate, wherein the light-emitting units are arranged laterally offset with respect to one another, wherein the plurality of light-emitting units is divided into light-emitting units of a first type and light-emitting units of a second type, wherein a current flow through the light-emitting units of the first type is directed in an opposite direction to a current flow through the light-emitting units of the second type during operation, and wherein the light-emitting units are grouped in neighboring pairs, each neighboring pair consists of a light-emitting unit of a first type and a light-emitting unit of a second type, both first electrodes or both second electrodes of which are electrically connected to one another.. ... Osram Gmbh

04/20/17 / #20170108198

Connecting element for connecting at least two rails adapted for mounting semiconductor light sources

A connecting element for connecting at least two rails adapted for mounting semiconductor light sources. The connecting element has a bottom wall and two side walls emerging from the bottom wall on opposite sides. ... Osram Gmbh

04/20/17 / #20170108190

Lighting apparatus with conversion device

Various embodiments may relate to a lighting apparatus, including at least one primary light source for generating primary light, a reflector having two spaced-apart focal spots, a guiding optical unit disposed downstream of the at least one primary light source and serving for guiding the primary light to a first focal spot of the reflector, and a conversion device for at least partly converting the primary light into secondary light having a different wavelength which is situated at the second focal spot. The reflector has a first reflective partial region, to which the two focal spots are assigned, and a second reflective partial region, which is a partial region retroreflective for the second focal spot. ... Osram Gmbh

04/13/17 / #20170105253

Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device

A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (z1, z2) and a plurality of column lines (s1, s2, . . ... Osram Gmbh

04/13/17 / #20170104966

Projection apparatus for projecting at least one frame onto a projection surface and method therefor

A projection apparatus includes a discharge lamp; a control apparatus for controlling a discharge current through the lamp. The apparatus is designed in a first drive mode, to control the discharge current having an amplitude profile; in a second drive mode, to control the discharge current in accordance with the amplitude profile; and to change between the first mode and the second mode. ... Osram Gmbh

04/13/17 / #20170104532

Light-based communication (lcom) visual hotspots

Techniques are disclosed for projecting visible cues to assist with light-based communication (lcom), the visible cues referred to herein as visual hotspots. The visual hotspots can be projected, for example, using a luminaire that may be lcom-enabled. ... Osram Gmbh

04/13/17 / #20170104531

Techniques for position-based actions using light-based communication

Techniques are disclosed for position-based actions using light-based communication (lcom). Lcom signals can be used to encode or otherwise provide data which in turn can be used to help determine the position of a device receiving those lcom signals. ... Osram Gmbh

04/13/17 / #20170102118

Lighting device with light mixing element and luminescent volume

Various embodiment may relate to a lighting device, including a light mixing element having a light entry surface and a light exit surface, multiple light sources, the primary light of which can be is radiated onto the light entry surface, a wavelength conversion unit having a carrier, on which a luminescent volume is arranged, which luminescent volume can be is illuminated by means of the primary light emitted by the light exit surface, and at least one decoupling optical unit for forming useful light emitted by the wavelength conversion unit, which has at least one non-imaging safety region. The multiple light sources radiate the primary light thereof at an angle onto the light entry surface. ... Osram Gmbh

04/13/17 / #20170100751

Method for classifying light-emitting semiconductor components and image sensor application having an image sensor and a semiconductor element

The invention relates to a method for classifying a light-emitting semiconductor component (301) for an image sensor application, wherein the semiconductor component (301) is designed as a light source for an image sensor (302), comprising the following steps: providing the light-emitting semiconductor component (301); determining at least one of the following parameters of the light emitted with an emission spectrum by the light-emitting semiconductor component (301) during operation: r=∫qr(λ)·s(λ)dλ·texp, g=∫qg(λ)·s(λ)dλ·texp, b=∫qb(λ)·s(λ)dλ·texp, wherein qr(λ), qg(λ), and qb(λ) are spectral sensitivities of a red, green, and blue color channel of the image sensor (302), s(λ) is the emission spectrum of the light-emitting semiconductor component (301), texp is an exposure time, and λ designates a wavelength; classifying the light-emitting semiconductor component (301) into a class from a group of classes, which are characterized by different value ranges of at least one parameter that depends on at least one of the parameters r, g, and b. The invention further relates to an image sensor application.. ... Osram Gmbh

04/06/17 / #20170099718

Identifying and controlling light-based communication (lcom)-enabled luminaires

Techniques are disclosed for identifying and controlling light-based communication (lcom)-enabled luminaires. In some cases, the techniques include a luminaire communicating its id to a computing device via one or more lcom signals. ... Osram Gmbh

04/06/17 / #20170099572

Techniques for indoor navigation with occupancy tracking and location tracking via light-based communication

Techniques are disclosed for enhancing indoor navigation using light-based communication (lcom). In some cases, an lcom-enabled luminaire configured as described herein may acquire user data from a local computing device and relay it to a server that tracks and analyzes the data to assess statistics for the luminaire's local spatial environment. ... Osram Gmbh

04/06/17 / #20170099571

Techniques for augmenting gps-based navigation via light-based communication

Techniques are disclosed for augmenting global positioning system (gps)-based navigation via light-based communication (lcom). In accordance with some embodiments, a light-sensing device, such as a camera or an ambient light sensor configured as described herein, may be used to detect an lcom signal transmitted by a local lcom-enabled solid-state luminaire. ... Osram Gmbh

04/06/17 / #20170098919

Edge emitting semiconductor laser system

A laser system includes an edge emitting semiconductor laser, and an optical fiber, wherein the laser emits one or more laser beams coupled into the optical fiber and the laser includes a semiconductor body including a waveguide region that includes first and second waveguide layers and an active layer arranged between the first and second waveguide layers and generates laser radiation, the waveguide region is arranged between first and second cladding layers disposed downstream of the waveguide region, a phase structure is formed in the semiconductor body, includes a cutout extending from a top side of the semiconductor body into the second cladding layer, at least one first intermediate layer composed of a semiconductor material different from the material of the second cladding layer is embedded therein, and the cutout extends from the top side of the semiconductor body at least partly into the first intermediate layer.. . ... Osram Gmbh

04/06/17 / #20170098787

Main group metal complexes as p-dopants for organic electronic matrix materials

A metal complex of a metal from groups 13 to 16 uses a ligand of the structure (i), where r.sup.1 and r.sup.2 can independently be oxygen, sulfur, selenium, nh or nr.sup.4, where r.sup.4 an alkyl or aryl and can be connected to r.sup.3. R.sup.3 is an alkyl, long-chain alkyl, alkoxy, long-chain alkoxy, cycloalkyl, halogenalkyl, aryl, arylene, halogenaryl, heteroaryl, heteroarylene, heterocycloalkylene, heterocycloalkyl, halogenheteroaryl, alkenyl, halogenalkenyl, alkynyl, halogenalkynyl, ketoaryl, halogenketoaryl, ketoheteroaryl, ketoalkyl, halogenketoalkyl, ketoalkenyl, halogenketoalkenyl, where in suitable radicals, one or more non-adjacent ch.sup.2-groups can be substituted independently of one another by —o—, —s—, —nh—, —nr.sup.o-, —sir.sup.or.sup.oo-, —co—, —coo—, —oco—, —oco—o—, —so.sub.2-, —s—co—, —co—s—, —cy1═cy2 or —c.dbd.c—, specifically in such a way that o and/or s atoms are not connected directly to one another, are likewise optionally substituted with aryl- or heteroaryl preferably containing 1 to 30 c atoms, as a dopant for matrix materials in organic electronic components.. ... Osram Gmbh

04/06/17 / #20170097448

Light control films and lighting devices including same

Light control films, and lighting devices including the same, are disclosed. The light control films include a single layer of light transmitting material having a first side and a second side. ... Osram Gmbh

04/06/17 / #20170097132

Illumination device

Various embodiments may relate to an illumination device for vehicles, including multiple semiconductor light sources, and at least one light wavelength conversion element for the wavelength conversion of the light emitted by the semiconductor sources. At least one light-refracting optical unit is associated with each semiconductor source, which is designed to direct light emitted by the respective semiconductor source onto the at least one light wavelength conversion element. ... Osram Gmbh

04/06/17 / #20170095955

Method of producing a housing for an electronic device and an electronic device, housing for an electronic device, and electronic device

A method of producing a housing for an electronic device including: in a three-dimensional molding process, a housing part assembly consisting of a plurality of contiguous plastics housing parts is produced using a plastics material; and the housing part assembly is split up into a plurality of individual plastics housing parts by a separation procedure, each one of the parts forming at least a part of a housing, wherein the molding process is transfer molding or compression molding, a mold is used for the molding process including mold pins by which first side faces molded on during the molding process are produced on each of the plastics housing parts, the separation procedure results in second side faces being produced on each of the plastics housing parts, and the first and second side faces form outer faces of the plastics housing parts.. . ... Osram Gmbh

03/30/17 / #20170094750

Lighting system that self detects the relative physical arrangement of its sources

Systems and methods are disclosed that allow a lighting system to self-determine the relative positions of its different light sources. Direct light source to light source distances are measured and trilateration is used to locate each light source in three dimensional space. ... Osram Gmbh

03/30/17 / #20170094738

Controller for a phase cut dimmable led driver

A control scheme for a dimmable lighting driver is provided. The control scheme may operate with a phase cut type dimmer (leading or trailing edge). ... Osram Gmbh

03/30/17 / #20170094494

Active proximity based wireless network commissioning

Active proximity based wireless network commissioning is provided. Routers and end devices are placed in a default mode before commissioning such that the devices are communicative but do not transmit join requests. ... Osram Gmbh

03/30/17 / #20170093716

Route optimization using star-mesh hybrid topology in localized dense ad-hoc networks

Optimized routing in localized dense networks is provided. A packet is received at a first network device in a network. ... Osram Gmbh

03/30/17 / #20170093663

Wireless mesh network health determination

Methods and system to determine the health of wireless mesh networks are provided. Each radio node of a wireless mesh network transmits link quantification messages (lqms) interpan at maximum power to enable adjacent nodes to determine the received signal strength indication (rssi) on the wireless link to that radio node. ... Osram Gmbh

03/30/17 / #20170093491

Adaptive baud rate in light-based communication

Light-based communication (lcom) techniques are disclosed for adaptively adjusting the baud rate of a luminaire to optimize the lcom signal transmitted for an intended receiver device. The adaptive baud rate can be adjusted by a process that includes, for example: determining decoding parameters of the receiver device, the device including a camera for receiving lcom signals, and a display. ... Osram Gmbh

03/30/17 / #20170093490

Sub-sampling raster lines in rolling shutter mode for light-based communication

Light-based communication (lcom) techniques are disclosed for decoding lcom signals using a sub-raster line sampling process. In accordance with an embodiment, a system is provided that is configured to sub-sample each raster line to capture data at a much faster sampling rate, which in turn allows for longer lcom messages and faster response time. ... Osram Gmbh

03/30/17 / #20170093489

Reconstructing light-based communication signals captured with a rolling shutter image capture device

Methods and systems are described for sampling an lcom message and accurately reconstructing the entire lcom message using a light receiver (e.g., digital camera) of a typical mobile computing device, such as a smartphone, tablet, or other mobile computing device. These including receiving segments of an lcom signal from at least two repetitions of the lcom signal. ... Osram Gmbh

03/30/17 / #20170093280

Digitally compensated hysteretic power supply with enhanced resolution

A digitally compensated hysteretic power supply with enhanced resolution is provided. Such a power supply includes a comparator that is used to compare a load current sense signal with an internal signal generated from a digital-to-analog converter (dac). ... Osram Gmbh

03/30/17 / #20170093274

Boost power factor correction circuit, driving circuit for light-emitting diode and lighting device

A boost power factor correction circuit, a driving circuit for light-emitting diodes and a lighting device are provided. The boost power factor correction circuit includes: a pfc controller; a pfc switch controlled by an output of the pfc controller; and an equivalent variable resistor connected between the pfc switch and the ground. ... Osram Gmbh

03/30/17 / #20170093159

Dynamic control of switching frequency in a switch mode power converter

A controller dynamically identifies a switching frequency based power converter output load condition, input voltage, and/or temperature. The controller updates the operating switching frequency to the identified target switching frequency when the identified switching frequency is sufficiently different than a current operating switching frequency of the power converter. ... Osram Gmbh

03/30/17 / #20170092808

Optoelectronic semiconductor device

An optoelectronic semiconductor device has a semiconductor body including a semiconductor layer sequence with an active region that generates radiation, a semiconductor layer and a further semiconductor layer, wherein the active region is arranged between the semiconductor layer and the further semiconductor layer, a current spreading layer is arranged on a radiation exit face of the semiconductor body, the current spreading layer connects electrically conductively with a contact structure for external electrical contacting of the semiconductor layer, in a plan view of the semiconductor device the current spreading layer adjoins the semiconductor layer in a connection region, and the current spreading layer includes a patterning with a plurality of recesses through which radiation exits the semiconductor device during operation.. . ... Osram Gmbh

03/30/17 / #20170092719

Method for lateral patterning of a pattern layer with three-dimensional pattern elements, and semiconductor device

The invention relates to a method for laterally structuring a structured layer (2) with a plurality of three-dimensional structure elements (20), having the following steps: a) providing the structured layer with the three-dimensional structure elements; b) forming a laterally structured covering layer (3) on the structured layer in order to define at least one structured layer region (4) to be removed; and c) removing the structured layer region to be removed by means of a force acting on the structure elements in the region to be removed. The invention further relates to a semiconductor component (1).. ... Osram Gmbh

03/30/17 / #20170092478

Dc gas discharge lamp having a thorium-free cathode

A dc gas discharge lamp includes an anode and a cathode having a first cathode segment, which forms the surface of the cathode at least in a region of the cathode which faces the anode and has an arc attachment region, within which an arc burning between the cathode and the anode attaches during lamp operation as intended. The first cathode segment consists of tungsten with at least one emitter material for reducing the work function of electrons from the cathode. ... Osram Gmbh

03/30/17 / #20170089558

Connector device and illumination apparatus comprising the connector device

The present invention relates to a connector device for an illumination apparatus and an illumination apparatus comprising this connector device. The connector device comprises a stationary element for connecting to the illumination apparatus, a first movable element for connecting to a power supply, a second movable element rotatably connected to the stationary element, and a locking element arranged between the stationary element and the second movable element, wherein rotation of the second movable element in a first direction drives the locking element to release locking of the second movable element, and when the second movable element continues to be rotated in the first direction and drives the first movable element to rotate together, rotation of the first movable element enables the locking element to release locking of the first movable element.. ... Osram Gmbh

03/30/17 / #20170089542

Lamp optic for use in led-based lamp

A lamp optic (100) for a lamp includes a proximal end (104), a distal end (106) and a longitudinal axis (l). The proximal end (104) has a proximal inner side wall (112) linearly extending toward the distal end (106) and intersecting a proximal flat portion (114). ... Osram Gmbh

03/23/17 / #20170084864

Process for producing an insulator layer, process for producing an organic optoelectronic component comprising an insulator layer and organic optoelectronic component comprising an insulator layer

A method is specified for production of an insulator layer. This method comprises the following process steps: a) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general formula ia where r1 and r2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general formula ila where r3 is an alkyl radical, and the third component comprises at least one amine compound; b) applying the precursor to a substrate; c) curing the precursor to form the insulator layer.. ... Osram Gmbh

03/23/17 / #20170084859

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode. ... Osram Gmbh

03/23/17 / #20170084805

Optoelectronic component and method of producing same

An optoelectronic component includes an optoelectronic semiconductor chip including a first and second electrical contacts; a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad; and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, a dielectric element is arranged between the first and second leadframe sections, the first and second leadframe sections and the dielectric element are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible, and a surface of the dielectric element is exposed at the underside of the housing.. . ... Osram Gmbh

03/23/17 / #20170084777

Method of producing an optoelectronic semiconductor chip and an optoelectronic semiconductor chip

A method of producing an optoelectronic semiconductor chip includes providing a growth substrate and a semiconductor layer sequence grown on the growth substrate with a main extension plane including a p-conductive layer, an active zone and an n-conductive layer, removing the semiconductor layer sequence in regions to form at least one aperture extending through the p-conductive layer and the active zone into the n-conductive layer of the semiconductor layer sequence, depositing a protective layer on a side of the semiconductor layer sequence facing away from the growth substrate, depositing an aluminum layer containing aluminum across the entire surface on a side of the semiconductor layer sequence facing away from the growth substrate, removing the growth substrate, and forming a mesa by removing the semiconductor layer sequence at the regions of the protective layer, wherein the protective layer is subsequently freely externally accessible at least in places.. . ... Osram Gmbh

03/16/17 / #20170079096

Driving a multi-color luminaire

Embodiments are disclosed for driving a multi-color solid state light source luminaire so as to maintain a color point as temperature varies within a given range. An array of solid state light sources includes two or more strings and is driven by a single constant current source. ... Osram Gmbh

03/16/17 / #20170077361

Production of optoelectronic components

A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.. . ... Osram Gmbh

03/16/17 / #20170077206

Organic light-emitting component and method for producing an organic light-emitting component

In various embodiments, an organic light-emitting organic is provided. The organic light-emitting component may include a first electrode layer, an organic functional layer structure over the first electrode layer, and a second electrode layer over the organic functional layer structure. ... Osram Gmbh

03/16/17 / #20170077071

Optoelectronic component

An optoelectronic component for mixing electromagnetic radiation having different wavelengths, for example, for the far field is disclosed. In an embodiment the optoelectronic component includes a carrier, at least one first semiconductor chip arranged on the carrier and having a first radiation exit surface for emitting electromagnetic radiation in a first spectral range and at least one second semiconductor chip arranged on the carrier and having a second radiation exit surface for emitting electromagnetic radiation in a second spectral range, wherein a diffusing layer is arranged on the first and second radiation exit surfaces of the semiconductor chips that face away from the carrier and wherein a reflecting layer is arranged between the first semiconductor chip and the second semiconductor chip, the first and second radiation exit surfaces being free from the reflecting layer at least in regions.. ... Osram Gmbh

03/16/17 / #20170077070

Semiconductor component, lighting device and method for producing a semiconductor component

The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.. ... Osram Gmbh

03/16/17 / #20170076933

Low-pressure discharge lamp with fluorescent particles having a small particle size

In different embodiments, a low-pressure discharge lamp (1) is provided. The low-pressure discharge lamp has a discharge vessel (2) and a coating structure (7). ... Osram Gmbh

03/09/17 / #20170069876

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.. . ... Osram Gmbh

03/09/17 / #20170069800

Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component

A method for producing optoelectronic semiconductor components (100) is specified, wherein a carrier (1) having a carrier main side (11) is provided. Furthermore, a plurality of singulated optoelectronic semiconductor chips (2) are provided, wherein the semiconductor chips (2) each have a main emission side (21) and a contact side (22) opposite the main emission side (21). ... Osram Gmbh

03/09/17 / #20170068089

Method for operating an illuminating device

Various embodiments may relate to a method for operating an illuminating device with a pump radiation source for emitting pump radiation, and a phosphor wheel, on which a first phosphor for emitting first conversion light and a second phosphor for emitting second conversion light are provided, in which method the phosphor wheel rotates about a rotation axis and in the process is irradiated with the pump radiation in an irradiation region eccentrically with respect to the rotation axis in such a way that a circular track is irradiated owing to the rotation of the phosphor wheel, wherein during a 360° revolution of the phosphor wheel the first phosphor is irradiated with a first pump radiation power and the second phosphor is irradiated with a second pump radiation power, which is different than the first pump radiation power.. . ... Osram Gmbh

03/09/17 / #20170067612

High efficency vehicle light featuring concave reflector and sub-reflector for generating low-beam output

A vehicle light (1, 11) produces low-beam output using generally spherical distribution light source (7) with increased efficiency. The vehicle light (1) includes transmissive lens (2) through which light exits vehicle light (1); concave reflector (3); light occluding member (100) defining first sub-reflector (6); cut-off edge (4); and second sub-reflector (5). ... Osram Gmbh

03/02/17 / #20170064820

Shaped substrate with arrangement of solid state light sources

A substrate for a solid state lighting module has a plurality of serrated finger sections extending from an interconnecting base. The substrate may be formed from a single rectangular sheet by cutting away material between adjacent finger sections of a symmetrical second substrate to form the finger sections of the substrate. ... Osram Gmbh

03/02/17 / #20170064270

Light module

A light module includes an excitation radiation source, first phosphor, a beam splitting apparatus configured to generate a first and a second partial optical path, with one of the two partial optical paths comprising the first phosphor and the other one including the excitation radiation, a combining apparatus to merge the first and second paths, and an exit where the radiation from the merged paths can be made available. The apparatus includes a first rotatably mounted filter wheel is arranged between the source and the first phosphor and has a first transmission region and a first reflection region for the excitation radiation, and a second rotatably mounted filter wheel, which has at least one second transmission region and a second reflection region for the excitation radiation.. ... Osram Gmbh

03/02/17 / #20170063240

Dc-dc flyback converter with primary side auxiliary voltage output

A dc-dc flyback converter includes a transformer and a switching component connected between the transformer and a ground. The switching component controls current flow through the primary winding of the transformer. ... Osram Gmbh

03/02/17 / #20170062687

Optoelectronic device

A method for producing an optoelectronic device comprises steps for providing a package with a first surface and a second surface, wherein an electrically conductive chip carrier is embedded in the package and is accessible at the first surface and at the second surface, and for applying an insulation layer on the second surface of the package by means of aerosol deposition.. . ... Osram Gmbh

03/02/17 / #20170062672

Wavelength conversion element, light-emitting semiconductor component including a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component including a wavelength conversion element

Various embodiments may relate to a wavelength conversion element including at least one sintered wavelength converting material, wherein a grid is formed by channels within the sintered wavelength converting material, the channels are at least partially surrounded by the sintered wavelength converting material, the channels reach at least partially through the sintered wavelength converting material in a direction perpendicular or oblique to a main extension direction of the wavelength conversion element, and the channels contain a non-converting sintered separator material.. . ... Osram Gmbh

03/02/17 / #20170062661

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

A method for producing an optoelectronic semiconductor component having a plurality of image points and an optoelectronic component are disclosed. In an embodiment the method includes providing a semiconductor layer sequence including an n-conducting semiconductor layer, an active zone, and a p-conducting semiconductor layer; applying a first layer sequence, wherein the first layer sequence is divided into a plurality of regions which are arranged laterally spaced with respect to each other on a top surface of the p-conducting semiconductor layer; c) applying a second insulating layer; partially removing the p-conducting semiconductor layer and the active zone, in such a way that the n-conducting semiconductor layer is exposed at points and the p-conducting semiconductor layer is divided into individual regions which are laterally spaced with respect to each other, wherein each of the regions comprises a part of the p-conducting semiconductor layer and a part of the active zone.. ... Osram Gmbh

03/02/17 / #20170062382

Production of optoelectronic components

A method of producing optoelectronic components includes providing an auxiliary carrier, forming separate connection elements on the auxiliary carrier, forming a molded body on the auxiliary carrier with recesses, arranging optoelectronic semiconductor chips on connection elements in the recesses of the molded body, removing the auxiliary carrier, and severing the molded body to form singulated optoelectronic components.. . ... Osram Gmbh

03/02/17 / #20170062351

Method for producing semiconductor components and semiconductor component

A method for producing a plurality of semiconductor components (1) is provided, comprising the following steps: a) providing a semiconductor layer sequence (2) having a first semiconductor layer (21), a second semiconductor layer (22) and an active region (25), said active region being arranged between the first semiconductor layer and the second semiconductor layer for generating and/or receiving radiation; b) forming a first connection layer (31) on the side of the second connection layer facing away from the first semiconductor layer; c) forming a plurality of cut-outs (29) through the semiconductor layer sequence; d) forming a conducting layer (4) in the cut-outs for establishing an electrically conductive connection between the first semiconductor layer and the first connection layer; and e) separating into the plurality of semiconductor components, wherein a semiconductor body (20) having at least one of the plurality of cut-outs arises from the semiconductor layer sequence for each semiconductor component and the at least one cut-out is completely surrounded by the semiconductor body in a top view of the semiconductor body. Furthermore, a semiconductor component is provided.. ... Osram Gmbh

03/02/17 / #20170059147

Illuminant with leds

An illuminant with at least two leds mounted on mutually opposite sides of a support plate and a reflection surface formed as a concave mirror, in which concave mirror the leds are arranged, wherein a housing part of the illuminant made of a transparent housing material is provided, which housing part at the same time forms an in relation to the main propagation direction lateral external surface of the illuminant and supports a reflecting layer forming the reflection surface at an internal surface opposite to the external surface.. . ... Osram Gmbh

03/02/17 / #20170059116

Led array within asymmetric cavity having reflective and non-reflective regions

A packaged light emitting device 100 that allows enhanced light cutoff in lighting applications to better control glare and optimize lumen output. Packaged device 100 includes an led array 4 in cavity 32 whose inner wall includes both a reflective wall portion 34 and a non-reflective wall portion 36 to increase output of useful light while mitigating reflection of light that can cause glare. ... Osram Gmbh

03/02/17 / #20170059115

Led array on partially reflective substrate within dam having reflective and non-reflective regions

A packaged light emitting device 100 that allows enhanced light cutoff in lighting applications to better control glare and optimize lumen output. Packaged device 100 includes both a reflective dam region 34 and a non-reflective dam region 36 to increase output of useful light while mitigating reflection of light that can cause glare. ... Osram Gmbh

03/02/17 / #20170059107

Thin wall internal reflection light optic

An example lamp optic comprises a light guide (100) to receive light from a light source (108) and generate a light beam via internal reflection. The light guide includes a proximal end (104) to receive the light and a distal end (106) to emit the light beam. ... Osram Gmbh

03/02/17 / #20170058195

Phosphor, method for producing a phosphor and use of a phosphor

A phosphor is disclosed. In an embodiment a phosphor includes an inorganic substance which includes, in its composition, at least an element d, an element a1, an element ax, an element sx and an element nx where d includes one, two or more elements selected from the group consisting of mn, ce, pr, nd, sm, eu, tb, dy, ho, er, tm, alkali metals and yb, a1 includes one, two or more elements selected from the group consisting of divalent metals not included in d, sx includes one, two or more elements selected from the group consisting of tetravalent metals, ax includes one, two or more elements selected from the group consisting of trivalent metals, and nx includes one, two or more elements selected from the group consisting of o, n, s, c, cl, and f, wherein the inorganic substance has the same crystal structure as sr(sraca1−a)si2al2n61.. ... Osram Gmbh

02/23/17 / #20170054271

Semiconductor strip laser and semiconductor component

A semiconductor strip laser and a semiconductor component are disclosed. In embodiments the laser includes a first semiconductor region of a first conductivity type of a semiconductor body, a second semiconductor region of a second different conductivity type of the semiconductor body, at least one active zone of the semiconductor body configured to generate laser radiation between the first and second semiconductor regions. ... Osram Gmbh

02/23/17 / #20170054110

Lighting device and method for producing a lighting device

A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.. ... Osram Gmbh

02/23/17 / #20170054054

Semiconductor component and illumination device

A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. ... Osram Gmbh

02/23/17 / #20170053795

Method for the production of a nitride compound semiconductor layer

Described is a method for producing a nitride compound semiconductor layer, involving the steps of:—depositing a first seed layer (1) comprising a nitride compound semiconductor material on a substrate (10);—desorbing at least some of the nitride compound semiconductor material in the first seed layer from the substrate (10);—depositing a second seed layer (2) comprising a nitride compound semiconductor material; and—growing the nitride compound semiconductor layer (3) containing a nitride compound semiconductor material onto the second seed layer (2).. . ... Osram Gmbh

02/23/17 / #20170051882

Semiconductor-tubular lamp, tube therefor, and production method

The invention relates to a tube (42) for a semiconductor tubular lamp (41), which tube has at least one holding projection for holding at least one printed circuit board (5) on the inside of the tube, wherein the tube (42) is a glass tube, and the at least one holding projection is an inwardly bulging, reshaped burling region (43-46) of the tube (42). A semiconductor tubular lamp (41) has a tube (42) and at least one printed circuit board (5) fitted with a semiconductor light source (6), which is accommodated in the tube (42) and is held transversely to a longitudinal direction (l) of the tube (42) by means of at least one burling region (43-46) in a form-fitted manner. ... Osram Gmbh

02/16/17 / #20170047552

Organic light-emitting component

An organic light-emitting component includes: a translucent first electrode and a second electrode, and an organic functional layer stack having at least one organic light-emitting layer between the first and second electrodes, wherein the second electrode is diffusely reflective; a translucent first electrode and a second electrode, and an organic functional layer stack having at least one organic light-emitting layer between the first and second electrodes, wherein the second electrode is diffusely reflective, and the second electrode layer includes a multiplicity of crystals with boundary surfaces for diffuse reflection; and a translucent first electrode and a second electrode, and an organic functional layer stack having at least one organic light-emitting layer between the first and second electrodes, wherein the second electrode is diffusely reflective, and the second electrode layer includes barium sulfate.. . ... Osram Gmbh

02/16/17 / #20170047539

Optoelectronic component device, method for producing an optoelectronic component device, and method for operating an optoelectronic component device

In various embodiments, an optoelectronic component device is provided. The optoelectronic component device may include a linear regulator designed for providing an electric current; an optoelectronic component formed for converting the electric current into an electromagnetic radiation; and an electrothermal transducer designed for converting the electric current into a temperature difference. ... Osram Gmbh

02/16/17 / #20170047486

Optoelectronic device and method for producing an optoelectronic device

An optoelectronic component (100) comprises an optoelectronic semiconductor chip (10), a first contact area (31) and a second contact area (32), which is laterally offset with respect to the first contact area and is electrically insulated therefrom, and a housing element (40). The first contact area (31) is electrically conductively connected to the first semiconductor layer (21) and the second contact area (32) is electrically conductively connected to the second semiconductor layer (22) of the optoelectronic semiconductor chip. ... Osram Gmbh

02/16/17 / #20170047485

Substrate for mounting light radiation sources and corresponding method

A substrate for mounting electrically-powered light radiation sources, e.g. Led sources, includes a base layer of electrically-insulating material, such as pet, and a contact layer of electrically conductive material, e.g. ... Osram Gmbh

02/16/17 / #20170047479

Method for producing a semiconductor layer sequence

A method for producing a semiconductor layer sequence is disclosed. In an embodiment the includes growing a first nitridic semiconductor layer at the growth side of a growth substrate, growing a second nitridic semiconductor layer having at least one opening on the first nitridic semiconductor layer, removing at least pail of the first nitridic semiconductor layer through the at least one opening in the second nitridic semiconductor layer, growing a third nitridic semiconductor layer on the second nitridic semiconductor layer, wherein the third nitridic semiconductor layer covers the at least one opening at least in places in such a way that at least one cavity free of a semiconductor material is present between the growth substrate and a subsequent semiconductor layers and removing the growth substrate.. ... Osram Gmbh

02/09/17 / #20170040503

Method of producing a multicolor led display

A method produces a multicolor led display, the display including an led luminous unit having a multiplicity of pixels. First subpixels, second subpixel and third subpixels contain an led chip that emits radiation of a first color, wherein a first conversion layer that converts the radiation into a second color is arranged at least above the second subpixels and a second conversion layer that converts the radiation into a third color is arranged above the third subpixels. ... Osram Gmbh

02/09/17 / #20170040500

Method for producing a laterally structured phosphor layer and optoelectronic component comprising such a phosphor layer

A method for producing a laterally structured phosphor layer and an optoelectronic component comprising such a phosphor layer are disclosed. In an embodiment the method includes providing a carrier having a first electrically conductive layer at a carrier top side, applying an insulation layer to the first electrically conductive layer and a second electrically conductive layer to the insulation layer, etching the second electrically conductive layer and the insulation layer, wherein the first electrically conductive layer is maintained as a continuous layer. ... Osram Gmbh

02/09/17 / #20170040165

Method for producing a layer structure as a buffer layer of a semiconductor component and layer structure as a buffer layer of a semiconductor component

What is specified is a method for producing a layer structure (10) as a buffer layer of a semiconductor component, said method comprising the following steps: a) provision of a carrier (1), which has a silicon surface (1a), b) deposition of a first layer sequence (2), which comprises a seeding layer (21) containing aluminium and nitrogen, on the silicon surface (1a) of the carrier (1) along a stacking direction (h) running perpendicular to a main plane of extent of the carrier (1), c) three-dimensional growth of a 3d-gan layer (3), which is formed with gallium nitride, on a top surface (2a) of the first layer sequence (2) which is remote from the silicon surface (1a), d) two-dimensional growth of a 2d-gan layer (4), which is formed with gallium nitride, on the outer surfaces (3a) of the 3d-gan layer (3) which are remote from the silicon surface (1a).. . ... Osram Gmbh

02/09/17 / #20170037308

Lighting device with a first phosphor and filter particles

A lighting device includes a radiation source that emits primary radiation in the wavelength range of 300 nm to 570 nm, a first phosphor arranged in a beam path of the primary radiation source that converts at least part of the primary radiation into secondary radiation in an orange to red wavelength range of 570 nm to 800 nm, and filter particles arranged in a beam path of the secondary radiation that absorb at least part of the secondary radiation.. . ... Osram Gmbh

02/09/17 / #20170035333

Apparatus for measuring a vital function of a living creature

Apparatus for measuring a vital function of a living creature comprising: a light source, wherein the light source emits a first light signal and a second light signal; a receiver, wherein the receiver receives a reflected first light signal, wherein the receiver receives a reflected second light signal; an evaluating unit, to evaluate the received first light signal with the received second light signal, wherein the evaluating unit measures the vital function based on the evaluated received first light signal.. . ... Osram Gmbh

02/02/17 / #20170033271

Optoelectronic component and method of production thereof

A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.. . ... Osram Gmbh

02/02/17 / #20170033092

Semiconductor chip, optoelectronic device with a semiconductor chip, and method for producing a semiconductor chip

A semiconductor chip, an optoelectronic device including a semiconductor chip, and a method for producing a semiconductor chip are disclosed. In an embodiment the chip includes a semiconductor body with a first main surface and a second main surface arranged opposite to the first main surface, wherein the semiconductor body includes a p-doped sub-region, which forms part of the first main surface, and an n-doped sub-region, which forms part of the second main surface and a metallic contact element that extends from the first main surface to the second main surface and that is electrically isolated from one of the sub-regions.. ... Osram Gmbh

02/02/17 / #20170031080

Edge-lit stepped light guide for downlight module

A light guide 2 for a ceiling downlight module 1 provides a batwing light distribution in a compact, flat form factor using edge-lit source light injection. A plurality of solid state light sources 16 inject light from peripheral side surface 12 inward into light guide 2 which has a disc-shaped light guide body 4 having a set of concentric annular steps or faces 42, 44, 46, 48, 50, 52 between which inwardly-facing light-exit rings or facets 24, 26, 28, 30, 32, 34 are formed. ... Osram Gmbh

01/26/17 / #20170027038

Illumination device

An illumination apparatus for a motor vehicle is provided. The illumination device may include at least one semiconductor light source arrangement, and means for regulating or controlling the supply current for the at least one semiconductor light source arrangement, the means having at least one resistance element with a temperature-dependent resistance value.. ... Osram Gmbh

01/26/17 / #20170025625

Metal complex and organic light-emitting component

A metal complex and an organic light-emitting component are disclosed. In an embodiment, the metal complex includes the following structural formula i:. ... Osram Gmbh

01/26/17 / #20170025624

Metal complex and organic light-emitting component

A metal complex and an organic light-emitting component are disclosed. In an embodiment the metal complex includes the following structural formula i:. ... Osram Gmbh

01/26/17 / #20170025623

Metal complex and organic light-emitting component

A metal complex and an organic light-emitting component are disclosed. In an embodiment, the metal complex includes the following structural formula i:. ... Osram Gmbh

01/26/17 / #20170025581

Optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body.. . ... Osram Gmbh

01/26/17 / #20170025574

Optoelectronic semiconductor element, optoelectronic semiconductor device and method for producing a plurality of optoelectronic semiconductor elements

An optoelectronic semiconductor element may include at least one led chip which emits infrared radiation via a top side during operation. The radiation has a global intensity maximum at wavelengths between 800 nm and 1100 nm. ... Osram Gmbh

01/26/17 / #20170025570

Light-emitting semiconductor chip

A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. ... Osram Gmbh

01/26/17 / #20170025569

Optoelectronic component and method for the production thereof

The invention concerns an optoelectronic component comprising a layer structure with a light-active layer. In a first lateral region the light-active layer has a higher density of v-defects than in a second lateral region.. ... Osram Gmbh

01/26/17 / #20170025478

Organic light-emitting component

An organic light-emitting component is disclosed. The organic light emitting component includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. ... Osram Gmbh

01/26/17 / #20170023806

Optical element and organic light-emitting device with optical element

An optical element includes a light guide plate with a first major surface and with a second major surface opposite the first major surface and with side faces connecting the first and second major surfaces, wherein the light guide plate includes a matrix material transparent to ultraviolet light in which scattering centers are embedded, at least one light-emitting semiconductor device that couples ultraviolet light into the light guide plate via a side face when in operation, a first filter layer on the first major surface and a second filter layer on the second major surface, wherein the filter layers opaque to ultraviolet light and at least partially transparent to visible light, and a first photochromic layer at least on the first major surface, between the light guide panel and the first filter layer, with a transparency to visible light by ultraviolet light.. . ... Osram Gmbh

01/26/17 / #20170023209

Lighting apparatus

In various embodiments, a lighting apparatus is provided. The lighting apparatus includes a primary light generating device configured to generate a primary light beam, a phosphor body configured to at least partly convert the primary light beam into secondary light, and a shell-shaped reflector situated in a primary light path between the primary light generating device and the phosphor body. ... Osram Gmbh

01/26/17 / #20170020084

Lighting device, for instance for greenhouse lighting, and corresponding method of use

Various embodiments may relate to a lighting device, e.g. For greenhouse lighting, including a substrate with an array of electrically-powered light radiation sources, e.g. ... Osram Gmbh

01/19/17 / #20170018730

Organic optoelectronic device and method of manufacturing an organic optoelectronic device

In at least one embodiment, an organic optoelectronic component, which is preferably an organic light emitting diode, includes a first electrode layer, a second electrode layer and an organic layer sequence situated between the electrode layers. Furthermore, the component includes a light-transmissive current confinement layer, which is fitted over the whole area between the first electrode layer and the organic layer sequence, such that the organic layer sequence is spaced apart from the first electrode layer. ... Osram Gmbh

01/19/17 / #20170018695

Method for producing an optoelectronic device

A method for manufacturing an opto-electronic component (100) is given, comprising a provision of a carrier (1) with at least one mounting surface (11), a generation of at least two vias (4) in the carrier (1) with electrically conducting contacts (12, 13) running through the vias (4), a provision of at least one light-emitting semiconductor chip (2), wherein the semiconductor chip (2) comprises a growth substrate (10) and a layer sequence (7) epitaxially grown thereon, a mounting of the at least one semiconductor chip (2) onto the at least one mounting surface (11) of the carrier (1), wherein the semiconductor chip (2) is connected in an electrically conducting manner to the contacts (12, 13) in the same method step during the mounting onto the mounting surface (11), an isolation of the carrier (1) along isolation lines (v), wherein an isolation line (v) runs through at least one of the vias (4), so that, after the isolation, the contacts (12, 13) form contact surfaces (5) at at least one side surface (1a) of the carrier (1), wherein the side surface (1a) is perpendicular to the mounting surface (11) of the carrier (1), and a mounting of the carrier (1) with the contact surfaces (5) on a connection plate (8), wherein the mounting surface (11) is perpendicular to the connection plate (8).. . ... Osram Gmbh

01/19/17 / #20170018689

Composite ceramic wavelength converter and light source having same

There is herein described a composite ceramic wavelength converter having a first phase of an α-sialon:eu phosphor and a second phase of a β-sialon:eu phosphor. The converter may be used in a phosphor-converted light emitting diode to form a light source having a correlated color temperature (cct) from 2000k to 4500k.. ... Osram Gmbh

01/19/17 / #20170015901

Ceramic phosphor target

There is herein described a ceramic phosphor target which may be used in a laser-activated remote phosphor application. The target comprises a substantially flat ceramic phosphor converter comprised of a photoluminescent polycrystalline ceramic which is attached to a reflective metal substrate by a high thermal conductivity adhesive.. ... Osram Gmbh

01/12/17 / #20170013693

Lighting system including a protection circuit, and corresponding method for protecting light sources from electrostatic discharges

. . Various embodiments may relate to a lighting system including a string of light sources connected in series between a first terminal and a second terminal, wherein at least one electrical contact of the string of light sources is accessible. The system further includes a protection circuit that protects the light sources from an electrostatic discharge applied to the electrical contact that is accessible. ... Osram Gmbh

01/12/17 / #20170012187

Optoelectronic component including a reflective layer sequence and method for producing a reflective layer sequence

An optoelectronic component includes a first layer sequence being designed to emit or to detect electromagnetic radiation, and a second layer sequence being arranged at a first side of the first layer sequence and designed to reflect the electromagnetic radiation emitted or to be detected by the first layer sequence. The second layer sequence has a first reflector layer, a second reflector layer and an adhesion promoting layer. ... Osram Gmbh

01/12/17 / #20170012165

Method of producing a semiconductor layer sequence and an optoelectronic semiconductor component

A method of producing a semiconductor layer sequence includes providing a growth substrate having a growth surface on a growth side, growing a first nitride semiconductor layer on the growth side, growing a second nitride semiconductor layer on the first nitride semiconductor layer, wherein the second nitride semiconductor layer includes at least one opening or at least one opening is produced in the second nitride semiconductor layer or at least one opening is created in the second nitride semiconductor layer during the growing process, removing at least one part of the first nitride semiconductor layer through the openings in the second nitride semiconductor layer, and growing a third nitride semiconductor layer on the second nitride semiconductor layer, wherein the third nitride semiconductor layer covers the openings at least in places.. . ... Osram Gmbh

01/12/17 / #20170009973

Lighting device and corresponding method

A lighting device includes an elongated profiled body with a web wall having first and second opposing faces, and two side walls to the side of the web wall, the latter having longitudinal slots extending therealong. In the profiled body, there may be provided an elongated light radiation source module including a support board with electrically conductive formations facing said longitudinal slots and at least one electrically-powered light radiation source which is in electrical contact with said electrically conductive formations. ... Osram Gmbh

01/05/17 / #20170005290

Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component may include a first electrically conductively formed layer, including an electrically conductive substance in a matrix, a second electrically conductively formed layer, and an electrically conductively formed thin film encapsulation between the first electrically conductively formed layer and the second electrically conductively formed layer. The electrically conductively formed thin film encapsulation is formed in such a way that the second electrically conductively formed layer is electrically conductively connected to the first electrically conductively formed layer by the electrically conductively formed thin film encapsulation, and the electrically conductively formed thin film encapsulation is formed in a hermetically impermeable fashion with respect to a diffusion of water and/or oxygen from the first electrically conductively formed layer through the electrically conductively formed thin film encapsulation into the second electrically conductively formed layer.. ... Osram Gmbh

01/05/17 / #20170005234

Optoelectronic component and method of producing an optoelectronic component

An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.. . ... Osram Gmbh

01/05/17 / #20170005223

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

A method for producing an electronic semiconductor chip and a semiconductor chip are disclosed. In embodiments, the method includes providing a growth substrate having a growth surface formed by a flat region having a plurality of three-dimensional surface structures on the flat region, directly applying a nucleation layer of oxygen-containing aln over a large area to the growth surface and growing a nitride-based semiconductor layer sequence on the nucleation layer, wherein growing the semiconductor layer sequence includes selectively growing the semiconductor layer sequence upwards from the flat region.. ... Osram Gmbh

01/05/17 / #20170005141

Optoelectronic component and method for producing an optoelectronic component

Various embodiments may relate to an optoelectronic component, including an optoelectronic structure formed for providing an electromagnetic radiation, a measuring structure formed for measuring the electromagnetic radiation, and a waveguide formed for guiding the electromagnetic radiation. The optoelectronic structure and the measuring structure are optically coupled to the waveguide. ... Osram Gmbh

01/05/17 / #20170005079

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (l) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).. . ... Osram Gmbh

01/05/17 / #20170002988

Lighting means having a specifiable emission characteristic and production method for an optical element

The invention relates to a lighting means (1), comprising: an optical element (3), which has a main extension direction (z), a radiation inlet surface (3a), and a radiation outlet surface (3b); and at least two light-emitting diodes (2), which each comprise at least one light-emitting diode chip (21) and a radiation passage surface (2a), which extends along a main extension plane (xz); wherein the at least two lighting-emitting diodes (2) are arranged along the main extension direction (z) of the optical element. (3), the radiation inlet surface (3a) of the optical element (3) faces the radiation passage surfaces (2a) of the at least two light-emitting diodes (2), the optical element (3) is formed as a solid body, the radiation inlet surface (3a) of the optical element (3) is flat or convexly curved, and the radiation outlet surface (3b) of the optical element (3) comprises at least one recess (4) in the optical element (3).. ... Osram Gmbh








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Osram Gmbh in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Osram Gmbh with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###