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Rohm And Haas Electronic Materials Cmp Holdings Inc patents (2016 archive)


Recent patent applications related to Rohm And Haas Electronic Materials Cmp Holdings Inc. Rohm And Haas Electronic Materials Cmp Holdings Inc is listed as an Agent/Assignee. Note: Rohm And Haas Electronic Materials Cmp Holdings Inc may have other listings under different names/spellings. We're not affiliated with Rohm And Haas Electronic Materials Cmp Holdings Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "R" | Rohm And Haas Electronic Materials Cmp Holdings Inc-related inventors


Composite polishing layer chemical mechanical polishing pad

A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second continuous non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a plurality of interconnected periodic recesses; wherein the plurality of interconnected periodic recesses are occupied with the second continuous non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has an open cell porosity of ≦6 vol %; wherein the second continuous non-fugitive polymeric phase contains an open cell porosity of ≧10 vol %; and, wherein the polishing surface is adapted for polishing a substrate.. . ... Rohm And Haas Electronic Materials Cmp Holdings Inc

Chemical mechanical plishing pad with window

A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.. . ... Rohm And Haas Electronic Materials Cmp Holdings Inc

Method for chemical mechanical polishing substrates containing ruthenium and copper

A method for chemical mechanical polishing of a substrate comprising ruthenium and copper.. . ... Rohm And Haas Electronic Materials Cmp Holdings Inc








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