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Sony Semiconductor Solutions Corporation patents


Recent patent applications related to Sony Semiconductor Solutions Corporation. Sony Semiconductor Solutions Corporation is listed as an Agent/Assignee. Note: Sony Semiconductor Solutions Corporation may have other listings under different names/spellings. We're not affiliated with Sony Semiconductor Solutions Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Sony Semiconductor Solutions Corporation-related inventors


Image processing device, image processing method, and program

The present disclosure relates to an image processing device, an image processing method, and a program capable of generating a high-quality composite image. Exposure time and exposure timing of a basic imaging unit which images a basic image and a plurality of auxiliary imaging units which may image under an imaging condition independent from that of the basic imaging unit are controlled according to a motion amount. ... Sony Semiconductor Solutions Corporation

Amplifier, audio signal output method, and electronic device

The present technology relates to an amplifier, an audio signal output method, and an electronic device that can inhibit unintended sound output in a class d amplifier that changes a peak value of a pwm signal. The amplifier includes: a positive-side amplitude generating circuit configured to generate positive-side amplitude of an output pwm signal that is a pwm signal to be output outside an apparatus; a negative-side amplitude generating circuit configured to generate negative-side amplitude of the output pwm signal; and a feedback circuit configured to feed back a difference between the amplitude generated by the positive-side amplitude generating circuit and the amplitude generated by the negative-side amplitude generating circuit to the positive-side amplitude generating circuit and the negative-side amplitude generating circuit. ... Sony Semiconductor Solutions Corporation

Solid-state image pickup device and manufacturing method thereof

There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region. . ... Sony Semiconductor Solutions Corporation

Solid-state image sensor, method of producing the same, and electronic apparatus

A solid-state image sensor includes a pixel formed, upon forming a structure where a photoelectric conversion layer is laminated on a wiring layer constituting a pixel circuit, by forming at least the photoelectric conversion layer and a wiring layer bonding layer on a different substrate from a semiconductor substrate in which the wiring layer is formed, and by bonding the wiring layer bonding film of the different substrate and the wiring layer of the semiconductor substrate together.. . ... Sony Semiconductor Solutions Corporation

Solid-state imaging device, and method of manufacturing solid-state imaging device

A solid-state imaging device includes: a plurality of pixels each including a first electrode, an organic photoelectric conversion film, and a second electrode in this order on a substrate, the organic photoelectric conversion film including a first inclined surface on a side wall; and a first sealing film formed, on the plurality of pixels, to cover the side wall of the organic photoelectric conversion film and the second electrode.. . ... Sony Semiconductor Solutions Corporation

Solid-state imaging element, method of manufacturing the same, and imaging device

In pixels that are two-dimensionally arranged in a matrix fashion in the pixel array unit of a solid-state imaging element, a photoelectric conversion film having a light shielding film buried therein is formed and stacked on the light incident side of the photodiode. The present technique can be applied to a cmos image sensor compatible with the global shutter system, for example.. ... Sony Semiconductor Solutions Corporation

Imaging element and imaging apparatus

There is provided an imaging element including a photoelectric conversion unit formed in a substrate and a wire grid polarizer disposed at a light-incident side of the photoelectric conversion unit. In addition, the wire grid polarizer includes a plurality of strip-shaped portions, where air gaps exist between adjacent strip-shaped portions. ... Sony Semiconductor Solutions Corporation

Display unit

A display unit is provided, on a substrate, with a first wiring layer and a device section. The device section has a plurality of pixels. ... Sony Semiconductor Solutions Corporation

Light emitting device and light emitting method

The present technology relates to a light emitting device and a light emitting method which readily emit high intensity light. Unipolar noise is applied to a plurality of rod-shaped metal antennas of a light emission mechanism including the plurality of metal antennas, radiating light by oscillation of electrons in the metal antennas caused by incident light. ... Sony Semiconductor Solutions Corporation

Imaging device

A light source projection unit projects intensity-modulated spatial pattern light. A time-of-flight distance measurement camera measures a distance to an object on the basis of a time of flight of a modulated component included in reflected light of the spatial pattern light from the object. ... Sony Semiconductor Solutions Corporation

Communication apparatus and method for controlling communication apparatus

A communication apparatus performs communication while suppressing an increase in power consumption. The communication apparatus includes a periodic signal generating unit, a clocking unit, a multiplication unit, and a communication processing unit. ... Sony Semiconductor Solutions Corporation

Camera module and electronic apparatus

The present technique relates to a camera module and an electronic apparatus that allow a camera module to be used for various purposes. The camera module includes a first pixel array in which pixels that receive light having an r, g, or b wavelength are two-dimensionally arranged in a matrix form and a second pixel array in which pixels that receive light having a wavelength region of visible light are two-dimensionally arranged in a matrix form and a first optical unit that converges incident light onto the first pixel array and a second optical unit that converges the incident light onto the second pixel array. ... Sony Semiconductor Solutions Corporation

Image processing device, image processing method, and program

The present disclosure relates to an image processing device, an image processing method, and a program which are capable of improving the image quality using a plurality of images captured by a plurality of imaging units. The presence or absence of mutual parallax is determined using a main image including a low sensitivity high resolution image captured by a high resolution imaging unit and a sub image including a low resolution high sensitivity image captured by a high sensitivity imaging unit, and when there is parallax, similar pixels searched in the sub image are synthesized with respective pixels of the main image through a search synthesis process, and when there is no parallax, pixels at the same position are synthesized through an optimal synthesis process. ... Sony Semiconductor Solutions Corporation

Imaging element and method of manufacturing the same, and electronic apparatus

. . The present technology relates to a back surface irradiation type imaging element having an organic photoelectric conversion film capable of preventing color mixing and securing dynamic range, a method of manufacturing the same, and an electronic apparatus. An imaging element according to an aspect of the present technology includes a photoelectric conversion film provided on one side of a semiconductor substrate, a pixel separation section formed in an inter-pixel region, and a through electrode that transmits a signal, corresponding to an electric charge obtained by photoelectric conversion in the photoelectric conversion film, to a wiring layer formed on the other side of the semiconductor substrate, the through electrode being formed in the inter-pixel region. ... Sony Semiconductor Solutions Corporation

08/23/18 / #20180240840

Solid-state imaging apparatus, and electronic apparatus

The present technology relates to a solid-state imaging apparatus and an electronic apparatus that makes it possible to improve coloration and improve image quality. The solid-state imaging apparatus is formed so that, in a pixel array unit in which combinations of a first pixel corresponding to a color component of a plurality of color components and a second pixel having higher sensitivity to incident light as compared with the first pixel are two-dimensionally arrayed, a first electrical barrier formed between a first photoelectric conversion unit and a first unnecessary electric charge drain unit in the first pixel, and a second electrical barrier formed between a second photoelectric conversion unit and a second unnecessary electric charge drain unit in the second pixel have different heights, respectively. ... Sony Semiconductor Solutions Corporation

08/23/18 / #20180240834

Solid-state image-capturing element and electronic device

The present disclosure relates to a solid-state image-capturing element and an electronic device capable of reducing the capacitance by using a hollow region. At least a part of a region between an fd wiring connected to a floating diffusion and a wiring other than the fd wiring is a hollow region. ... Sony Semiconductor Solutions Corporation

08/23/18 / #20180240829

Solid-state imaging element, manufacturing method, and electronic device

The present disclosure relates to a solid-state imaging element, a manufacturing method, and an electronic device capable of further improving quality. A flattening film is formed so as to fill a recessed portion of a semiconductor substrate having a pixel region in which a plurality of pixels is arranged in an array, a recessed region is formed in the flattening film by hollowing out a region corresponding to the pixel region, and a color filter layer is formed in the recessed region. ... Sony Semiconductor Solutions Corporation

08/23/18 / #20180240823

Solid-state imaging element and electronic apparatus

The present disclosure relates to a solid-state imaging element and an electronic apparatus, in which the number of wires controlling readout can be reduced in a case where a pixel signal of each pixel is read out in a predetermined order for each unit pixel region. The unit pixel region is configured by a plurality of pixels arranged in an array. ... Sony Semiconductor Solutions Corporation

08/23/18 / #20180240673

Transistor, protection circuit, and method of manufacturing transistor

Both an improvement of on-current and suppression of leakage current of a transistor are achieved. A transistor includes a drain, a source, a gate, and a gate insulating film. ... Sony Semiconductor Solutions Corporation

08/16/18 / #20180235038

Display device and light-emitting element

. . There is provided a display device including a light-emitting element body part, a low refractive index layer part which is provided over a light output surface of the light-emitting element body part and has a first refractive index, and a packaging member which is provided to seal the light-emitting element body part and the low refractive index layer part inside the packaging member, has a planar light output surface, and has a second refractive index which is greater than the first refractive index.. . ... Sony Semiconductor Solutions Corporation

08/16/18 / #20180233540

Photoelectric conversion element, imaging device, and electronic apparatus

A photoelectric conversion element according to one embodiment of the disclosure includes: a first electrode and a second electrode that are oppositely disposed; and a photoelectric conversion layer that is provided between the first electrode and the second electrode, and includes a high-molecular semiconductor material and a low-molecular material. The high-molecular semiconductor material has an absorption coefficient in a visible light region of 50000 cm−1 or less. ... Sony Semiconductor Solutions Corporation

08/09/18 / #20180226444

Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

. . . . A solid-state imaging device according to the present disclosure includes: a semiconductor base; a photoelectric conversion element provided in the semiconductor base; a photoelectric conversion film arranged on a light receiving surface side of the semiconductor base; a contact section to which a signal charge generated in the photoelectric conversion film is read, the contact section being provided in the semiconductor base; a first film member covering the photoelectric conversion element; and a second film member provided on the contact section.. . ... Sony Semiconductor Solutions Corporation

08/02/18 / #20180219046

Solid-state imaging device

Solid-state imaging devices, electronic apparatuses, and methods of forming image sensors are provided. A solid-state imaging device or an electronic apparatus incorporating a solid-state imaging device can include a substrate and at least a first photoelectric conversion element formed in the substrate. ... Sony Semiconductor Solutions Corporation

08/02/18 / #20180219039

Imaging device and method for manufacturing the same

An imaging device includes a plurality of light-receiving elements 10 arranged in a two-dimensional matrix shape. Each of the light-receiving elements 10 includes a first electrode 31, a photoelectric conversion layer 20, and a second electrode 32. ... Sony Semiconductor Solutions Corporation

08/02/18 / #20180217955

Communication device and control method

The present technology relates to a communication device and a control method that allow variation of modes of connection between electronic devices to be increased. A transmission unit transmits a modulated signal obtained by frequency-converting a baseband signal into a signal of a frequency band higher than the baseband signal by using a predetermined carrier. ... Sony Semiconductor Solutions Corporation

08/02/18 / #20180217361

Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. ... Sony Semiconductor Solutions Corporation

07/26/18 / #20180210487

Signal processing apparatus and method

. . The present disclosure relates to a signal processing apparatus and method that enables to reduce required power. In the signal processing apparatus, a rtc of a main chip and a rtc of a power supply chip are synchronized before power supply of the main chip is stopped, and the rtc of the main chip is synchronized with the time of the rtc of the power supply chip after the power supply of the main chip is restored. ... Sony Semiconductor Solutions Corporation

07/19/18 / #20180204881

Switch device and storage unit

A switch device according to an embodiment of the technology includes a first electrode, a second electrode that faces the first electrode, and a switch layer provided between the first electrode and the second electrode. The switch layer includes a chalcogen element. ... Sony Semiconductor Solutions Corporation

07/19/18 / #20180204878

Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer

A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.. . ... Sony Semiconductor Solutions Corporation

07/19/18 / #20180203164

Stacked lens structure, method of manufacturing the same, and electronic apparatus

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. ... Sony Semiconductor Solutions Corporation

07/12/18 / #20180197906

Imaging device, manufacturing method, and substrate dividing method

. . There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.. . ... Sony Semiconductor Solutions Corporation

07/12/18 / #20180197902

Imaging device, manufacturing method, semiconductor device, and electronic device

The present disclosure relates to an imaging device, a manufacturing method, a semiconductor device, and an electronic device that can further improve image quality. An imaging device includes a photoelectric conversion unit that receives and photoelectrically converts light, a floating diffusion layer that accumulates charge generated by the photoelectric conversion unit, and a diffusion layer that serves as a source or a drain of a transistor. ... Sony Semiconductor Solutions Corporation

07/12/18 / #20180196170

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. ... Sony Semiconductor Solutions Corporation

07/12/18 / #20180192889

Information processing device, information processing method, and program

The present technology relates to an information processing device, an information processing method, and a program for enabling continuous measurement of information in a body. The information processing device includes: a light emitting unit that emits light of a predetermined wavelength; an imaging unit that captures reflected light from an object; an analysis unit that analyzes an image captured by the imaging unit; a storage unit that stores an analysis result analyzed by the analysis unit; a communication unit that transmits the analysis result stored in the storage unit to another device; and a battery unit that generates and stores power to supply electric power to each unit, and the information processing device is embedded in a body to operate. ... Sony Semiconductor Solutions Corporation

07/05/18 / #20180191398

Information processing device and method, transmitting device and method, and receiving device and method

. . An information processing device and method, a transmitting device and method, and a receiving device and method are disclosed for multiplexing transmission signals in the same channel. In one example, transmission signals are generated by performing chirp modulation on data to be transmitted, and the transmission signals are multiplexed by shifting transmission timings of a plurality of transmission signals in a time direction and transmitting the transmission signals. ... Sony Semiconductor Solutions Corporation

07/05/18 / #20180190687

Image sensor, image processing method, and electronic device

The present disclosure relates to an image sensor, an image processing method, and an electronic device capable of executing image processing with fewer resources. The image sensor is provided with a pixel region in which pixels each including a photoelectric conversion unit which converts light to a charge and an in-pixel memory unit which holds the charge generated in the photoelectric conversion unit are arranged in a matrix manner, a driving unit which drives to read out a pixel signal from the pixel, and an image processing unit which performs image processing based on a plurality of images read out by a plurality of times of readout from the pixel region according to driving of the driving unit. ... Sony Semiconductor Solutions Corporation

07/05/18 / #20180188422

Image sensor and electronic apparatus

There is provided imaging devices and methods of forming the same, the imaging devices, including: a photodetector layer; and a light-blocking member stacked above the photodetector layer, where the light-blocking member includes at least one light-transmitting portion and at least one lens portion.. . ... Sony Semiconductor Solutions Corporation

06/28/18 / #20180184025

Imaging element, driving method, and electronic device

A pixel is included, the pixel including a photoelectric conversion portion configured to convert incident light to a charge by photoelectric conversion and accumulate the charge, a charge transfer unit configured to transfer the charge generated in the photoelectric conversion portion, a diffusion layer to which the charge is transferred through the charge transfer unit, the diffusion layer having a predetermined storage capacitance, a conversion unit configured to convert the charge transferred to the diffusion layer to a pixel signal, and connection wiring configured to connect the diffusion layer and the conversion unit. The connection wiring is connected to the diffusion layer and the conversion unit through contact wiring extending in a vertical direction with respect to a semiconductor substrate on which the diffusion layer is formed and is formed closer to the semiconductor substrate than other wiring provided in the pixel.. ... Sony Semiconductor Solutions Corporation

06/28/18 / #20180183985

Imaging device and control method

The present disclosure relates to an imaging device and a control method that achieve low electric power consumption. A light source is of a wavelength received by an opd pixel which is a pixel that detects light exposure, and its light emission is controlled by a pc or the like. ... Sony Semiconductor Solutions Corporation

06/28/18 / #20180183448

System, analog to digital converter, and method of controlling system

Power consumption of a successive-approximation type analog to digital converter is reduced. A system is provided with an analog to digital converter and a power-supply voltage generation unit. ... Sony Semiconductor Solutions Corporation

06/28/18 / #20180182789

Solid-state image sensing device, electronic device, and method for manufacturing solid-state image sensing device

The present technology relates to a solid-state image sensing device for preventing a reduction in light receiving sensitivity of an avalanche photodiode, an electronic device, and a method for manufacturing the solid-state image sensing device. A solid-state image sensing device includes an avalanche photodiode having a first region of a first conductive type, a second region of a second conductive type different from the first conductive type, and an avalanche region sandwiched between the first region and the second region, which extend in a thickness direction of a semiconductor substrate, and a film formed on at least one side of the semiconductor substrate and including a metal oxide film, a metal nitride film, or a mix crystal-based film of metal oxide film and metal nitride film. ... Sony Semiconductor Solutions Corporation

06/21/18 / #20180176445

Imaging device and imaging method

The present disclosure relates to an imaging device and an imaging method that enable more appropriate exposure control to be performed quickly. An image sensor includes an image sensor in which an exposure detection pixel configured to output a pixel value to be used for detection of brightness of a subject and an effective pixel configured to output a pixel value effective for construction of an image are arranged in an imaging effective area to be utilized for imaging of the image; and an exposure control unit configured to control exposure time of the image sensor on the basis of the pixel value output from the exposure detection pixel. ... Sony Semiconductor Solutions Corporation

06/21/18 / #20180175108

Memory device and memory system

Provided is a memory device that has a structure suitable for still higher integration while securing production easiness, and includes n memory cell units stacked, on a substrate, in order as first to n-th memory cell units in a first direction. The n memory cell units each include: one or more first electrodes; a plurality of second electrodes each provided to intersect the first electrode; a plurality of memory cells provided at respective intersections of the first electrode and the second electrodes and each coupled to both the first and second electrodes; and one or more lead lines coupled to the first electrode to form one or more coupling parts, which, in (m+1)-th memory cell unit, are located at a position where the coupling parts and m-th memory cell region surrounded by the memory cells in m-th memory cell unit overlap each other in the first direction.. ... Sony Semiconductor Solutions Corporation

06/21/18 / #20180175087

Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels includes: a plurality of photoelectric conversion portions; a plurality of transfer gates, each of which is disposed in each of the photoelectric conversion portions to transfer signal charges from the photoelectric conversion portion; and a floating diffusion to which the signal charges are transferred from the plurality of the photoelectric conversion portions by the plurality of the transfer gates, wherein the plurality of the photoelectric conversion portions receive light of the same color to generate the signal charges, and wherein the signal charges transferred from the plurality of the photoelectric conversion portions to the floating diffusion are added to be output as an electrical signal.. . ... Sony Semiconductor Solutions Corporation

06/14/18 / #20180167649

Audio recording device, audio recording system, and audio recording method

Deterioration in audio quality is inhibited in a device which records audio and stretches a reproduction time period. A sampling processing unit performs processing of sampling audio in a predetermined period at a sampling rate higher than a predetermined sampling rate to generate audio data as high-resolution audio data, and processing of sampling audio outside the predetermined period at the predetermined sampling rate to generate audio data as normal audio data. ... Sony Semiconductor Solutions Corporation

06/14/18 / #20180166615

Display unit

A display unit according to an embodiment of the disclosure includes a substrate, a wiring line and a light-emission section that are provided on the substrate, an insulating layer covering the wiring line and the light-emission section, and provided on an entire surface of the substrate, and a sealing layer provided on an entire surface of the insulating layer, and including a resin material having an oxygen transmission rate higher than a water-vapor transmission rate.. . ... Sony Semiconductor Solutions Corporation

06/07/18 / #20180160058

Solid-state imaging device and electronic apparatus

Image quality can be improved. In a case where light is focused on the center of an opening, sensitivity can be decreased by extending any side of a light-shielding film to the center. ... Sony Semiconductor Solutions Corporation

06/07/18 / #20180159648

Signal processing device, method thereof, and program

The present technology relates to a signal processing device, a method thereof, and a program capable of inhibiting deterioration in reception sensitivity. According to the present technology, in a case where a frequency band is vacant on the basis of a result of carrier sense, a data frame is transmitted as a wireless signal in the frequency band, and further, a synchronous frame formed of predetermined information different from that of the data frame is transmitted as a wireless signal in the frequency band in a case where the data frame is transmitted predetermined number of times within first time. ... Sony Semiconductor Solutions Corporation

06/07/18 / #20180159557

Coding device and coding method

The present technology relates to a coding device and a coding method that makes it possible to correspond to a dvb-like ldpc code and an ldpc code in an etri format. A coding device includes: a first ldpc coding unit configured to generate an ldpc code of a predetermined information word by using a first parity check matrix; a first parity interleaving unit configured to interleave a parity bit of the ldpc code; and a second ldpc coding unit configured to generate an ldpc code in an etri format by using a second parity check matrix with respect to the ldpc code in which the parity bit is interleaved. ... Sony Semiconductor Solutions Corporation

06/07/18 / #20180159059

Photoelectric conversion element, solid-state imaging device, and electronic apparatus

A photoelectric conversion element according to an embodiment of the disclosure includes a first electrode and a second electrode, and an organic semiconductor layer. The first electrode and the second electrode are disposed to face each other. ... Sony Semiconductor Solutions Corporation

05/31/18 / #20180151624

Photoelectric conversion element and solid-state imaging device

. . A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. ... Sony Semiconductor Solutions Corporation

05/31/18 / #20180149728

Signal processing device and method, information processing device and method, and program

The present technology relates to a signal processing device and method, an information processing device and method, and a program, in which a distance between a position where a signal is transmitted and a position where the signal is received can be obtained with higher accuracy. According to the present technology, a predetermined signal is transmitted as a radio signal at a predetermined timing known to a receiving side. ... Sony Semiconductor Solutions Corporation

05/24/18 / #20180146144

Image processing device, image processing method, program, and imaging device

. . The present disclosure relates to an image processing device, an image processing method, a program, and an imaging device, which are capable of improving the quality of an image generated using an image obtained in a state in which infrared light is radiated and an image obtained in a state in which infrared light is not radiated. A modulation coefficient setting unit sets a first modulation coefficient used for correction of infrared luminance information, which is luminance information of an infrared image obtained in a state in which infrared light is radiated, on the basis of a ratio between the infrared luminance information and visible luminance information, which is luminance information of a visible image obtained in a state in which the infrared light is not radiated. ... Sony Semiconductor Solutions Corporation

05/24/18 / #20180145101

Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device

The present technology relates to a solid-state imaging device, a manufacturing method of a solid-state imaging device, and an electronic device, in which degradation of transfer characteristics of a photo diode can be suppressed. A floating diffusion is formed to reach the same depth as a layer of a photo diode formed on a silicon substrate, and a transfer transistor gate is formed therebetween. ... Sony Semiconductor Solutions Corporation

05/24/18 / #20180143931

Communication device and control method

The present technology relates to a communication device and a control method, in which the variety of connection modes between electronic apparatuses can be increased. Provided are: a detection target mechanism detected when the first electronic apparatus is connected to a second electronic apparatus that receives a baseband signal output from the first electronic apparatus; a connection detecting unit adapted to detect a baseband signal output from the second electronic apparatus and to detect a connection between the first and second electronic apparatuses; and a control unit adapted to connect the detection target mechanism to the first electronic apparatus where a connection between the first electronic apparatus and the second electronic apparatus is detected by the connection detecting unit. ... Sony Semiconductor Solutions Corporation

05/17/18 / #20180138217

Solid-state imaging device

An imaging device that includes a substrate, a photoelectric conversion section disposed in the substrate, an element isolation region disposed adjacent to the photoelectric conversion section, a floating diffusion electrically connected to the photoelectric conversion section, an amplification transistor having a gate electrode and an active region, and a contact section disposed on the gate electrode of the amplification transistor. The contact section overlaps the active region of the amplification transistor. ... Sony Semiconductor Solutions Corporation

05/10/18 / #20180130833

Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus

A solid-state image pickup unit includes: a p-type compound semiconductor layer of a chalcopyrite structure; an electrode formed on the p-type compound semiconductor layer; and an n-type layer formed separately for each pixel, on a surface opposite to a light incident side of the p-type compound semiconductor layer.. . ... Sony Semiconductor Solutions Corporation

05/10/18 / #20180130389

Display apparatus and construction method

A display apparatus includes: a plurality of display units that are two-dimensionally arranged; a supporting member that supports the plurality of display units; and an elastic member that partially couples the supporting member and each of some or all of the plurality of display units.. . ... Sony Semiconductor Solutions Corporation

05/03/18 / #20180122466

Memory device, memory system, and memory control method

A memory device of one embodiment of the technology includes: a plurality of memory cells in a matrix arrangement; a plurality of row wirings each coupled to one end of each memory cell; a plurality of column wirings each coupled to another end of each memory cell, a first decoder circuit coupled to each of the row wirings of even-numbered rows; a second decoder circuit coupled to each of the row wirings of odd-numbered rows; a third decoder circuit coupled to each of the column wirings of even-numbered columns; and a fourth decoder circuit coupled to each of the column wirings of odd-numbered columns. The first decoder circuit, the second decoder circuit, the third decoder circuit, and the fourth decoder circuit are constituted by independent circuits from one another.. ... Sony Semiconductor Solutions Corporation

04/19/18 / #20180108658

Solid-state image sensor, image capturing device, and electronic device

[object] the present technology relates to a solid-state image sensor, image capturing device, and electronic device, capable of setting a reference voltage applied to a vertical transfer line to be substantially the same as a reset voltage of a floating diffusion portion. [solution] a reference voltage generation circuit configured to generate the reference voltage includes the same circuit as a reset transistor, an amplification transistor, and a selection transistor in a pixel circuit, and applies it to the vertical transfer line immediately before transferring an optical signal and a reset signal. ... Sony Semiconductor Solutions Corporation

04/12/18 / #20180102371

Semiconductor device and method of manufacturing the same

Semiconductors and methods of manufacturing semiconductors are provided. A semiconductor can include a plurality of insulating layers, and a plurality of conductive layers, with the insulating layers and the conductive layers alternately stacked. ... Sony Semiconductor Solutions Corporation

04/05/18 / #20180097036

Semiconductor device and electronic apparatus

A semiconductor device includes a plurality of pixels arranged in a two-dimensional array, each pixel of the plurality of pixels including a photoelectric conversion film configured to photoelectrically convert light of a first wavelength and pass light of a second wavelength, and a photoelectric conversion unit configured to photoelectrically convert the light of the second wavelength. The semiconductor device may further include a charge storage unit configured to store charge received from the photoelectric conversion unit of each pixel in a pixel group, wherein the pixel group includes adjacent pixels among the plurality of pixels, a plurality of through electrodes, and a wiring layer coupled to the photoelectric conversion film of each pixel of the plurality of pixels by at least one through electrode of the plurality of through electrodes. ... Sony Semiconductor Solutions Corporation

03/29/18 / #20180090533

Semiconductor device and electronic apparatus

A semiconductor device includes a plurality of pixels arranged in a two-dimensional array, each pixel of the plurality of pixels including a photoelectric conversion film configured to photoelectrically convert light of a first wavelength and pass light of a second wavelength, and a photoelectric conversion unit configured to photoelectrically convert the light of the second wavelength. The semiconductor device may further include a charge storage unit configured to store charge received from the photoelectric conversion unit of each pixel in a pixel group, wherein the pixel group includes adjacent pixels among the plurality of pixels, a plurality of through electrodes, and a wiring layer coupled to the photoelectric conversion film of each pixel of the plurality of pixels by at least one through electrode of the plurality of through electrodes. ... Sony Semiconductor Solutions Corporation

03/22/18 / #20180084299

Reception apparatus, receiving method, and program

The present disclosure relates to a reception apparatus, a reception method, and a program for generating a time stamp with a simple circuit structure that is realized at low cost. In one example, a reception apparatus includes a reception unit, an obtaining unit, a time stamp increment value specifying unit, a time stamp calculating unit and a time stamp adding unit. ... Sony Semiconductor Solutions Corporation

03/22/18 / #20180083059

Solid-state image capture element and electronic device

The present disclosure relates to a solid-state image capture element and an electronic device which are enabled to eliminate asymmetry of a light reception amount in accordance with an incident angle of light incident on a pixel. A solid-state image capture element includes: a pixel including a light-receiving portion that receives light incident from a rear-surface side of a semiconductor substrate; and a wiring layer laminated on a front-surface of the semiconductor substrate. ... Sony Semiconductor Solutions Corporation

03/22/18 / #20180081099

Solid-state imaging device, method of manufacturing the same, and electronic device

The present technology relates to a solid-state imaging device, a method of manufacturing the same, and an electronic device capable of improving sensitivity in a certain wavelength band and at the same time reducing color mixture of light of other wavelength bands in a photoelectric conversion unit. The solid-state imaging device is provided with a first photoelectric conversion unit which generates a signal charge corresponding to a light amount of light of a first color component on a short wavelength side out of incident light, a second photoelectric conversion unit which generates a signal charge corresponding to a light amount of light of a second color component on a long wavelength side out of the incident light, and a first optical interference film provided between the first photoelectric conversion unit and the second photoelectric conversion unit formed below the first photoelectric conversion unit which transmits the light on the long wavelength side while reflecting the light on the short wavelength side out of the incident light. ... Sony Semiconductor Solutions Corporation

03/15/18 / #20180077373

Solid-state imaging device and method of operating the same, and electronic apparatus and method of operating the same

A solid-state imaging device includes a plurality of pixels in a two-dimensional array. Each pixel includes a photoelectric conversion element that converts incident light into electric charge, and a charge holding element that receives the electric charge from the photoelectric conversion element, and transfers the electric charge to a corresponding floating diffusion. ... Sony Semiconductor Solutions Corporation

03/15/18 / #20180076501

Connector device and communication system

A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. ... Sony Semiconductor Solutions Corporation

03/15/18 / #20180076243

Solid-state image sensing device, drive method, and electronic apparatus

The present disclosure relates to a solid-state image sensing device, a drive method, and an electronic apparatus that are configured to suppress the color mixture of a phase difference detection signal to an image sensing signal. The solid-state image sensing device has a pixel area configured to be arranged with a plurality of pixels in which a first photoelectrical conversion section for photoelectrically converting a visible light of a first wavelength range and a second photoelectrical conversion section for photoelectrically converting a visible light of a second wavelength range are formed in different depths as viewed from a cross-sectional direction, and a drive section configured to execute a drive operation of reading each pixel signal having a level corresponding to charges generated in each of the first photoelectrical conversion section and the second photoelectrical conversion section from each of the above-mentioned plurality of pixels. ... Sony Semiconductor Solutions Corporation

03/15/18 / #20180074991

Asynchronous interface

An asynchronous interface according to the disclosure includes: a transmission circuit that transmits, with data of w bits as one word, the data on the one-word basis, and transmits an req signal whose value differs by one bit per transmission of the data of one word; a reception circuit including a reception buffer having a reception buffer word count of n (n is an integer of 4 or more), in which the reception circuit receives the data on the one-word basis, and transmits an ack signal whose value differs by one bit per reception of the data of one word; a data signal line that has a bit width of w, and transfers the data from the transmission circuit to the reception circuit; an req signal line that has a bit width of log2(n) or more, and transfers the req signal from the transmission circuit to the reception circuit; and an ack signal line that has a bit width of log2(n) or more, and transfers the ack signal from the reception circuit to the transmission circuit.. . ... Sony Semiconductor Solutions Corporation

03/01/18 / #20180062047

Light-emitting element, light-emitting unit, light-emitting panel device, and method for driving light-emitting panel device

[object] a light-emitting element includes: a semiconductor layer; a first electrode portion; a second electrode portion; a first insulating layer; and a metal layer. The semiconductor layer includes an active layer, a first-conductivity-type layer, and a second-conductivity-type layer, and has a semiconductor-layer side surface including a side surface of the active layer, a side surface of the first-conductivity-type layer, and a side surface of the second-conductivity-type layer. ... Sony Semiconductor Solutions Corporation

02/22/18 / #20180054558

Imaging unit and electronic apparatus including the same

An imaging unit of an embodiment of the present technology includes: a detector that detects temperature or remaining battery capacity; an imaging device that obtains a captured image; and a first correction section that changes, on a basis of a detection result of the detector, electronic hand shake correction accuracy with respect to the captured image obtained by the imaging device when an electronic hand shake correction function is enabled.. . ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180048046

Signal processing circuit, signal processing module, and communication apparatus

. . In one example, a signal processing circuit including a directional coupler and a termination part is disclosed. The directional coupler includes a main line as a transmission path of an rf signal and a sub-line constituting a coupled line together with the main line. ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180048045

Signal transmission system, connector apparatus, electronic device, and signal transmission method

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.. ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180047784

Switch device and storage unit

A switch device according to an embodiment of the technology includes a first electrode, a second electrode that is disposed to face the first electrode, and a switch layer that is provided between the first electrode and the second electrode. The switch layer contains a chalcogen element. ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180047608

Electronic device and method of manufacturing electronic device

A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.. . ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180047325

Display apparatus and correction method

A display apparatus may comprise a display section and circuitry. The display section may comprise a plurality of display units arranged in a two-dimensional array, wherein each of the display units comprises a plurality of pixels arranged in a matrix, and each of the plurality pixels comprises a plurality of light-emitting devices that are each configured to emit a different color of light. ... Sony Semiconductor Solutions Corporation

02/15/18 / #20180045383

Electronic component, electronic component mounting substrate, and electronic component mounting method

An electronic component mounting substrate 10a is configured of an electronic component 20, and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10, a connection part 39 is exposed at the bottom of the concave part 24, and electronic component attachment parts 12 provided on the mounting substrate 10 are soldered to the connection parts 39 provided in the electronic component 20.. . ... Sony Semiconductor Solutions Corporation

02/08/18 / #20180040665

Display apparatus and illumination apparatus, and light emitting element and semiconductor device

. . A display apparatus according to one embodiment of the disclosure includes pixels in a plurality. The pixels are two-dimensionally disposed, and the pixels each include light emitting elements of at least a first primary color. ... Sony Semiconductor Solutions Corporation

02/08/18 / #20180040653

Solid-state imaging element and electronic apparatus

The present disclosure relates to a solid-state imaging element and an electronic apparatus capable of suppressing color mixing and sensitivity reduction in each of pixels of a solid-state imaging element having a vertical spectral structure. A solid-state imaging element according to a first aspect of the present disclosure is a solid-state imaging element including a vertical spectral structure pixel containing a plurality of photoelectric conversion units stacked in layers. ... Sony Semiconductor Solutions Corporation

02/08/18 / #20180040348

Signal processing device, signal processing system, signal processing method, and program

Reduction in reproduction quality is suppressed in an imaging device that images a sound and a moving image. A frame rate converter converts a frame rate of a frame captured outside a predetermined period among a plurality of frames captured at a predetermined frame rate to a low frame rate lower than the predetermined frame rate. ... Sony Semiconductor Solutions Corporation

02/01/18 / #20180035097

Image processing device, imaging device, image processing method and program

An image processing device includes depth acquisition circuitry that uses a parallax corresponding to image data to electronically generate a depth map of an image and object detection circuitry that uses distance information and the depth map to electronically detect a specific object in the image by identifying specific pixels in the image data. The depth map includes information that pertains to distances from a reference position for each pixel in the image.. ... Sony Semiconductor Solutions Corporation

02/01/18 / #20180033816

Imaging element, imaging device, and manufacturing apparatus and method

The present technology relates to an imaging element, an imaging device, and a manufacturing apparatus and a method that facilitate electric charge transfer. An imaging element of the present technology includes a vertical transistor that has a potential with a gradient in at least part of a charge transfer channel that transfers electric charge of a photoelectric conversion unit. ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180027171

Image pickup device and electronic apparatus

. . The present disclosure relates to an image pickup device that inhibits color mixture or noise, and an electronic apparatus. The image pickup device of the present disclosure includes an image plane phase difference detection pixel for image plane phase difference af. ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180026063

Semiconductor device, its manufacturing method and electronic apparatus thereof

The present invention proposes a semiconductor device, its manufacturing method and to an electronic apparatus thereof equipped with the semiconductor device where it becomes possible to make a cmos type solid-state imaging device, an imager area formed with a mos transistor of an ldd structure without having a metal silicide layer of a refractory metal, an area of dram cells and the like into a single semiconductor chip. According to the present invention, a semiconductor device is constituted such that an insulating film having a plurality of layers is used, sidewalls at the gate electrodes are formed by etchingback the insulating film of the plurality of layers or a single layer film in the region where metal silicide layers are formed and in the region where the metal silicide layers are not formed, sidewalls composed of an upper layer insulating film is formed on a lower layer insulating film whose surface is coated or the insulating film of the plurality of layers remain unchanged.. ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180025951

Information processing device, processing device, prediction method, program, and processing method

Efficiency of prediction of a physical quantity increases in repeated simulation of an etching process with a change of parameters. An information processing device includes a base shape storage unit and a physical quantity prediction unit. ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180025882

Connector device, communication device, and communication system

A connector device of the present disclosure includes two waveguides configured to transmit a radio-frequency signal, a state monitoring unit configured to monitor a connection state of the two waveguides, and a control unit that is provided on a side of the waveguide, which is on a transmission side to transmit a radio-frequency signal, between the two waveguides and that stops transmission of the radio-frequency signal according to the connection state of the two waveguides, the state being monitored by the state monitoring unit.. . ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180025778

Non-volatile memory device

A non-volatile memory device of the present disclosure includes: a plurality of bit lines; a plurality of word lines; a memory cell array having a plurality of memory cells each including a non-volatile storage element and being disposed at crossing sections of the bit lines and the word lines; a reference voltage generator circuit that generates a readout reference voltage serving as a reference for discrimination of data values stored on the memory cells; a readout circuit that reads the data values stored on the memory cells by detecting values of readout voltages from the memory cells relative to the readout reference voltage in a state where a predetermined current-limited readout current is applied to the bit lines; and an address compensation circuit that changes the readout reference voltage in accordance with a placement position of a memory cell to be read of the memory cells in the readout circuit.. . ... Sony Semiconductor Solutions Corporation

01/25/18 / #20180024187

Semiconductor integrated circuit

A semiconductor integrated circuit of the present disclosure includes: first power and second power supply lines that are coupled to a protected circuit; a third power supply line that is supplied with a voltage different from voltages supplied to the first and second power supply lines; a detection circuit that is coupled between the first and second power supply lines and detects a surge occurring in the first power supply line; an inverter circuit that includes one or more inverters coupled in series, and is coupled between the first and second power supply lines; a protection transistor that is coupled between the first and second power supply lines, and is controlled by an output of the detection circuit to cause the surge to flow through the second power supply line; and a time constant circuit that is coupled to at least the third power supply line and the protection transistor.. . ... Sony Semiconductor Solutions Corporation

01/18/18 / #20180020172

Imaging device, driving method, and electronic apparatus

The present disclosure relates to an imaging device, a driving method, and an electronic apparatus that can capture an image with a higher dynamic range. The imaging device includes: a pixel region in which pixels are arranged, the pixels each including a photoelectric conversion unit that converts incident light into electric charges through electric conversion and stores the electric charges, and two or more charge storage units that store the electric charges transferred from the photoelectric conversion unit; and a drive unit that drives the pixels. ... Sony Semiconductor Solutions Corporation

01/18/18 / #20180020169

Solid-state image sensor and electronic device

The present disclosure relates to a solid-state image sensor and an electronic device capable of simultaneously imaging a subject image and detecting a moving object. A solid-state image sensor according to an aspect of the present disclosure is provided with an infrared light detection unit which outputs a moving object image on the basis of infrared light out of incident light, and a visible light detection unit which outputs a subject image on the basis of visible light out of the incident light, in which the infrared light detection unit and the visible light detection unit are stacked and simultaneously output the moving object image and the subject image with the same frame and the same angle of view. ... Sony Semiconductor Solutions Corporation

01/18/18 / #20180019277

Image pickup unit and method of manufacturing the same

An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal member including a concave portion, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. ... Sony Semiconductor Solutions Corporation

01/11/18 / #20180012869

Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods

Methods of forming bonded semiconductor structures include providing a first semiconductor structure including a device structure, bonding a second semiconductor structure to the first semiconductor structure below about 400° c., forming a through wafer interconnect through the second semiconductor structure and into the first semiconductor structure, and bonding a third semiconductor structure to the second semiconductor structure on a side thereof opposite the first semiconductor structure. In additional embodiments, a first semiconductor structure is provided. ... Sony Semiconductor Solutions Corporation

01/11/18 / #20180012618

Image processing apparatus, image pickup device, image processing method, and program

An image pickup device which captures sound and a moving image prevents deterioration in a reproduction quality. A scene change detector detects a frame at the time of a scene change from among a plurality of frames imaged at a predetermined frame rate as a detection frame. ... Sony Semiconductor Solutions Corporation

12/28/17 / #20170373258

Photoelectric conversion film, photoelectric conversion element and electronic device

There is provided a photoelectric conversion film including a quinacridone derivative represented by the following general formula and a subphthalocyanine derivative represented by the following general formula.. . ... Sony Semiconductor Solutions Corporation

12/28/17 / #20170373107

Solid-state image sensing device and electronic device

The present technology relates to a solid-state image sensing device capable of restricting a deterioration in photoelectric conversion characteristic of a photoelectric conversion unit, and an electronic device. A solid-state image sensing device includes: a photoelectric conversion unit formed outside a semiconductor substrate; a charge holding unit for holding signal charges generated by the photoelectric conversion unit; a reset transistor for resetting the potential of the charge holding unit; a capacitance switching transistor connected to the charge holding unit and directed for switching the capacitance of the charge holding unit; and an additional capacitance device connected to the capacitance switching transistor. ... Sony Semiconductor Solutions Corporation

12/28/17 / #20170373104

Solid-state imaging device and method for fabricating same

A solid-state imaging device includes a plurality of pixels two-dimensionally arrayed in a well region disposed on a semiconductor substrate, each pixel including a photoelectric conversion section having a charge accumulation region which accumulates signal charge; an element isolation layer which is disposed on the surface of the well region along the peripheries of the individual charge accumulation regions and which electrically isolates the individual pixels from each other; and a diffusion layer which is disposed beneath the element isolation layer and which electrically isolates the individual pixels from each other, the diffusion layer having a smaller width than that of the element isolation layer. Each charge accumulation region is disposed so as to extend below the element isolation layer and be in contact with or in close proximity to the diffusion layer.. ... Sony Semiconductor Solutions Corporation

12/21/17 / #20170365979

Driver circuitry and electronic device

. . . . Driver circuitry including an inductor configured to be used both as inductor of a buck convertor, and to provide high-speed pulse driving of a load.. . ... Sony Semiconductor Solutions Corporation

12/14/17 / #20170359537

Imaging apparatus, drive method, and electronic apparatus

. . An imaging apparatus with logarithmic characteristics includes: a photodiode that receives light; a well tap unit that fixes the potential of an n-type region of the photodiode; and a resetting unit that resets the photodiode, a p-type region of the photodiode outputting a voltage signal equivalent to a photocurrent subjected to logarithmic compression. The first potential to be supplied to the well tap unit is made lower than the second potential to be supplied to the resetting unit, so that the capacitance formed with the pn junction of the photodiode is charged when the resetting unit performs a reset operation. ... Sony Semiconductor Solutions Corporation

12/14/17 / #20170358614

Solid-state imaging device and electronic apparatus

The present technology relates to a solid-state imaging device that can achieve a higher resolution while increasing sensitivity, and an electronic apparatus. In a pixel array unit, pixels are two-dimensionally arranged, and the pixels are formed with a combination of: a first pixel that performs photoelectric conversion on light of a first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a third color component with a second photoelectric conversion unit, the light of the third color component having passed through a first color filter and the first photoelectric conversion unit, the first color filter being designed to pass light of a second color component; a second pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a fifth color component with a second photoelectric conversion unit, the light of the fifth color component having passed through a second color filter and the first photoelectric conversion unit, the second color filter being designed to pass light of a fourth color component; and a third pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a sixth color component with a second photoelectric conversion unit, the light of the sixth color component having passed through the first photoelectric conversion unit. ... Sony Semiconductor Solutions Corporation

11/30/17 / #20170345767

Multilayer wiring substrate, display unit, and electronic apparatus

In a case of a multilayer wiring structure in which an insulating layer provided between wires is made of a material having high transmittance of light in a visible range containing ultraviolet rays, wires in the upper layer and those in a lower layer may be recognized together when defects of an upper layer are visually inspected. In this case, the lower layer may be noise for the inspection of the wires in the upper layer, lowering inspection accuracy. ... Sony Semiconductor Solutions Corporation

11/23/17 / #20170338410

Methods for fabricating a memory device with an enlarged space between neighboring bottom electrodes

. . Embodiments of the present invention describe a method for fabricating a memory device comprising an enlarged space between neighboring bottom electrodes comprising depositing a poly-silicon layer on a substrate depositing a carbon layer above the poly-silicon layer, patterning a photo-resist layer on the carbon layer, depositing a first spacer layer on the photo-resist layer and performing a modified photolithography process on the photo resist layer after etching back the spacer layer creating sidewalls.. . ... Sony Semiconductor Solutions Corporation

11/23/17 / #20170338273

Semiconductor device and method for manufacturing semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus

The present technology relates to a semiconductor device and a method for manufacturing the semiconductor device, and in particular, to a semiconductor device configured to suppress scattering dusts caused by dicing, chipping due to clogging, and further suppress peel-off of an undercoat from a passivation film, thereby improving yields in manufacturing to realize cost reduction and a method for manufacturing the semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus. In a step of exposing a pad by etching, when etching a lens material layer as an uppermost layer and a passivation layer, a pad portion and a blade region to be cut by a blade at the time of dicing are simultaneously etched, while a part of a region including both portions and a part therebetween or all the region on the lump, is simultaneously etched. ... Sony Semiconductor Solutions Corporation

11/09/17 / #20170323686

Charge injection noise reduction in sample-and-hold circuit

A sample-and-hold circuit includes a first transistor; a second transistor disposed between a gate electrode and a drain electrode of the first transistor; a sampling capacitor, an electrode of the sampling capacitor being connected to the gate electrode of the first transistor; and a first current source connected to the drain electrode of the first transistor, where a gate electrode of the second transistor receives a gate control signal. A minimum voltage of the gate control signal is vth2+vsat2+vth1+vsat1, where vth1 is a threshold voltage of the first transistor, vsat1 is a saturation voltage of the first transistor, vth2 is a threshold voltage of the second transistor, and vsat2 is a saturation voltage of the second transistor.. ... Sony Semiconductor Solutions Corporation

10/26/17 / #20170310398

Transmission apparatus, transmission method, and filter circuit

The present technology relates to a transmission apparatus, a transmission method, and a filter circuit that make it possible to transmit a signal with high quality, the signal including a plurality of signals having different speeds. the transmission apparatus includes a detection unit that detects each of a plurality of signals having different speeds from an input signal. ... Sony Semiconductor Solutions Corporation

10/26/17 / #20170309347

State machine controlled mos linear resistor

A sample-and-hold circuit includes a sampling capacitor, a first transistor, a first switch between a gate electrode and a source electrode of the first transistor, a current source connected to the source electrode of the first transistor, and a resistive element and a second switch connected in parallel between a drain electrode of the first transistor and a predetermined voltage. The resistive element may include a second transistor biased to operate in a linear region according to a gate control signal at a gate electrode of the second transistor, or may include multiple transistor banks connected in parallel, each including a second transistor biased to operate in a linear region according to a gate control signal at a gate electrode of the second transistor. ... Sony Semiconductor Solutions Corporation

10/26/17 / #20170309335

Non-volatile memory device and method of controlling non-volatile memory device

A non-volatile memory device of the disclosure includes a memory cell, a writing circuit, and a current controller. The memory cell is disposed at an intersection of a first wiring and a second wiring, and includes a variable resistance element having a resistance state that is variable between a first resistance state and a second resistance state. ... Sony Semiconductor Solutions Corporation

10/12/17 / #20170295326

Image processing device, imaging device, and imaging method

An image signal corresponding to infrared light is separated from an image signal corresponding to visible light, the visible light including an infrared light signal, even when imaging is performed while performing the infrared light irradiation. An exposure control unit alternately repeats a first frame in which an exposure time is set to a predetermined first exposure time and a second frame in which the exposure time is set to a second exposure time longer than the first exposure time. ... Sony Semiconductor Solutions Corporation

10/12/17 / #20170294485

Imaging device, manufacturing device, and manufacturing method

The present technology relates to an imaging device, a manufacturing device, and a manufacturing method capable of preventing a substance such as hydrogen from entering and preventing change in performance. The imaging device includes an organic photoelectric conversion film, an upper electrode provided in an upper portion of the organic photoelectric conversion film, a lower electrode provided in a lower portion of the organic photoelectric conversion film, and a metal thin film provided between the organic photoelectric conversion film and the upper electrode or between the organic photoelectric conversion film and the lower electrode. ... Sony Semiconductor Solutions Corporation

10/12/17 / #20170294375

Memory cell unit array

In a memory cell unit array, memory cell units each constituted of first wires, second wires, and a nonvolatile memory cell are arranged in a two-dimensional matrix form in a first direction and a second direction. Each of the memory cell units includes a control circuit below it. ... Sony Semiconductor Solutions Corporation

10/05/17 / #20170289477

Imaging device and camera system with photosensitive conversion element

. . An imaging device including a pixel array section functioning as a light receiving section which includes photoelectric conversion devices and in which a plurality of pixels, which output electric signals when photons are incident, are disposed in an array; a sensing circuit section in which a plurality of sensing circuits, which receive the electric signals from the pixels and perform binary determination regarding whether or not there is an incidence of photons on the pixels in a predetermined period, are arrayed; and a determination result integration circuit section having a function of integrating a plurality of determination results of the sensing circuits for the respective pixels or for each pixel group, wherein the determination result integration circuit section derives the amount of photon incidence on the light receiving section by performing photon counting for integrating the plurality of determination results in the plurality of pixels.. . ... Sony Semiconductor Solutions Corporation

10/05/17 / #20170287982

Solid-state image pickup device and manufacturing method thereof, and electronic apparatus

Provided is a solid-state image pickup device that makes it possible to enhance image quality, and a manufacturing method thereof, and an electronic apparatus. A solid-state image pickup device includes a pixel section that includes a plurality of pixels, the pixels each including one or more organic photoelectric conversion sections, wherein the pixel section includes an effective pixel region and an optical black region, and the organic photoelectric conversion sections of the optical black region include a light-shielding film and a buffer film on a light-incidence side.. ... Sony Semiconductor Solutions Corporation

10/05/17 / #20170287962

Solid-state imaging device, method of manufacturing the same, and electronic apparatus

The present disclosure relates to a solid-state imaging device that can achieve a higher image quality by reducing image quality degradation, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes: a semiconductor substrate having photodiodes formed for respective pixels, the photodiodes performing photoelectric conversion; color filters that pass light in the colors corresponding to the respective pixels, the color filters being stacked on the light incident surface side of the semiconductor substrate; and a light shielding film provided between the color filters of the respective pixels, the light shielding film being formed by stacking a first light shielding film and a second light shielding film, the first light shielding film and the second light shielding film being formed with two different materials from each other. ... Sony Semiconductor Solutions Corporation

10/05/17 / #20170287958

Solid-state image pickup apparatus and electronic apparatus

The present disclosure relates to a solid-state image pickup apparatus and an electronic apparatus capable of preventing charges accumulated in a pd from being lost and suppressing reductions of an s/n and a dynamic range. The apparatus according to an embodiment of the present disclosure includes: a photoelectric conversion unit; a first holding unit that holds the charge transferred from the photoelectric conversion unit; a first transfer gate unit that controls the transfer of the charge; a charge drain unit that is a drain destination of the charge generated by the photoelectric conversion unit; a first drain gate unit that controls the transfer of the charge from the photoelectric conversion unit to the charge drain unit; and a second drain gate unit that connects the charge drain unit with a constant voltage source. ... Sony Semiconductor Solutions Corporation

09/28/17 / #20170276807

Radiation counting device and method of controlling radiation counting device

. . . . A radiation counting device is provided that includes a scintillator, a pixel circuit, and an analog-to-digital conversion circuit. In the radiation counting device, the scintillator generates a photon when radiation is incident. ... Sony Semiconductor Solutions Corporation

09/21/17 / #20170271752

Antenna

An antenna includes: a connection device for connection with an electronic device; a cable connected to the connection device; and a high-frequency cutoff unit that is formed of a material having high impedance in a high frequency and disposed at a given position of the cable. The cable with a length defined by the high-frequency cutoff unit functions as an antenna.. ... Sony Semiconductor Solutions Corporation

09/21/17 / #20170271393

Solid-state imaging device and manufacturing method thereof

A solid-state imaging device includes a photoelectric conversion unit, a transistor, and an element separation region separating the photoelectric conversion unit and the transistor. The photoelectric conversion unit and the transistor constitute a pixel. ... Sony Semiconductor Solutions Corporation

09/21/17 / #20170270858

Comparator unit, display, and method of driving display

A comparator unit includes: a comparison section configured to compare a control pulse with an electric potential based on a signal voltage; and a control section configured to control, based on the control pulse, operation and non-operation of the comparison section.. . ... Sony Semiconductor Solutions Corporation

09/21/17 / #20170270857

Display and electronic apparatus

A display includes a plurality of pixels and a drive circuit. The plurality of pixels are disposed in a two-dimensional fashion, and each include one or more light emitting devices. ... Sony Semiconductor Solutions Corporation

09/14/17 / #20170264857

Signal processing device and method

There is provided a signal processing device including a signal generation unit that generates a control signal for controlling an imaging device connected via one cable, a signal superimposition unit that superimposes the control signal generated by the signal generation unit on a video signal received from the imaging device via the cable without an influence on display of a video corresponding to the video signal, and a transmission unit that transmits the signals superimposed by the signal superimposition unit to the imaging device via the cable.. . ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257721

Audio processing device and method

The present disclosure relates to an audio processing device and a method therefor allowing a localization position of a sound image to be readily changed. A coefficient computation unit 23 adds or subtracts coefficients k_ls, k_l, k_c, k_r, and k_rs set for respective channels by a control unit 21 to or from audio signals ls, l, c, r, and rs from a delay unit 22, respectively. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257720

Audio processing apparatus

The present technology relates to an audio processing apparatus capable of downmixing 7.1-ch audio data to 2-ch audio data. A coefficient for downmixing 7.1-ch audio data to 2-ch audio data is set from a coefficient for downmixing 7.1-ch audio data to 5.1-ch audio data specified by a moving picture experts group 4 (mpeg4) audio standard and a coefficient for downmixing 5.1-ch audio data to 2-ch audio data specified by the standard, and stored in a 2-ch downmixing coefficient unit 22. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257589

Control device, control method, and solid-state imaging device

The present disclosure relates to a control device, a control method, and a solid-state imaging device that enable a larger number of shutter row addresses to be set at the same time. A vertical selection decoder and a latch circuit set shutter row addresses that identify rows of pixels for which an electronic shutter operation is performed, of pixels arranged in a matrix manner, on the basis of a start address and an end address of the shutter row addresses. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257587

Solid-state imaging device, method for driving the same, and electronic device

The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257584

Image processing device, image processing method, and image processing system

The present technology relates to an image processing device, an image processing method, and an image processing system capable of improving detection accuracy of a defective pixel. Provided is an image processing device including a defective pixel estimation unit that estimates a defect of a pixel of interest in an image captured by a solid-state imaging device that contains a two-dimensional array of color pixels, and high-sensitivity pixels having higher sensitivity than sensitivities of the color pixels. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170257245

Receiver, frame synchronization method, transmitter, transmission method, and program

The present technology relates to a receiver, a frame synchronization method, a transmitter, a transmission method, and a program that allows for enhancing frame synchronization performance without reducing throughput. A receiver of an aspect of the present technology receives signals of a frame having a preamble including a frame detection signal sequence formed by a repetition of a known signal sequence, followed by a frame synchronization signal sequence formed by the known signal sequence or an inverse sequence thereof, performs convolution arithmetic operation of a known correlation sequence and cross-correlation between a received signal sequence and the frame synchronization signal sequence, and ensures synchronization of the frame while regarding predetermined time when a value more than or equal to a threshold value or a maximum value is obtained. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170256577

Solid-state imaging device, imaging apparatus, electronic apparatus, and semiconductor device

The present technology relates to a solid-state imaging device, an imaging apparatus, an electronic apparatus, and a semiconductor device, which can prevent overflow of an underfilling resin filled in a portion adapted to connect the substrate to the flip chip and can prevent secondary damages such as electric short-circuit and contact with processing equipment. By utilizing a molding technology of forming an on-chip lens, a dam is formed in a ring shape or a square shape in a manner surrounding a range where a flip chip is connected via a solder bump on an upper layer of a substrate of the solid-state imaging device and provided in order to form the on-chip lens. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170256067

Image processing device, image processing method, and solid-state imaging device

The present disclosure relates to an image processing device, an image processing method, and a solid-state imaging device capable of detecting image information with high accuracy by using images with different shooting conditions. A difference detection unit detects difference information of a short exposure image of a current frame and a past frame shot in a short exposure time. ... Sony Semiconductor Solutions Corporation

09/07/17 / #20170256030

Signal processing device, signal processing method, solid-state image sensor, imaging device, electronic device, and program

The present technology relates to a signal processing device, a signal processing method, a solid-state image sensor, an imaging device, an electronic device, and a program capable of generating an interpolated pixel such that occurrence of jaggies may be inhibited without blurring an image with a small calculation amount. Two candidate lines are set in each of a horizontal direction and a vertical direction in positional relationship symmetrical about a current pixel. ... Sony Semiconductor Solutions Corporation

08/31/17 / #20170250213

Imaging element, method for manufacturing imaging element, pixel design method, and electronic apparatus

An imaging element includes a plurality of pixels that are two-dimensionally arranged and each have a light receiving part including a photoelectric conversion element and a light collecting part that collects incident light toward the light receiving part. Each of the light collecting parts in the plurality of pixels includes an optical functional layer having, in a surface, a specific projection and depression structure depending on the pixel position.. ... Sony Semiconductor Solutions Corporation

08/31/17 / #20170249909

Display device and light-emitting element

There is provided a display device including a light-emitting element body part, a low refractive index layer part which is provided over a light output surface of the light-emitting element body part and has a first refractive index, and a packaging member which is provided to seal the light-emitting element body part and the low refractive index layer part inside the packaging member, has a planar light output surface, and has a second refractive index which is greater than the first refractive index.. . ... Sony Semiconductor Solutions Corporation

08/24/17 / #20170244406

Power on reset circuit and high frequency communication device

A power on reset circuit according to the present disclosure includes: a reference voltage generating circuit that generates a reference voltage, and also outputs, as a control voltage, a voltage at a node at which a voltage rise is slower than the reference voltage; a comparison voltage generating circuit that operates in response to the control voltage output from the reference voltage generating circuit, and outputs a comparison voltage depending on a power source voltage; and a comparison circuit that compares the comparison voltage output from the comparison voltage generating circuit to the reference voltage output from the reference voltage generating circuit, and outputs an operation signal while the comparison voltage exceeds the reference voltage.. . ... Sony Semiconductor Solutions Corporation

08/24/17 / #20170243912

Solid-state image sensor, method of manufacturing the same, and electronic device

A more preferable pixel for detecting a focal point may be formed by using a photoelectric converting film. A solid-state image sensor includes a first pixel including a photoelectric converting unit formed of a photoelectric converting film and first and second electrodes which interpose the same from above and below in which at least one of the first and second electrodes is a separated electrode separated for each pixel, and a second pixel including the photoelectric converting unit in which the separated electrode is formed to have a planar size smaller than that of the first pixel and a third electrode extending at least to a boundary of the pixel is formed in a region which is vacant due to a smaller planar size. ... Sony Semiconductor Solutions Corporation

08/24/17 / #20170243819

Stacked device, manufacturing method, and electronic instrument

The present disclosure relates to a stacked device, a manufacturing method, and an electronic instrument, capable of suppressing adverse effects of noise generated from one substrate, onto the other substrate. A first metal layer is formed on a bonding surface of one substrate, and a second metal layer is formed on a bonding surface of the other substrate stacked with the one substrate. ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170237917

Signal processing device and method, imaging element, and electronic device

The present technology relates to signal processing device and method, an imaging element, and an electronic device capable of reducing a rise of costs. A signal processing device according to the present technology includes a measurement unit that performs measurement of a length of a period from an input start of a signal to a change of a value of the signal a plurality of times, retains measured values obtained by the measurement performed the plurality of times, sets an initial value of the measurement on the basis of any one of a plurality of the retained measured values, and performs the measurement by using the initial value. ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170237443

Phase-locked loop and frequency synthesizer

A phase-locked loop according to the present disclosure includes a reference-phase generation circuit that sequentially generates a reference phase value, and an oscillating circuit that generates a first clock on a basis of a difference between the reference phase value and a feedback phase value. The phase-locked loop further includes a signal generation circuit that generates, on a basis of the first clock, a plurality of second clocks varying in phase, and generates a third clock by switching the plurality of second clocks a plurality of times in each of cycle periods each corresponding to one cycle of the reference clock. ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170236859

Solid state image sensor and electronic device

The present disclosure relates to a solid-state imaging device and an electronic device that are configured to suppress the occurrence of noise and white blemishes in an amplification transistor having an element separation region which is formed by ion implantation. An amplification transistor has an element separation region formed by ion implantation. ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170236622

Cable

Provided is a cable including: at least two signal cables formed of first and second signal cables for differential transmission; a third cable for ground; a fourth cable for power supply; a metal sheet adapted to cover the first and second signal cables; a coating material adapted to house the first and second signal cables covered with the metal sheet, and the third and fourth cables; and a magnetic powder-mixed resin filled into an inner space of the coating material and prepared by mixing magnetic powder with a resin.. . ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170234995

Solid-state image sensor, manufacturing method, and radiation imaging device

The present disclosure relates to a solid-state image sensor capable of suppressing deterioration of the noise characteristics and the dark characteristics when capturing an image of radiation, a manufacturing method, and a radiation imaging device. A scintillator converts radiation to visible light. ... Sony Semiconductor Solutions Corporation

08/17/17 / #20170234992

Imaging apparatus and manufacturing method thereof

[solution to problem] an imaging apparatus includes a photoelectric conversion layer, a light guide layer, and a scintillator layer. The photoelectric conversion layer has a plurality of pixel regions configured to be capable of performing photoelectric conversion. ... Sony Semiconductor Solutions Corporation

08/10/17 / #20170230592

Solid state imaging apparatus, signal reading method, and electronic apparatus

. . There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. ... Sony Semiconductor Solutions Corporation

08/10/17 / #20170230539

Image processing device, image processing method, and program

In one example, an image processing device includes a reduction scaler unit that reduces or maintains the image data of an input image. An enlargement scaler unit enlarges or maintains the image data and outputs the image data as the image data of an output image. ... Sony Semiconductor Solutions Corporation

08/10/17 / #20170229503

Solid-state imaging element and electronic device

The present technology relates to a solid-state imaging element and an electronic device capable of improving image quality of the solid-state imaging element. The solid-state imaging element includes a photoelectric conversion unit adapted to photoelectrically convert incident light incident from a predetermined incident surface. ... Sony Semiconductor Solutions Corporation

08/10/17 / #20170229493

Pixel circuit and imaging apparatus

Dark current of fd is eliminated in an image sensor, and conversion efficiency of converting electric charge to voltage is improved. A pixel circuit includes a photoelectric conversion portion, a control transistor, and an electric charge accumulation portion. ... Sony Semiconductor Solutions Corporation

08/03/17 / #20170223290

Solid-state imaging device and electronic apparatus

A solid-state imaging device includes: an r pixel provided with an r filter for transmitting red-color light; a b pixel provided with a b filter for transmitting blue-color light; an s1 pixel which is provided with an s1 filter with a visible light transmittance independent of wavelengths in a visible light region and has a sensitivity higher than that of the r pixel; and an s2 pixel which is provided with an s2 filter with a visible light transmittance independent of wavelengths in the visible light region and lower than the visible light transmittance of the s1 filter and has a sensitivity lower than the sensitivity of the s1 pixel.. . ... Sony Semiconductor Solutions Corporation

08/03/17 / #20170222655

Analog-to-digital converter, electronic device, and method of controlling analog-to-digital converter

An analog signal is accurately converted into a digital signal. An oscillator generates an oscillation signal having a cycle that depends on a signal level of an input analog signal. ... Sony Semiconductor Solutions Corporation

08/03/17 / #20170221949

Two-dimensional solid-state image capture device and polarization-light data processing method therefor

A two-dimensional solid-state image capture device includes pixel areas arranged in a two-dimensional matrix, each pixel area being constituted by multiple sub-pixel regions, each sub-pixel region having a photoelectric conversion element. A polarization member is disposed at a light incident side of at least one of the sub-pixel regions constituting each pixel area. ... Sony Semiconductor Solutions Corporation

08/03/17 / #20170219722

Image pickup panel and image pickup processing system

An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.. . ... Sony Semiconductor Solutions Corporation

07/27/17 / #20170213099

Image recognition unit, learning method of the same, and electronic apparatus

. . An image recognition unit of the present disclosure includes: a plurality of memory sections; a writing section that selectively writes a plurality of pieces of pixel data of a data map to the plurality of memory sections; and an arithmetic section that reads a plurality of pixel data sets from the plurality of memory sections, and determines whether an input image corresponding to the data map includes a recognition object, on a basis of the plurality of pixel data sets, the pixel data sets each including a predetermined number of pieces of pixel data.. . ... Sony Semiconductor Solutions Corporation

07/20/17 / #20170207257

Pixel circuit, semiconductor photodetection device, and radiation counting device

In a photoelectric changing unit, a photoelectric conversion unit converts light into electric charge, and an electric charge accumulation unit accumulates the electric charge in a polygonal area whose plurality of sides are adjacent to the photoelectric conversion unit on a light receiving surface. A voltage generation unit accumulates the electric charge and generates a voltage according to an amount of the accumulated electric charge. ... Sony Semiconductor Solutions Corporation








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