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Rohinni Llc patents


Recent patent applications related to Rohinni Llc. Rohinni Llc is listed as an Agent/Assignee. Note: Rohinni Llc may have other listings under different names/spellings. We're not affiliated with Rohinni Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "R" | Rohinni Llc-related inventors


Apparatus and method for stacking semiconductor devices

An apparatus including components to stack semiconductor device die.. . ... Rohinni Llc

Apparatus and method for distributed control of a semiconductor device array

A semiconductor device array includes a plurality of first semiconductor devices arranged in an array and a plurality of second semiconductor devices distributed throughout the array of the plurality of first semiconductor devices. Each of the second semiconductor devices is interconnected with at least one of the first semiconductor devices. ... Rohinni Llc

Flexible support substrate for transfer of semiconductor devices

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer tape and a support frame disposed adjacent to the wafer frame. ... Rohinni Llc

Apparatus for high speed printing of semiconductor devices

A device for depositing an unpackaged semiconductor die (“die”) onto a substrate. The device includes a developing unit adjacent to a drum. ... Rohinni Llc

Backlighting display apparatus

A backlighting apparatus for an lcd display includes a substrate and a circuit trace disposed on a surface of the substrate. The apparatus further includes a plurality of light sources affixed to the substrate via the circuit trace in a predetermined pattern across the surface of the substrate. ... Rohinni Llc

Light diffusion with light-generating sources

Described herein are techniques related to orienting a plurality of light-generating sources of a lightguide to illuminate a backlit a device, such as a display or keyboard, with soft, even light. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.. ... Rohinni Llc

Pattern array direct transfer apparatus and method therefor

An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. ... Rohinni Llc

Method and apparatus for embedding semiconductor devices

An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The semiconductor die is disposed on the transfer surface of the product substrate such that at least a portion of the first surface is in contact with the transfer surface, and at least a portion of the second surface is embedded onto the product substrate, beneath a plane that extends across the transfer surface.. ... Rohinni Llc

Top-side laser for direct transfer of semiconductor devices

An apparatus includes a needle including a hole extending from a first end to a second end through the needle and an energy-emitting device arranged in the hole of the needle. The energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at an electrically-actuatable element to bond a circuit trace and the electrically-actuatable element.. ... Rohinni Llc

Compliant needle for direct transfer of semiconductor devices

An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.. ... Rohinni Llc

Apparatus for multi-direct transfer of semiconductors

An apparatus includes a frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the first side of the wafer tape. ... Rohinni Llc

Backlighting color temperature control apparatus

An apparatus includes a housing including a plurality of light sources to provide backlighting for the apparatus. A first portion of the plurality of light sources is configured to provide a first color temperature setting. ... Rohinni Llc

Semiconductor device on string circuit and method of making the same

An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized, unpackaged leds disposed sequentially on the circuit trace. A height of the leds ranges from about 12.5 microns to about 200 microns. ... Rohinni Llc

Light vectoring apparatus

An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. ... Rohinni Llc

09/21/17 / #20170269430

Method and apparatus for light diffusion

A display apparatus includes a substrate and a plurality of leds. Each led is attached to the substrate via conductive pads on a side of the led. ... Rohinni Llc

09/14/17 / #20170263826

Method for applying phosphor to light emitting diodes and apparatus thereof

A method of applying phosphor to an unpackaged light-emitting diode (led) die includes transferring the unpackaged led die directly to a product substrate; disposing a coverlay on the product substrate to create a cavity around the unpackaged led die; and applying phosphor to substantially fill the cavity around the unpackaged led die, the applying including at least one of using a squeegee to place the phosphor into the cavity, spraying the cavity with the phosphor, or disposing the phosphor in a sheet form onto the unpackaged led die.. . ... Rohinni Llc

09/07/17 / #20170256524

Semiconductor device on glass substrate and method of making the same

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. ... Rohinni Llc

09/07/17 / #20170256523

Method and apparatus for transfer of semiconductor devices

A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. ... Rohinni Llc

07/06/17 / #20170194171

Manufacture of circuit assembly with unpackaged semiconductor devices

An apparatus includes a carrier-to-circuit transfer mechanism that is configured to obtain one or more unpackaged semiconductor devices on a carrier substratum and directly transfer the one or more unpackaged semiconductor devices from the carrier substratum to a circuit assembly. The apparatus further includes an in-situ packager that is configured to in-situ package the one or more transferred devices by interconnecting each semiconductor device of the one or more transferred devices to conductive links of the circuit assembly and applying a coating material to the one or more transferred devices.. ... Rohinni Llc

05/18/17 / #20170140967

Apparatus and method for direct transfer of semiconductor devices via stacking

An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. ... Rohinni Llc

05/18/17 / #20170140959

Apparatus and method for direct transfer of semiconductor devices

An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. ... Rohinni Llc

05/11/17 / #20170131654

Electrophotographic deposition of unpackaged semiconductor device

A method of depositing an unpackaged semiconductor die (“die”) onto a substrate. The method includes writing a latent image on a photosensitive drum. ... Rohinni Llc

02/23/17 / #20170053901

Substrate with array of leds for backlighting a display device

An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of leds are connected to the substrate via the circuit trace. ... Rohinni Llc








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Rohinni Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Rohinni Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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